TWI431826B - 用於有機電子裝置之垂直互連 - Google Patents
用於有機電子裝置之垂直互連 Download PDFInfo
- Publication number
- TWI431826B TWI431826B TW094136559A TW94136559A TWI431826B TW I431826 B TWI431826 B TW I431826B TW 094136559 A TW094136559 A TW 094136559A TW 94136559 A TW94136559 A TW 94136559A TW I431826 B TWI431826 B TW I431826B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive
- organic electronic
- organic
- layer
- interconnect
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 95
- 239000000758 substrate Substances 0.000 claims description 87
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
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- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
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- 239000004925 Acrylic resin Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
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- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/84—Parallel electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/86—Series electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Electrodes Of Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/020,338 US7259391B2 (en) | 2004-12-22 | 2004-12-22 | Vertical interconnect for organic electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200625709A TW200625709A (en) | 2006-07-16 |
| TWI431826B true TWI431826B (zh) | 2014-03-21 |
Family
ID=35976640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094136559A TWI431826B (zh) | 2004-12-22 | 2005-10-19 | 用於有機電子裝置之垂直互連 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7259391B2 (enExample) |
| EP (1) | EP1684354A3 (enExample) |
| JP (1) | JP5486756B2 (enExample) |
| KR (1) | KR101261638B1 (enExample) |
| CN (2) | CN101604702B (enExample) |
| TW (1) | TWI431826B (enExample) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070046179A1 (en) * | 2005-08-26 | 2007-03-01 | Chan-Ching Chang | Organic electro-luminescent device |
| US20080311738A1 (en) * | 2007-06-18 | 2008-12-18 | Lakshmi Supriya | Method of forming an interconnect joint |
| US20090186550A1 (en) * | 2008-01-21 | 2009-07-23 | General Electric Company | Methods, apparatus, and rollers for forming optoelectronic devices |
| US7741140B2 (en) * | 2008-01-21 | 2010-06-22 | General Electric Company | Methods, apparatus, and rollers for cross-web forming of optoelectronic devices |
| US20090284158A1 (en) * | 2008-05-16 | 2009-11-19 | General Electric Company | Organic light emitting device based lighting for low cost, flexible large area signage |
| US8022623B2 (en) * | 2008-08-15 | 2011-09-20 | General Electric Company | Ultra-thin multi-substrate color tunable OLED device |
| WO2010022105A2 (en) * | 2008-08-19 | 2010-02-25 | Plextronics, Inc. | Organic light emitting diode products |
| WO2010022104A2 (en) | 2008-08-19 | 2010-02-25 | Plextronics, Inc. | Organic light emitting diode lighting systems |
| TW201014452A (en) * | 2008-08-19 | 2010-04-01 | Plextronics Inc | Organic light emitting diode lighting devices |
| US8519424B2 (en) * | 2008-08-19 | 2013-08-27 | Plextronics, Inc. | User configurable mosaic light emitting apparatus |
| DE102008050332A1 (de) * | 2008-10-07 | 2010-04-22 | Leonhard Kurz Stiftung & Co. Kg | Photovoltaische Zellen sowie Mehrschichtfolie |
| CN102414859B (zh) * | 2009-04-23 | 2015-04-01 | 皇家飞利浦电子股份有限公司 | 具有电阻互连层的分段电致发光器件 |
| US9161448B2 (en) | 2010-03-29 | 2015-10-13 | Semprius, Inc. | Laser assisted transfer welding process |
| US9899329B2 (en) | 2010-11-23 | 2018-02-20 | X-Celeprint Limited | Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance |
| US8692457B2 (en) | 2010-12-20 | 2014-04-08 | General Electric Company | Large area light emitting electrical package with current spreading bus |
| KR101881462B1 (ko) * | 2011-02-10 | 2018-07-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| US8889485B2 (en) * | 2011-06-08 | 2014-11-18 | Semprius, Inc. | Methods for surface attachment of flipped active componenets |
| US9412727B2 (en) | 2011-09-20 | 2016-08-09 | Semprius, Inc. | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion |
| JP2013179020A (ja) * | 2012-02-08 | 2013-09-09 | National Institute Of Advanced Industrial & Technology | 有機光電子素子 |
| CN107155373B (zh) | 2014-06-18 | 2019-01-15 | 艾克斯瑟乐普林特有限公司 | 微组装led显示器 |
| US20160020131A1 (en) | 2014-07-20 | 2016-01-21 | X-Celeprint Limited | Apparatus and methods for micro-transfer-printing |
| US9991163B2 (en) | 2014-09-25 | 2018-06-05 | X-Celeprint Limited | Small-aperture-ratio display with electrical component |
| US9799719B2 (en) | 2014-09-25 | 2017-10-24 | X-Celeprint Limited | Active-matrix touchscreen |
| US9871345B2 (en) | 2015-06-09 | 2018-01-16 | X-Celeprint Limited | Crystalline color-conversion device |
| US10133426B2 (en) | 2015-06-18 | 2018-11-20 | X-Celeprint Limited | Display with micro-LED front light |
| US11061276B2 (en) | 2015-06-18 | 2021-07-13 | X Display Company Technology Limited | Laser array display |
| US9704821B2 (en) | 2015-08-11 | 2017-07-11 | X-Celeprint Limited | Stamp with structured posts |
| US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
| US10380930B2 (en) | 2015-08-24 | 2019-08-13 | X-Celeprint Limited | Heterogeneous light emitter display system |
| US10230048B2 (en) | 2015-09-29 | 2019-03-12 | X-Celeprint Limited | OLEDs for micro transfer printing |
| US10066819B2 (en) | 2015-12-09 | 2018-09-04 | X-Celeprint Limited | Micro-light-emitting diode backlight system |
| US9786646B2 (en) | 2015-12-23 | 2017-10-10 | X-Celeprint Limited | Matrix addressed device repair |
| CN105629543B (zh) * | 2016-01-04 | 2019-03-01 | 京东方科技集团股份有限公司 | 一种柔性液晶显示面板及显示装置 |
| TWI681508B (zh) | 2016-02-25 | 2020-01-01 | 愛爾蘭商艾克斯瑟樂普林特有限公司 | 有效率地微轉印微型裝置於大尺寸基板上 |
| US10193025B2 (en) | 2016-02-29 | 2019-01-29 | X-Celeprint Limited | Inorganic LED pixel structure |
| US10153257B2 (en) | 2016-03-03 | 2018-12-11 | X-Celeprint Limited | Micro-printed display |
| US10153256B2 (en) | 2016-03-03 | 2018-12-11 | X-Celeprint Limited | Micro-transfer printable electronic component |
| US10103069B2 (en) | 2016-04-01 | 2018-10-16 | X-Celeprint Limited | Pressure-activated electrical interconnection by micro-transfer printing |
| US10199546B2 (en) | 2016-04-05 | 2019-02-05 | X-Celeprint Limited | Color-filter device |
| US10008483B2 (en) | 2016-04-05 | 2018-06-26 | X-Celeprint Limited | Micro-transfer printed LED and color filter structure |
| US9997501B2 (en) | 2016-06-01 | 2018-06-12 | X-Celeprint Limited | Micro-transfer-printed light-emitting diode device |
| US11137641B2 (en) | 2016-06-10 | 2021-10-05 | X Display Company Technology Limited | LED structure with polarized light emission |
| US10222698B2 (en) | 2016-07-28 | 2019-03-05 | X-Celeprint Limited | Chiplets with wicking posts |
| US11064609B2 (en) | 2016-08-04 | 2021-07-13 | X Display Company Technology Limited | Printable 3D electronic structure |
| US9980341B2 (en) | 2016-09-22 | 2018-05-22 | X-Celeprint Limited | Multi-LED components |
| US10782002B2 (en) | 2016-10-28 | 2020-09-22 | X Display Company Technology Limited | LED optical components |
| US10347168B2 (en) | 2016-11-10 | 2019-07-09 | X-Celeprint Limited | Spatially dithered high-resolution |
| US10600671B2 (en) | 2016-11-15 | 2020-03-24 | X-Celeprint Limited | Micro-transfer-printable flip-chip structures and methods |
| US10395966B2 (en) | 2016-11-15 | 2019-08-27 | X-Celeprint Limited | Micro-transfer-printable flip-chip structures and methods |
| TWI739949B (zh) | 2016-11-15 | 2021-09-21 | 愛爾蘭商艾克斯展示公司技術有限公司 | 微轉印可印刷覆晶結構及方法 |
| US10438859B2 (en) | 2016-12-19 | 2019-10-08 | X-Celeprint Limited | Transfer printed device repair |
| US10396137B2 (en) | 2017-03-10 | 2019-08-27 | X-Celeprint Limited | Testing transfer-print micro-devices on wafer |
| US11024608B2 (en) | 2017-03-28 | 2021-06-01 | X Display Company Technology Limited | Structures and methods for electrical connection of micro-devices and substrates |
| US10748793B1 (en) | 2019-02-13 | 2020-08-18 | X Display Company Technology Limited | Printing component arrays with different orientations |
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| US5326671A (en) * | 1992-12-28 | 1994-07-05 | At&T Bell Laboratories | Method of making circuit devices comprising a dielectric layer of siloxane-caprolactone |
| JP3251711B2 (ja) * | 1993-06-02 | 2002-01-28 | 株式会社東芝 | 印刷配線板および印刷配線板の製造方法 |
| JP3516965B2 (ja) * | 1993-09-09 | 2004-04-05 | 株式会社東芝 | プリント配線板 |
| JP3474937B2 (ja) * | 1994-10-07 | 2003-12-08 | 株式会社東芝 | 実装用配線板の製造方法、半導体パッケージの製造方法 |
| GB9907120D0 (en) * | 1998-12-16 | 1999-05-19 | Cambridge Display Tech Ltd | Organic light-emissive devices |
| JP2000332157A (ja) * | 1999-05-25 | 2000-11-30 | Matsushita Electric Ind Co Ltd | 電子部品実装部材 |
| JP3424627B2 (ja) * | 1999-11-26 | 2003-07-07 | 日本電気株式会社 | 半導体装置とそれを用いた三次元半導体装置及びその製造方法並びにテンプレート |
| US6566808B1 (en) * | 1999-12-22 | 2003-05-20 | General Electric Company | Luminescent display and method of making |
| US6541919B1 (en) * | 2000-02-14 | 2003-04-01 | Sarnoff Corporation | Electrical interconnection of light-emitting fibers, and method therefor |
| JP3840926B2 (ja) * | 2000-07-07 | 2006-11-01 | セイコーエプソン株式会社 | 有機el表示体及びその製造方法、並びに電子機器 |
| JP3893916B2 (ja) * | 2000-08-11 | 2007-03-14 | セイコーエプソン株式会社 | 有機el装置の製造方法および有機el装置、電子機器 |
| JP2002141173A (ja) * | 2000-08-22 | 2002-05-17 | Semiconductor Energy Lab Co Ltd | 発光装置 |
| JP2002343560A (ja) * | 2001-03-16 | 2002-11-29 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置、電子機器 |
| FI110675B (fi) * | 2001-07-06 | 2003-03-14 | Valtion Teknillinen | Menetelmä orgaanisen valoa emittoivan diodin muokkaamiseksi |
| TW543336B (en) * | 2001-12-13 | 2003-07-21 | Ritdisplay Corp | Global lamp-lighting test method of organic light-emitting diode |
| JP2003197379A (ja) * | 2001-12-27 | 2003-07-11 | Print Labo Kk | 導電材料保持シートおよびそれを用いたel発光装置 |
| US6872472B2 (en) * | 2002-02-15 | 2005-03-29 | Eastman Kodak Company | Providing an organic electroluminescent device having stacked electroluminescent units |
| US7049757B2 (en) * | 2002-08-05 | 2006-05-23 | General Electric Company | Series connected OLED structure and fabrication method |
| US6693296B1 (en) * | 2002-08-07 | 2004-02-17 | Eastman Kodak Company | OLED apparatus including a series of OLED devices |
| US7034470B2 (en) * | 2002-08-07 | 2006-04-25 | Eastman Kodak Company | Serially connecting OLED devices for area illumination |
| GB0229653D0 (en) * | 2002-12-20 | 2003-01-22 | Cambridge Display Tech Ltd | Electrical connection of optoelectronic devices |
| US6870196B2 (en) * | 2003-03-19 | 2005-03-22 | Eastman Kodak Company | Series/parallel OLED light source |
| US7052355B2 (en) * | 2003-10-30 | 2006-05-30 | General Electric Company | Organic electro-optic device and method for making the same |
-
2004
- 2004-12-22 US US11/020,338 patent/US7259391B2/en not_active Expired - Fee Related
-
2005
- 2005-10-18 JP JP2005302673A patent/JP5486756B2/ja not_active Expired - Fee Related
- 2005-10-19 TW TW094136559A patent/TWI431826B/zh not_active IP Right Cessation
- 2005-10-20 KR KR1020050099255A patent/KR101261638B1/ko not_active Expired - Fee Related
- 2005-10-21 EP EP05256553A patent/EP1684354A3/en not_active Withdrawn
- 2005-10-21 CN CN2009101395657A patent/CN101604702B/zh not_active Expired - Fee Related
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2006179867A (ja) | 2006-07-06 |
| KR101261638B1 (ko) | 2013-05-06 |
| CN1794464A (zh) | 2006-06-28 |
| JP5486756B2 (ja) | 2014-05-07 |
| EP1684354A3 (en) | 2010-10-06 |
| CN100565899C (zh) | 2009-12-02 |
| TW200625709A (en) | 2006-07-16 |
| CN101604702B (zh) | 2012-02-15 |
| EP1684354A2 (en) | 2006-07-26 |
| CN101604702A (zh) | 2009-12-16 |
| US7259391B2 (en) | 2007-08-21 |
| KR20060071855A (ko) | 2006-06-27 |
| US20060134822A1 (en) | 2006-06-22 |
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