KR101632974B1 - 낮은 점도 유체를 사용하여 입자를 제거하기 위한 단일의 기판 프로세싱 헤드 - Google Patents

낮은 점도 유체를 사용하여 입자를 제거하기 위한 단일의 기판 프로세싱 헤드 Download PDF

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Publication number
KR101632974B1
KR101632974B1 KR1020117006691A KR20117006691A KR101632974B1 KR 101632974 B1 KR101632974 B1 KR 101632974B1 KR 1020117006691 A KR1020117006691 A KR 1020117006691A KR 20117006691 A KR20117006691 A KR 20117006691A KR 101632974 B1 KR101632974 B1 KR 101632974B1
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South Korea
Prior art keywords
fluid
substrate
feeds
reservoir
main bore
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Expired - Fee Related
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KR1020117006691A
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English (en)
Korean (ko)
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KR20110044327A (ko
Inventor
아놀드 콜로덴코
청-유 린
레온 긴즈버그
마크 만델보임
그레고리 에이 토마슈
앤워 후세인
Original Assignee
램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85938—Non-valved flow dividers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020117006691A 2008-06-30 2009-06-30 낮은 점도 유체를 사용하여 입자를 제거하기 위한 단일의 기판 프로세싱 헤드 Expired - Fee Related KR101632974B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/165,577 US8584613B2 (en) 2008-06-30 2008-06-30 Single substrate processing head for particle removal using low viscosity fluid
US12/165,577 2008-06-30

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020117002399A Division KR20110028530A (ko) 2008-06-30 2009-06-30 낮은 점도 유체를 사용하여 입자를 제거하기 위한 단일의 기판 프로세싱 헤드

Publications (2)

Publication Number Publication Date
KR20110044327A KR20110044327A (ko) 2011-04-28
KR101632974B1 true KR101632974B1 (ko) 2016-06-23

Family

ID=41445969

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020117006691A Expired - Fee Related KR101632974B1 (ko) 2008-06-30 2009-06-30 낮은 점도 유체를 사용하여 입자를 제거하기 위한 단일의 기판 프로세싱 헤드
KR1020117002399A Withdrawn KR20110028530A (ko) 2008-06-30 2009-06-30 낮은 점도 유체를 사용하여 입자를 제거하기 위한 단일의 기판 프로세싱 헤드

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020117002399A Withdrawn KR20110028530A (ko) 2008-06-30 2009-06-30 낮은 점도 유체를 사용하여 입자를 제거하기 위한 단일의 기판 프로세싱 헤드

Country Status (7)

Country Link
US (2) US8584613B2 (enExample)
JP (1) JP2011527123A (enExample)
KR (2) KR101632974B1 (enExample)
CN (1) CN102105967B (enExample)
SG (1) SG192443A1 (enExample)
TW (1) TWI423366B (enExample)
WO (1) WO2010002905A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
CN106999962B (zh) * 2014-09-11 2019-11-15 亨茨曼国际有限公司 设计和制造分配棒的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109929A (ja) 2001-09-28 2003-04-11 Alps Electric Co Ltd ウエット処理用ノズルおよびウエット処理装置
JP2005347326A (ja) 2004-05-31 2005-12-15 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP2006501691A (ja) 2002-09-30 2006-01-12 ラム　リサーチ　コーポレーション 動的液体メニスカスを使用して基板を処理する方法及びシステム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276011A (en) * 1979-02-21 1981-06-30 American Cyanamid Company Spinnerette assembly
US5618566A (en) * 1995-04-26 1997-04-08 Exxon Chemical Patents, Inc. Modular meltblowing die
SG45121A1 (en) * 1995-10-28 1998-01-16 Inst Of Microelectronics Apparatus for dispensing fluid in an array pattern
US6220843B1 (en) * 1998-03-13 2001-04-24 Nordson Corporation Segmented die for applying hot melt adhesives or other polymer melts
US6689215B2 (en) 1998-09-17 2004-02-10 Asml Holdings, N.V. Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US20050260789A1 (en) * 2004-05-21 2005-11-24 Texas Instruments Incorporated Method and system for applying an adhesive substance on an electronic device
CA2612020A1 (en) 2005-06-23 2006-12-28 Akzo Nobel Coatings International B.V. Dispenser
JP2007158161A (ja) 2005-12-07 2007-06-21 Elpida Memory Inc ウエハ洗浄装置及びウエハ洗浄方法
US20080038448A1 (en) 2006-08-11 2008-02-14 Lam Research Corp. Chemical resistant semiconductor processing chamber bodies

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109929A (ja) 2001-09-28 2003-04-11 Alps Electric Co Ltd ウエット処理用ノズルおよびウエット処理装置
JP2006501691A (ja) 2002-09-30 2006-01-12 ラム　リサーチ　コーポレーション 動的液体メニスカスを使用して基板を処理する方法及びシステム
JP2005347326A (ja) 2004-05-31 2005-12-15 Tokyo Electron Ltd 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
JP2011527123A (ja) 2011-10-20
US8584613B2 (en) 2013-11-19
WO2010002905A1 (en) 2010-01-07
SG192443A1 (en) 2013-08-30
TWI423366B (zh) 2014-01-11
CN102105967A (zh) 2011-06-22
US20140041581A1 (en) 2014-02-13
KR20110044327A (ko) 2011-04-28
TW201009981A (en) 2010-03-01
KR20110028530A (ko) 2011-03-18
CN102105967B (zh) 2014-10-08
US20090320942A1 (en) 2009-12-31

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