TWI423366B - 藉由低粘度流體移除顆粒用之單基板處理頭 - Google Patents
藉由低粘度流體移除顆粒用之單基板處理頭 Download PDFInfo
- Publication number
- TWI423366B TWI423366B TW98122048A TW98122048A TWI423366B TW I423366 B TWI423366 B TW I423366B TW 98122048 A TW98122048 A TW 98122048A TW 98122048 A TW98122048 A TW 98122048A TW I423366 B TWI423366 B TW I423366B
- Authority
- TW
- Taiwan
- Prior art keywords
- fluid
- substrate
- panel
- feeders
- main
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title claims description 225
- 239000000758 substrate Substances 0.000 title claims description 144
- 239000002245 particle Substances 0.000 title description 4
- 238000011084 recovery Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 9
- 238000004064 recycling Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85938—Non-valved flow dividers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/165,577 US8584613B2 (en) | 2008-06-30 | 2008-06-30 | Single substrate processing head for particle removal using low viscosity fluid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201009981A TW201009981A (en) | 2010-03-01 |
| TWI423366B true TWI423366B (zh) | 2014-01-11 |
Family
ID=41445969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98122048A TWI423366B (zh) | 2008-06-30 | 2009-06-30 | 藉由低粘度流體移除顆粒用之單基板處理頭 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8584613B2 (enExample) |
| JP (1) | JP2011527123A (enExample) |
| KR (2) | KR101632974B1 (enExample) |
| CN (1) | CN102105967B (enExample) |
| SG (1) | SG192443A1 (enExample) |
| TW (1) | TWI423366B (enExample) |
| WO (1) | WO2010002905A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7849554B2 (en) * | 2009-04-28 | 2010-12-14 | Lam Research Corporation | Apparatus and system for cleaning substrate |
| CN106999962B (zh) * | 2014-09-11 | 2019-11-15 | 亨茨曼国际有限公司 | 设计和制造分配棒的方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5836520A (en) * | 1995-10-28 | 1998-11-17 | Institute Of Microelectronics | Apparatus for dispensing fluid in an array pattern |
| US20050260789A1 (en) * | 2004-05-21 | 2005-11-24 | Texas Instruments Incorporated | Method and system for applying an adhesive substance on an electronic device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4276011A (en) * | 1979-02-21 | 1981-06-30 | American Cyanamid Company | Spinnerette assembly |
| US5618566A (en) * | 1995-04-26 | 1997-04-08 | Exxon Chemical Patents, Inc. | Modular meltblowing die |
| US6220843B1 (en) * | 1998-03-13 | 2001-04-24 | Nordson Corporation | Segmented die for applying hot melt adhesives or other polymer melts |
| US6689215B2 (en) | 1998-09-17 | 2004-02-10 | Asml Holdings, N.V. | Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
| US7000622B2 (en) * | 2002-09-30 | 2006-02-21 | Lam Research Corporation | Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus |
| JP3955197B2 (ja) * | 2001-09-28 | 2007-08-08 | アルプス電気株式会社 | ウエット処理用ノズルおよびウエット処理装置 |
| US7093375B2 (en) | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
| JP4343031B2 (ja) * | 2004-05-31 | 2009-10-14 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| CA2612020A1 (en) | 2005-06-23 | 2006-12-28 | Akzo Nobel Coatings International B.V. | Dispenser |
| JP2007158161A (ja) | 2005-12-07 | 2007-06-21 | Elpida Memory Inc | ウエハ洗浄装置及びウエハ洗浄方法 |
| US20080038448A1 (en) | 2006-08-11 | 2008-02-14 | Lam Research Corp. | Chemical resistant semiconductor processing chamber bodies |
-
2008
- 2008-06-30 US US12/165,577 patent/US8584613B2/en not_active Expired - Fee Related
-
2009
- 2009-06-30 TW TW98122048A patent/TWI423366B/zh not_active IP Right Cessation
- 2009-06-30 CN CN200980125832.3A patent/CN102105967B/zh not_active Expired - Fee Related
- 2009-06-30 JP JP2011516821A patent/JP2011527123A/ja active Pending
- 2009-06-30 SG SG2013049945A patent/SG192443A1/en unknown
- 2009-06-30 WO PCT/US2009/049280 patent/WO2010002905A1/en not_active Ceased
- 2009-06-30 KR KR1020117006691A patent/KR101632974B1/ko not_active Expired - Fee Related
- 2009-06-30 KR KR1020117002399A patent/KR20110028530A/ko not_active Withdrawn
-
2013
- 2013-10-11 US US14/052,194 patent/US20140041581A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5836520A (en) * | 1995-10-28 | 1998-11-17 | Institute Of Microelectronics | Apparatus for dispensing fluid in an array pattern |
| US20050260789A1 (en) * | 2004-05-21 | 2005-11-24 | Texas Instruments Incorporated | Method and system for applying an adhesive substance on an electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011527123A (ja) | 2011-10-20 |
| US8584613B2 (en) | 2013-11-19 |
| KR101632974B1 (ko) | 2016-06-23 |
| WO2010002905A1 (en) | 2010-01-07 |
| SG192443A1 (en) | 2013-08-30 |
| CN102105967A (zh) | 2011-06-22 |
| US20140041581A1 (en) | 2014-02-13 |
| KR20110044327A (ko) | 2011-04-28 |
| TW201009981A (en) | 2010-03-01 |
| KR20110028530A (ko) | 2011-03-18 |
| CN102105967B (zh) | 2014-10-08 |
| US20090320942A1 (en) | 2009-12-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |