TWI432911B - A light source device and an exposure device using the same - Google Patents
A light source device and an exposure device using the same Download PDFInfo
- Publication number
- TWI432911B TWI432911B TW096130173A TW96130173A TWI432911B TW I432911 B TWI432911 B TW I432911B TW 096130173 A TW096130173 A TW 096130173A TW 96130173 A TW96130173 A TW 96130173A TW I432911 B TWI432911 B TW I432911B
- Authority
- TW
- Taiwan
- Prior art keywords
- discharge lamp
- light
- illuminance
- light source
- source device
- Prior art date
Links
- 230000005856 abnormality Effects 0.000 claims description 36
- 230000002159 abnormal effect Effects 0.000 claims description 25
- 230000003287 optical effect Effects 0.000 claims description 16
- 230000000903 blocking effect Effects 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 230000010354 integration Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000036461 convulsion Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70016—Production of exposure light, i.e. light sources by discharge lamps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007079178A JP4955436B2 (ja) | 2007-03-26 | 2007-03-26 | 光源装置ならびにこれを用いた露光装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200839453A TW200839453A (en) | 2008-10-01 |
| TWI432911B true TWI432911B (zh) | 2014-04-01 |
Family
ID=39913350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096130173A TWI432911B (zh) | 2007-03-26 | 2007-08-15 | A light source device and an exposure device using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4955436B2 (ko) |
| KR (1) | KR101360800B1 (ko) |
| CN (1) | CN101277567A (ko) |
| TW (1) | TWI432911B (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130207544A1 (en) * | 2011-09-30 | 2013-08-15 | Pinebrook Imaging Technology, Ltd. | Illumination system |
| JP5869713B1 (ja) * | 2015-04-13 | 2016-02-24 | フェニックス電機株式会社 | 光源装置及び露光装置とその検査方法 |
| CN106507532A (zh) * | 2016-09-28 | 2017-03-15 | 宁波工程学院 | 一种锂电太阳能led路灯及其基于物联网的监控系统 |
| WO2019039427A1 (ja) * | 2017-08-23 | 2019-02-28 | フェニックス電機株式会社 | 光源装置、露光装置、および光源装置の判定方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62200345A (ja) * | 1986-02-28 | 1987-09-04 | Fuji Xerox Co Ltd | 照明装置 |
| JP2600433B2 (ja) * | 1990-04-18 | 1997-04-16 | 三菱電機株式会社 | 放電灯点灯装置 |
| JP2001307988A (ja) * | 2000-04-24 | 2001-11-02 | Canon Inc | 照明装置と照明方法、および該照明装置を備えた露光装置とこれらによるデバイス製造方法 |
| JP3593654B2 (ja) * | 2000-05-25 | 2004-11-24 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| KR100558490B1 (ko) * | 2003-09-08 | 2006-03-07 | 삼성전자주식회사 | 램프 모니터링수단을 구비한 반도체 제조장치 |
-
2007
- 2007-03-26 JP JP2007079178A patent/JP4955436B2/ja active Active
- 2007-08-15 TW TW096130173A patent/TWI432911B/zh active
- 2007-09-12 CN CNA2007101489320A patent/CN101277567A/zh active Pending
- 2007-09-28 KR KR1020070097810A patent/KR101360800B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| TW200839453A (en) | 2008-10-01 |
| KR101360800B1 (ko) | 2014-02-11 |
| KR20080087629A (ko) | 2008-10-01 |
| JP2008241876A (ja) | 2008-10-09 |
| CN101277567A (zh) | 2008-10-01 |
| JP4955436B2 (ja) | 2012-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI421643B (zh) | A light source device and an exposure device using the same | |
| TWI432911B (zh) | A light source device and an exposure device using the same | |
| TWI394014B (zh) | Peripheral exposure device | |
| TWI566054B (zh) | Lighting device with discharge lamp | |
| JP2010034293A (ja) | 露光用光照射装置 | |
| JP2003173029A (ja) | 露光装置および露光方法 | |
| KR101586062B1 (ko) | 광 출력제어 기능을 구비한 led 노광 장치 및 그 제어 방법 | |
| WO2022224576A1 (ja) | 照明装置の制御方法及び露光装置 | |
| JP3878470B2 (ja) | 処理装置 | |
| TWI811234B (zh) | 光源裝置、曝光裝置、及光源裝置之判定方法 | |
| KR102538972B1 (ko) | 광원 장치, 그것을 구비하는 조사 장치, 및 광원 장치의 점등 방법 | |
| KR20220161573A (ko) | 에지 노광 장치 및 광원 출력 제어 방법 | |
| KR200169701Y1 (ko) | 반도체 노광장치 | |
| JP2000277290A (ja) | 放電灯駆動装置及び放電灯駆動方法 | |
| JP2006344430A (ja) | 照明装置 | |
| JPS61176116A (ja) | 半導体露光装置 | |
| JPS5835530A (ja) | 写真焼付装置 | |
| JP2012248435A (ja) | 照明装置 | |
| KR20150120179A (ko) | Led를 이용한 노광 장치 및 그 제어방법 | |
| JPH0915753A (ja) | 照明装置 |