TWI431677B - Segmentation method of packaging substrate - Google Patents

Description

Method for dividing package substrate Field of invention

The present invention relates to a method of dividing a package substrate such as a CSP substrate or a QFN substrate.

Background of the invention

With the high integration of semiconductors, such as BGA (Ball Grid Array) or QFN (Quad Flat Non-leaded Package), etc. A processing device such as a dicing device is processed in the field to be cut and formed into a package having a size substantially the same as that of the semiconductor wafer.

Here, in general, the semiconductor wafer is aligned with the position of the cutting area to be cut and the positioning of the cutting insert, and the cutting industry is aligned with the cutting area, and then the intervals of the respective cutting areas are indexed into one side. The cutting insert is cut on one side, that is, the alignment system is performed only for the cutting area where the cutting is performed first, and therefore, all the fields to be cut are formed in parallel with high precision before cutting.

However, in fact, there are cases in which the angles of the various fields are deviated, especially in the case of a CSP (Chip Size Package) substrate or a QFN substrate, strain is generated on the wiring substrate during resin molding, and each of the fields to be cut is used. The parallel accuracy is easily reduced. When the fields to be cut are not parallel, if it is assumed that all the fields to be cut are formed in parallel and cut as described above, they are cut into fields other than the field to be cut, such as the wafer field. There is also the problem of damaging the semiconductor components.

Therefore, if the alignment is performed for all the fields to be cut, and the respective fields to be cut are cut with reference to the alignment information of each of the areas to be cut (for example, refer to Patent Document 1), or to measure the alignment target disposed on the opposite side of the substrate. The distance is calculated by dividing the number of processing lines, calculating the machining index and cutting it (for example, see Patent Document 2), and performing special alignment and more precise alignment (equal processing) Processing.

[Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 9-52227

[Patent Document 2] JP-A-2002-33295

[Summary of the Invention] Invention

However, in a substrate having a large strain, when a large number of blocks on the long side of the package are traversed and cut, the error in one line is large, and even if the special alignment is as described above, cutting to the field of cutting is generated. The problem of externality, therefore, additional procedures for partitioning the package substrate at the beginning of each block, and individualizing each of the divided blocks, are increased and inefficient.

The present invention has been made in view of the above problems, and an object of the invention is to provide a method for dividing a package substrate which can be efficiently and accurately cut in a state in which a strained substrate is used even in a strained substrate.

In order to solve the foregoing problems and achieve the object, a method for dividing a package substrate according to the present invention uses a cutting device to divide a package substrate into individual package components, and the package substrate is divided into predetermined lines by a predetermined line. The plurality of blocks of the plurality of elements are arranged in two or more blocks and are connected by the remaining connecting portions. The cutting device includes a chuck table that holds the package substrate and can adjust a rotation angle. The cutting mechanism has a cutting mechanism. Cutting the cutting insert of the package substrate held on the chuck table, and cutting and exiting in a vertical direction with respect to the surface of the chuck table; cutting the feeding mechanism to perform cutting feed to make the chuck The table moves in the cutting feed direction opposite to the cutting mechanism; and the indexing feed mechanism performs indexing feed so that the chuck table and the cutting mechanism face each other orthogonal to the cutting feed direction The indexing feed direction moves. Further, the method for dividing the package substrate includes: measuring a method of measuring an angle of all the planned dividing lines of the block unit of the package substrate held on the chuck stage; and cutting the program using the measured area The cutting of the predetermined dividing line is sequentially performed at an angle of the dividing line of the block width, and in the cutting process, the block is arranged in the cutting feed direction by the remaining connecting portion, and two or more pieces are connected When cutting in the direction, the following series of operations are repeated: the cutting insert cuts into the remaining joint portion and performs cutting feed of one block, and if the cutting insert reaches the adjacent remaining joint portion, the cutting mechanism faces Temporarily exit at the top.

Since the method of dividing the package substrate according to the present invention measures the tilt angle in the block unit by the long side of the remaining connection portion, and sequentially changes the rotation of the package substrate by the angle of the division line of one block width. Cutting at an angle, so that even in the case of a strained substrate, the cutting process can be performed with good precision, and by each block width At the time of cutting, the cutting insert is repeatedly pulled upward and then cut into the remaining joint portion, and the treatment can be efficiently performed directly in a state in which the strained substrate is provided.

The best form for implementing the invention

Hereinafter, a method of dividing a package substrate using the cutting device of the preferred embodiment of the present invention will be described with reference to the drawings.

Fig. 1 is an external perspective view showing an example of a cutting apparatus to which a method of dividing a package substrate according to an embodiment of the present invention is applied, and Fig. 2 is a perspective view showing a structure around which a cutting mechanism is taken out. In the cutting apparatus 10 of the present embodiment, the package substrate 11 such as a CSP substrate to be cut is cut along a line to be divided, and the schematic structure is as shown in Fig. 1, and includes a chuck table 12, an image pickup mechanism 13, and a cutting mechanism 20. And control mechanism 30.

The cutting mechanism 20 includes a main shaft 22 to which a cutting insert 21 is attached and detachable, and a casing 23 that supports the main shaft 22 so as to be rotatable and includes a driving source (not shown) that is rotationally driven and has a circular shape In the tubular shape, the cutting insert 21 acts on the package substrate 11 held by the chuck table 12 and cuts it.

The photographing mechanism 13 is provided with a microscope for CCD camera or the like for photographing the surface of the package substrate 11 held on the chuck table 12, and is provided for alignment of the cutting insert 21 with respect to the position to be cut. As shown in FIG. 2, the photographing mechanism 13 is disposed on the side portion of the outer casing 23 so as to be aligned with the cutting insert 21 in the X-axis direction, and is movable integrally with the cutting mechanism 20.

The package substrate 11 is passed through the holding tape T and held on the chuck table 12 in a state of being integrated with the frame F. As shown in Fig. 2, the chuck table 12 holding the package substrate 11 is coupled to the rotating mechanism 14. And rotating in a horizontal plane, the rotating mechanism 14 is fixed to the moving base 15, wherein the cutting device 10 includes a cutting feed mechanism 50, a cutting feed mechanism 60, and a feed operation necessary for performing a cutting operation. The indexing feed mechanism 70.

The cutting feed mechanism 50 is configured to move the moving base 15 in the X-axis direction, thereby causing the chuck table 12 to perform cutting feed in the X-axis direction with respect to the cutting mechanism 20. The cutting feed mechanism 50 includes a ball screw 51 that is disposed in the X-axis direction, a pulse motor 52 that is coupled to one end of the ball screw 51, and a pair of guide rails 53 that are arranged in parallel with the ball screw 51. Further, a nut (not shown) provided on the lower portion of the moving base 15 is screwed to the ball screw 51. The ball screw 51 is driven and rotated by the pulse motor 52, and the moving base 15 is guided by the guide rail 53 to move in the X-axis direction.

The cutting feed mechanism 60 is configured to move the support portion 16 of the outer casing 23 supporting the cutting mechanism 20 relative to the wall portion 17 in the Z-axis direction, thereby moving the cutting mechanism 20 up and down and controlling the cutting with respect to the package substrate 11. the amount. The cutting feed mechanism 60 includes a ball screw 61 that is disposed on one side of the wall portion 17 in the Z-axis direction, a pulse motor 62 that rotates the ball screw 61, and a pair of guide rails 63 that are arranged in a row. In parallel with the ball screw 61, a nut (not shown) inside the support portion 16 is screwed to the ball screw 61. The support portion 16 is driven by the pulse motor 62, and is guided by the guide rail 63 and lifted in the Z-axis direction as the ball screw 61 rotates. Further, the cutting blade 20 of the cutting mechanism 20 supported by the support portion 16 is also directed Lifting in the Z-axis direction, whereby the cutting mechanism 20 can be relatively The surface of the chuck table 11 is cut in and out in a vertical direction.

The indexing feed mechanism 70 is configured to move the wall portion 17 of the outer casing 23 that supports the cutting mechanism 20 through the support portion 16 in the Y-axis direction, thereby causing the cutting mechanism 20 to face the Y-axis direction with respect to the chuck table 12 Perform indexing feed. The index feeding mechanism 70 includes a ball screw 71 disposed in the Y-axis direction, a pulse motor 72 coupled to one end of the ball screw 71, and a pair of guide rails 73 arranged in parallel with the ball screw 71. Further, a nut (not shown) provided on a lower portion of the moving base 18 formed integrally with the wall portion 17 is screwed to the ball screw 71. The ball screw 71 is driven and rotated by the pulse motor 72, and the moving base 18 is guided by the guide shaft 73 to move in the Y-axis direction.

The control mechanism 30 controls the photographing mechanism 13, the cutting mechanism 20, the cutting feed mechanism 50, the cutting feed mechanism 60, the index feed mechanism 70, and the like when cutting the package substrate 11 by the cutting insert 21, and executes The following procedure, that is, the measurement procedure is to measure the angles of all the division lines of the block unit of the package substrate 11 held on the chuck table 12; and the cutting program is to use the division line of the measured width of one block. At the angle, the cutters dividing the predetermined line are sequentially performed. At this time, in the cutting program, it is controlled to repeat the following series of operations when the cutting is performed in the direction in which the remaining connecting portions are arranged in the cutting feed direction and the two or more pieces are connected, that is, the cutting insert 21 is attached to the remaining joint portion. The cutting feed of one block is cut in and performed, and if the cutting insert 21 reaches the adjacent remaining joint portion, the cutting mechanism 20 temporarily exits upward.

Hereinafter, a method of dividing the package substrate 11 of the present embodiment which is carried out under the control of the control unit 30 will be described in detail. First, in the present embodiment, The package substrate 11 to be subjected to the cutting is formed by laminating one or two or more semiconductor wafers on the surface of the wiring substrate from which the spherical terminals protrude from the inner surface, and then molding the bonded semiconductor wafer with a resin, thereby, for example, As shown in Fig. 3, one substrate can be formed. Here, the package substrate 11 is connected to the plurality of blocks A, B, C, and D by the remaining connection portion E and formed into an elongated rectangular shape. Further, the plurality of blocks A, B, C, and D are divided by a predetermined line. (Street) S divides and forms an element 11a such as a predetermined number of CSP chips. In the third diagram and the like, four blocks each composed of 3 × 3 = 9 elements 11a are shown. However, the more practical structure of the package substrate 11 is, for example, the length L of the long side direction is 220 mm, and each The five blocks composed of 7 × 5 = 35 elements 11a are connected to each other in the longitudinal direction through the remaining connecting portion E having a width of 6.5 mm.

Further, in the package substrate 11, an alignment pattern is formed at a position other than the block A to D every predetermined line S. Here, when focusing on the longitudinal direction of the package substrate 11, the longitudinal direction dividing line is defined. The alignment pattern at the position of S is formed as blocks A to D, such as A ₁₁ , A ₁₄ , B ₁₁ , B ₁₄ , C ₁₁ , C ₁₄ , D ₁₁ , D ₁₄ , A ₂₁ , ~, A ₄₁ , A ₄₄ , B ₄₁ , B ₄₄ , C ₄₁ , C ₄₄ , D ₄₁ , and D ₄₄ , and an alignment pattern defining the position of the predetermined line S in the short-side direction is also formed in the same manner. The strain of the package substrate 11 is large, and as shown in Fig. 3, the planned dividing line S is often curved in an arc shape.

First, when the package substrate 11 held on the chuck table 12 is to be cut, it is necessary to first position the cutting-to-cut dividing line and the Y-axis direction of the cutting insert 21, so that the chuck table is cut by the cutting feed mechanism 50. 12 moves in the X-axis direction while moving the photographing mechanism 13 in the Y-axis direction by the index feeding mechanism 70, and positions the package substrate 11 directly under the photographing mechanism 13, and seals The surface of the substrate 11 is mounted for photographing.

Here, each of the alignment patterns is sequentially photographed, and the X coordinate and the Y coordinate of each alignment pattern are obtained, thereby measuring the block A to D unit of the package substrate 11 held on the chuck table 12. For example, as shown in FIG. 4, the division line S is obtained by ascertaining the coordinates of the alignment patterns A ₁₁ and A ₁₄ of the block A as shown in FIG. 4 . inclination angle ₁₁ with respect to the X-axis direction of θ _11, and so the memory in the memory (not shown). Further, by determining the coordinates of the alignment patterns B ₁₁ and B ₁₄ of the block B, the inclination angle θ _{12 of the} division planned line S ₁₂ with respect to the X-axis direction is obtained, and the alignment of the block C is obtained. The coordinates of the patterns C ₁₁ and C _{14 are} obtained by obtaining the inclination angle θ _{13 of the} division planned line S ₁₃ with respect to the X-axis direction, and the division is obtained by finding the coordinates of the alignment patterns D ₁₁ and D ₁₄ of the block D. a line S ₁₄ with respect to the X-axis direction of the inclination angle θ _14, and so the memory in the memory (not shown). Similarly, the predetermined dividing lines S ₂₁ to S _{44 are} similarly obtained by the tilt angle, and are stored in a memory (not shown). The dividing line in the short-side direction is also determined according to the coordinates of the alignment pattern. The angle of inclination in the Y-axis direction is stored in a memory not shown.

Next, the cutting of the planned dividing line is sequentially performed by the angle of the predetermined dividing line of the measured block width, and the cutting in the longitudinal direction will be described here. First, as shown in FIG. 5 (a) of FIG, 14 by the rotation mechanism, the tilt angle θ ₁₁ parts to enable rotation of the chuck table 12, whereby the first block A with the dividing lines S ₁₁ made with the X-axis The directions are parallel. And, by indexing means 70, the cutting mechanism 20 in the Y-axis direction, whereby the cutting insert 21 of the Y coordinate position coincides with a predetermined dividing line S _11. Further, in this state, the cutting stage 12 is moved in the -X-axis direction by the cutting feed mechanism 50, and the cutting mechanism 20 is lowered by the cutting feed mechanism 60, and the cutting blade 21 which is rotated at a high speed is self-rotating. The remaining connecting portion E of the end portion of the package substrate 11 is cut in, and the cutting of the block A by one block is performed, whereby the split portion (cutting groove) K of the dividing line S ₁₁ for the block A is formed. ₁₁ .

Then, if the end block A is cut by the entire piece of the dividing line S ₁₁ of one block width portion and reaches the remaining joint portion E between the adjacent lower block B, the cutting mechanism 60 is cut by the feed mechanism 60. The cutting mechanism 20 is temporarily withdrawn upward, whereby the cutting operation is interrupted. Further, by the rotation mechanism 14, the chuck table 12 is rotated at a relative angle (θ _{12 -} θ ₁₁ ) between the predetermined line S ₁₁ and the block 12 is rotated as shown in Fig. 5(b). The dividing line S _{12 for} B is made parallel to the X-axis direction. And, by indexing means 70, the cutting mechanism 20 in the Y-axis direction, whereby the cutting insert 21 of the Y coordinate position coincides with a predetermined dividing line S _12. Further, in this state, the cutting stage 12 is moved in the -X-axis direction by the cutting feed mechanism 50, and the cutting mechanism 20 is lowered by the cutting feed mechanism 60, and the cutting blade 21 which is rotated at a high speed is self-rotating. The remaining connection portion E between the blocks A and B of the package substrate 11 is again cut in, and the block B is subjected to cutting feed by one block, thereby forming the dividing line S ₁₂ for the block B. Splitting part K ₁₂ .

Then, if the end block B is cut by the entire piece of the dividing line S ₁₂ of one block width portion and reaches the remaining joint portion E between the adjacent lower block C, the cutting mechanism 60 is cut by the feed mechanism 60. The cutting mechanism 20 is temporarily withdrawn upward, whereby the cutting operation is interrupted. Further, by the rotation mechanism 14, the chuck table 12 is rotated by the relative angle (θ _{13 -} θ ₁₂ ) between the planned dividing line S ₁₂ and the block 12 is rotated as shown in Fig. 5(c). The dividing line S _{13 for} C is made parallel to the X-axis direction. And, by indexing means 70, the cutting mechanism 20 in the Y-axis direction, whereby the cutting insert 21 of the Y coordinate position coincides with a predetermined dividing line S _13. Further, in this state, the cutting stage 12 is moved in the -X-axis direction by the cutting feed mechanism 50, and the cutting mechanism 20 is lowered by the cutting feed mechanism 60, and the cutting blade 21 which is rotated at a high speed is self-rotating. The remaining connecting portion E between the blocks B and C of the package substrate 11 is again cut in, and the cutting of the block C is performed by one block, thereby forming the dividing line S ₁₃ for the compliant block C. Splitting part K ₁₃ .

Furthermore, if the end block C is cut by a whole piece of the predetermined dividing line S ₁₃ of one block width portion and reaches the remaining joint portion E between the adjacent lower block D, the cutting feed mechanism is cut by 60 causes the cutting mechanism 20 to temporarily exit upward, thereby interrupting the cutting operation. Further, by the rotation mechanism 14, the chuck table 12 is rotated by the relative angle (θ _{14 -} θ ₁₃ ) between the predetermined line S ₁₃ and the block 12 is rotated as shown in Fig. 5(d). The dividing line S _{14 for} D is made parallel to the X-axis direction. And, by indexing means 70, the cutting mechanism 20 in the Y-axis direction, whereby the cutting insert 21 of the Y coordinate position coincides with a predetermined dividing line S _14. Further, in this state, the cutting stage 12 is moved in the -X-axis direction by the cutting feed mechanism 50, and the cutting mechanism 20 is lowered by the cutting feed mechanism 60, and the cutting blade 21 which is rotated at a high speed is self-rotating. The remaining connecting portion E between the blocks C and D of the package substrate 11 is again cut in, and the cutting of the block D is performed by one block, thereby forming the dividing line S ₁₄ for the compliant block D. Splitting part K ₁₄ .

In the following, the same operation is repeated for each of the division planned lines S ₂₁ to S ₄₄ , whereby the splitting portions K ₁₁ to K of the respective divided planned lines S ₁₁ to S ₄₄ in the longitudinal direction are formed as shown in Fig. 6 . ₄₄ . Further, the cutting process in accordance with each of the predetermined dividing lines in the short-side direction is performed as is conventional.

That is, if there is no strain on the package substrate 11, for example, the portions of the predetermined dividing lines S ₁₁ , S ₁₂ , S ₁₃ , and S ₁₄ can be formed as a continuous dividing line to be continuously cut by the cutting insert 21, However, in the present embodiment, in consideration of the bending or the like due to the strain of the package substrate 11, a predetermined line to be continuously divided is divided into predetermined dividing lines S ₁₁ , S ₁₂ , S ₁₃ , and S ₁₄ and divided into a plurality of lines. And each position determines its position or angle, and according to its position information or angle information, the cutting is performed by the chopper cutting method of the block unit. Here, a boundary line which is divided into a plurality of lines to be divided into a plurality of lines is formed as a remaining joint portion E having a width of 6.5 mm between the blocks, whereby the angle can be changed while a line is to be continuously divided into a predetermined line. The impact is minimal.

According to this, in the method of dividing the package substrate 11 of the present embodiment, the inclination angle is measured in the block unit on the long side connected by the remaining connection portion E, and the division line by one block width is used. Since the angle of rotation of the package substrate 11 is sequentially changed and cut, the cutting process can be performed with good precision even when the package substrate 11 having a large strain is used. Further, since the cutting blade 21 is temporarily pulled upward and then cut in the remaining connecting portion E at the time of cutting each of the block width portions, it can be directly in the state of having the strained one-piece package substrate 11. The processing is effectively performed.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. For example, in the present embodiment, the coordinates of all the alignment patterns are read and the positions of the respective division lines are measured. Angle, however, for example, with respect to the block A, the coordinates of the two alignment patterns A ₁₁ , A ₁₄ , A ₄₁ , A ₄₄ disposed on the opposite sides of the block A can also be read and measured, and By dividing the predetermined number of lines into equal divisions, the positions and angles of the division planned lines S ₁₁ , S ₂₁ , S ₃₁ , and S _{41 are} determined.

In the present embodiment, an application example of the package substrate 11 such as a CSP substrate will be described. However, a QFN substrate may be used. Further, a wafer level CSP (WL-CSP) called a next-generation CSP may be similarly used. Be applicable.

10‧‧‧ cutting device

11‧‧‧Package substrate

11a‧‧‧ components

12‧‧‧ chuck table

13‧‧‧Photography

14‧‧‧Rotating mechanism

15,18‧‧‧Mobile abutments

16‧‧‧Support Department

17‧‧‧ wall

20‧‧‧ cutting mechanism

21‧‧‧Cutting inserts

22‧‧‧ Spindle

23‧‧‧ Shell

30‧‧‧Control agency

50‧‧‧ cutting feed mechanism

51,61,71‧‧‧ball screw

52,62,72‧‧‧pulse motor

53,63,73‧‧‧guide

60‧‧‧ cut into the feeding institution

70‧‧‧分分进机构

A, B, C, D‧‧‧ blocks

E‧‧‧ remaining link

F‧‧‧ frame

K‧‧‧ splitting department

S‧‧‧ dividing line

T‧‧‧Retaining belt

Fig. 1 is an external perspective view showing an example of a cutting device to which a method of dividing a package substrate according to an embodiment of the present invention is applied.

Fig. 2 is a perspective view showing the configuration around the cutting mechanism of Fig. 1 taken out.

Fig. 3 is a schematic plan view showing a package substrate.

Fig. 4 is a schematic plan view showing an example of measurement results of a dividing line of the package substrate.

The fifth (a) to (d) drawings sequentially show a schematic plan view of a division processing example of the package substrate.

Fig. 6 is a schematic plan view showing an example of a split portion formed on a package substrate.

11‧‧‧Package substrate

A, B, C, D‧‧‧ blocks

E‧‧‧ remaining link

K ₁₁ , K ₁₂ , K ₁₃ , K ₁₄ ‧ ‧ division

Claims (1)

A method for dividing a package substrate, wherein the package substrate is divided into individual package components by using a cutting device, and the package substrate is formed by dividing a predetermined number of blocks by a predetermined dividing line to form two or more blocks and by remaining connecting portions Further, the cutting device includes: a chuck table that holds the package substrate and adjusts a rotation angle; and the cutting mechanism includes a cutting blade that cuts the package substrate held on the chuck table And cutting in and out with respect to the surface of the chuck table in a vertical direction; the cutting feed mechanism performs cutting feed to move the chuck table relative to the cutting mechanism in a cutting feed direction; and The indexing feed mechanism performs indexing feed so that the chuck table and the cutting mechanism move toward the index feed direction orthogonal to the cutting feed direction, and the package substrate is divided. The method includes: measuring a method of measuring an angle of all dividing lines of the block unit of the package substrate held on the chuck table; The cutting program sequentially cuts the predetermined dividing line by the angle of the predetermined dividing line of the measured block width, and in the cutting process, the cutting is performed by the remaining connecting portion toward the cutting When the feed direction is arranged and the cutting is performed in a direction in which two or more pieces are joined, the following series of operations are repeated: the cutting insert cuts into the remaining joint portion and performs cutting feed of one block, if the cutting insert reaches the adjacent one In the remaining connecting portion, the cutting mechanism temporarily exits upward.