TWI417908B - 具可撓性之高導磁率片材及其製作方法 - Google Patents
具可撓性之高導磁率片材及其製作方法 Download PDFInfo
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Description
本發明係有關於一種解決電磁干擾之技術,特別是有關於一種可撓性之高導磁率片材及其製作方法。
隨著通訊、消費、筆記型電腦等電子技術日新月異,將許多電子元組件組合裝配於更小的電路面積時,如何解決電磁干擾(electromagnetic interference,以下可簡稱EMI)是一重要議題,所謂EMI是指會對信號造成阻礙之雜音、雜訊,其干擾的通道有由發生源,經空間傳播而干擾者(輻射雜訊)和經由電源線的傳導而干擾者(傳導雜訊)。對傳導雜訊,經常使用電容器、電感器、EMI濾波器或以抗EMI薄片繞成環狀作為磁蕊等來去濾除傳導雜訊;對於輻射雜訊,則是以抗EMI薄片來吸收輻射的雜訊或導電薄片來反射輻射的雜訊。因此抗EMI薄片不管是傳導雜訊或輻射雜訊都可派上用場,舉凡有高速訊號傳輸的積體電路、線路或纜線都會需要抗EMI薄片來濾除傳導雜訊或來阻隔電磁雜訊。
一般的導磁抗EMI薄片大都將磁性材料粉末與樹脂或橡膠混合混練,調製成漿料或膠料,經刮刀成型或滾輪壓製等方式,製成具有可撓性之薄片。其缺點是薄片需含固定比例的樹脂或橡膠,普遍造成抗EMI薄片導磁率低,因此EMI與磁場遮蔽(shielding)之效果不佳。為了解決抗EMI薄片導磁率低的問題,除了改變磁性材料粉末之外,方法之一為提高磁性材料粉末的填充比,然而,磁性材料粉末填充比的增加已經有限。
本發明提供一種具可撓性之高導磁率片材,包括含有複數個微間隙碎片的軟磁性鐵氧體燒結薄片及一第一彈性層,此第一彈性層貼合於該軟磁性鐵氧體燒結薄片之一第一表面,其中上述碎片於微間隙兩側的第一凹凸狀結構和第二凹凸狀結構在微觀上係相匹配的。
本發明另提供一種具可撓性之高導磁率片材的製作方法,包括:製作一軟磁性鐵氧體燒結薄片;將一第一彈性層貼合於軟磁性鐵氧體燒結薄片之一第一表面;及進行一熱壓合製程,其中在熱壓合製程中,軟磁性鐵氧體燒結薄片係裂成複數個碎片,接著進行熱壓硬化,即得到可撓性之高導磁率片材。
為讓本發明之上述目的、特徵及優點能更明顯易懂,下文特舉一較佳實施例,並配合所附圖式,作詳細說明如下:
為了解決抗EMI薄片導磁率低的問題,本發明於一實施例將軟磁性鐵氧體材料之燒結薄片為主體置放於中間層,上層及/或下層接合含有軟磁性鐵氧體之微細粉末的膠層,所壓合成型的三明治夾層結構,接著進行熱壓硬化,製成具有可撓性之高導磁率薄片,解決一般EMI薄片導磁率低,抗EMI與磁場遮蔽之效果不佳的問題。
以下請參照第1A~1B圖,描述本發明一實施例高導磁率之EMI薄片之製作方法:首先製作高導磁率之軟磁性鐵氧體材料,本發明不限定特定軟磁性鐵氧體材料,其可包括錳鋅系、鎳鋅系、銅鋅系、鎳銅鋅系、鎂鋅系及鋰鋅系之鐵氧磁性物其中之一者或上述混合物所構成,以下係以軟磁性鐵氧體材料為鎳銅鋅鐵氧體(NiCuZnferrite)粉末之實施例說明,其係使用氧化鐵、氧化鎳、氧化鋅、氧化銅,以適當比例配製,經混合、煆燒、球磨、燒結,粉碎等製作為鎳銅鋅鐵氧體之微細粉末,鎳銅鋅鐵氧體粉末以偶合劑經表面改質處理成為良好分散的粉末,軟磁性鐵氧體材料的製備係為已知的技術,熟習此技藝人士可參照相關公開技術,例如:Journal of Zhejiang University SCIENCE ISSN 1009-3095,Science Letters:Preparation of high-permeability NiCuZn ferrite;Journal of Magnetism and Magnetic Materials 198(1997)285-291,Low temperature sintering of Ni-Zn-Cu ferrite and its permeability spectra;或1997 American Institute of Physics[S0021-8979(97)07218-6]Magnetic field effect on the complex permeability。接著將鎳銅鋅鐵氧體粉末與改質環氧樹脂膠、或矽膠混合混練,製成含有鎳銅鋅鐵氧體微細粉末的膠料。
接著,進行形成軟磁性鐵氧體燒結薄片100之步驟:本發明一實施例係將具有高導磁率之鎳銅鋅鐵氧體材料粉末與聚乙烯丁醛(Polyvinyl butyral;PVB)樹脂混合形成漿料,經刮刀成型法製作為生胚薄片,生胚薄片再經脫脂及高溫燒結後形成鎳銅鋅鐵氧體燒結薄片100,鎳銅鋅鐵氧體燒結薄片厚度可以是30~150μm。
在軟磁性鐵氧體燒結薄片102上表面和下表面,各貼付一第一彈性層104和一第二彈性層106,形成三明治夾層結構。值得注意的是,本發明不限定在鎳銅鋅鐵氧體燒結薄片的上下層皆要貼付彈性層,本發明可於其它實施例僅於鎳銅鋅鐵氧體燒結薄片的上層或下層貼付彈性層。此外,本發明不限於特定的彈性層,彈性層可以是膠膜或是磁性金屬薄片,其中膠膜可以是聚氯乙烯(PVC)、聚氨酯(PU)、壓克力系、熱融膠系、環氧樹脂系或液態矽膠樹脂之可黏彈性體材料或上述之組合。本發明一實施例中,鐵氧體燒結薄片的上下層膠膜的黏結膠料可填充軟磁性粉末,此軟磁性粉末係由鐵鎳鈷為基材之金屬粉、錳鋅系、鎳鋅系、銅鋅系、鎳銅鋅系、鎂鋅系及鋰鋅系之鐵氧磁性物其中之一者或上述混合物所構成。本發明另一實施例中,鐵氧體燒結薄片的上下層膠膜的黏結膠料可填充高導熱系數如銅、銀、銅銀合金、氧化鋁、氮化硼等材料之微細粉末,所製成之EMI薄片除了具有高導磁率,也具有良好的散熱效果,可作為兼具散熱與抗EMI的薄片。
其後,如第1B圖所示,進行一熱壓合製程,在壓合期間鎳銅鋅鐵氧體燒結薄片100會裂成有許多間隙108的碎片102,再經熱壓硬化後,即得到高導磁率之EMI薄片,於熱壓合硬化後,此薄片也可以再經多次曲折或模具壓折形成有更多碎片而增加其可撓性。
本發明高導磁率之EMI薄片可應用於元件內埋式基板、可撓式電感、變壓器、EMI元件、無線射頻辨識系統標籤(RFID tag)及電磁零組件之防EMI薄片、磁遮蔽貼片等,但不限於以上應用範圍為其特徵。
在本實施例中,由於軟磁性鐵氧體燒結薄片100之各碎片102是藉由熱壓合製程時自然破裂形成,各碎片102係為不規則形狀。在本發明另一實施例中,在進行熱壓合製程之前,可於鐵氧體燒結薄片100上進行預形(Pre-grooving)的步驟,於鐵氧體燒結薄片表面形成複數條溝槽(未繪示),使得鐵氧體燒結薄片在進行熱壓合製程時,可沿著溝槽破裂分開,可藉由溝槽使得形成的碎片有特定規則的形狀。在本發明一實施例中,軟磁性鐵氧體燒結薄片之碎片的長寬範圍為0.5至5.0mm。
以下根據第2圖描述本實施例製備好之可撓性之高導磁率片材,如圖所示,軟磁性鐵氧體燒結薄片100上表面係貼附一第一彈性層104,下表面係貼附一第二彈性層106,軟磁性鐵氧體燒結薄片因熱壓合製程破裂成複數個碎片102。值得注意的是,由於軟磁性鐵氧體燒結薄片100之各碎片102是藉由熱壓合製程時破裂形成,其相鄰碎片102間的微間隙(micro gap)108會呈現不規則的形狀。以下以第2圖更清楚的描述本發明可撓性之高導磁率片材碎片間的微間隙,請參照第3圖(第3圖是第2圖的局部放大圖),相鄰的第一碎片102a和第二碎片102b間係間隔一微間隙108,第一碎片102a在相鄰微間隙108的面係呈現第一凹凸狀結構105,同理,第二碎片102b在相鄰微間隙108的面係呈現第二凹凸狀結構107,由於軟磁性鐵氧體燒結薄片100之各碎片102是藉由熱壓合製程時破裂形成,第一碎片102之第一凹凸狀結構105係與第二碎片102b之第二凹凸狀結構107在微觀上係相匹配(match)的。易言之,第一碎片102a之第一凹凸狀結構105的凸部係對應到第二碎片102b之第二凹凸狀結構107的凹部,第一碎片102a之第一凹凸狀結構105的凹部係對應到第二碎片102b之第二凹凸狀結構107的凸部。
第4圖繪示本發明另一實施例之可撓性之高導磁率片材的剖面圖,其中與上述結構類似的單元使用相同的符號,如第4圖所示,僅有一彈性層402貼合於軟磁性鐵氧體燒結薄片100之上表面。
第圖繪示本發明又另一實施例之可撓性之高導磁率片材的剖面圖,如第5圖所示,僅有一彈性層502貼合於軟磁性鐵氧體燒結薄片100之下表面。
第6圖繪示本發明又另一實施例之可撓性之高導磁率片材的剖面圖,如第6圖所示,本實施例係於一第一軟磁性鐵氧體燒結薄片604上貼合一例如上述膠膜的彈性層606,之後,於彈性層606上貼合一第二軟磁性鐵氧體燒結薄片610。接著,進行一熱壓合製程,在壓合期間第一鐵氧體燒結薄片604和第二鐵氧體燒結薄片610會裂成有許多間隙612的碎片(602、608)。
【實施範例1】
以66%重量的氧化鐵,4.7%重量的氧化鎳,22.7%重量的氧化鋅、6.6%重量的氧化銅之比例配製,經濕式混合、850℃煆燒、球磨後烘乾,將此材料銅鋅鐵氧體粉末,與PVB樹脂混合形成漿料經刮刀成型法製作為生胚薄片,生胚薄片再經脫脂及高溫1100℃燒結後形成鎳銅鋅鐵氧體燒結薄片,薄片厚度為33μm。
使用上述已球磨後烘乾的銅鋅鐵氧體粉末,再經過造粒、1100℃燒結、微細粉碎等程序製作為鎳銅鋅鐵氧體微細粉末,此粉末以偶合劑經表面改質處理成為良好分散的鎳銅鋅鐵氧體粉末,接著使用10%重量的鎳銅鋅鐵氧體粉末與90%重量的改質環氧樹脂膠,混合混練製成含有鎳銅鋅鐵氧體微細粉末的膠料。
接著將膠料塗佈在有離型性的PET膠膜,膠料塗佈控制在10~20μm,然後在鎳銅鋅鐵氧體燒結薄片的上下面各貼付上一層已塗有鎳銅鋅鐵氧體粉末的膠料之PET膠膜,形成三明治夾層結構,接著進行一熱壓合製程,經熱壓合時鎳銅鋅鐵氧體燒結薄片會微裂形成複數個碎片,碎片彼此間有微間隙,再經熱壓硬化後,即得到高導磁率之EMI薄片。
以一阻抗/材料分析儀測量此EMI薄片之導磁率,此EMI薄片的導磁率高達203(在1MHz時)。
【實施範例2】
以65%重量的氧化鐵,4.4%重量的氧化鎳,22.3%重量的氧化鋅、8.3%重量的氧化銅之比例配製,經濕式混合、850℃煆燒、球磨後烘乾,將此材料銅鋅鐵氧體粉末,與PVB樹脂混合形成漿料經刮刀成型法製作為生胚薄片,生胚薄片再經脫脂及高溫1100℃燒結後形成鎳銅鋅鐵氧體燒結薄片,薄片厚度為50μm。
使用上述已球磨後烘乾的銅鋅鐵氧體粉末,再經過造粒、1100℃燒結、微細粉碎等程序製作為鎳銅鋅鐵氧體次微米粒徑粉末,此粉末以偶合劑經表面改質處理成為良好分散的鎳銅鋅鐵氧體粉末,接著使用10%重量的鎳銅鋅鐵氧體粉末與90%重量的改質環氧樹脂膠,製成含有鎳銅鋅鐵氧體之微細粉末的膠料。
接著將膠料塗佈在有離型性的PET膠膜,膠料塗佈控制在10~20μm,然後在鎳銅鋅鐵氧體燒結薄片的上下層,各貼付上一層已塗有鎳銅鋅鐵氧體粉末的膠料之PET膠膜,形成三明治夾層結構,進行一熱壓合製程,在壓合期間鎳銅鋅鐵氧體燒結薄片會微裂形成複數個碎片,碎片彼此間有微間隙,經熱壓硬化後,即得到高導磁率之EMI薄片。
以一阻抗/材料分析儀測量此EMI薄片之導磁率,此EMI薄片的導磁率高達228(在1MHz時)。
【實施範例3】
以65%重量的氧化鐵,8.4%重量的氧化鎳,19.9%重量的氧化鋅、6.7%重量的氧化銅之比例配製,經濕式混合、750℃煆燒、球磨後烘乾,將此材料銅鋅鐵氧體粉末,與PVB樹脂混合形成漿料經刮刀成型法製作為生胚薄片,生胚薄片再經脫脂及高溫1050℃燒結後形成鎳銅鋅鐵氧體燒結薄片,薄片厚度為52μm。
使用上述已球磨後烘乾的銅鋅鐵氧體粉末,再經過造粒、950℃燒結、微細粉碎等程序製作為鎳銅鋅鐵氧體次微米粒徑粉末,此粉末以偶合劑經表面改質處理成為良好分散的鎳銅鋅鐵氧體粉末,接著使用10%重量的鎳銅鋅鐵氧體粉末與90%重量的改質環氧樹脂膠,製成含有鎳銅鋅鐵氧體之微細粉末的膠料。
接著將膠料塗佈在有離型性的PET膠膜,膠料塗佈控制在10~20μm,然後在鎳銅鋅鐵氧體燒結薄片的上下層,各貼付上一層已塗有鎳銅鋅鐵氧體粉末的膠料之PET膠膜,形成三明治夾層結構,進行一熱壓合製程,在壓合期間鎳銅鋅鐵氧體燒結薄片會微裂形成複數個碎片,碎片彼此間有微間隙,經熱壓硬化後,即得到高導磁率之EMI薄片。
以一阻抗/材料分析儀測量此EMI薄片之導磁率,此EMI薄片的導磁率高達140(在1MHz時)。
雖然本發明已揭露較佳實施例如上,然其並非用以限定本發明,任何熟悉此項技藝者,在不脫離本發明之精神和範圍內,當可做些許更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定為準。
100...鐵氧體燒結薄片
102...碎片
102a...第一碎片
102b...第二碎片
104...第一彈性層
105...第一凹凸狀結構
106...第二彈性層
107...第二凹凸狀結構
108...微間隙
402...彈性層
502...彈性層
602...碎片
604...第一軟磁性鐵氧體燒結薄片
606...彈性層
608...碎片
610...第二軟磁性鐵氧體燒結薄片
612...間隙
第1A圖~第1B圖顯示本發明一實施例具可撓性之高導磁率片材的製作方法。
第2圖顯示本發明一實施例具可撓性之高導磁率片材的剖面圖。
第3圖顯示本發明一實施例具可撓性之高導磁率片材的局部放大圖。
第4圖顯示本發明另一實施例具可撓性之高導磁率片材的剖面圖。
第5圖顯示本發明又另一實施例具可撓性之高導磁率片材的剖面圖。
第6圖顯示本發明又另一實施例具可撓性之高導磁率片材的剖面圖。
100...鐵氧體燒結薄片
102...碎片
104...第一彈性層
106...第二彈性層
108...微間隙
Claims (20)
- 一種具可撓性之高導磁率片材,包括:一軟磁性鐵氧體燒結薄片,該薄片包含有複數個碎片,碎片彼此間有微間隙,該碎片微間隙兩側的第一凹凸狀結構和第二凹凸狀結構在微觀上係相匹配的;及一第一彈性層,貼合於該軟磁性鐵氧體燒結薄片之一第一表面。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,其中該第一凹凸狀結構的凸部係對應到第二凹凸狀結構的凹部,該第一凹凸狀結構的凹部係對應到該第二凹凸狀結構的凸部。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,其中尚包括一第二彈性層,貼合於該軟磁性鐵氧體燒結薄片之一第二表面。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,其中該軟磁性鐵氧體燒結薄片係由錳鋅系、鎳鋅系、銅鋅系、鎳銅鋅系、鎂鋅系及鋰鋅系之鐵氧磁性物其中之一者或上述混合物所構成。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,其中該第一彈性層是膠膜,該膠膜是聚氯乙烯(PVC)、聚氨酯(PU)、壓克力系、熱融膠系、環氧樹脂系或液態矽膠樹脂之可黏彈性體材料或上述之組合。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,其中第一彈性層是磁性金屬薄片。
- 如申請專利範圍第5項所述之具可撓性之高導磁率片材,其中該膠膜係填充軟磁性粉末,該軟磁性粉末係由鐵鎳鈷為基材之金屬粉、錳鋅系、鎳鋅系、銅鋅系、鎳銅鋅系、鎂鋅系及鋰鋅系之鐵氧磁性物其中之一者或上述混合物所構成。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,尚包括另一軟磁性鐵氧體燒結薄片,貼合於該第一彈性層相對於該軟磁性鐵氧體燒結薄片之另一表面。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,其中該軟磁性鐵氧體燒結薄片之碎片的長寬範圍為0.5至5.0mm。
- 如申請專利範圍第1項所述之具可撓性之高導磁率片材,其中該具可撓性之高導磁率片材係應用於元件內埋式基板、可撓式電感、變壓器、防電磁干擾元件、無線射頻辨識系統標籤(RFID tag)、電磁零組件之防電磁干擾薄片或磁遮蔽貼片。
- 一種具可撓性之高導磁率片材的製作方法,包括:製作一軟磁性鐵氧體燒結薄片;將一第一彈性層貼合於該軟磁性鐵氧體燒結薄片之一第一表面;及進行一熱壓合製程,其中在該熱壓合製程中,該軟磁性鐵氧體燒結薄片係裂成複數個碎片。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,在進行該熱壓合製程之前,尚包括將一第二彈性層貼合於該軟磁性鐵氧體燒結薄片之一第二表面。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,在進行該熱壓合製程之前,尚包括於該鐵氧體燒結薄片上進行預形(Pre-grooving)的步驟,在鐵氧體燒結薄片表面形成複數條溝槽,使得鐵氧體燒結薄片在進行熱壓合製程時,可沿著該些溝槽破裂分開。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,其中該軟磁性鐵氧體燒結薄片係由錳鋅系、鎳鋅系、銅鋅系、鎳銅鋅系、鎂鋅系及鋰鋅系之鐵氧磁性物其中之一者或上述混合物所構成。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,其中該第一彈性層是膠膜,該膠膜是聚氯乙烯(PVC)、聚氨酯(PU)、壓克力系、熱融膠系、環氧樹脂系或液態矽膠樹脂之可黏彈性體材料或上述之組合。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,其中該第一彈性層是磁性金屬薄片。
- 如申請專利範圍第15項所述之具可撓性之高導磁率片材的製作方法,其中該膠膜係填充軟磁性粉末,該軟磁性粉末係由鐵鎳鈷為基材之金屬粉、錳鋅系、鎳鋅系、銅鋅系、鎳銅鋅系、鎂鋅系及鋰鋅系之鐵氧磁性物其中之一者或上述混合物所構成。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,在進行該熱壓合製程之前,尚包括將另一軟磁性鐵氧體燒結薄片貼合於該第一彈性層相對於該軟磁性鐵氧體燒結薄片之另一表面。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,其中該軟磁性鐵氧體燒結薄片之碎片的長寬範圍為0.5至5.0mm。
- 如申請專利範圍第11項所述之具可撓性之高導磁率片材的製作方法,其中該具可撓性之高導磁率片材係應用於元件內埋式基板、可撓式電感、變壓器、防電磁干擾元件、無線射頻辨識系統標籤(RFID tag)、電磁零組件之防電磁干擾薄片或磁遮蔽貼片。
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TW098144939A TWI417908B (zh) | 2009-12-25 | 2009-12-25 | 具可撓性之高導磁率片材及其製作方法 |
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US (1) | US20110159317A1 (zh) |
TW (1) | TWI417908B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US20130207759A1 (en) * | 2010-06-30 | 2013-08-15 | Katsumi Komatsu | String-shaped magnet |
JP6241701B2 (ja) * | 2012-04-20 | 2017-12-06 | 日立金属株式会社 | 磁性シート、コイル部品および磁性シートの製造方法 |
KR20140040460A (ko) * | 2012-09-26 | 2014-04-03 | 삼성전기주식회사 | 자성 기판 및 자성 기판 제조 방법 |
JP6131418B2 (ja) * | 2012-11-26 | 2017-05-24 | スミダコーポレーション株式会社 | 電子機器 |
KR101740749B1 (ko) * | 2012-12-21 | 2017-05-26 | 삼성전기주식회사 | 자성체 복합 시트 및 전자기 유도 모듈 |
CN103964830A (zh) * | 2014-05-07 | 2014-08-06 | 宿州学院 | 一种低温烧结制备永磁铁氧体的方法 |
KR102047562B1 (ko) * | 2014-07-29 | 2019-11-21 | 삼성전기주식회사 | 칩 전자부품 및 그 제조방법 |
DE202014008347U1 (de) | 2014-10-16 | 2014-10-28 | Würth Elektronik eiSos Gmbh & Co. KG | Induktionsbauelement |
CN109712775B (zh) * | 2019-01-30 | 2021-12-10 | 深圳市晶磁材料技术有限公司 | 无线充电器用导磁片的制备方法 |
JP2021093465A (ja) * | 2019-12-11 | 2021-06-17 | Tdk株式会社 | 磁性シート、および、磁性シートを備えるコイルモジュール、並びに非接触給電装置。 |
CN114591075B (zh) * | 2022-03-29 | 2023-03-24 | 重庆科技学院 | 一种锰锌铁氧体软磁合金吸波材料及其制备工艺 |
JP7448266B1 (ja) | 2023-08-01 | 2024-03-12 | 株式会社コラントッテ | 紐状磁石とその着磁方法、磁気治療具及び着磁器 |
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JP2000349493A (ja) * | 1999-06-02 | 2000-12-15 | Fuji Elelctrochem Co Ltd | 放射ノイズ抑制用磁性シート |
US20060266435A1 (en) * | 2005-04-26 | 2006-11-30 | Yang Jae S | Magnetic sheet for radio frequency identification antenna, method of manufacturing the same, and radio frequency identification antenna using the same |
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US20040219328A1 (en) * | 2001-08-31 | 2004-11-04 | Kazunori Tasaki | Laminated soft magnetic member, soft magnetic sheet and production method for laminated soft magnetic member |
JP3971697B2 (ja) * | 2002-01-16 | 2007-09-05 | Tdk株式会社 | 高周波用磁性薄膜及び磁気素子 |
US7138896B2 (en) * | 2004-06-29 | 2006-11-21 | International Business Machines Corporation | Ferrite core, and flexible assembly of ferrite cores for suppressing electromagnetic interference |
WO2006129704A1 (ja) * | 2005-06-03 | 2006-12-07 | Murata Manufacturing Co., Ltd. | フェライトシート及びその製造方法 |
CN101213896A (zh) * | 2005-07-07 | 2008-07-02 | 株式会社村田制作所 | 铁氧体片 |
JP2008194865A (ja) * | 2007-02-09 | 2008-08-28 | Matsushita Electric Ind Co Ltd | シート状成形体その製造方法 |
JP4868461B2 (ja) * | 2007-11-12 | 2012-02-01 | 北川工業株式会社 | 雑音吸収具 |
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2009
- 2009-12-25 TW TW098144939A patent/TWI417908B/zh active
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JP2000349493A (ja) * | 1999-06-02 | 2000-12-15 | Fuji Elelctrochem Co Ltd | 放射ノイズ抑制用磁性シート |
US20060266435A1 (en) * | 2005-04-26 | 2006-11-30 | Yang Jae S | Magnetic sheet for radio frequency identification antenna, method of manufacturing the same, and radio frequency identification antenna using the same |
TWM343872U (en) * | 2008-04-09 | 2008-11-01 | Crown Ferrite Entpr Co | Radio frequency identification tag with EMI prevention |
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TW201123218A (en) | 2011-07-01 |
US20110159317A1 (en) | 2011-06-30 |
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