TWI440227B - 殼體、光電組件及殼體的製造方法 - Google Patents

殼體、光電組件及殼體的製造方法 Download PDF

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Publication number
TWI440227B
TWI440227B TW099140164A TW99140164A TWI440227B TW I440227 B TWI440227 B TW I440227B TW 099140164 A TW099140164 A TW 099140164A TW 99140164 A TW99140164 A TW 99140164A TW I440227 B TWI440227 B TW I440227B
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TW
Taiwan
Prior art keywords
plastic
coating
casing
housing
housing body
Prior art date
Application number
TW099140164A
Other languages
English (en)
Chinese (zh)
Other versions
TW201131826A (en
Inventor
葛托德 克勞特
伯恩 巴克曼
Original Assignee
歐斯朗奧托半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 歐斯朗奧托半導體股份有限公司 filed Critical 歐斯朗奧托半導體股份有限公司
Publication of TW201131826A publication Critical patent/TW201131826A/zh
Application granted granted Critical
Publication of TWI440227B publication Critical patent/TWI440227B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
TW099140164A 2009-11-25 2010-11-22 殼體、光電組件及殼體的製造方法 TWI440227B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009055786A DE102009055786A1 (de) 2009-11-25 2009-11-25 Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses

Publications (2)

Publication Number Publication Date
TW201131826A TW201131826A (en) 2011-09-16
TWI440227B true TWI440227B (zh) 2014-06-01

Family

ID=43383620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099140164A TWI440227B (zh) 2009-11-25 2010-11-22 殼體、光電組件及殼體的製造方法

Country Status (8)

Country Link
US (1) US9006773B2 (https=)
EP (1) EP2504861A1 (https=)
JP (1) JP2013512556A (https=)
KR (1) KR20120117792A (https=)
CN (1) CN102630346A (https=)
DE (1) DE102009055786A1 (https=)
TW (1) TWI440227B (https=)
WO (1) WO2011064072A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740149B (zh) * 2019-05-24 2021-09-21 華碩電腦股份有限公司 殼體的製造方法

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DE102010013317B4 (de) * 2010-03-30 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil, Gehäuse hierfür und Verfahren zur Herstellung des optoelektronischen Bauteils
WO2012002580A1 (ja) * 2010-07-01 2012-01-05 シチズンホールディングス株式会社 Ｌｅｄ光源装置及びその製造方法
JP2014011029A (ja) * 2012-06-29 2014-01-20 Toshiba Lighting & Technology Corp 照明装置
WO2013025832A1 (en) * 2011-08-16 2013-02-21 E. I. Du Pont De Nemours And Company Reflector for light-emitting diode and housing
JP2013222499A (ja) * 2012-04-12 2013-10-28 Sharp Corp 光源基板ユニット
CN102779926B (zh) * 2012-08-02 2015-01-28 慧明光电(深圳)有限公司 高对比度的防水表贴led灯
DE102014102258B4 (de) * 2014-02-21 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
DE102014106882A1 (de) * 2014-05-15 2015-11-19 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR102360957B1 (ko) * 2015-03-27 2022-02-11 삼성디스플레이 주식회사 발광 다이오드 패키지
EP3306683A4 (en) * 2015-06-01 2018-12-19 Mitsubishi Electric Corporation Light emitting device, display unit, and image display device
JP6728764B2 (ja) * 2016-02-26 2020-07-22 日亜化学工業株式会社 発光装置及びそれを用いた照明装置
JP7117170B2 (ja) * 2018-06-20 2022-08-12 スタンレー電気株式会社 発光装置
JP7212241B2 (ja) 2018-06-21 2023-01-25 日亜化学工業株式会社 発光装置
JP7190889B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置及び発光装置モジュール
CN113410374B (zh) * 2021-06-17 2022-10-04 中国科学院半导体研究所 一种混色led器件

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JP2000037726A (ja) 1998-07-21 2000-02-08 Toray Ind Inc 熱可塑性樹脂製品類のリサイクル方法
DE10020465A1 (de) 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP2002374007A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
DE10153259A1 (de) 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US20030133300A1 (en) * 2002-01-11 2003-07-17 Bily Wang Light absorbing wall for LED package
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JP2004071950A (ja) 2002-08-08 2004-03-04 Matsushita Electric Ind Co Ltd 半導体パッケージおよびその製造方法
US7718451B2 (en) * 2003-02-28 2010-05-18 Osram Opto Semiconductor Gmbh Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
DE102004064150B4 (de) 2004-06-29 2010-04-29 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse mit leitfähiger Beschichtung zum ESD-Schutz
JP4747726B2 (ja) 2004-09-09 2011-08-17 豊田合成株式会社 発光装置
DE102005036520A1 (de) 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740149B (zh) * 2019-05-24 2021-09-21 華碩電腦股份有限公司 殼體的製造方法

Also Published As

Publication number Publication date
US20120273811A1 (en) 2012-11-01
JP2013512556A (ja) 2013-04-11
DE102009055786A1 (de) 2011-05-26
WO2011064072A1 (de) 2011-06-03
US9006773B2 (en) 2015-04-14
CN102630346A (zh) 2012-08-08
EP2504861A1 (de) 2012-10-03
KR20120117792A (ko) 2012-10-24
TW201131826A (en) 2011-09-16

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