TWI415527B - Multi-layer circuit board with embedded thermal conductive metal block and its preparation method - Google Patents
Multi-layer circuit board with embedded thermal conductive metal block and its preparation method Download PDFInfo
- Publication number
- TWI415527B TWI415527B TW100103643A TW100103643A TWI415527B TW I415527 B TWI415527 B TW I415527B TW 100103643 A TW100103643 A TW 100103643A TW 100103643 A TW100103643 A TW 100103643A TW I415527 B TWI415527 B TW I415527B
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- metal blocks
- heat
- conductive
- metal
- Prior art date
Links
Abstract
Description
本發明係關於一種多層電路板,尤指一種內嵌導熱金屬塊的多層電路板。The present invention relates to a multilayer circuit board, and more particularly to a multilayer circuit board in which a thermally conductive metal block is embedded.
由於電子裝置愈趨小形且薄形化,其內部電路密度相對提高,而促成高線路密度的多層式電路板發展;又隨著電子裝置整合功能趨勢,漸漸採用高速運算器或功率元件於其電路中,造成電子裝置使用期間中易發熱的主因;因此,除了附加散熱裝置進行散熱外,為了再提高多層電路板的散熱效率,且不佔據電子元件機殼內過大空間,一種內嵌導熱金屬塊多層電路板已被提出。As electronic devices become smaller and thinner, their internal circuit density is relatively increased, which leads to the development of multi-layer circuit boards with high line density. With the trend of integration of electronic devices, high-speed computing devices or power components are gradually used in their circuits. The main cause of heat generation during use of the electronic device; therefore, in addition to the additional heat sink for heat dissipation, in order to further improve the heat dissipation efficiency of the multilayer circuit board, and does not occupy too much space in the electronic component casing, an in-line heat conductive metal block Multilayer boards have been proposed.
請參閱圖6所示,係為一種既有內嵌導熱金屬塊多層電路板50結合電子元件70及散熱器71的示意圖,該多層電路板50係內嵌入一塊貫穿多層電路板50上下表面之導熱金屬塊60,令銲接至多層電路板50上表面的電子元件70得以接觸該導熱金屬塊60上表面,而設置於多層電路板50下方的散熱器71,則與導熱金屬塊60下表面接觸;如此,如圖7所示,該導熱金屬塊60即作為電子元件70與散熱器71之間的導熱路徑,有效地將電子元件70運作中產生的廢熱傳導至該多層電路板50下方的散熱器71。Please refer to FIG. 6 , which is a schematic diagram of a multi-layer circuit board 50 with embedded heat-conductive metal blocks combined with an electronic component 70 and a heat sink 71 . The multilayer circuit board 50 is embedded with a heat conducting through the upper and lower surfaces of the multilayer circuit board 50 . The metal block 60 is such that the electronic component 70 soldered to the upper surface of the multilayer circuit board 50 contacts the upper surface of the heat conductive metal block 60, and the heat sink 71 disposed under the multilayer circuit board 50 is in contact with the lower surface of the heat conductive metal block 60; Thus, as shown in FIG. 7 , the heat conductive metal block 60 serves as a heat conduction path between the electronic component 70 and the heat sink 71 , and effectively transfers the waste heat generated during the operation of the electronic component 70 to the heat sink below the multilayer circuit board 50 . 71.
由於上述內嵌導熱金屬塊多層電路板直接提供電子元件導熱路徑,故令電子元件上可不必再疊設散熱器,讓電子裝置配置內部元件更有彈性,但卻也間接造成多層電路板製造商的良率降低。Since the above-mentioned embedded heat conductive metal block multi-layer circuit board directly provides the heat conduction path of the electronic component, the electronic component does not need to be stacked with the heat sink, so that the electronic device is configured with internal components more elastic, but indirectly causes the multilayer circuit board manufacturer. The yield is reduced.
請參閱圖8A至8D所示,內嵌導熱金屬塊的多層式電路板50的製程方法係包含以下步驟:將複數玻纖板51及核芯板52依序置於一壓合機的治具上,其中該核芯板52係夾設於複數玻纖板52之中;於預設導熱金屬塊60位置進行切型,以形成匹配金屬塊尺寸的貫孔容置槽501;將導熱金屬塊60置入容置槽501中;及熱壓合複數玻纖板51及核芯板52,構成一多層電路板50。Referring to FIGS. 8A to 8D, the manufacturing method of the multi-layer circuit board 50 in which the heat conductive metal block is embedded includes the following steps: sequentially placing the plurality of fiberglass boards 51 and the core board 52 in a fixture of a press machine. The core board 52 is sandwiched between the plurality of fiberglass boards 52; and is cut at a position of the predetermined heat conducting metal block 60 to form a through hole receiving groove 501 matching the size of the metal block; 60 is placed in the accommodating groove 501; and the plurality of glass fiber sheets 51 and the core board 52 are thermocompression-bonded to form a multilayer circuit board 50.
由圖8D及圖8E可知,多層電路板50經熱壓合後因玻纖板51熱壓後厚度不一,因此縱使挑選相同厚度金屬塊,導熱金屬塊60仍有可能凸出於多層電路板50’上表面或凹陷於多層電路板50中。蓋因熱壓會後通常會再執行一道防銲綠漆72,故可填補如圖8D導熱金屬塊60凹陷處,令多層電路板50表面平坦。然而,對於導熱金屬塊60表面凸出於多層電路板50’的成品,如圖8D所示,則被視為瑕疵品而必須丟棄,因而造成整體多層電路板的良率下降,增加製作成本。As can be seen from FIG. 8D and FIG. 8E, the thickness of the multilayer circuit board 50 after thermal pressing is different due to the heat pressing of the glass fiber board 51. Therefore, even if the metal block of the same thickness is selected, the heat conductive metal block 60 may protrude from the multilayer circuit board. The upper surface 50' is recessed or recessed in the multilayer circuit board 50. After the cover is hot pressed, a solder resist green paint 72 is usually executed, so that the recess of the heat conductive metal block 60 in Fig. 8D can be filled to make the surface of the multilayer circuit board 50 flat. However, for the finished product of the heat-conductive metal block 60 protruding from the multilayer circuit board 50', as shown in Fig. 8D, it is regarded as a defective product and must be discarded, thereby causing a decrease in the yield of the entire multilayer circuit board and an increase in manufacturing cost.
有鑑於上述內嵌導熱金屬塊多層電路板的既有缺陷,本發明主要目的係提供一種於壓合製程後確保金屬塊與電路板表面齊平的多層電路板及其製法。In view of the above-mentioned defects of the embedded heat conductive metal block multilayer circuit board, the main object of the present invention is to provide a multilayer circuit board for ensuring that the metal block is flush with the surface of the circuit board after the pressing process and a method of manufacturing the same.
欲達上述目的所使用的主要技術手段係令該內嵌導熱 金屬塊的多層電路板,係包含有:一多層電路基板,係於上下表面的同一位置分別向內形成有一第一容置槽及一第二容置槽;二金屬塊,係分別設於第一容置槽及第二容置槽中,其中設置於第一容置槽之金屬塊外露表面與多層電路基板上表面齊平,而設置於第二容置槽之金屬塊外露表面係與該多層電路基板下表面齊平;及一導熱件,係嵌設於多層電路基板內,分別與二金屬塊接觸,作為二金屬塊的導熱媒介。The main technical means used to achieve the above purpose is to make the embedded heat conduction The multi-layer circuit board of the metal block comprises: a multi-layer circuit substrate, wherein a first receiving groove and a second receiving groove are respectively formed inward at the same position on the upper and lower surfaces; the two metal blocks are respectively disposed on In the first accommodating groove and the second accommodating groove, the exposed surface of the metal block disposed in the first accommodating groove is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block disposed in the second accommodating groove is The lower surface of the multi-layer circuit substrate is flush; and a heat-conducting member is embedded in the multi-layer circuit substrate and is respectively in contact with the two metal blocks as a heat-conducting medium of the two metal blocks.
再者,欲達上述目的所使用的主要技術手段係令該內嵌導熱金屬塊之多層電路板的製法係於一多層電路板上下表面的相同位置分別嵌入一金屬塊,令此二個金屬塊彼此分離,再透過導熱件一同穿設二金屬塊,構成該多層電路板二相對端面之一完整的導熱路徑。Furthermore, the main technical means for achieving the above purpose is to fabricate the multilayer circuit board in which the heat conductive metal block is embedded in a metal block at the same position on the lower surface of a multilayer circuit board, so that the two metals are The blocks are separated from each other, and then two metal blocks are pierced through the heat conducting member to form a complete heat conduction path of one of the opposite end faces of the multilayer circuit board.
上述本發明主要以二個分離設置於多層電路基板內的金屬塊,配合導熱件構成電子元件及散熱器的導熱路徑;由於二分離設置的金屬塊總厚度必定小於多層電路基板厚度,加上多層電路板壓合時其複數玻纖板會熔融軟化,故置於第一及第二容置槽內的金屬塊會壓入多層電路板中,確保二金屬塊表面分別與對應的端面齊平,而不會凸出於多層電路板表面之上;是以,本發明多層電路板的結構設計具有高良率。The above-mentioned invention mainly uses two metal blocks which are separately disposed in the multi-layer circuit substrate, and the heat-conducting member forms a heat-conducting path of the electronic component and the heat sink; since the total thickness of the two metal blocks is necessarily smaller than the thickness of the multi-layer circuit substrate, plus multiple layers When the circuit board is pressed, the plurality of glass fiber sheets are melted and softened, so the metal blocks placed in the first and second receiving grooves are pressed into the multilayer circuit board to ensure that the surfaces of the two metal blocks are flush with the corresponding end faces, respectively. It does not protrude above the surface of the multilayer circuit board; therefore, the structural design of the multilayer circuit board of the present invention has a high yield.
首先請參閱圖1F所示,係為本發明一內嵌導熱金屬塊 的多層電路板10的一較佳實施例剖面圖,其包含有:一多層電路基板,係由複數玻纖板11及核芯板12壓合而成,並於上下表面的同一位置分別向內形成有一第一容置槽101及一第二容置槽102,如圖1B所示;二金屬塊20、21,係分別設於第一容置槽101及第二容置槽102中,其中設置於第一容置槽101之金屬塊20外露表面與多層電路基板上表面齊平,而設置於第二容置槽102之金屬塊21外露表面係與該多層電路基板下表面齊平;及一導熱件,係嵌設於多層電路基板內,分別與二金屬塊20、21接觸,作為二金屬塊20、21的導熱媒介;於本實施例中,該導熱件係包含複數導電孔柱202,係貫穿於二金屬塊20、21及多層電路基板,其中各導電孔柱202內係可填充絕緣材30,或如圖1G填充導熱或導電材31(如銅膠或銀膠);又如圖1H,係為另一多層電路板的較佳實施例,該導熱件係包含複數導熱柱32,分別貫穿二金屬塊20、21及多層電路基板,該導熱柱32係為螺絲、金屬柱。First, please refer to FIG. 1F, which is an embedded thermal conductive metal block of the present invention. A cross-sectional view of a preferred embodiment of a multi-layer circuit board 10 includes a multi-layer circuit substrate which is formed by pressing a plurality of fiberglass panels 11 and a core panel 12 and respectively at the same position on the upper and lower surfaces. The first accommodating groove 101 and the second accommodating groove 102 are formed in the first accommodating groove 101 and the second accommodating groove 102, respectively. The exposed surface of the metal block 20 disposed on the first accommodating groove 101 is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block 21 disposed on the second accommodating groove 102 is flush with the lower surface of the multilayer circuit substrate; And a heat-conducting member is embedded in the multi-layer circuit substrate and is respectively in contact with the two metal blocks 20 and 21 as a heat-conducting medium of the two metal blocks 20 and 21; in the embodiment, the heat-conducting member comprises a plurality of conductive holes. 202, is through the two metal blocks 20, 21 and the multi-layer circuit substrate, wherein each of the conductive hole posts 202 can be filled with an insulating material 30, or as shown in FIG. 1G filled with a heat conducting or conductive material 31 (such as copper or silver glue); 1H is a preferred embodiment of another multilayer circuit board, the heat conductive member includes Heat conducting column 32, respectively, through two metal blocks 20, 21 and the multilayer circuit board, the heat conducting column 32 is a screw-based, metal pillar.
請配合參閱圖1A至1F,上述圖1F的多層電路板製程方法係包含以下步驟:準備複數玻纖板11、一核芯板12及二金屬塊20、21;其中部份玻纖板11分別係形成有一個以上的貫孔111,而二金屬塊20、21的厚度小於複數玻纖板11及核芯板12疊合的總厚度;將複數玻纖板11分別疊設於該核芯板12上下表面位置,其中位於核芯板12下方形成有貫孔111的玻纖板11, 該些貫孔111深度匹配其中一金屬塊21厚度,並容置該金屬塊21於其中,而位於核芯板12上方形成有貫孔111的玻纖板11,該些貫孔111係匹配另一金屬塊20厚度,並將該金屬塊20容置於其中;熱壓合複數玻纖板11及核芯板12,以構成一多層電路板10;對此二上下金屬塊20、21同時進行鑽孔201;電鍍鑽孔201以形成複數導電孔柱202;及對導電孔柱202主進行內層塞孔,以填滿各導電孔柱202於導熱件,令上下金屬塊20、21構成一導熱路徑。Referring to FIG. 1A to FIG. 1F, the multi-layer circuit board manufacturing method of FIG. 1F includes the following steps: preparing a plurality of fiberglass boards 11, a core board 12 and two metal blocks 20, 21; wherein some of the fiberglass boards 11 respectively More than one through hole 111 is formed, and the thickness of the two metal blocks 20, 21 is smaller than the total thickness of the plurality of glass fiber sheets 11 and the core board 12; the plurality of glass sheets 11 are respectively stacked on the core board 12 upper and lower surface positions, wherein the fiberglass board 11 having the through hole 111 formed under the core board 12, The through holes 111 are closely matched to the thickness of one of the metal blocks 21 and accommodate the metal block 21 therein, and the fiberglass plates 11 are formed with the through holes 111 formed above the core plate 12, and the through holes 111 are matched with each other. a metal block 20 having a thickness and accommodating the metal block 20 therein; thermocompression bonding the plurality of fiberglass sheets 11 and the core board 12 to form a multilayer circuit board 10; simultaneously, the upper and lower metal blocks 20, 21 are simultaneously Drilling 201; electroplating the hole 201 to form a plurality of conductive vias 202; and internally laminating the conductive vias 202 to fill the conductive vias 202 to the heat conducting members, so that the upper and lower metal blocks 20, 21 are formed. A heat conduction path.
此外,欲製作如圖1G的多層電路板10a則製程步驟與上述圖1A至1E都相同,惟於電鍍步驟後,再對各導電孔柱202內填充導熱或導電材31(如銅膠或銀膠),令提高二金屬塊20、21的導熱效率。In addition, if the multilayer circuit board 10a of FIG. 1G is to be fabricated, the process steps are the same as those of FIGS. 1A to 1E described above, but after the electroplating step, the conductive vias 202 are filled with a heat conductive or conductive material 31 (such as copper or silver). Glue), which improves the heat transfer efficiency of the two metal blocks 20, 21.
若欲製作如圖1H的多層電路板10b,則於上述鑽孔步驟後,選用長度較多層電路板10b厚度為短的螺絲或金屬柱等導電柱32,直接貫穿對應鑽孔201中。If the multilayer circuit board 10b of FIG. 1H is to be formed, after the drilling step, the conductive pillars 32 such as screws or metal posts having a shorter thickness of the circuit board 10b are directly inserted into the corresponding drill holes 201.
請參閱圖2A至2F所示,係為本發明內嵌導熱金屬塊的多層電路板10c的另一較佳實施例剖面圖,其包含有:一多層電路基板,係由複數玻纖板11及核芯板12壓合而成,各玻纖板11及核芯板12係於相同位置形成有貫孔111、121,於對位壓合後形成一貫穿多層電路基板的一容置槽101”;二金屬塊20、21,係分別設於該容置槽101”的上下位置,且彼此分離,設置於該容置槽101”上方位置之金屬塊 20外露表面與多層電路基板上表面齊平,而設置於該容置槽101”下方位置之金屬塊21外露表面係與該多層電路基板下表面齊平;及一熱塑型導熱層22,係容置於該容置槽101”內,並夾設於二金屬塊20、21之間,以與二金屬塊20、21接觸,作為二金屬塊20、21的導熱媒介;其中該熱塑型導熱層22係可採用如鋁基板、軟性導熱材料或導電材料(銅膠或銀膠)作為熱塑型導熱層。2A to 2F are cross-sectional views showing another preferred embodiment of a multilayer printed circuit board 10c with a heat conductive metal block embedded therein, comprising: a multilayer circuit substrate, which is composed of a plurality of fiberglass boards 11 And the core board 12 is formed by pressing together, and each of the glass fiber board 11 and the core board 12 is formed with through holes 111 and 121 at the same position, and a accommodating groove 101 penetrating the multilayer circuit substrate is formed after the alignment is pressed. The two metal blocks 20 and 21 are respectively disposed at upper and lower positions of the accommodating groove 101", and are separated from each other, and the metal block is disposed above the accommodating groove 101". The exposed surface is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block 21 disposed under the receiving groove 101" is flush with the lower surface of the multilayer circuit substrate; and a thermoplastic heat conductive layer 22 is The capacitor is placed in the accommodating groove 101" and is sandwiched between the two metal blocks 20, 21 to be in contact with the two metal blocks 20, 21 as a heat conduction medium of the two metal blocks 20, 21; wherein the thermoplastic type The heat conductive layer 22 may be, for example, an aluminum substrate, a soft heat conductive material, or a conductive material (copper or silver paste) as the thermoplastic heat conductive layer.
又為提升本實施例的導熱效率,如圖2F所示,該多層電路板係進一步形成有複數導電孔柱202,以貫穿二金屬塊20、21及熱塑型導熱層22,再於各導電孔柱202填充絕緣材30或導熱或導電材(如銅膠或銀膠),亦或直接穿設有導電柱。In order to improve the heat conduction efficiency of the embodiment, as shown in FIG. 2F, the multilayer circuit board is further formed with a plurality of conductive via posts 202 for penetrating the two metal blocks 20, 21 and the thermoplastic heat conductive layer 22, and then conducting the conductive materials. The column 202 is filled with an insulating material 30 or a heat conductive or conductive material (such as copper or silver glue), or directly through a conductive column.
請配合參閱圖2A至2F,上述圖2F多層電路板的製程方法步驟:準備複數玻纖板11、一核芯板12、二金屬塊20、21及一熱塑型導熱層22;其中所有玻纖板11及核芯板12均於相同位置均分別形成有一貫孔111、121,而二金屬塊20、21的厚度小於複數玻纖板111及核芯板12疊合的總厚度;將複數玻纖板11分別疊設於該核芯板12上下表面位置,各玻纖板11及核芯板12的貫孔111、121係形成一容置槽101”;其中二金屬塊20、21及熱塑型導熱層22厚度係匹配該容置槽101”的深度,以容置於容置槽101”中,其中該熱塑型導熱層22係夾設於二金屬塊20、21之間; 熱壓合複數玻纖板11及核芯板12,以構成一多層電路板10c;對此二金屬塊20、21及熱塑型導熱層22同時進行鑽孔201;電鍍鑽孔201以形成複數導電孔柱202;及對導電孔柱202進行內層塞孔,以填滿各導電孔柱202,以提高二金屬塊20、21導熱效率。Please refer to FIG. 2A to FIG. 2F, the process steps of the above-mentioned FIG. 2F multilayer circuit board: preparing a plurality of fiberglass boards 11, a core board 12, two metal blocks 20, 21 and a thermoplastic heat conductive layer 22; The fiberboard 11 and the core plate 12 are respectively formed with the same holes 111 and 121 at the same position, and the thickness of the two metal blocks 20 and 21 is smaller than the total thickness of the plurality of the fiberglass plates 111 and the core plate 12; The fiberglass panels 11 are respectively stacked on the upper and lower surfaces of the core panel 12, and the through holes 111 and 121 of each of the fiberglass panels 11 and the core panel 12 form a receiving slot 101"; wherein the two metal blocks 20, 21 and The thickness of the thermoplastic heat-conducting layer 22 is matched to the depth of the accommodating groove 101" to be received in the accommodating groove 101", wherein the thermoplastic heat-conductive layer 22 is sandwiched between the two metal blocks 20, 21; The plurality of glass fiber sheets 11 and the core board 12 are thermocompression-bonded to form a multilayer circuit board 10c; the two metal blocks 20, 21 and the thermoplastic heat conductive layer 22 are simultaneously drilled 201; the drilling holes 201 are formed to form The plurality of conductive via posts 202; and the inner via plugs of the conductive vias 202 to fill the conductive vias 202 to improve the thermal conductivity of the two metal blocks 20, 21.
請參閱圖3A至3C所示,係為本發明內嵌導熱金屬塊的多層電路板10d的又一較佳實施例剖面圖,其包含有:一多層電路基板,係由複數玻纖板11及核芯板12壓合而成,並於上下表面的二相同位置分別向內形成有二第一容置槽101、101’及二第二容置槽102、102’,其中二第一容置槽101、101’係相互連通,而二第二容置槽102、102’亦相互連通;四金屬塊20、21,各金屬塊20、21係分別設於第一容置槽101、101’及第二容置槽102、102’中,其中設置於第一容置槽101、101’之金屬塊20外露表面與多層電路基板上表面齊平,而設置於第二容置槽102、102’之金屬塊21外露表面係與該多層電路基板下表面齊平;二橫向導熱件,係分別容置於二第一容置槽101、101’之一連通通道112中,以及二第二容置槽102、102’之連通通道112中,以與對應的二金屬塊20/21連接,該橫向導熱件係係一導熱柱32,分別連接二金屬塊20/20及二金屬塊21/21;及二縱向導熱件,係嵌設於多層電路基板內,分別與二 組上下金屬塊20、21接觸,作為二金屬塊20、21的導熱媒介;於本實施例中,該縱向導熱件係包含複數導電孔柱202,係貫穿於二金屬塊20、21及多層電路基板,其中各導電孔柱202內係可填充絕緣材30,或如圖1G填充導熱或導電材31(如銅膠或銀膠);又如圖1H,係為另一多層電路板的較佳實施例,該縱向導熱件係包含複數導熱柱32,分別貫穿二金屬塊20、21及多層電路基板,該導熱柱32係為螺絲、金屬柱。3A to 3C are cross-sectional views showing still another preferred embodiment of the multilayer printed circuit board 10d with the heat conductive metal block embedded therein, comprising: a multilayer circuit substrate, which is composed of a plurality of fiberglass boards 11 And the core board 12 is press-fitted, and two first accommodating grooves 101, 101' and two second accommodating grooves 102, 102' are respectively formed inward at the same position on the upper and lower surfaces, wherein the two first capacities are The slots 101 and 101 ′ are connected to each other, and the second accommodating slots 102 and 102 ′ are also connected to each other. The four metal blocks 20 and 21 and the metal blocks 20 and 21 are respectively disposed in the first accommodating slots 101 and 101 . And the second accommodating groove 102, 102', wherein the exposed surface of the metal block 20 disposed in the first accommodating groove 101, 101' is flush with the upper surface of the multilayer circuit substrate, and is disposed in the second accommodating groove 102, The exposed surface of the metal block 21 of the 102' is flush with the lower surface of the multilayer circuit substrate; and the two lateral heat conducting members are respectively received in the communication channel 112 of the two first receiving slots 101, 101', and the second The communication channel 112 of the accommodating groove 102, 102' is connected to the corresponding two metal blocks 20/21, and the transverse heat conducting member is tied to The heat conducting column 32 is respectively connected to the two metal blocks 20/20 and the two metal blocks 21/21; and the two longitudinal heat conducting members are embedded in the multilayer circuit substrate, respectively The upper and lower metal blocks 20 and 21 are in contact with each other as a heat-conducting medium of the two metal blocks 20 and 21; in the embodiment, the longitudinal heat-conducting member comprises a plurality of conductive hole posts 202 extending through the two metal blocks 20 and 21 and the multilayer circuit. The substrate, wherein each of the conductive vias 202 can be filled with an insulating material 30, or filled with a heat conducting or conductive material 31 (such as copper or silver glue) as shown in FIG. 1G; and FIG. 1H is a comparison of another multilayer circuit board. In a preferred embodiment, the longitudinal heat conducting member comprises a plurality of thermally conductive columns 32 extending through the two metal blocks 20, 21 and the multilayer circuit substrate, respectively. The heat conducting columns 32 are screws and metal posts.
請配合參閱圖3A至3C,上述圖3C的多層電路板製程方法係包含以下步驟:準備複數玻纖板11、一核芯板12、二導熱金屬組件;其中部份玻纖板11係形成有複數貫孔111、111’及橫向連通複數貫孔111、111’的連通通道112,各導熱金屬組件係包含二金屬塊20、21及橫向連接二金屬塊20/20、21/21的橫向導熱件,又二導熱金屬組件的金屬塊20、21總厚度小於複數玻纖板11及核芯板12疊合的總厚度;將複數玻纖板11分別疊設於該核芯板12上下表面位置,其中位於核芯板12下方玻纖板11各貫孔111深度匹配對應導熱金屬組件的金屬塊21厚度,而橫向導熱件則匹配連通通道112,以將其中一導熱金屬組件容置其中,而位於核芯板12上方玻纖板11各貫孔111深度匹配另一組導熱金屬組件的金屬塊20厚度,而橫向導熱件則匹配連通通道112,以將該導熱金屬組件容置其中;熱壓合複數玻纖板11及核芯板12,以構成一多層電路板10d; 對此二上下金屬塊同時進行鑽孔201;電鍍鑽孔201以形成複數導電孔柱202;及對導電孔柱202主進行內層塞孔,以填滿各導電孔柱202,令上下導熱金屬組件之相同位置的金屬塊20、21構成一導熱路徑。Referring to FIG. 3A to FIG. 3C, the multi-layer circuit board manufacturing method of FIG. 3C includes the following steps: preparing a plurality of fiberglass boards 11, a core board 12, and two heat conducting metal components; wherein some of the fiberglass boards 11 are formed with The plurality of through holes 111, 111' and the communication passage 112 laterally connecting the plurality of through holes 111, 111', each of the heat conducting metal components comprising the two metal blocks 20, 21 and the transverse heat conduction of the laterally connected two metal blocks 20/20, 21/21. And the total thickness of the metal blocks 20 and 21 of the heat conductive metal component is less than the total thickness of the plurality of the fiberglass board 11 and the core board 12; and the plurality of glass fiber boards 11 are respectively stacked on the upper and lower surfaces of the core board 12. Wherein the through holes 111 of the fiberglass plate 11 under the core plate 12 are deeply matched to the thickness of the metal block 21 corresponding to the heat conductive metal component, and the lateral heat conducting member is matched with the communication channel 112 to accommodate one of the heat conductive metal components therein. The through holes 111 of the fiberglass board 11 located above the core board 12 are deep enough to match the thickness of the metal block 20 of the other set of heat conducting metal components, and the transverse heat conducting members are matched with the communication passages 112 to accommodate the heat conducting metal components therein; Combined with multiple fiberglass panels 11 and Core board 12 to form a multilayer circuit board 10d; The upper and lower metal blocks are simultaneously drilled 201; the drilling holes 201 are plated to form a plurality of conductive via posts 202; and the conductive via posts 202 are internally internally plugged to fill the conductive via posts 202 to make the upper and lower heat conductive metals The metal blocks 20, 21 at the same location of the assembly form a thermally conductive path.
以下謹進一步說明上述技術應用於具有內嵌電子元件的多層電路板時,亦能有效地將內嵌於多層電路板的電子元件廢熱一併藉由導熱金屬塊帶出多層電路板外。In the following, it is further explained that when the above technology is applied to a multilayer circuit board having embedded electronic components, the waste heat of the electronic components embedded in the multilayer circuit board can be effectively taken out of the multilayer circuit board by the heat conductive metal blocks.
請參閱圖4A至4E所示,係為本發明另一多層電路板的較佳實施例,其中該多層電路板10f係包含有:一多層電路基板,係由複數玻纖板11及一核芯板12’壓合而成,其中該核芯板12銲接有電子元件70’,並於電子元件70’位置嵌設有一導熱塊23,又該多層電路基板係於上下表面對應核芯板12’之導熱塊23的同一位置,分別向內形成有一第一容置槽101及一第二容置槽102;二金屬塊20、21,係分別設於第一容置槽101及第二容置槽102中,其中設置於第一容置槽101之金屬塊20外露表面與多層電路基板上表面齊平,而設置於第二容置槽101之金屬塊21外露表面係與該多層電路基板下表面齊平;及一導熱件,係嵌設於多層電路基板內,分別與二金屬塊20、21及導熱塊23接觸,作為二金屬塊20、21及導熱塊23的導熱媒介;於本實施例中,該導熱件係包含複數導電孔柱202,其中部份導電孔柱202係貫穿於二金屬塊20、21及多層電路基板,其餘則貫穿於二金屬塊20、21、多層 電路基板及導熱塊23;其中各導電孔柱202內係可填充絕緣材30,或如圖1G填充導熱或導電材(如銅膠或銀膠)31;又如圖1H,係為另一多層電路板的較佳實施例,該導熱件係包含複數導熱柱32,分別貫穿二金屬塊、多層電路基板及/或導熱塊,該導熱柱32係為螺絲、金屬柱。4A to 4E are preferred embodiments of another multilayer circuit board according to the present invention, wherein the multilayer circuit board 10f includes: a multilayer circuit substrate, which is composed of a plurality of fiberglass boards 11 and a The core board 12' is press-fitted, wherein the core board 12 is soldered with an electronic component 70', and a heat conducting block 23 is embedded in the electronic component 70'. The multilayer circuit board is attached to the upper and lower surfaces corresponding to the core board. A first accommodating groove 101 and a second accommodating groove 102 are formed inwardly at the same position of the heat-conducting block 23 of the 12'; the two metal blocks 20 and 21 are respectively disposed in the first accommodating groove 101 and the second In the accommodating groove 102, the exposed surface of the metal block 20 disposed on the first accommodating groove 101 is flush with the upper surface of the multilayer circuit substrate, and the exposed surface of the metal block 21 disposed in the second accommodating groove 101 is connected to the multilayer circuit. The lower surface of the substrate is flush; and a heat conducting member is embedded in the multilayer circuit substrate and is respectively in contact with the two metal blocks 20, 21 and the heat conducting block 23 as a heat conducting medium of the two metal blocks 20, 21 and the heat conducting block 23; In this embodiment, the heat conducting member includes a plurality of conductive via posts 202, wherein the conductive portion The electroporation column 202 is penetrated through the two metal blocks 20 and 21 and the multilayer circuit substrate, and the rest is penetrated through the two metal blocks 20, 21 and multiple layers. The circuit substrate and the heat conducting block 23; wherein each of the conductive holes 202 can be filled with the insulating material 30, or filled with a heat conducting or conductive material (such as copper or silver glue) 31 as shown in FIG. 1H; In a preferred embodiment of the layer circuit board, the heat conducting member comprises a plurality of heat conducting columns 32 extending through the two metal blocks, the multilayer circuit substrate and/or the heat conducting block, respectively, and the heat conducting columns 32 are screws and metal posts.
請配合參閱圖4A至4D,上述圖4D的多層電路板製程方法係包含以下步驟:準備複數玻纖板11、一核芯板12’及二金屬塊20、21;其中該核芯板12’其上銲接有電子元件70’,而對應電子元件70’處則嵌設有一導熱塊23,而部份玻纖板11係對應核芯板12’導熱塊23形成有貫孔111,又二金屬塊20、21的厚度小於複數玻纖板11及核芯板12’疊合的總厚度;將複數玻纖板11分別疊設於該核芯板12’上下表面位置,其中位於核芯板12’下方形成有貫孔111的玻纖板11,該等貫孔111深度匹配其中一金屬塊21厚度,並容置該金屬塊21於其中,而位於核芯板12’上方形成有貫孔111的板纖板11,其貫孔111則匹配另一金屬塊20厚度,並將該金屬塊20容置於其中;熱壓合複數玻纖板11及核芯板12’,以構成一多層電路板10f;對此二上下金屬塊20、21同時進行鑽孔201,其中部份鑽孔201係穿經該導熱塊23;電鍍鑽孔201以形成複數導電孔柱202;及對導電孔柱202主進行內層塞孔,以填滿各導電孔柱202,令上下金屬塊20、21及導熱塊23構成一導熱路徑。Referring to FIG. 4A to FIG. 4D, the multi-layer circuit board manufacturing method of FIG. 4D includes the following steps: preparing a plurality of fiberglass boards 11, a core board 12' and two metal blocks 20, 21; wherein the core board 12' The electronic component 70' is soldered thereon, and a heat conducting block 23 is embedded in the corresponding electronic component 70', and a part of the fiberglass board 11 is formed with a through hole 111 corresponding to the core plate 12'. The thickness of the blocks 20, 21 is smaller than the total thickness of the plurality of fiberglass panels 11 and the core panel 12'; and the plurality of fiberglass panels 11 are respectively stacked on the upper and lower surfaces of the core panel 12', wherein the core panel 12 is located. The fiberglass plate 11 having the through holes 111 is formed below, and the through holes 111 are closely matched to the thickness of one of the metal blocks 21, and the metal block 21 is accommodated therein, and the through holes 111 are formed above the core plate 12'. The fiberboard 11 has a through hole 111 matching the thickness of the other metal block 20, and the metal block 20 is accommodated therein; the plurality of glass fiber sheets 11 and the core board 12' are thermocompression-bonded to form a multilayer. a circuit board 10f; the two upper and lower metal blocks 20, 21 are simultaneously drilled 201, and a part of the drill holes 201 are passed through the heat conducting block 23; electroplating the drill hole 201 to form a plurality of conductive via posts 202; and internally laminating the conductive via posts 202 to fill the conductive via posts 202, so that the upper and lower metal blocks 20, 21 and the thermal block 23 constitute a heat transfer path.
因此,該核芯板12’的電子元件70’廢熱可藉由導熱塊23往二金屬塊20、21傳導,而將多層電路板內嵌於電子元件70’向外傳導出,提高內嵌電子元件70’之多層電路板的散熱效率。此外,電子元件70’亦可銲接於其它的玻纖板11中。Therefore, the waste heat of the electronic component 70' of the core board 12' can be conducted by the heat conducting block 23 to the two metal blocks 20, 21, and the multilayer circuit board is embedded in the electronic component 70' to be out, thereby improving the embedded electronic component. The heat dissipation efficiency of the 70' multilayer board. Further, the electronic component 70' may be soldered to other fiberglass panels 11.
請再參閱圖5所示,係為整合圖1F、2F、3C及4D導熱結構的多層電路板10g,如此一來除了於多層電路板上表面設置電子元件70外,亦藉由如圖3C結構,另設置有散熱器71,而多層電路板下表面亦設置有散熱器71。再者,為使得本發明與散熱器71散熱效率更佳,可將導熱柱32’穿出多層電路板10g下表面或上表面,配合散熱膠與散熱器71接觸。Please refer to FIG. 5 again, which is a multi-layer circuit board 10g which integrates the heat conducting structures of FIGS. 1F, 2F, 3C and 4D, so that in addition to the electronic components 70 disposed on the surface of the multilayer circuit board, the structure is also as shown in FIG. 3C. A heat sink 71 is further provided, and a heat sink 71 is also disposed on the lower surface of the multilayer circuit board. Furthermore, in order to make the heat dissipation efficiency of the present invention and the heat sink 71 better, the heat conducting post 32' can be passed out of the lower surface or the upper surface of the multilayer circuit board 10g, and the heat dissipating glue is brought into contact with the heat sink 71.
綜上所述,本發明藉由熱壓合步驟中,複數玻纖板熔融軟化而與相鄰的玻纖板或核芯板黏合,故將設置於上方的金屬塊將會略為向下沉而黏合於上方玻纖板的貫孔中,且其上表面係與最上層玻纖板表面齊平;是以,本發明多層電路板製法能確保導熱用的金屬塊可與二相對表面齊平,並保有原本導熱路徑的功能。In summary, in the thermal compression bonding step, the plurality of glass fiber sheets are melted and softened to adhere to adjacent glass fiber boards or core sheets, so that the metal blocks disposed above will be slightly sunken. Bonded to the through hole of the upper glass fiber board, and the upper surface thereof is flush with the surface of the uppermost fiberglass board; therefore, the multilayer circuit board manufacturing method of the invention can ensure that the metal block for heat conduction can be flush with the opposite surfaces of the two surfaces, And retain the original heat transfer path function.
10、10a~10f‧‧‧多層電路板10, 10a~10f‧‧‧Multilayer circuit board
101、101’‧‧‧第一容置槽101, 101' ‧ ‧ first accommodating slot
101”‧‧‧容置槽101"‧‧‧ 容 槽
102、102’‧‧‧第二容置槽102, 102' ‧ ‧ second accommodating slot
11‧‧‧玻纖板11‧‧‧Fiberglass board
111、111’、121‧‧‧貫孔111, 111’, 121‧‧‧ through holes
112‧‧‧連通通道112‧‧‧Connected channel
12、12’‧‧‧核芯板12, 12’‧‧‧ Core board
20、21‧‧‧金屬塊20, 21‧‧‧ metal blocks
201‧‧‧鑽孔201‧‧‧Drilling
202‧‧‧導電孔柱202‧‧‧conductive hole column
22‧‧‧熱塑型導熱層22‧‧‧Thermal heat conduction layer
23‧‧‧導熱塊23‧‧‧heat block
30‧‧‧絕緣材30‧‧‧Insulation
31‧‧‧導電材31‧‧‧Electrical materials
32、32’‧‧‧導熱柱32, 32'‧‧‧ Thermal column
50、50’‧‧‧多層電路板50, 50'‧‧‧Multilayer boards
501‧‧‧容置槽501‧‧‧ accommodating slots
51‧‧‧玻纖板51‧‧‧glass board
52‧‧‧核芯板52‧‧‧core board
50‧‧‧導熱金屬塊50‧‧‧thermal metal block
70、70’‧‧‧電子元件70, 70’‧‧‧ Electronic components
71‧‧‧散熱器71‧‧‧ radiator
圖1A至1F:係本發明第一較佳實施例的製程剖面圖。1A to 1F are cross-sectional views showing a process of a first preferred embodiment of the present invention.
圖1G:係於圖1E後執行另一道製程剖面圖。Figure 1G: Another process profile is performed after Figure 1E.
圖1H:係於圖1D後執行另一道製程剖面圖。Figure 1H: Another process profile is performed after Figure 1D.
圖2A至2F:係本發明第二較佳實施例的製程剖面圖。2A to 2F are cross-sectional views showing a process of a second preferred embodiment of the present invention.
圖3A至3C:係本發明第三較佳實施例的製程剖面圖。3A to 3C are cross-sectional views showing a process of a third preferred embodiment of the present invention.
圖4A至4E:係本發明第四較佳實施例的製程剖面圖。4A to 4E are cross-sectional views showing a process of a fourth preferred embodiment of the present invention.
圖5:係本發明多層電路板結合電子元件及二散熱器的部分剖面圖。Figure 5 is a partial cross-sectional view showing the multilayer circuit board of the present invention incorporating electronic components and two heat sinks.
圖6:係既有內嵌導熱金屬塊多層電路板結合電子元件及二散熱器的仰視立體圖。Figure 6 is a bottom perspective view of a multi-layer circuit board with embedded thermally conductive metal blocks combined with electronic components and two heat sinks.
圖7:係圖6的部分剖面圖。Figure 7 is a partial cross-sectional view of Figure 6.
圖8A至8D:係既有內嵌導熱金屬塊多層電路板製程流程剖面圖。8A to 8D are cross-sectional views showing a process flow of a multilayer circuit board having embedded heat conductive metal blocks.
圖8E:係既有內嵌導熱金屬塊多層電路板另一剖面圖。Figure 8E is another cross-sectional view of a multilayer circuit board having embedded thermally conductive metal blocks.
10...多層電路板10. . . Multi-layer circuit board
101...第一容置槽101. . . First accommodating slot
102...第二容置槽102. . . Second receiving slot
11...玻纖板11. . . Fiberglass panels
12...核芯板12. . . Core board
20、21...金屬塊20, 21. . . Metal block
202...導電孔柱202. . . Conductive hole column
30...絕緣材30. . . Insulating material
Claims (36)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100103643A TWI415527B (en) | 2011-01-31 | 2011-01-31 | Multi-layer circuit board with embedded thermal conductive metal block and its preparation method |
CN201110054328.8A CN102625563B (en) | 2011-01-31 | 2011-03-08 | Multilayer circuit board embedded with heat-conducting metal block and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100103643A TWI415527B (en) | 2011-01-31 | 2011-01-31 | Multi-layer circuit board with embedded thermal conductive metal block and its preparation method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201233258A TW201233258A (en) | 2012-08-01 |
TWI415527B true TWI415527B (en) | 2013-11-11 |
Family
ID=46565180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100103643A TWI415527B (en) | 2011-01-31 | 2011-01-31 | Multi-layer circuit board with embedded thermal conductive metal block and its preparation method |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102625563B (en) |
TW (1) | TWI415527B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013019617B4 (en) | 2013-11-25 | 2015-07-02 | Tesat-Spacecom Gmbh & Co.Kg | High voltage electrical component for use in a satellite and satellite therewith |
CN104754887B (en) * | 2013-12-30 | 2018-06-05 | 深南电路有限公司 | The method and wiring board of processing line plate |
KR102222608B1 (en) * | 2014-08-01 | 2021-03-05 | 삼성전기주식회사 | Printed circuit board and manufacturing method thereof |
CN108353508B (en) * | 2016-02-10 | 2021-03-12 | 名幸电子股份有限公司 | Substrate and method for manufacturing substrate |
CN106341941A (en) * | 2016-10-17 | 2017-01-18 | 珠海杰赛科技有限公司 | Manufacturing method for locally burying copper block and conducting internal-layer lead wire |
CN107249287A (en) * | 2017-07-27 | 2017-10-13 | 维沃移动通信有限公司 | A kind of electronic building brick and electronic equipment |
TWI704852B (en) * | 2018-11-28 | 2020-09-11 | 先豐通訊股份有限公司 | Plating method for circuit board and circuit board made therefrom |
US11388811B1 (en) | 2021-05-21 | 2022-07-12 | Amulaire Thermal Technology, Inc. | Heat-dissipating substrate structure with built-in conductive circuits |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200942762A (en) * | 2008-04-11 | 2009-10-16 | Unimicron Technology Corp | Circuit board and process for fabricating the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5561322A (en) * | 1994-11-09 | 1996-10-01 | International Business Machines Corporation | Semiconductor chip package with enhanced thermal conductivity |
CN1240327A (en) * | 1998-06-23 | 2000-01-05 | 日东电工株式会社 | Installed circuit board structure and multi-layer circuit board for same |
CN1802069A (en) * | 2005-01-05 | 2006-07-12 | 照敏企业股份有限公司 | Substrate with high heat conduction and its making process |
CN101686611A (en) * | 2008-09-28 | 2010-03-31 | 华为技术有限公司 | Multilayer circuit board, manufacture method thereof and communication equipment |
-
2011
- 2011-01-31 TW TW100103643A patent/TWI415527B/en active
- 2011-03-08 CN CN201110054328.8A patent/CN102625563B/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200942762A (en) * | 2008-04-11 | 2009-10-16 | Unimicron Technology Corp | Circuit board and process for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
CN102625563B (en) | 2014-11-12 |
TW201233258A (en) | 2012-08-01 |
CN102625563A (en) | 2012-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI415527B (en) | Multi-layer circuit board with embedded thermal conductive metal block and its preparation method | |
KR101015651B1 (en) | Chip embedded printed circuit board and manufacturing method thereof | |
TWI530241B (en) | A multi - layer circuit board manufacturing method for embedded electronic components | |
WO2010034194A1 (en) | Multilayer circuit board and production method thereof and communication device | |
CN105321888B (en) | Package structure and method for fabricating the same | |
RU2013128431A (en) | ELECTRONIC DEVICE, METHOD OF ITS MANUFACTURE AND PRINTED BOARD CONTAINING AN ELECTRONIC DEVICE | |
JP2014503997A5 (en) | ||
TW201427509A (en) | Printed circuit board having buried component and method for manufacturing same | |
TWI544850B (en) | Manufacturing method of circuit structure embedded with heat-dissipation block | |
CN103260350B (en) | Blind buried via hole plate compression method | |
TW201507556A (en) | Thermally enhanced wiring board with thermal pad and electrical post | |
US10485098B2 (en) | Electronic component device | |
JP6047688B1 (en) | Substrate manufacturing method | |
JP2007013136A (en) | Printed circuit board with built-in parallel chip, and its manufacturing method | |
KR101516531B1 (en) | Circuit board, and manufacturing method for circuit board | |
CN108235602A (en) | The processing method that second order buries copper billet circuit board | |
JP6511851B2 (en) | Multilayer circuit board, semiconductor device, method of manufacturing multilayer circuit board | |
CN201216042Y (en) | Second order hole overlapping construction constructed by reverse suspension type blind hole | |
JP2007335675A (en) | Power supply and method for manufacturing power supply | |
CN105789161B (en) | Encapsulating structure and its preparation method | |
TWI508635B (en) | Circuit board with electronic element embeded and method for manufacturing same | |
JPH0794868A (en) | Multilayered wiring board and its manufacture | |
TW201637536A (en) | Method for directly executing attachment by dielectric to manufacture circuit board with embedded electronic devices | |
JP2005135995A (en) | Module with built-in circuit, its manufacturing method, and module with built-in multilayer-structure circuit and its manufacturing method | |
KR20140052832A (en) | Electronic device and method of manufacturing the same |