JP5486756B2 - 有機電子デバイス用の垂直相互接続 - Google Patents
有機電子デバイス用の垂直相互接続 Download PDFInfo
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- JP5486756B2 JP5486756B2 JP2005302673A JP2005302673A JP5486756B2 JP 5486756 B2 JP5486756 B2 JP 5486756B2 JP 2005302673 A JP2005302673 A JP 2005302673A JP 2005302673 A JP2005302673 A JP 2005302673A JP 5486756 B2 JP5486756 B2 JP 5486756B2
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/82—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/84—Parallel electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/86—Series electrical configurations of multiple OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Description
引き続き相互接続要素に関して、相互接続要素は固体形態であってもよい。例えば、固体形態の相互接続要素は、テープ又はフィルムのうちの1つを含むことができる。或いは、相互接続要素は液体状態であってもよい。例えば、相互接続要素は、ペースト又はインクのうちの1つを含むことができる。
26 第1電極
28 有機材料層(有機層)
30 (第1)相互接続要素
32 第2電極
40 導電性充填材
42 導電性充填材
58 第2相互接続要素
66 母線
72 相互接続組立体
74 第1導電性材料
76 第2導電性材料
78 有機材料層
80 相互接続要素
82 相互接続組立体
Claims (8)
- 各々が第1電極(26)と第2電極(32)とを含む、基板(24)上に配置された複数の有機電子デバイスと、
前記複数の有機電子デバイスの各々の第1及び第2電極(26、32)間に配置された有機層(28)と、
非導電性基材中に分散されかつ前記非導電性基材を貫通して配置された導電性充填材(40、42)を有する前記非導電性基材を含む相互接続層を備えた相互接続要素(30)と、
を備え、
前記導電性充填材(40、42)が、前記非導電性基材および前記有機層を突き抜けて、前記複数の有機電子デバイスの各々の第1又は第2電極(26、32)のいずれかと電気的に結合する導電性粒子を含む、
デバイス(22)。 - 前記デバイス(22)が、第1有機電子デバイスと第2有機電子デバイスとを備え、
該第1及び第2有機電子デバイスが、それぞれ第1電極(26)と第2電極(32)とを備える、
請求項1に記載のデバイス(22)。 - 前記それぞれの第1電極(26)の各々がアノードであり、
前記それぞれの第2電極(32)の各々がカソードである、
請求項2に記載のデバイス(22)。 - 前記複数の有機電子デバイスの各々が、有機発光デバイス、有機光電池、有機光検出器、有機エレクトロクロミックデバイス、有機センサ、又はこれらの組み合わせのうちの1つを含む、請求項1に記載のデバイス(22)。
- 前記導電性粒子が繊維を含む、請求項1から4のいずれかに記載のデバイス(22)。
- 前記相互接続要素が等方性材料を含む、請求項1から5のいずれかに記載のデバイス(22)。
- 前記相互接続要素が非等方性材料を含む、請求項1から5のいずれかに記載のデバイス(22)。
- 前記導電性充填材の大きさが前記非導電性基材の厚さよりも大きい、請求項1から7のいずれかに記載のデバイス(22)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/020,338 US7259391B2 (en) | 2004-12-22 | 2004-12-22 | Vertical interconnect for organic electronic devices |
US11/020,338 | 2004-12-22 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006179867A JP2006179867A (ja) | 2006-07-06 |
JP2006179867A5 JP2006179867A5 (ja) | 2011-06-16 |
JP5486756B2 true JP5486756B2 (ja) | 2014-05-07 |
Family
ID=35976640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005302673A Expired - Fee Related JP5486756B2 (ja) | 2004-12-22 | 2005-10-18 | 有機電子デバイス用の垂直相互接続 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7259391B2 (ja) |
EP (1) | EP1684354A3 (ja) |
JP (1) | JP5486756B2 (ja) |
KR (1) | KR101261638B1 (ja) |
CN (2) | CN100565899C (ja) |
TW (1) | TWI431826B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI686101B (zh) | 2017-04-12 | 2020-02-21 | 日商日本發條股份有限公司 | 加熱器單元 |
TWI687128B (zh) | 2017-04-12 | 2020-03-01 | 日商日本發條股份有限公司 | 護套型加熱器 |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070046179A1 (en) * | 2005-08-26 | 2007-03-01 | Chan-Ching Chang | Organic electro-luminescent device |
US20080311738A1 (en) * | 2007-06-18 | 2008-12-18 | Lakshmi Supriya | Method of forming an interconnect joint |
US7741140B2 (en) * | 2008-01-21 | 2010-06-22 | General Electric Company | Methods, apparatus, and rollers for cross-web forming of optoelectronic devices |
US20090186550A1 (en) * | 2008-01-21 | 2009-07-23 | General Electric Company | Methods, apparatus, and rollers for forming optoelectronic devices |
US20090284158A1 (en) * | 2008-05-16 | 2009-11-19 | General Electric Company | Organic light emitting device based lighting for low cost, flexible large area signage |
US8022623B2 (en) * | 2008-08-15 | 2011-09-20 | General Electric Company | Ultra-thin multi-substrate color tunable OLED device |
US8288951B2 (en) | 2008-08-19 | 2012-10-16 | Plextronics, Inc. | Organic light emitting diode lighting systems |
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WO2010022105A2 (en) * | 2008-08-19 | 2010-02-25 | Plextronics, Inc. | Organic light emitting diode products |
DE102008050332A1 (de) * | 2008-10-07 | 2010-04-22 | Leonhard Kurz Stiftung & Co. Kg | Photovoltaische Zellen sowie Mehrschichtfolie |
JP5992326B2 (ja) * | 2009-04-23 | 2016-09-14 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 抵抗性の相互接続層を有するセグメント化されたエレクトロルミネセンス素子 |
US9161448B2 (en) | 2010-03-29 | 2015-10-13 | Semprius, Inc. | Laser assisted transfer welding process |
US9899329B2 (en) | 2010-11-23 | 2018-02-20 | X-Celeprint Limited | Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance |
US8692457B2 (en) | 2010-12-20 | 2014-04-08 | General Electric Company | Large area light emitting electrical package with current spreading bus |
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US8934259B2 (en) | 2011-06-08 | 2015-01-13 | Semprius, Inc. | Substrates with transferable chiplets |
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US10133426B2 (en) | 2015-06-18 | 2018-11-20 | X-Celeprint Limited | Display with micro-LED front light |
US9704821B2 (en) | 2015-08-11 | 2017-07-11 | X-Celeprint Limited | Stamp with structured posts |
US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
US10380930B2 (en) | 2015-08-24 | 2019-08-13 | X-Celeprint Limited | Heterogeneous light emitter display system |
US10230048B2 (en) | 2015-09-29 | 2019-03-12 | X-Celeprint Limited | OLEDs for micro transfer printing |
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US9786646B2 (en) | 2015-12-23 | 2017-10-10 | X-Celeprint Limited | Matrix addressed device repair |
CN105629543B (zh) * | 2016-01-04 | 2019-03-01 | 京东方科技集团股份有限公司 | 一种柔性液晶显示面板及显示装置 |
US10217730B2 (en) | 2016-02-25 | 2019-02-26 | X-Celeprint Limited | Efficiently micro-transfer printing micro-scale devices onto large-format substrates |
US10193025B2 (en) | 2016-02-29 | 2019-01-29 | X-Celeprint Limited | Inorganic LED pixel structure |
US10153256B2 (en) | 2016-03-03 | 2018-12-11 | X-Celeprint Limited | Micro-transfer printable electronic component |
US10153257B2 (en) | 2016-03-03 | 2018-12-11 | X-Celeprint Limited | Micro-printed display |
US10103069B2 (en) | 2016-04-01 | 2018-10-16 | X-Celeprint Limited | Pressure-activated electrical interconnection by micro-transfer printing |
US10008483B2 (en) | 2016-04-05 | 2018-06-26 | X-Celeprint Limited | Micro-transfer printed LED and color filter structure |
US10199546B2 (en) | 2016-04-05 | 2019-02-05 | X-Celeprint Limited | Color-filter device |
US9997501B2 (en) | 2016-06-01 | 2018-06-12 | X-Celeprint Limited | Micro-transfer-printed light-emitting diode device |
US11137641B2 (en) | 2016-06-10 | 2021-10-05 | X Display Company Technology Limited | LED structure with polarized light emission |
US10222698B2 (en) | 2016-07-28 | 2019-03-05 | X-Celeprint Limited | Chiplets with wicking posts |
US11064609B2 (en) | 2016-08-04 | 2021-07-13 | X Display Company Technology Limited | Printable 3D electronic structure |
US9980341B2 (en) | 2016-09-22 | 2018-05-22 | X-Celeprint Limited | Multi-LED components |
US10782002B2 (en) | 2016-10-28 | 2020-09-22 | X Display Company Technology Limited | LED optical components |
US10347168B2 (en) | 2016-11-10 | 2019-07-09 | X-Celeprint Limited | Spatially dithered high-resolution |
US10395966B2 (en) | 2016-11-15 | 2019-08-27 | X-Celeprint Limited | Micro-transfer-printable flip-chip structures and methods |
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US10600671B2 (en) | 2016-11-15 | 2020-03-24 | X-Celeprint Limited | Micro-transfer-printable flip-chip structures and methods |
US10438859B2 (en) | 2016-12-19 | 2019-10-08 | X-Celeprint Limited | Transfer printed device repair |
US10396137B2 (en) | 2017-03-10 | 2019-08-27 | X-Celeprint Limited | Testing transfer-print micro-devices on wafer |
US11024608B2 (en) | 2017-03-28 | 2021-06-01 | X Display Company Technology Limited | Structures and methods for electrical connection of micro-devices and substrates |
US10748793B1 (en) | 2019-02-13 | 2020-08-18 | X Display Company Technology Limited | Printing component arrays with different orientations |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5326671A (en) * | 1992-12-28 | 1994-07-05 | At&T Bell Laboratories | Method of making circuit devices comprising a dielectric layer of siloxane-caprolactone |
JP3251711B2 (ja) * | 1993-06-02 | 2002-01-28 | 株式会社東芝 | 印刷配線板および印刷配線板の製造方法 |
JP3516965B2 (ja) * | 1993-09-09 | 2004-04-05 | 株式会社東芝 | プリント配線板 |
JP3474937B2 (ja) * | 1994-10-07 | 2003-12-08 | 株式会社東芝 | 実装用配線板の製造方法、半導体パッケージの製造方法 |
JP2000332157A (ja) * | 1999-05-25 | 2000-11-30 | Matsushita Electric Ind Co Ltd | 電子部品実装部材 |
JP3424627B2 (ja) * | 1999-11-26 | 2003-07-07 | 日本電気株式会社 | 半導体装置とそれを用いた三次元半導体装置及びその製造方法並びにテンプレート |
US6566808B1 (en) * | 1999-12-22 | 2003-05-20 | General Electric Company | Luminescent display and method of making |
US6541919B1 (en) * | 2000-02-14 | 2003-04-01 | Sarnoff Corporation | Electrical interconnection of light-emitting fibers, and method therefor |
JP3840926B2 (ja) * | 2000-07-07 | 2006-11-01 | セイコーエプソン株式会社 | 有機el表示体及びその製造方法、並びに電子機器 |
US6768258B2 (en) * | 2000-08-11 | 2004-07-27 | Seiko Epson Corporation | Method for manufacturing organic EL device, organic EL device, and electronic apparatus |
JP2002141173A (ja) * | 2000-08-22 | 2002-05-17 | Semiconductor Energy Lab Co Ltd | 発光装置 |
JP2002343560A (ja) * | 2001-03-16 | 2002-11-29 | Seiko Epson Corp | 有機エレクトロルミネッセンス装置、電子機器 |
FI110675B (fi) * | 2001-07-06 | 2003-03-14 | Valtion Teknillinen | Menetelmä orgaanisen valoa emittoivan diodin muokkaamiseksi |
TW543336B (en) * | 2001-12-13 | 2003-07-21 | Ritdisplay Corp | Global lamp-lighting test method of organic light-emitting diode |
JP2003197379A (ja) * | 2001-12-27 | 2003-07-11 | Print Labo Kk | 導電材料保持シートおよびそれを用いたel発光装置 |
US6872472B2 (en) * | 2002-02-15 | 2005-03-29 | Eastman Kodak Company | Providing an organic electroluminescent device having stacked electroluminescent units |
US7049757B2 (en) * | 2002-08-05 | 2006-05-23 | General Electric Company | Series connected OLED structure and fabrication method |
US6693296B1 (en) * | 2002-08-07 | 2004-02-17 | Eastman Kodak Company | OLED apparatus including a series of OLED devices |
US7034470B2 (en) * | 2002-08-07 | 2006-04-25 | Eastman Kodak Company | Serially connecting OLED devices for area illumination |
GB0229653D0 (en) * | 2002-12-20 | 2003-01-22 | Cambridge Display Tech Ltd | Electrical connection of optoelectronic devices |
US6870196B2 (en) * | 2003-03-19 | 2005-03-22 | Eastman Kodak Company | Series/parallel OLED light source |
US7052355B2 (en) * | 2003-10-30 | 2006-05-30 | General Electric Company | Organic electro-optic device and method for making the same |
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Cited By (2)
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TWI686101B (zh) | 2017-04-12 | 2020-02-21 | 日商日本發條股份有限公司 | 加熱器單元 |
TWI687128B (zh) | 2017-04-12 | 2020-03-01 | 日商日本發條股份有限公司 | 護套型加熱器 |
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CN1794464A (zh) | 2006-06-28 |
JP2006179867A (ja) | 2006-07-06 |
TW200625709A (en) | 2006-07-16 |
CN100565899C (zh) | 2009-12-02 |
CN101604702A (zh) | 2009-12-16 |
KR20060071855A (ko) | 2006-06-27 |
US7259391B2 (en) | 2007-08-21 |
TWI431826B (zh) | 2014-03-21 |
EP1684354A3 (en) | 2010-10-06 |
CN101604702B (zh) | 2012-02-15 |
EP1684354A2 (en) | 2006-07-26 |
KR101261638B1 (ko) | 2013-05-06 |
US20060134822A1 (en) | 2006-06-22 |
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