TWI435851B - Cutter wheel holder unit - Google Patents

Cutter wheel holder unit Download PDF

Info

Publication number
TWI435851B
TWI435851B TW099135694A TW99135694A TWI435851B TW I435851 B TWI435851 B TW I435851B TW 099135694 A TW099135694 A TW 099135694A TW 99135694 A TW99135694 A TW 99135694A TW I435851 B TWI435851 B TW I435851B
Authority
TW
Taiwan
Prior art keywords
wheel
pair
scribing wheel
scribing
holder
Prior art date
Application number
TW099135694A
Other languages
English (en)
Chinese (zh)
Other versions
TW201114705A (en
Inventor
Masanobu Soyama
Tadanobu Nakano
Hiroyoshi Hayashi
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009248807A external-priority patent/JP5281542B2/ja
Priority claimed from JP2009248808A external-priority patent/JP4960428B2/ja
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201114705A publication Critical patent/TW201114705A/zh
Application granted granted Critical
Publication of TWI435851B publication Critical patent/TWI435851B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW099135694A 2009-10-29 2010-10-20 Cutter wheel holder unit TWI435851B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009248807A JP5281542B2 (ja) 2009-10-29 2009-10-29 チップホルダユニット
JP2009248808A JP4960428B2 (ja) 2009-10-29 2009-10-29 チップホルダユニット

Publications (2)

Publication Number Publication Date
TW201114705A TW201114705A (en) 2011-05-01
TWI435851B true TWI435851B (zh) 2014-05-01

Family

ID=43955428

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099135694A TWI435851B (zh) 2009-10-29 2010-10-20 Cutter wheel holder unit

Country Status (3)

Country Link
KR (1) KR101235600B1 (ko)
CN (1) CN102050565B (ko)
TW (1) TWI435851B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI504576B (zh) * 2011-10-13 2015-10-21 Mitsuboshi Diamond Ind Co Ltd A holder, a holder unit and a scribing device
JP2014065173A (ja) * 2012-09-25 2014-04-17 Mitsuboshi Diamond Industrial Co Ltd チップホルダ及びチップホルダユニット
CN104445907A (zh) * 2014-10-31 2015-03-25 北京沃尔德超硬工具有限公司 一种焊接式复合钻石刀轮
JP5936733B1 (ja) * 2015-03-10 2016-06-22 トーヨー産業株式会社 ガラス専用カッターホイール
JP6031150B1 (ja) * 2015-04-27 2016-11-24 トーヨー産業株式会社 ガラス切断専用ホイールホルダ
JP6744626B2 (ja) * 2016-07-25 2020-08-19 三星ダイヤモンド工業株式会社 スクライブ方法並びにスクライブ装置
JP2018020533A (ja) * 2016-08-05 2018-02-08 ファインテック株式会社 スクライブヘッド及びそれを備えたスクライブ装置
CN107856206B (zh) * 2017-10-31 2019-09-13 青岛福瀛建设集团有限公司 一种适用于现场铺贴施工用的石材切割装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342101Y2 (ko) * 1984-09-08 1988-11-04
JPS6342102Y2 (ko) * 1984-10-11 1988-11-04
JPH044028U (ko) * 1990-04-24 1992-01-14
JP4948725B2 (ja) * 2000-12-05 2012-06-06 三星ダイヤモンド工業株式会社 チップホルダー

Also Published As

Publication number Publication date
CN102050565B (zh) 2013-10-30
CN102050565A (zh) 2011-05-11
TW201114705A (en) 2011-05-01
KR20110047135A (ko) 2011-05-06
KR101235600B1 (ko) 2013-02-21

Similar Documents

Publication Publication Date Title
TWI435851B (zh) Cutter wheel holder unit
JP5257323B2 (ja) チップホルダユニット
JP4948725B2 (ja) チップホルダー
TW201412665A (zh) 刀輪保持具單元
EP0978490A2 (en) Cutter wheel
KR20140145984A (ko) 팁 홀더 유닛, 팁 홀더, 핀, 휠 팁 및 기판 가공 장치
KR20030029911A (ko) 다양한 형상의 인서트를 사용하는 밀링 커터
JP2007152936A (ja) 脆性材料用のホイールカッター
JP2018020533A (ja) スクライブヘッド及びそれを備えたスクライブ装置
JP5281542B2 (ja) チップホルダユニット
KR102516664B1 (ko) 커터 휠
CN109382529A (zh) 切削刀片以及切削工具
KR102625913B1 (ko) 스크라이빙 휠, 이 스크라이빙 휠을 구비하는 칩 홀더, 지지 핀 및 이 지지 핀을 구비하는 칩 홀더
TW201604159A (zh) 玻璃切割工具
JP4960428B2 (ja) チップホルダユニット
KR20140097000A (ko) 스크라이빙 휠용 홀더, 홀더 유닛 및 스크라이브 장치
JP2014065213A (ja) チップホルダユニット
JP5083392B2 (ja) 微細加工用工具および脆性材料の微細加工方法
JP5123919B2 (ja) スクライビングホイールの製造方法
TW201412664A (zh) 刀輪保持具及刀輪保持具單元
JP2013028181A (ja) チップホルダユニット及びホルダ
KR20110047123A (ko) 팁 홀더 유닛
JP2019116083A (ja) スクライブ装置およびホルダユニット
JP4349384B2 (ja) 微細加工用工具および脆性材料の微細加工方法
JP2014065214A (ja) チップホルダユニット

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees