TWI415527B - Multi-layer circuit board with embedded thermal conductive metal block and its preparation method - Google Patents

Multi-layer circuit board with embedded thermal conductive metal block and its preparation method Download PDF

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Publication number
TWI415527B
TWI415527B TW100103643A TW100103643A TWI415527B TW I415527 B TWI415527 B TW I415527B TW 100103643 A TW100103643 A TW 100103643A TW 100103643 A TW100103643 A TW 100103643A TW I415527 B TWI415527 B TW I415527B
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Taiwan
Prior art keywords
circuit board
metal
conductive
metal blocks
heat
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TW100103643A
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Chinese (zh)
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TW201233258A (en
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Compeq Mfg Co Ltd
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Priority to TW100103643A priority Critical patent/TWI415527B/en
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Publication of TWI415527B publication Critical patent/TWI415527B/en

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Abstract

The invention provides a multilayer circuit board with embedded heat-conducting metal blocks and a manufacturing method thereof. Two opposite end faces are embedded with one metal block at the same position, respectively, so as to separate the two metal blocks from each other. Then a heat-conducting member passes through the two metal blocks to form a complete heat-conducting path of the two opposite end faces of the multilayer circuit board. In this way, as long as two metal blocks with total thickness being less than the thickness of the laminated multilayer circuit board are selected, the surfaces of the two metal blocks are respectively aligned with the corresponding end faces by laminating a core plate and a plurality of sub layers as resin materials of the sub layers are molten, thereby enhancing the qualification rate of the multilayer circuit board.

Description

Multilayer circuit board with embedded thermal metal block and its preparation method

The present invention relates to a multilayer circuit board, and more particularly to a multilayer circuit board in which a thermally conductive metal block is embedded.

As electronic devices become smaller and thinner, their internal circuit density is relatively increased, which leads to the development of multi-layer circuit boards with high line density. With the trend of integration of electronic devices, high-speed computing devices or power components are gradually used in their circuits. The main cause of heat generation during use of the electronic device; therefore, in addition to the additional heat sink for heat dissipation, in order to further improve the heat dissipation efficiency of the multilayer circuit board, and does not occupy too much space in the electronic component casing, an in-line heat conductive metal block Multilayer boards have been proposed.

Please refer to FIG. 6 , which is a schematic diagram of a multi-layer circuit board 50 with embedded heat-conductive metal blocks combined with an electronic component 70 and a heat sink 71 . The multilayer circuit board 50 is embedded with a heat conducting through the upper and lower surfaces of the multilayer circuit board 50 . The metal block 60 is such that the electronic component 70 soldered to the upper surface of the multilayer circuit board 50 contacts the upper surface of the heat conductive metal block 60, and the heat sink 71 disposed under the multilayer circuit board 50 is in contact with the lower surface of the heat conductive metal block 60; Thus, as shown in FIG. 7 , the heat conductive metal block 60 serves as a heat conduction path between the electronic component 70 and the heat sink 71 , and effectively transfers the waste heat generated during the operation of the electronic component 70 to the heat sink below the multilayer circuit board 50 . 71.

Since the above-mentioned embedded heat conductive metal block multi-layer circuit board directly provides the heat conduction path of the electronic component, the electronic component does not need to be stacked with the heat sink, so that the electronic device is configured with internal components more elastic, but indirectly causes the multilayer circuit board manufacturer. The yield is reduced.

Referring to FIGS. 8A to 8D, the manufacturing method of the multi-layer circuit board 50 in which the heat conductive metal block is embedded includes the following steps: sequentially placing the plurality of fiberglass boards 51 and the core board 52 in a fixture of a press machine. The core board 52 is sandwiched between the plurality of fiberglass boards 52; and is cut at a position of the predetermined heat conducting metal block 60 to form a through hole receiving groove 501 matching the size of the metal block; 60 is placed in the accommodating groove 501; and the plurality of glass fiber sheets 51 and the core board 52 are thermocompression-bonded to form a multilayer circuit board 50.

As can be seen from FIG. 8D and FIG. 8E, the thickness of the multilayer circuit board 50 after thermal pressing is different due to the heat pressing of the glass fiber board 51. Therefore, even if the metal block of the same thickness is selected, the heat conductive metal block 60 may protrude from the multilayer circuit board. The upper surface 50' is recessed or recessed in the multilayer circuit board 50. After the cover is hot pressed, a solder resist green paint 72 is usually executed, so that the recess of the heat conductive metal block 60 in Fig. 8D can be filled to make the surface of the multilayer circuit board 50 flat. However, for the finished product of the heat-conductive metal block 60 protruding from the multilayer circuit board 50', as shown in Fig. 8D, it is regarded as a defective product and must be discarded, thereby causing a decrease in the yield of the entire multilayer circuit board and an increase in manufacturing cost.

In view of the above-mentioned defects of the embedded heat conductive metal block multilayer circuit board, the main object of the present invention is to provide a multilayer circuit board for ensuring that the metal block is flush with the surface of the circuit board after the pressing process and a method of manufacturing the same.

The main technical means used to achieve the above purpose is to make the embedded heat conduction The multi-layer circuit board of the metal block comprises: a multi-layer circuit substrate, wherein a first receiving groove and a second receiving groove are respectively formed inward at the same position on the upper and lower surfaces; the two metal blocks are respectively disposed on In the first accommodating groove and the second accommodating groove, the exposed surface of the metal block disposed in the first accommodating groove is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block disposed in the second accommodating groove is The lower surface of the multi-layer circuit substrate is flush; and a heat-conducting member is embedded in the multi-layer circuit substrate and is respectively in contact with the two metal blocks as a heat-conducting medium of the two metal blocks.

Furthermore, the main technical means for achieving the above purpose is to fabricate the multilayer circuit board in which the heat conductive metal block is embedded in a metal block at the same position on the lower surface of a multilayer circuit board, so that the two metals are The blocks are separated from each other, and then two metal blocks are pierced through the heat conducting member to form a complete heat conduction path of one of the opposite end faces of the multilayer circuit board.

The above-mentioned invention mainly uses two metal blocks which are separately disposed in the multi-layer circuit substrate, and the heat-conducting member forms a heat-conducting path of the electronic component and the heat sink; since the total thickness of the two metal blocks is necessarily smaller than the thickness of the multi-layer circuit substrate, plus multiple layers When the circuit board is pressed, the plurality of glass fiber sheets are melted and softened, so the metal blocks placed in the first and second receiving grooves are pressed into the multilayer circuit board to ensure that the surfaces of the two metal blocks are flush with the corresponding end faces, respectively. It does not protrude above the surface of the multilayer circuit board; therefore, the structural design of the multilayer circuit board of the present invention has a high yield.

First, please refer to FIG. 1F, which is an embedded thermal conductive metal block of the present invention. A cross-sectional view of a preferred embodiment of a multi-layer circuit board 10 includes a multi-layer circuit substrate which is formed by pressing a plurality of fiberglass panels 11 and a core panel 12 and respectively at the same position on the upper and lower surfaces. The first accommodating groove 101 and the second accommodating groove 102 are formed in the first accommodating groove 101 and the second accommodating groove 102, respectively. The exposed surface of the metal block 20 disposed on the first accommodating groove 101 is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block 21 disposed on the second accommodating groove 102 is flush with the lower surface of the multilayer circuit substrate; And a heat-conducting member is embedded in the multi-layer circuit substrate and is respectively in contact with the two metal blocks 20 and 21 as a heat-conducting medium of the two metal blocks 20 and 21; in the embodiment, the heat-conducting member comprises a plurality of conductive holes. 202, is through the two metal blocks 20, 21 and the multi-layer circuit substrate, wherein each of the conductive hole posts 202 can be filled with an insulating material 30, or as shown in FIG. 1G filled with a heat conducting or conductive material 31 (such as copper or silver glue); 1H is a preferred embodiment of another multilayer circuit board, the heat conductive member includes Heat conducting column 32, respectively, through two metal blocks 20, 21 and the multilayer circuit board, the heat conducting column 32 is a screw-based, metal pillar.

Referring to FIG. 1A to FIG. 1F, the multi-layer circuit board manufacturing method of FIG. 1F includes the following steps: preparing a plurality of fiberglass boards 11, a core board 12 and two metal blocks 20, 21; wherein some of the fiberglass boards 11 respectively More than one through hole 111 is formed, and the thickness of the two metal blocks 20, 21 is smaller than the total thickness of the plurality of glass fiber sheets 11 and the core board 12; the plurality of glass sheets 11 are respectively stacked on the core board 12 upper and lower surface positions, wherein the fiberglass board 11 having the through hole 111 formed under the core board 12, The through holes 111 are closely matched to the thickness of one of the metal blocks 21 and accommodate the metal block 21 therein, and the fiberglass plates 11 are formed with the through holes 111 formed above the core plate 12, and the through holes 111 are matched with each other. a metal block 20 having a thickness and accommodating the metal block 20 therein; thermocompression bonding the plurality of fiberglass sheets 11 and the core board 12 to form a multilayer circuit board 10; simultaneously, the upper and lower metal blocks 20, 21 are simultaneously Drilling 201; electroplating the hole 201 to form a plurality of conductive vias 202; and internally laminating the conductive vias 202 to fill the conductive vias 202 to the heat conducting members, so that the upper and lower metal blocks 20, 21 are formed. A heat conduction path.

In addition, if the multilayer circuit board 10a of FIG. 1G is to be fabricated, the process steps are the same as those of FIGS. 1A to 1E described above, but after the electroplating step, the conductive vias 202 are filled with a heat conductive or conductive material 31 (such as copper or silver). Glue), which improves the heat transfer efficiency of the two metal blocks 20, 21.

If the multilayer circuit board 10b of FIG. 1H is to be formed, after the drilling step, the conductive pillars 32 such as screws or metal posts having a shorter thickness of the circuit board 10b are directly inserted into the corresponding drill holes 201.

2A to 2F are cross-sectional views showing another preferred embodiment of a multilayer printed circuit board 10c with a heat conductive metal block embedded therein, comprising: a multilayer circuit substrate, which is composed of a plurality of fiberglass boards 11 And the core board 12 is formed by pressing together, and each of the glass fiber board 11 and the core board 12 is formed with through holes 111 and 121 at the same position, and a accommodating groove 101 penetrating the multilayer circuit substrate is formed after the alignment is pressed. The two metal blocks 20 and 21 are respectively disposed at upper and lower positions of the accommodating groove 101", and are separated from each other, and the metal block is disposed above the accommodating groove 101". The exposed surface is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block 21 disposed under the receiving groove 101" is flush with the lower surface of the multilayer circuit substrate; and a thermoplastic heat conductive layer 22 is The capacitor is placed in the accommodating groove 101" and is sandwiched between the two metal blocks 20, 21 to be in contact with the two metal blocks 20, 21 as a heat conduction medium of the two metal blocks 20, 21; wherein the thermoplastic type The heat conductive layer 22 may be, for example, an aluminum substrate, a soft heat conductive material, or a conductive material (copper or silver paste) as the thermoplastic heat conductive layer.

In order to improve the heat conduction efficiency of the embodiment, as shown in FIG. 2F, the multilayer circuit board is further formed with a plurality of conductive via posts 202 for penetrating the two metal blocks 20, 21 and the thermoplastic heat conductive layer 22, and then conducting the conductive materials. The column 202 is filled with an insulating material 30 or a heat conductive or conductive material (such as copper or silver glue), or directly through a conductive column.

Please refer to FIG. 2A to FIG. 2F, the process steps of the above-mentioned FIG. 2F multilayer circuit board: preparing a plurality of fiberglass boards 11, a core board 12, two metal blocks 20, 21 and a thermoplastic heat conductive layer 22; The fiberboard 11 and the core plate 12 are respectively formed with the same holes 111 and 121 at the same position, and the thickness of the two metal blocks 20 and 21 is smaller than the total thickness of the plurality of the fiberglass plates 111 and the core plate 12; The fiberglass panels 11 are respectively stacked on the upper and lower surfaces of the core panel 12, and the through holes 111 and 121 of each of the fiberglass panels 11 and the core panel 12 form a receiving slot 101"; wherein the two metal blocks 20, 21 and The thickness of the thermoplastic heat-conducting layer 22 is matched to the depth of the accommodating groove 101" to be received in the accommodating groove 101", wherein the thermoplastic heat-conductive layer 22 is sandwiched between the two metal blocks 20, 21; The plurality of glass fiber sheets 11 and the core board 12 are thermocompression-bonded to form a multilayer circuit board 10c; the two metal blocks 20, 21 and the thermoplastic heat conductive layer 22 are simultaneously drilled 201; the drilling holes 201 are formed to form The plurality of conductive via posts 202; and the inner via plugs of the conductive vias 202 to fill the conductive vias 202 to improve the thermal conductivity of the two metal blocks 20, 21.

3A to 3C are cross-sectional views showing still another preferred embodiment of the multilayer printed circuit board 10d with the heat conductive metal block embedded therein, comprising: a multilayer circuit substrate, which is composed of a plurality of fiberglass boards 11 And the core board 12 is press-fitted, and two first accommodating grooves 101, 101' and two second accommodating grooves 102, 102' are respectively formed inward at the same position on the upper and lower surfaces, wherein the two first capacities are The slots 101 and 101 ′ are connected to each other, and the second accommodating slots 102 and 102 ′ are also connected to each other. The four metal blocks 20 and 21 and the metal blocks 20 and 21 are respectively disposed in the first accommodating slots 101 and 101 . And the second accommodating groove 102, 102', wherein the exposed surface of the metal block 20 disposed in the first accommodating groove 101, 101' is flush with the upper surface of the multilayer circuit substrate, and is disposed in the second accommodating groove 102, The exposed surface of the metal block 21 of the 102' is flush with the lower surface of the multilayer circuit substrate; and the two lateral heat conducting members are respectively received in the communication channel 112 of the two first receiving slots 101, 101', and the second The communication channel 112 of the accommodating groove 102, 102' is connected to the corresponding two metal blocks 20/21, and the transverse heat conducting member is tied to The heat conducting column 32 is respectively connected to the two metal blocks 20/20 and the two metal blocks 21/21; and the two longitudinal heat conducting members are embedded in the multilayer circuit substrate, respectively The upper and lower metal blocks 20 and 21 are in contact with each other as a heat-conducting medium of the two metal blocks 20 and 21; in the embodiment, the longitudinal heat-conducting member comprises a plurality of conductive hole posts 202 extending through the two metal blocks 20 and 21 and the multilayer circuit. The substrate, wherein each of the conductive vias 202 can be filled with an insulating material 30, or filled with a heat conducting or conductive material 31 (such as copper or silver glue) as shown in FIG. 1G; and FIG. 1H is a comparison of another multilayer circuit board. In a preferred embodiment, the longitudinal heat conducting member comprises a plurality of thermally conductive columns 32 extending through the two metal blocks 20, 21 and the multilayer circuit substrate, respectively. The heat conducting columns 32 are screws and metal posts.

Referring to FIG. 3A to FIG. 3C, the multi-layer circuit board manufacturing method of FIG. 3C includes the following steps: preparing a plurality of fiberglass boards 11, a core board 12, and two heat conducting metal components; wherein some of the fiberglass boards 11 are formed with The plurality of through holes 111, 111' and the communication passage 112 laterally connecting the plurality of through holes 111, 111', each of the heat conducting metal components comprising the two metal blocks 20, 21 and the transverse heat conduction of the laterally connected two metal blocks 20/20, 21/21. And the total thickness of the metal blocks 20 and 21 of the heat conductive metal component is less than the total thickness of the plurality of the fiberglass board 11 and the core board 12; and the plurality of glass fiber boards 11 are respectively stacked on the upper and lower surfaces of the core board 12. Wherein the through holes 111 of the fiberglass plate 11 under the core plate 12 are deeply matched to the thickness of the metal block 21 corresponding to the heat conductive metal component, and the lateral heat conducting member is matched with the communication channel 112 to accommodate one of the heat conductive metal components therein. The through holes 111 of the fiberglass board 11 located above the core board 12 are deep enough to match the thickness of the metal block 20 of the other set of heat conducting metal components, and the transverse heat conducting members are matched with the communication passages 112 to accommodate the heat conducting metal components therein; Combined with multiple fiberglass panels 11 and Core board 12 to form a multilayer circuit board 10d; The upper and lower metal blocks are simultaneously drilled 201; the drilling holes 201 are plated to form a plurality of conductive via posts 202; and the conductive via posts 202 are internally internally plugged to fill the conductive via posts 202 to make the upper and lower heat conductive metals The metal blocks 20, 21 at the same location of the assembly form a thermally conductive path.

In the following, it is further explained that when the above technology is applied to a multilayer circuit board having embedded electronic components, the waste heat of the electronic components embedded in the multilayer circuit board can be effectively taken out of the multilayer circuit board by the heat conductive metal blocks.

4A to 4E are preferred embodiments of another multilayer circuit board according to the present invention, wherein the multilayer circuit board 10f includes: a multilayer circuit substrate, which is composed of a plurality of fiberglass boards 11 and a The core board 12' is press-fitted, wherein the core board 12 is soldered with an electronic component 70', and a heat conducting block 23 is embedded in the electronic component 70'. The multilayer circuit board is attached to the upper and lower surfaces corresponding to the core board. A first accommodating groove 101 and a second accommodating groove 102 are formed inwardly at the same position of the heat-conducting block 23 of the 12'; the two metal blocks 20 and 21 are respectively disposed in the first accommodating groove 101 and the second In the accommodating groove 102, the exposed surface of the metal block 20 disposed on the first accommodating groove 101 is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block 21 disposed in the second accommodating groove 101 is connected to the multilayer circuit. The lower surface of the substrate is flush; and a heat conducting member is embedded in the multilayer circuit substrate and is respectively in contact with the two metal blocks 20, 21 and the heat conducting block 23 as a heat conducting medium of the two metal blocks 20, 21 and the heat conducting block 23; In this embodiment, the heat conducting member includes a plurality of conductive via posts 202, wherein the conductive portion The electroporation column 202 is penetrated through the two metal blocks 20 and 21 and the multilayer circuit substrate, and the rest is penetrated through the two metal blocks 20, 21 and multiple layers. The circuit substrate and the heat conducting block 23; wherein each of the conductive holes 202 can be filled with the insulating material 30, or filled with a heat conducting or conductive material (such as copper or silver glue) 31 as shown in FIG. 1H; In a preferred embodiment of the layer circuit board, the heat conducting member comprises a plurality of heat conducting columns 32 extending through the two metal blocks, the multilayer circuit substrate and/or the heat conducting block, respectively, and the heat conducting columns 32 are screws and metal posts.

Referring to FIG. 4A to FIG. 4D, the multi-layer circuit board manufacturing method of FIG. 4D includes the following steps: preparing a plurality of fiberglass boards 11, a core board 12' and two metal blocks 20, 21; wherein the core board 12' The electronic component 70' is soldered thereon, and a heat conducting block 23 is embedded in the corresponding electronic component 70', and a part of the fiberglass board 11 is formed with a through hole 111 corresponding to the core plate 12'. The thickness of the blocks 20, 21 is smaller than the total thickness of the plurality of fiberglass panels 11 and the core panel 12'; and the plurality of fiberglass panels 11 are respectively stacked on the upper and lower surfaces of the core panel 12', wherein the core panel 12 is located. The fiberglass plate 11 having the through holes 111 is formed below, and the through holes 111 are closely matched to the thickness of one of the metal blocks 21, and the metal block 21 is accommodated therein, and the through holes 111 are formed above the core plate 12'. The fiberboard 11 has a through hole 111 matching the thickness of the other metal block 20, and the metal block 20 is accommodated therein; the plurality of glass fiber sheets 11 and the core board 12' are thermocompression-bonded to form a multilayer. a circuit board 10f; the two upper and lower metal blocks 20, 21 are simultaneously drilled 201, and a part of the drill holes 201 are passed through the heat conducting block 23; electroplating the drill hole 201 to form a plurality of conductive via posts 202; and internally laminating the conductive via posts 202 to fill the conductive via posts 202, so that the upper and lower metal blocks 20, 21 and the thermal block 23 constitute a heat transfer path.

Therefore, the waste heat of the electronic component 70' of the core board 12' can be conducted by the heat conducting block 23 to the two metal blocks 20, 21, and the multilayer circuit board is embedded in the electronic component 70' to be out, thereby improving the embedded electronic component. The heat dissipation efficiency of the 70' multilayer board. Further, the electronic component 70' may be soldered to other fiberglass panels 11.

Please refer to FIG. 5 again, which is a multi-layer circuit board 10g which integrates the heat conducting structures of FIGS. 1F, 2F, 3C and 4D, so that in addition to the electronic components 70 disposed on the surface of the multilayer circuit board, the structure is also as shown in FIG. 3C. A heat sink 71 is further provided, and a heat sink 71 is also disposed on the lower surface of the multilayer circuit board. Furthermore, in order to make the heat dissipation efficiency of the present invention and the heat sink 71 better, the heat conducting post 32' can be passed out of the lower surface or the upper surface of the multilayer circuit board 10g, and the heat dissipating glue is brought into contact with the heat sink 71.

In summary, in the thermal compression bonding step, the plurality of glass fiber sheets are melted and softened to adhere to adjacent glass fiber boards or core sheets, so that the metal blocks disposed above will be slightly sunken. Bonded to the through hole of the upper glass fiber board, and the upper surface thereof is flush with the surface of the uppermost fiberglass board; therefore, the multilayer circuit board manufacturing method of the invention can ensure that the metal block for heat conduction can be flush with the opposite surfaces of the two surfaces, And retain the original heat transfer path function.

10, 10a~10f‧‧‧Multilayer circuit board

101, 101' ‧ ‧ first accommodating slot

101"‧‧‧ 容 槽

102, 102' ‧ ‧ second accommodating slot

11‧‧‧Fiberglass board

111, 111’, 121‧‧‧ through holes

112‧‧‧Connected channel

12, 12’‧‧‧ Core board

20, 21‧‧‧ metal blocks

201‧‧‧Drilling

202‧‧‧conductive hole column

22‧‧‧Thermal heat conduction layer

23‧‧‧heat block

30‧‧‧Insulation

31‧‧‧Electrical materials

32, 32'‧‧‧ Thermal column

50, 50'‧‧‧Multilayer boards

501‧‧‧ accommodating slots

51‧‧‧glass board

52‧‧‧core board

50‧‧‧thermal metal block

70, 70’‧‧‧ Electronic components

71‧‧‧ radiator

1A to 1F are cross-sectional views showing a process of a first preferred embodiment of the present invention.

Figure 1G: Another process profile is performed after Figure 1E.

Figure 1H: Another process profile is performed after Figure 1D.

2A to 2F are cross-sectional views showing a process of a second preferred embodiment of the present invention.

3A to 3C are cross-sectional views showing a process of a third preferred embodiment of the present invention.

4A to 4E are cross-sectional views showing a process of a fourth preferred embodiment of the present invention.

Figure 5 is a partial cross-sectional view showing the multilayer circuit board of the present invention incorporating electronic components and two heat sinks.

Figure 6 is a bottom perspective view of a multi-layer circuit board with embedded thermally conductive metal blocks combined with electronic components and two heat sinks.

Figure 7 is a partial cross-sectional view of Figure 6.

8A to 8D are cross-sectional views showing a process flow of a multilayer circuit board having embedded heat conductive metal blocks.

Figure 8E is another cross-sectional view of a multilayer circuit board having embedded thermally conductive metal blocks.

10. . . Multi-layer circuit board

101. . . First accommodating slot

102. . . Second receiving slot

11. . . Fiberglass panels

12. . . Core board

20, 21. . . Metal block

202. . . Conductive hole column

30. . . Insulating material

Claims (36)

  1. A multi-layer circuit board with a heat-conductive metal block embedded therein, comprising: a multi-layer circuit substrate, which is formed by pressing a plurality of fiberglass plates and a core plate, and forming a first receiving portion at an same position on the upper and lower surfaces respectively; And the second metal block is disposed in the first accommodating groove and the second accommodating groove, wherein the metal block disposed in the first accommodating groove is exposed on the upper surface of the multilayer circuit substrate, The metal block disposed in the second receiving groove is exposed on the lower surface of the multilayer circuit substrate; and a heat conducting member is embedded in the multilayer circuit substrate and respectively contacted with the two metal blocks as a heat conducting medium of the two metal blocks.
  2. The multilayer circuit board of claim 1, wherein the exposed surface of the metal block disposed in the first receiving groove is flush with the upper surface of the multilayer circuit substrate, and the metal block disposed in the second receiving groove is exposed. The surface is flush with the lower surface of the multilayer circuit substrate.
  3. The multilayer circuit board of claim 1 or 2, wherein the first and second receiving grooves are longitudinally connected to form a single receiving groove, and the heat conducting member is a thermoplastic heat conducting layer sandwiched between Between the two metal blocks in the tank.
  4. The multi-layer circuit board of claim 1 or 2, wherein the multi-layer circuit substrate is further formed with another first accommodating groove and another second accommodating groove for accommodating the other two metal blocks, respectively And communicating with the first accommodating groove and the second accommodating groove; wherein a transverse heat conducting member is connected between the two metal blocks disposed in the two first accommodating grooves, and between the two metal blocks of the second accommodating groove The connection has a transverse heat conducting member.
  5. The multi-layer circuit board of claim 1 or 2, wherein the core board is further soldered with an electronic component, and a heat conducting block is embedded in the corresponding electronic component, and the heat conducting block is partially corresponding to the upper and lower two metals. Piece.
  6. The multi-layer circuit board of claim 1 or 2, wherein at least one of the fiberglass boards is further soldered with an electronic component, and a heat conducting block is embedded in the corresponding electronic component, and the heat conducting block is partially corresponding to the upper and lower sides. Metal block.
  7. The multilayer circuit board according to claim 1 or 2, further comprising a plurality of conductive vias extending through the upper and lower metal blocks.
  8. The multi-layer circuit board according to claim 3 is further formed with a plurality of conductive hole columns penetrating the upper and lower metal blocks.
  9. The multi-layer circuit board according to claim 4 is further formed with a plurality of conductive hole columns penetrating the upper and lower metal blocks.
  10. The multi-layer circuit board according to claim 5 is further formed with a plurality of conductive hole columns penetrating the upper and lower metal blocks.
  11. The multi-layer circuit board according to claim 6 is further formed with a plurality of conductive hole columns penetrating the upper and lower metal blocks.
  12. The multi-layer circuit board according to claim 7, wherein each of the heat-conducting members is filled with an insulating material, a heat-conducting material or a conductive material.
  13. The multi-layer circuit board according to claim 11, wherein each of the heat-conducting members is filled with an insulating material, a heat-conducting material or a conductive material.
  14. The multilayer circuit board of claim 13, wherein the heat conductive material is copper glue or silver glue.
  15. The multilayer circuit board of claim 13, wherein the heat conductive material is copper glue or silver glue.
  16. The multilayer circuit board of claim 1 or 2 further comprising a plurality of thermally conductive columns extending through the upper and lower metal blocks.
  17. The multi-layer circuit board of claim 3, further comprising a plurality of thermally conductive columns extending through the upper and lower metal blocks.
  18. The multilayer circuit board of claim 4, further comprising a plurality of thermally conductive columns extending through the upper and lower metal blocks.
  19. The multi-layer circuit board of claim 5, further comprising a plurality of thermally conductive columns extending through the upper and lower metal blocks.
  20. The multi-layer circuit board of claim 6, further comprising a plurality of thermally conductive columns extending through the upper and lower metal blocks.
  21. The multilayer circuit board of claim 16, wherein the length of the heat conducting column is shorter than the thickness of the multilayer circuit substrate and is a screw or a metal post.
  22. The multilayer circuit board of claim 20, wherein the length of the heat conducting column is shorter than the thickness of the multilayer circuit substrate and is a screw or a metal post.
  23. A multi-layer circuit board method for embedding a heat-conductive metal block is formed by embedding a metal block at a first identical position on the upper and lower surfaces of a multi-layer circuit substrate, so that the upper and lower metal blocks are separated from each other, and then the upper and lower metal blocks are respectively passed through a heat-conducting member. Forming a complete thermal path of the upper and lower surfaces of the two layers of the multilayer circuit board.
  24. The method of manufacturing the multi-layer circuit board according to claim 23, wherein the method of embedding the two metal blocks on the upper and lower surfaces of the multi-layer circuit substrate comprises the steps of: preparing a plurality of fiberglass boards, a core board, and the two metal blocks. Some of the fiberglass sheets are formed with through holes, and the thickness of the two metal blocks is smaller than the plurality of glass sheets And a total thickness of the core board superposed; the plurality of glass fiber boards are respectively stacked on the lower surface of the core board, wherein the depth of the fiberglass board under the core board matches the thickness of one of the metal blocks, and is accommodated The metal block is disposed therein, and the through hole of the fiberglass plate above the core plate matches the thickness of the other metal block, and the metal block is accommodated therein; and the plurality of fiberglass plates and the core plate are thermally pressed.
  25. The method of manufacturing the multi-layer circuit board according to claim 23, wherein the method of embedding the two metal blocks on the upper and lower surfaces of the multi-layer circuit substrate comprises the steps of: preparing a plurality of glass fiber boards, a core board, and the two metal blocks. And a thermoplastic heat conductive layer; wherein all the fiberglass sheets and the core sheets are formed with uniform holes at the same position, and the thickness of the two metal blocks is smaller than the total thickness of the plurality of glass fiber sheets and the core sheets; The fiberboards are respectively stacked on the lower surface of the core board, and the through holes of each of the glass fiber board and the core board form a receiving groove; wherein the thickness of the two metal blocks and the thermoplastic heat conductive layer match the accommodating groove The depth is to be accommodated in the accommodating groove, wherein the thermoplastic heat conductive layer is sandwiched between the two metal blocks; and the plurality of glass fiber boards and the core board are thermocompression-bonded.
  26. The method for manufacturing a multi-layer circuit board according to any one of claims 23 to 24, wherein the method of inserting the heat-conducting member together with the upper and lower metal blocks comprises: drilling a pair of metal blocks to form a plurality of drilled holes; Electroplating drilling to form a plurality of conductive via columns; and internally plugging holes for each of the conductive via posts to fill the respective conductive via posts.
  27. For example, the multi-layer circuit board method described in claim 26, The conductive hole column is filled with an insulating material, a heat conductive material or a conductive material.
  28. The method for manufacturing a multi-layer circuit board according to any one of claims 23 to 24, wherein the method of inserting the heat-conducting member together with the upper and lower metal blocks comprises: drilling a pair of metal blocks to form a plurality of drilled holes; And a plurality of conductive columns are passed through the corresponding holes.
  29. The multi-layer circuit board method of claim 28, wherein the conductive post is a screw or a metal post.
  30. The method of manufacturing the multi-layer circuit board according to claim 23, wherein a metal block is further embedded in the second same position on the upper and lower surfaces of the multilayer circuit substrate, so that the upper and lower metal blocks in the second same position are separated from each other, and A heat conducting member is disposed together with the upper and lower metal blocks in the second same position, so that the upper and lower surfaces of the multilayer circuit board form two heat conduction paths.
  31. The method for manufacturing a multi-layer circuit board according to claim 30, wherein the step of providing the upper and lower metal blocks in the first and second identical positions comprises the steps of: preparing a plurality of fiberglass boards, a core board, and two heat conducting metal parts. A part of the fiberglass board is formed with a plurality of through holes and a communication passage connecting the plurality of through holes in the lateral direction, and each of the heat conductive metal components includes two first and second metal blocks and a lateral connection of the first and second metal blocks The transverse heat conducting member, wherein the total thickness of the two first heat conducting metal blocks and the second heat conducting metal blocks of the two heat conducting metal components is less than the total thickness of the plurality of glass fiber sheets and the core sheets; and the plurality of glass sheets are stacked The position of the lower surface of the core plate, wherein the depth of each of the holes of the fiberglass plate under the core plate matches the thickness of the first and second metal blocks of the corresponding heat conductive metal component, and the transverse heat conductive member matches the communication channel to one of them The thermally conductive metal component is received therein, and the depth of each of the through holes of the fiberglass plate above the core plate matches the thickness of the first and second metal blocks of the other thermally conductive metal component, and the transverse heat conducting component is matched Passage to accommodate the thermally conductive metal assembly housed therein; and a plurality of thermocompression bonding glass plate and core plate.
  32. The method for manufacturing a multi-layer circuit board according to claim 31, wherein the method of inserting the heat-conducting member together with the upper and lower metal blocks comprises: drilling a pair of metal blocks to form a plurality of through-holes; Forming a plurality of conductive hole columns; and performing inner layer plug holes on the conductive hole columns to fill the conductive hole columns.
  33. The method for manufacturing a multilayer circuit board according to claim 32, wherein the conductive hole column is filled with an insulating material, a heat conductive material or a conductive material.
  34. The method for manufacturing a multi-layer circuit board according to claim 31, wherein the method of inserting the heat-conducting member together with the upper and lower metal blocks comprises: drilling a pair of metal blocks to form a plurality of drilled holes; and conducting the plurality of conductive holes; The column passes through the corresponding borehole.
  35. The multi-layer circuit board method of claim 34, wherein the conductive post is a screw or a metal post.
  36. The method of manufacturing a multi-layer circuit board according to claim 24, 25 or 31, wherein a part of the fiberglass board or the core board is soldered with an electronic component, and a heat conducting block is embedded in the electronic component, the heat conducting block The part corresponds to the upper and lower metal blocks and is passed through by the heat conducting member.
TW100103643A 2011-01-31 2011-01-31 Multi-layer circuit board with embedded thermal conductive metal block and its preparation method TWI415527B (en)

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CN104754887B (en) * 2013-12-30 2018-06-05 深南电路有限公司 The method and wiring board of processing line plate
KR20160015980A (en) * 2014-08-01 2016-02-15 삼성전기주식회사 Printed circuit board and manufacturing method thereof
WO2017138104A1 (en) * 2016-02-10 2017-08-17 株式会社メイコー Substrate and method for manufacturing substrate
CN106341941A (en) * 2016-10-17 2017-01-18 珠海杰赛科技有限公司 Manufacturing method for locally burying copper block and conducting internal-layer lead wire
CN107249287A (en) * 2017-07-27 2017-10-13 维沃移动通信有限公司 A kind of electronic building brick and electronic equipment
TWI704852B (en) * 2018-11-28 2020-09-11 先豐通訊股份有限公司 Plating method for circuit board and circuit board made therefrom

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