CN107249287A - A kind of electronic building brick and electronic equipment - Google Patents
A kind of electronic building brick and electronic equipment Download PDFInfo
- Publication number
- CN107249287A CN107249287A CN201710623570.XA CN201710623570A CN107249287A CN 107249287 A CN107249287 A CN 107249287A CN 201710623570 A CN201710623570 A CN 201710623570A CN 107249287 A CN107249287 A CN 107249287A
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat
- cored
- metal
- dissipation channel
- Prior art date
Links
- 239000011469 building brick Substances 0.000 title claims abstract description 36
- 239000000758 substrates Substances 0.000 claims abstract description 85
- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 239000010410 layers Substances 0.000 claims description 36
- 239000011241 protective layers Substances 0.000 claims description 10
- 230000000875 corresponding Effects 0.000 claims description 7
- 280000094896 Green Oil companies 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 239000000463 materials Substances 0.000 description 9
- 239000003292 glue Substances 0.000 description 3
- 229910052751 metals Inorganic materials 0.000 description 3
- 239000002184 metals Substances 0.000 description 3
- 230000001681 protective Effects 0.000 description 3
- 239000011347 resins Substances 0.000 description 3
- 229920005989 resins Polymers 0.000 description 3
- 238000010586 diagrams Methods 0.000 description 2
- 239000006185 dispersions Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxanes Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical group 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[Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound 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[C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000034 methods Methods 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 238000002360 preparation methods Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Abstract
Description
Technical field
The present invention relates to communication technical field, more particularly to a kind of electronic building brick and electronic equipment.
Background technology
With the high speed development of current electronic device, the electronic equipment such as mobile phone, notebook computer increasingly pursues " ultra-thin Change "." ultrathin " is intended to carry more electronic building bricks in narrow space, electronic building brick, such as battery, shooting First-class large power assembly can operationally produce substantial amounts of heat, if the heat that electronic building brick is produced can not be disperseed in time, Then the service behaviour of electronic building brick will be influenceed to a certain extent.
At present, traditional radiating mode is essentially relying on around electronic building brick Heat Conduction Material of fitting, but this radiating side Formula is for battery, the first-class large power assembly of shooting, and radiating effect is not still good.It can be seen that, it is necessary to electronic building brick in electronic equipment Radiating effect improved.
The content of the invention
The embodiment of the present invention provides a kind of electronic building brick and electronic equipment, poor to solve existing electronic building brick radiating effect The problem of.
In order to solve the above-mentioned technical problem, the present invention is realized in：A kind of electronic building brick, including electronic device, hair Warmware and substrate, the electronic device, the heat generating member and the substrate stack gradually setting, and the substrate includes being oppositely arranged The first face and the second face, wherein the first of the substrate facing to the heat generating member；
Metal-cored and at least one heat dissipation channel, described metal-cored and at least one heat dissipation channel are provided with the substrate Heat-conducting medium is filled with connection, each heat dissipation channel, the heat that the heat generating member is produced can be along described metal-cored and radiating Heat-conducting medium in passage, conducts to the second face of the substrate from the first face of the substrate.
The embodiment of the present invention additionally provides a kind of electronic equipment, including above-mentioned electronic building brick.
In embodiments of the present invention, by setting metal-cored and heat dissipation channel in substrate, so, the heat that heat generating member is produced Amount can be just conducted to the second face of substrate by the heat-conducting medium in metal-cored and heat dissipation channel from the first face of substrate, The quick diffusion of heat is realized, so as to improve the radiating effect of electronic building brick.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed for description of the embodiment of the present invention The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, For those of ordinary skill in the art, without having to pay creative labor, it can also be obtained according to these accompanying drawings Take other accompanying drawings.
Fig. 1 is a kind of structural representation of camera module provided in an embodiment of the present invention；
Fig. 2 is a kind of heat conduction schematic diagram of camera module provided in an embodiment of the present invention；
Fig. 3 is the structural representation of another camera module provided in an embodiment of the present invention；
Fig. 4 is the heat conduction schematic diagram of another camera module provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation is described, it is clear that described embodiment is a part of embodiment of the invention, rather than whole embodiments.Based on this hair Embodiment in bright, those of ordinary skill in the art's every other implementation acquired under the premise of creative work is not made Example, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of electronic building brick, including heat generating member and substrate, the heat generating member and the substrate stack Folded to set, the substrate includes the first face and the second face being oppositely arranged, wherein the first of the substrate facing to the heating Part；Be provided with metal-cored and at least one heat dissipation channel in the substrate, it is described it is metal-cored be connected with least one heat dissipation channel, Heat-conducting medium is filled with each heat dissipation channel, the heat that the heat generating member is produced can be along along described metal-cored and heat dissipation channel Heat-conducting medium, conducted from the first face of the substrate to the second face of the substrate.
The embodiment of the present invention is applied to any electronic building brick with radiating requirements, and be particularly suitable for use in great-power electronic group Part.
For example, with it is current in time bitcom it is prevailing, increasing user is by mobile phone or notebook computer Taken pictures, imaged or live Deng electronic equipment, the frequency of use of camera is more and more frequent, time of work is also increasingly It is long.Therefore, CCD camera assembly needs good heat dispersion.
For another example electronic equipment is in long-term use or charging, battery-heating is more serious, therefore, and battery component needs Good heat dispersion.
It can be seen that, the electronic building brick in the embodiment of the present invention can be camera module or battery modules, can be with It is other high-power heat generating member modules.For camera module, the heat generating member in the embodiment of the present invention can be chip, core Camera lens can be stacked with piece；For battery modules, the heating in the embodiment of the present invention can be just battery and chip.
To more fully understand the embodiment of the present invention, it is specifically described below so that electronic building brick is camera module as an example.
As shown in Figures 1 to 4, the embodiment of the present invention provides a kind of camera module, including camera lens 1, chip 2 and substrate 3, Camera lens 1, chip 2 and substrate 3 stack gradually setting, and substrate 3 includes the first face 31 and the second face 32 being oppositely arranged, wherein substrate 3 the first face 31 is towards chip 2；
Be provided with metal-cored 33 and at least one heat dissipation channel 34 in substrate 3, metal-cored 33 with least one heat dissipation channel 34 connections, are filled with heat-conducting medium in each heat dissipation channel 34, and the heat that chip 2 is produced can be along metal-cored 33 and heat dissipation channel Heat-conducting medium in 34, conducts to the second face 32 of substrate 3 from the first face of substrate 3.
In the embodiment of the present invention, printed circuit board (PCB) (PCB, Printed of the prior art are replaced using substrate 3 Circuit Board), the electric connection with chip 2 is realized by substrate 3.Substrate 3 in addition to being provided with metal-cored 33, its It is remaining to be partially filled with the base material such as resin.
Wherein, metal-cored 33 can be good metal-cored of the electric conductivities such as aluminium core or copper core, and metal-cored 33 in substrate 3 It is integral, based on the layout requirements of substrate 3, the window at interval can be set on metal-cored 33.Metal-cored 33 thickness can Flexibly to set according to stacking space, under conditions of meeting and stacking space, can suitably select that thickness is larger metal-cored 33.
In addition, should set the circuit 35 of electron-donating connection in substrate 3, circuit 35 should be arranged in base material, circuit 35 Layout can flexibly be set according to the need for electric connection.
In general, circuit 35 can be set in metal-cored 33 both sides up and down, metal-cored 33 can also be positioned only at Top, the quantity of circuit 35 can also differentiation.Also just say, be reference with metal-cored 33, the circuit close to the side of chip 2 is minimum It can be one layer, the circuit away from the side of chip 2 can be at least zero layer.
As shown in Figure 1 to Figure 2, when only setting circuit 35 in metal-cored 33 top, because metal-cored 33 lower sections do not have Circuit 35, therefore, metal-cored 33 lower section need not fill base material, so, the second face that metal-cored 33 side wall can be with substrate 3 32 is concordant, i.e., metal-cored 33 side wall is exposed to the second face 32 of substrate 3.
Based on the set-up mode, because metal-cored 33 exposed side walls can serve as radiating surface, therefore can be only in metal The top of core 33 sets heat dissipation channel 34, that is to say, that at least one heat dissipation channel 34 extends to gold from the first face 31 of substrate 3 Belong to core 33.
As shown in Fig. 2 the heat conduction path under the set-up mode is shown in arrow in figure, first, heat is passed from chip 2 Be directed at heat dissipation channel 34, then conducted through heat dissipation channel 34 to metal-cored 33, finally from metal-cored 33 exposed side walls radiation or It is distributed to the outside of substrate 3.Should during, heat, can be with except can be metal-cored 33 and the internal consumption of heat dissipation channel 34 Rapid radiating is distributed to outside, is quickly dissipated so as to the heat that produces chip 2.
As shown in Figure 3 to Figure 4, when needing to set circuit 35 in metal-cored 33 both sides up and down, metal-cored about 33 two Side should fill base material, so, and metal-cored 33 each side wall may be contained within the inside of substrate 3.
Based on the set-up mode, in order that heat conducted from the first face 31 of substrate 3 to the second face 32 of substrate 3, it is necessary to Heat dissipation channel 34 is respectively provided with metal-cored 33 both sides up and down, that is to say, that at least one heat dissipation channel 34 is from the first of substrate 3 Face 31 extends to metal-cored 33, and at least one heat dissipation channel 34 extends to metal-cored 33 from the second face 32 of substrate 3.
As shown in figure 4, the heat conduction path under the set-up mode is shown in arrow in figure, to avoid repeating, to this not Repeat.
The quantity of heat dissipation channel 34 of metal-cored about 33 both sides can be consistent, can also be inconsistent；Metal-cored about 33 two The heat dissipation channel 34 of side can be oppositely arranged, and can also be staggered.
In addition, in addition to the set-up mode of the heat dissipation channel 34 shown in Fig. 1 and Fig. 3, can also metal-cored 33 window The heat dissipation channel 34 in the second face 32 that substrate 3 is extended to from the first face 31 of substrate 3 is set at mouthful.
It should be noted that in order to avoid being produced on the electric connection of electronic building brick in influence, any of the above mode, dissipating The setting of the passage of heat 34 is required to avoid the position where circuit 35.
The diameter of heat dissipation channel 34 can flexibly be set according to process capability, and the quantity of heat dissipation channel 34 is in the space of substrate 3 , can be many as far as possible in the case of license, and be in the layout of as homogeneously as possible in substrate 3.
In heat dissipation channel 34 heat-conducting medium of filling can be the metal column that is formed using blind hole filling perforation mode or The Heat Conduction Materials such as heat-conducting resin, heat-conducting glue, phase-change material or heat-conducting silicone grease.
In embodiments of the present invention, by substrate 3 set metal-cored 33 and heat dissipation channel 34, so, chip 2 produce Heat can just be conducted by the heat-conducting medium in metal-cored 33 and heat dissipation channel 34 from the first face 31 of substrate 3 to base Second face 32 of plate 3, realizes the quick diffusion of heat, so as to improve the radiating effect of electronic building brick.
Optionally, as shown in Figures 1 to 4, First Transition layer 4 is provided between chip 2 and substrate 3, First Transition layer 4 exists The corresponding position of heat dissipation channel 34 offers in window 41, the window 41 of First Transition layer 4 and is filled with heat-conducting medium.
In the embodiment of the present invention, chip 2 can be stacked on substrate 3 by First Transition layer 4, so, First Transition layer 4 Window 41, and the filling heat-conducting medium in window 41 can be opened up in the corresponding position of heat dissipation channel 34.So, First Transition layer Heat-conducting medium in 4 window 41 can be in contact with the heat-conducting medium in heat dissipation channel 34, and the heat of chip 2 can be through window Heat-conducting medium in 41 is conducted to the heat-conducting medium in heat dissipation channel 34, so that the conduction for the heat of chip 2 is provided continuously Path.
The heat-conducting medium of filling can be heat-conducting metal, heat-conducting resin, heat-conducting glue, phase in the window 41 of First Transition layer 4 Become the Heat Conduction Material such as material or heat-conducting silicone grease.
First Transition layer 4 can be the fixation glue-line for adhering chip 2 and substrate 3, as such, it is desirable to open up through fixation The window 41 of glue-line；First Transition layer 4 can also be the green oil layer for protective substrate 3, as such, it is desirable to open up through green oil layer Window 41；First Transition layer 4 can also be fixed glue-line 42 and green oil layer 43, as such, it is desirable to open up through fixed glue-line 42 With the window 41 of green oil layer 43.
Optionally, as shown in Figures 1 to 4, the window 41 of First Transition layer 4 is more than its court towards the opening of the side of chip 2 To the opening of the side of substrate 3.
It is well known that the conduction of velocity of heat is directly proportional to the size of thermal conductive surface, i.e., thermal conductive surface is bigger, heat conduction of velocity It is higher.Therefore, in embodiment of the present invention, in order to improve heat conduction efficiency, the window 41 of First Transition layer 4 is towards chip 2 The opening of side can be more than its opening towards the side of substrate 3.
Optionally, as shown in Figures 1 to 4, the window 41 of First Transition layer 4 is more than radiating towards the opening of the side of substrate 3 Opening of the passage 34 towards 4 side of First Transition layer.
In embodiment of the present invention, in order to improve heat conduction efficiency, the window 41 of First Transition layer 4 is towards substrate 3 one The opening of side can be more than heat dissipation channel 34 towards the opening of 4 side of First Transition layer.
Optionally, as shown in Figure 3 to Figure 4, the second face 32 of substrate 3 is covered with heat dissipating layer 5.
In order to which the waste heat in metal-cored 33 is transferred out into electronic building brick, heat dissipating layer can be covered in the second face 32 of substrate 3 5.The heat dissipating layer 5 can be from heat-conducting glue, conductive graphite piece or heat pipe etc..
Optionally, the second face 32 covering matcoveredn 6 of substrate 3, protective layer 6 is in heat dissipation channel 34 or metal-cored 33 correspondence Position offer window 61.
For protective substrate 3, can substrate 3 the protective mulch 6 of the second face 32, such as green oil layer.Meanwhile, protective layer 6 open up window 61 in heat dissipation channel 34 or metal-cored 33 corresponding position, in favor of distributing for heat.
For the set-up mode shown in Fig. 1 to Fig. 2, protective layer 6 should open up window 61 in metal-cored 33 corresponding positions； For the set-up mode shown in Fig. 3 to Fig. 4, protective layer should open up window 61 in the corresponding position of heat dissipation channel 34.
Optionally, as shown in Figure 3 to Figure 4, it is filled with heat-conducting medium in the window 61 of protective layer 6.
Filling heat-conducting medium, is conducive to heat to conduct in the window 61 of protective layer 6, covers and dissipates especially on protective layer 6 The situation of thermosphere 5, by filling heat-conducting medium in the window 61 in protective layer 6, makes window 61 form continuous dissipate with heat dissipating layer 5 Hot path.
It should be noted that substrate 3 can also include other structures for being used to be electrically connected with.Knot on electric connection Structure, can realize that it is unrelated with radiator structure provided in an embodiment of the present invention, and does not collide, therefore based on prior art, this It is not specifically described inventive embodiments.
In addition, the embodiment of the present invention further relates to a kind of electronic equipment, including above-mentioned electronic building brick.
In the embodiment of the present invention, electronic equipment includes but is not limited to be such as mobile phone, tablet personal computer, notebook computer, the palm The electronic equipments such as upper computer, guider, wearable device, Intelligent bracelet, pedometer.
More than, it is only the embodiment of the present invention, but protection scope of the present invention is not limited thereto, and it is any to be familiar with Those skilled in the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be covered Within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710623570.XA CN107249287A (en) | 2017-07-27 | 2017-07-27 | A kind of electronic building brick and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710623570.XA CN107249287A (en) | 2017-07-27 | 2017-07-27 | A kind of electronic building brick and electronic equipment |
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| Publication Number | Publication Date |
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| CN107249287A true CN107249287A (en) | 2017-10-13 |
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| CN201710623570.XA CN107249287A (en) | 2017-07-27 | 2017-07-27 | A kind of electronic building brick and electronic equipment |
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| CN (1) | CN107249287A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896435A (en) * | 2018-09-13 | 2020-03-20 | 三赢科技（深圳）有限公司 | Camera module |
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| US8859908B2 (en) * | 2012-11-23 | 2014-10-14 | Subtron Technology Co., Ltd. | Package carrier |
| US20140355215A1 (en) * | 2013-05-31 | 2014-12-04 | Dialog Semiconductor Gmbh | Embedded Heat Slug to Enhance Substrate Thermal Conductivity |
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board and there is its mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110896435A (en) * | 2018-09-13 | 2020-03-20 | 三赢科技（深圳）有限公司 | Camera module |
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