TW201233258A - Multilayer circuit board embedded with heat conduction metal slugs and manufacturing method thereof - Google Patents

Multilayer circuit board embedded with heat conduction metal slugs and manufacturing method thereof Download PDF

Info

Publication number
TW201233258A
TW201233258A TW100103643A TW100103643A TW201233258A TW 201233258 A TW201233258 A TW 201233258A TW 100103643 A TW100103643 A TW 100103643A TW 100103643 A TW100103643 A TW 100103643A TW 201233258 A TW201233258 A TW 201233258A
Authority
TW
Taiwan
Prior art keywords
circuit board
metal
conductive
heat
multilayer circuit
Prior art date
Application number
TW100103643A
Other languages
Chinese (zh)
Other versions
TWI415527B (en
Inventor
De-Chang Huang
Original Assignee
Compeq Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compeq Mfg Co Ltd filed Critical Compeq Mfg Co Ltd
Priority to TW100103643A priority Critical patent/TWI415527B/en
Publication of TW201233258A publication Critical patent/TW201233258A/en
Application granted granted Critical
Publication of TWI415527B publication Critical patent/TWI415527B/en

Links

Abstract

Disclosed are a multilayer circuit board embedded with heat conduction metal slugs and its manufacturing method, which embed a metal slug at the corresponding locations of two opposite end surfaces respectively, have the two metal slugs be separated from each other, and pierce the two metal slugs by a heat conduction member together to form a complete heat conduction path of the two corresponding end surfaces of the multilayer circuit board. Accordingly, as long as the invention selects two metal slugs with the total thickness smaller than the thickness of the compressed multilayer circuit board, the surfaces of the two metal slugs being respectively level with their corresponding end surfaces will be guaranteed due to melting the resin material of sub-layers when compressing a core board and the plural sub-layers. As a result, the yield rate of the multilayer circuit board is rised.

Description

201233258 VI. Description of the Invention: [Technical Field] The present invention relates to a multilayer circuit board, and more particularly to a multilayer circuit board in which a thermally conductive metal block is embedded. [Prior Art] As the electronic device becomes smaller and thinner, the internal circuit density is relatively increased, and the multi-layer circuit board that contributes to high line density is developed. With the trend of the integration function of the φ electronic device, the high-speed computing device is gradually adopted. The power component is in the circuit, causing the main cause of heat generation during the use of the electronic device; therefore, in addition to the additional heat sink for heat dissipation, in order to further improve the heat dissipation rate of the multilayer circuit board, and does not occupy excessive space in the electronic component casing, A multilayer printed circuit board with embedded thermally conductive metal blocks has been proposed. Please refer to FIG. 6 , which is a schematic diagram of a multi-layer circuit board 50 with an embedded thermal conductive metal block combined with an electronic component 7 〇 and a heat sink 71 . The multi-layer circuit board 50 is embedded with a human-block through the multi-layer circuit board 5Q. The surface of the conductive metal block 6〇' allows the electronic component 70 soldered to the upper surface of the multilayer circuit board 5 to contact the upper surface of the heat conducting metal block 6 and the heat sink 71 disposed under the multilayer circuit board 50. The thermal conductive metal block 60 serves as a heat conduction path between the electronic component 7 and the heat sink 71, as shown in FIG. The heat is conducted to the heat sink below the multilayer circuit board 5〇. Since the above-mentioned embedded heat-conductive metal block multi-layer circuit board directly provides the heat-conducting path of the electronic component, the heat-dissipating path of the electronic component does not need to be stacked, so that the internal components of the electronic device are more flexible, but indirectly cause the multilayer circuit 3 201233258 board The manufacturer's yield is reduced. Referring to FIGS. 8A to 8D, the manufacturing method of the multi-layer circuit board 50 in which the heat conductive metal block is embedded includes the following steps: sequentially placing the plurality of fiberglass boards 51 and the core board 52 in a fixture of a press machine The core plate 52 is sandwiched between the plurality of fiberglass plates 52; the shape is cut at a position of the predetermined heat conductive metal block 60 to form a through hole receiving groove 501 matching the size of the metal block; The heat dissipation of the plurality of fiberglass plates 51 and the core plate 52 constitutes a multilayer circuit board 50 °. As can be seen from FIG. 8D and FIG. 8E, the multilayer circuit board 50 is thermally pressed and then The thickness of the fiberboard 51 after hot pressing is not uniform, so even if the metal block 60 of the same thickness is selected, it is still possible to protrude from the multilayer circuit board 5, the upper surface or the recessed in the multilayer circuit board 50. After the cover is hot pressed, a new anti-weld green paint 72 is usually applied, so that the recessed portion of the metal block 60 can be filled to make the surface of the multilayer circuit board 5 flat. However, for the finished product of the metal block 60 protruding from the multilayer circuit board 5', as shown in FIG. 8D, it is regarded as a defective product and must be discarded', thereby causing a decrease in the yield of the overall multilayer circuit board and increasing the manufacturing cost. . SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks of the embedded thermally conductive metal block multilayer circuit board, the main object of the present invention is to provide a multilayer circuit board which ensures that the metal block is flush with the surface of the circuit board after the pressing process and a method of manufacturing the same. The main technical means for achieving the above purpose is to enable the multi-layer circuit board with the embedded heat conduction 201233258 metal block to include: a multi-layer circuit substrate, which is formed with a first receiving portion at the same position on the upper and lower surfaces. a metal block is disposed in the first accommodating groove and the second accommodating groove, wherein the metal block is placed on the exposed surface of the metal block of the first accommodating groove and the multilayer circuit substrate The exposed surface of the metal block disposed on the first receiving groove is flush with the lower surface of the multilayer circuit substrate; and

A heat conducting member is embedded in the multilayer circuit substrate and is respectively in contact with the two metal blocks as a heat conducting medium of the two metal blocks. In addition, the main technical means used to achieve the above purpose is to make the method of manufacturing the multilayer circuit board with the embedded heat conductive metal block embedded in the same position on the lower surface of the multilayer circuit board. The blocks are separated from each other, and then through the heat conducting member-the same two metal i ghosts, forming a complete heat conduction path of one of the opposite end faces of the multilayer circuit board. The above-mentioned invention mainly uses two metal blocks which are separately disposed in the multi-layer circuit substrate, and the heat-conducting member forms a heat-conducting path of the electronic component and the heat sink. The total thickness of the metal block which is separately provided must be smaller than the thickness of the multi-layer circuit substrate plus When the layer circuit board is pressed, the plurality of glass fiber sheets are melted and softened, so the metal blocks placed in the first first valley groove are pressed into the multilayer circuit board to ensure that the surfaces of the two metal blocks are flush with the corresponding end faces, respectively. However, it does not protrude above the surface of the circuit board, and the structural design of the multilayer circuit board of the present invention has a good yield. [Embodiment] First, a cross-sectional view of a preferred embodiment of a multi-layer circuit board 1A incorporating a thermally conductive metal block 201233258 is shown in (4) 1F, which includes: - a multilayer circuit substrate is broken by a plurality of layers The plate and the core plate are press-fitted, and a first accommodating groove 101 and a second accommodating groove 102 are respectively formed inward at the same position on the upper and lower surfaces, as shown by a circle 1B; the two metal blocks 20, 21' The exposed surface of the metal block 2〇 disposed in the first receiving groove 1〇1 is flush with the upper surface of the multilayer circuit substrate, and is disposed in the first receiving groove 1〇1 and the second receiving groove 102, respectively. The surface of the metal block 21 in the second accommodating groove 102 is flush with the lower surface of the multilayer circuit substrate; and a heat conducting member is embedded in the multilayer circuit substrate and is in contact with the two metal blocks 20, 21 respectively. The heat conducting medium of the metal block 2 (), 21; in the embodiment, the heat conducting member, comprising a plurality of conductive hole columns 2G2, is through the two metal blocks and the multilayer circuit substrate 'the conductive holes 2 卞2 The inner system can be filled with the insulating material 30, or the conductive or conductive material 31 is filled as shown in FIG. (Last copper or silver glue); and FIG. 1H is a preferred embodiment of another multilayer circuit board, the heat conductive member includes a plurality of heat conducting columns respectively penetrating the two metal blocks and the multilayer circuit substrate 'the heat conducting column 32 It is a screw and a metal column. Please refer to FIG. 1A to FIG. 1F. The above-mentioned multi-layer electric circuit board manufacturing method includes the following steps: preparing a plurality of glass fiber boards 11, a core core board 12 and two heat conducting metal blocks 2, 21; The glass fiber sheets 1 1 are respectively formed with through holes 彳彳, and the thickness of the two heat conductive metal blocks 20, 21 is smaller than the total thickness of the plurality of glass fiber sheets 核 and the core board 12 overlap; the plurality of glass sheets 11 Stacked on the upper and lower surfaces of the core plate 12, wherein the fiber plate is formed under the core plate 12, and the through holes 111 are deeply matched with one of the metal blocks 2, a thickness of 21, and accommodating the metal block 21 therein, and a fiberglass board 11 formed with a through hole ^ formed on the core board 12, the through holes matching the thickness of the other metal block 2, and the metal Block 20 is placed therein; & thermocompression composite fiberglass panel 11 and core panel 23 to form a multilayer circuit board 10; the upper and lower metal blocks are simultaneously drilled 20i; electroplated drill holes 201 to form a plurality of conductive hole columns 2〇2; and #料电孔柱2〇2 main inner layer plug holes to fill each conductive hole column 202 to the heat conducting member The upper and lower metal blocks 2, 21 form a heat conduction path. Further, in order to fabricate the multilayer circuit board 如图a of Fig. 1G, the process steps are the same as those of Figs. 1A to 1E described above, but after the plating step, The conductive hole column 202 is filled with a heat conductive or conductive material 31 (such as copper glue or silver glue) to improve the heat conduction efficiency of the two metal blocks 20, 21. If a multilayer circuit board 彳〇b as shown in Fig. 1 is to be fabricated, After the drilling step, the Φ conductive column 32' such as a screw or a metal column having a short length of the circuit board having a short length is directly inserted into the corresponding hole 2〇1. Referring to FIG. 2F, the heat conductive metal is embedded in the present invention. Another preferred embodiment of the multi-layer circuit board 10c of the block is a plan view comprising: a multi-layer circuit substrate formed by laminating a plurality of fiberglass sheets 1 and a core board 12, each of the glass sheets 1 1 and the core plate 彳 2 are formed with through holes 111 ′ 121 at the same position, and form a accommodating groove 101 ′ through the multilayer circuit substrate after the aligning; the two metal blocks 20 and 21 are respectively provided The upper and lower positions of the accommodating groove 1 ' are separated from each other and disposed in the accommodating groove 彳〇 1. The metal block of the upper position 201233258 20 has an exposed surface that is flush with the upper surface of the multilayer circuit substrate, and the metal block 21 disposed at a position below the accommodating slab 101' is externally mounted on the surface of the metal block 21 and the multilayer circuit. The lower surface of the substrate is flush; and the thermoplastic heat conductive layer is disposed in the receiving groove I , I, and is sandwiched between the metal blocks 20 and 21 to contact the two metal blocks 20 and 21, 〆. ', the heat conductive medium of the metal block 20 21; wherein the thermoplastic heat conductive layer 22 can be used as a thermoplastic heat conductive layer such as a substrate, a soft heat conductive material or a conductive material (copper or silver paste). In order to improve the heat conduction efficiency of the embodiment, as shown in FIG. 2F, the multi-layer circuit board is formed with a plurality of conductive via posts 202 to penetrate the two metal blocks and the thermoplastic heat conductive layer 22' and then to the conductive holes. The column is filled with insulating material 30 or a heat conductive or conductive material (such as copper or silver glue), or directly through a conductive column. Referring to FIG. 2A to 2F, the process steps of the above-mentioned FIG. 2F multilayer circuit board are as follows: preparing a plurality of fiberglass boards 11, a core board, 2, two heat conducting metal blocks 2, 21 and a thermoplastic heat conducting layer 22; The glass fiber plate 11 and the core plate 12 are respectively formed with the same holes 1彳1 and 1 2彳 at the same position, and the thickness of the two heat conductive metal blocks 20 and 21 is smaller than that of the plurality of glass fiber boards and the core. The total thickness of the core plate 1 2 is superposed; the plurality of fiberglass plates 11 are respectively stacked on the upper and lower surface positions of the core plate 1 2, and the through holes 111 and 1 21 of each of the fiberglass plate 11 and the core plate 12 Forming a accommodating groove 101 ′′; wherein the thickness of the two metal blocks 20 , 21 and the thermoplastic heat conductive layer 22 matches the depth of the accommodating groove 1 〇 1 ′′ to accommodate the accommodating groove 1 〇 1 , Wherein the thermoplastic heat conductive layer 22 is interposed between the two metal blocks 20, 21; 201233258 heat-compresses the plurality of glass fiber boards 11 and m 12 to form a multilayer circuit board 10c; 20, 21, and 道 道 道 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热 热Row inner plug hole to fill each conductive post holes 202 'are two metal block 2〇 Tinan, 21 heat transfer efficiency. Referring to FIG. 3C, a cross-sectional view of another preferred embodiment of a multilayer φ circuit board 10d incorporating a thermally conductive metal block according to the present invention includes: a multilayer circuit substrate, which is composed of a plurality of glass fiber boards. The 彳 and the core plate 彳 2 are press-fitted, and two first accommodating grooves 101, 101' and two second accommodating grooves 102, 1 〇 2 are respectively formed inward at the same position on the upper and lower surfaces, wherein The first accommodating slots 101 and 101 are connected to each other, and the second accommodating slots 2 and 1 are connected to each other. The four metal blocks 20 and 21 are respectively disposed on the metal blocks 2 and 21 respectively. The first accommodating groove 101, 101' and the second accommodating groove 1 〇 2, 1 〇 2, wherein the exposed surface of the metal block 20 disposed on the φ first accommodating groove 101, 101 ′ and the upper surface of the multilayer circuit substrate The flat surface of the metal block 21 is flush with the lower surface of the multilayer circuit substrate; the two lateral heat conducting members 3 2 ' are respectively accommodated in the second a receiving slot 1 〇 1, 101 'connecting channel 112 ' and two second accommodating slots 1 〇 2, 1 〇 2, in the connecting channel 112, to connect with the corresponding two metal blocks 20/21 And two longitudinal heat conducting members are embedded in the multi-layer circuit substrate and respectively contact the two sets of upper and lower metal blocks 20, 21 as a heat conducting medium of the two metal blocks 2, 21; in the embodiment, the heat conducting member is The plurality of conductive vias 202, 201233258 are embedded in the two metal blocks 20, 21 and the multi-layer circuit substrate, wherein each of the conductive vias 202 can be filled with an insulating material 30, or filled with a heat conducting or conductive material 31 (such as copper) as shown in FIG. FIG. 1H is a preferred embodiment of another multilayer circuit board. The heat conductive member includes a plurality of heat conducting columns 32 respectively penetrating through the two metal blocks and the multilayer circuit substrate, and the heat conducting column is Screws, metal posts. Please refer to FIG. 3A to FIG. 3C. The multilayer circuit board manufacturing method of FIG. 3C includes the following steps: preparing a plurality of fiberglass boards 1 1 , a core core board 1 2, two heat conducting metal components; and some of the fiberglass boards 11 Forming a plurality of through holes 111, 111' and a communication passage 112 laterally connecting the plurality of through holes, each of the heat conducting metal components including a first and second metal block 20/21 and laterally connecting the first and second metal blocks 2 The total thickness of the first and second heat conducting metal blocks 20, 21 of the transverse heat conducting member 32' and the second heat conducting metal component is less than the total thickness of the composite of the plurality of glass fiber sheets 11 and the core board 12; 1 is respectively stacked on the upper and lower surface positions of the core board 1 2, wherein the depth of each of the through holes 1 1 of the fiberglass board 11 under the core board 1 2 matches the thickness of the first and second metal blocks 21 corresponding to the heat conductive metal component, The transverse heat conducting member 32 is matched with the communication channel 112 to accommodate one of the heat conducting metal components, and the through holes 11 of the fiberglass plate 1 are located above the core plate 12 to match another set of heat conducting metal components. The first and second metal blocks 2〇, and the lateral heat conducting member 32 Matching the communication channel to accommodate the thermally conductive metal component; thermally pressing the plurality of fiberglass panels 11 and the core panel 1 2 ' to form a multilayer circuit board 10d; simultaneously drilling the upper and lower metal blocks 201; 201233258 The magnetic recording hole 201 is formed to form a plurality of conductive hole columns 202; and the conductive hole column 202 is internally bored to fill the conductive hole columns 202, so that the metal blocks of the same position of the upper and lower heat conductive metal components are 2, $ 】 constitute a heat conduction path. In the following, it is further explained that when the above technique is applied to a multilayer circuit board having embedded electronic components, the waste heat of the electronic components embedded in the multilayer circuit board can be effectively taken out of the multilayer circuit board by the heat conductive metal blocks. Referring to FIG. 4E, it is a preferred embodiment of the multilayer circuit board of the present invention. The multilayer circuit board includes: a multi-layer circuit substrate, which is composed of a plurality of glass fiber boards. The core board 2 is press-fitted, wherein the core board 12 is soldered with an electronic component 7〇, and a heat conducting block 23 is embedded in the position of the electron tl 70', and the multilayer circuit board is attached to the upper and lower surfaces. Corresponding to the same position of the heat conducting block 23 of the core board, a first receiving groove 101 and a second receiving groove 〇2 are respectively formed inward; the two metal blocks 20 and 21 are respectively disposed in the first receiving groove j. 〇1 and the second accommodating groove 102, wherein the metal block 2 disposed outside the first accommodating groove 1〇1 is flush with the upper surface of the multilayer circuit substrate, and is disposed in the second accommodating groove 101. The exposed surface of the metal block 20 is flush with the lower surface of the multilayer circuit substrate; and a heat conducting member is embedded in the multilayer circuit substrate and respectively contacts the two metal blocks 20, 21 and the heat conducting block 7' as a two metal block 2〇, a and the heat conducting medium of the heat conducting block 70'; in this embodiment, the heat conducting member comprises a plurality of conductive holes 202 ' part of the conductive hole column 202 is penetrated through the two metal blocks 2〇, 21 and the multilayer circuit substrate, and the rest is penetrated through the two metal blocks 2〇, 21, the multilayer circuit substrate and the heat conducting block 23; wherein each conductive hole column 2 〇2 can be filled with 201233258 edge material 30' or as shown in Fig. 1G filled with heat conductive or conductive material (such as copper or silver glue...; and Figure 1H' is another preferred embodiment of the multilayer circuit board, the heat conduction The component comprises a plurality of thermally conductive columns, which are respectively penetrated into a metal block, a multilayer circuit substrate and/or a heat conducting block, and the heat conducting column 32 is a screw or a metal column. Please refer to FIG. 4A. 4D, the multi-layer circuit board manufacturing method of FIG. 4D includes the following steps: preparing a plurality of fiberglass boards 11, a core board 12' and two metal blocks 2, 21; wherein the core board 12' is soldered with electrons thereon The component 7〇, and a corresponding heat-conducting block 23 is embedded in the corresponding electronic component 70', and a part of the fiber-optic board u corresponds to the core board 12. The heat-conducting block 23 is formed with a through-hole 111 and two heat-conductive metal blocks 2 The thickness of 21 is less than the total thickness of the plurality of fiberglass panels 11 and the core panel 12, and the total thickness of the laminate; The fiberboards 11 are respectively stacked on the upper and lower surface positions of the core core plate 12, wherein the fiberglass plates 11 are formed with the through holes 111 formed under the core plate 12, and the through holes 111 are depth-matched to the thickness of one of the metal blocks 21, and The metal block 21 is received therein, and the fiberboard 1 1 having the through hole 11 1 is formed above the core plate 12 ′, and the through hole 1 11 matches the thickness of the other metal block 21 and the metal block is 21 is accommodated therein; thermocompression of a plurality of fiberglass panels 1 1 and a core panel 1 2' to form a multilayer circuit board 1 Of; the upper and lower metal blocks 20, 21 are simultaneously drilled 201, the middle portion thereof The drilling hole 201 is passed through the heat conducting block 23; the drilling hole 201 is plated to form a plurality of conductive hole columns 202; and the conductive hole 202 is internally internally plugged to fill the conductive hole columns 202, so that the upper and lower metal blocks 20, 21 and the heat conducting block 23 constitute a heat conducting path. Therefore, the electronic component 7 of the core board 12' (depletion heat can be conducted by the heat conducting block 12 201233258 23 to the blocks 20, 21, and the multilayer circuit board is embedded in the electronic component 70' to be conducted outward, thereby improving the inside. The electronic component 70 can be soldered to other fiberglass panels U. Please refer to Figure 5 for the integration diagrams π, 2F, 3C and 4D thermally conductive structure of the multi-layer circuit board 1〇g, in addition to the electronic component 70 disposed on the surface of the multi-layer circuit board, and by the structure of FIG. 3C, a heat sink 71 is further provided, and the lower surface of the multi-layer circuit board is also disposed. There is a heat sink 71. Further, in order to make the heat dissipation efficiency of the present invention and the heat sink 71 better, the heat conducting column 32 can be passed through the lower surface or the upper surface of the multilayer circuit board 10g, and the heat radiating glue is in contact with the heat sink 71. As described above, in the thermal compression bonding step, the plurality of glass fiber sheets are melted and softened to adhere to the adjacent glass fiber sheets or core sheets, so that the metal blocks disposed above will be slightly sunk and adhered. In the through hole of the upper fiberglass board, and the upper surface thereof is The surface of the uppermost fiberglass board is flush; therefore, the method of manufacturing the multilayer circuit board of the invention can ensure that the metal block for heat conduction can be flush with the opposite surface of the two surfaces and retain the original heat conduction path. [Simplified Schematic] FIG. 1F·· is a cross-sectional view of a process according to a first preferred embodiment of the present invention. Fig. 1G is a cross-sectional view of another process performed after Fig. 1E. Fig. 1H is a cross-sectional view of another process after Fig. 1D. 2 A to 2 F : This is a cross-sectional view of the process of the first embodiment of the present invention. Fig. 3 A to 3 C: The present invention 箪 pv apricot, the second best implementation of the month Figure 4A to 4E is a process sectional view of the fourth embodiment of the present invention 筮mt ^ , Zanyue. 13 201233258 Figure 5: The multilayer circuit board of the present invention is combined with electronic components and two heat dissipation Figure 6: A bottom perspective view of a multi-layer circuit board with embedded thermally conductive metal blocks combined with electronic components and two heat sinks. Figure 7: Partial cross-sectional view of Figure 6 Figure 8A to 8D: A process flow diagram of a multi-layer printed circuit board with embedded thermal conductive metal blocks. Figure 8E: There are many embedded thermal conductive metal blocks. Another cross-section of the circuit board. [Main component symbol description] 1〇, 10a~1〇f multilayer circuit board receiving slot 11 glass fiber board 20, 21 metal block 2〇2 conductive hole column 23 heat conducting block 31 conductive material 50, 50' multilayer circuit board 51 glass fiber board 60 heat conductive metal block 71 heat sink 101, 101 'first accommodating groove 1 02, 102 'second accommodating groove 12, 12' core board 201 drilling 22 thermoplastic type Thermal Conductive Layer 30 Insulating Material 32, 32' Thermal Conductive Column 501 accommodating Groove 52 Core Plate 70, 70' Electronic Components

14

Claims (1)

  1. 201233258 VII. Patent application scope: 1. A multi-layer circuit board with embedded heat-conducting metal blocks, comprising: a multi-layer circuit substrate, which is formed by pressing a plurality of glass fiber boards and a core board, and is at the same position on the upper and lower surfaces. Forming a first accommodating groove and a second accommodating groove respectively; the two metal blocks are respectively disposed in the first accommodating groove and the second accommodating groove, wherein the metal block disposed in the first accommodating groove Exposed on the multilayer circuit substrate
    a metal block disposed on the second receiving groove is exposed on the lower surface of the multilayer circuit substrate; and a heat conducting member is embedded in the multilayer circuit substrate and respectively contacted with the two metal blocks as heat conduction of the two metal blocks medium. The multilayer circuit board of claim 1, wherein the valley is placed on the exposed surface of the metal block of the valley and is flat on the back surface of the multilayer circuit board. The exposed surface of the metal block disposed in the second accommodating groove is flush with the lower surface of the multilayer circuit substrate. The multilayer circuit board according to the above-mentioned patent scope, the first and second accommodating grooves are longitudinally The heat conducting member is a thermoplastic heat conducting layer sandwiched between the two metal blocks in the receiving groove. (2) The multi-layer circuit board of claim 2, wherein the multi-layer circuit substrate is further formed with another first receiving groove and another second receiving groove to accommodate the other two metal forces, and a heat conducting member is disposed between the two metals that are respectively connected to the first receiving groove and the second receiving groove, and the second metal block of the second receiving groove is reversed. There is a transverse heat conducting member. 5. The multilayer circuit board according to the patent specification (4) or 2, wherein the core board is further welded with electronic components in 2012, the second electronic board, and a heat conducting block is embedded in the corresponding electronic component. Further, the heat conducting block is partially corresponding to the upper and lower metal blocks. 6. The multilayer circuit board of claim 2 or 2, wherein at least one of the fiberglass boards is further soldered with electronic components and embedded in corresponding electronic components. A heat conducting block is disposed, and the heat conducting block is partially corresponding to the upper and lower metal blocks. 7. The multilayer circuit board according to the invention of claim ii or 2, further formed with a plurality of conductive holes extending through the upper and lower metal blocks 8 as a kiss patent The multi-layer circuit board according to item 3 is formed by a plurality of conductive hole columns penetrating the upper and lower metal blocks in a step. 9. The multilayer circuit board according to claim 4 of the patent application is further formed with a through-upper The plurality of conductive holes of the two metal blocks. 1 〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The multi-layer circuit board described in the above item is further formed with a plurality of conductive hole columns penetrating the upper and lower two metal blocks. 12. The multi-layer circuit board according to claim 7 of the patent application, each of the heat-insulating parts is filled with an insulating material and thermally conductive. A multilayer circuit board according to claim 11, wherein each of the heat conductive members is filled with an insulating material, a heat conductive material or a conductive material. 14. The multilayer circuit board according to claim 13 The heat conductive material is a copper or silver paste. 15. The multilayer circuit board according to claim 13, wherein the heat conductive material is copper glue or silver glue. 16. According to claim 1 or 2 Multi-layer circuit board 16 201233258 Further contains plurals throughout 1 7 · As applied for patents, the step contains multiple numbers running through the upper and lower 1 8 _ as applied for patents. The step contains multiple numbers running through the top and bottom 1 · If the patent application step contains multiple numbers running through the top 20 The patent paradigm includes a plurality of penetrating top and bottom 21 _ such as the patent application hot column length is shorter than the multi-layer column. 22 · If the patent application hot column length is shorter than the thermal conductivity of the upper and lower two metal blocks of the multi-layer column 0. The multi-layer circuit board of the three items, the heat-conducting column of one or two metal blocks. The heat-conducting column of the two-metal block of the multi-layer circuit board described in Item 4. The heat conduction of the two metal blocks of the multi-layer circuit board described in item 5 column. A multi-layer circuit board as described in item 6 is a thermally conductive column of a metal block. The multilayer circuit board according to Item 16, wherein the thickness of the conductive circuit substrate is a multi-layer circuit board according to item 20 of the screw or the metal, the thickness of the conductive circuit substrate, and the screw or the metal advances.
    23. A multi-circuit board method in which a thermally conductive metal block is embedded, in which a metal block 'separates the upper and lower metal blocks' from each other at a first identical position on the upper and lower surfaces of a multi-layer circuit substrate, and then through a heat-conducting member The upper and lower metal blocks are pierced to form a complete heat conduction path of the upper and lower surfaces of the multilayer circuit board. 24. The method of manufacturing a multilayer circuit board according to claim 23, wherein the method for the upper and lower surfaces of the multilayer circuit substrate of the second metal member comprises the steps of: preparing a plurality of fiberglass sheets, a nuclear anger plate, and the two metals Block; some of the fiberglass sheets are formed with through holes' and the thickness of the two heat conducting metal blocks is less than the total thickness of the plurality of glass sheets and the core sheets; the plurality of glass sheets are stacked on the core The position of the lower surface of the plate, wherein the depth of the fiberglass plate under the core plate matches the thickness of one of the metal blocks and accommodates the metal block therein, and the through hole of the fiberglass plate above the core plate matches the thickness of the other metal block And the metal block is accommodated therein. The composite fiberglass board and the core board are thermocompression bonded. 25. The method of manufacturing a multilayer circuit board according to claim 23, wherein the method of embedding the two metal blocks in the upper and lower surfaces of the multilayer circuit substrate comprises the steps of: preparing a plurality of fiberglass boards, a core board, and the second a metal block and a thermoplastic heat conductive layer; wherein all of the glass fiber board and the core board are formed with uniform holes at the same position, and the thickness of the two heat conductive metal blocks is less than the total thickness of the plurality of glass fiber boards and the core board; The plurality of glass fiber sheets are respectively stacked on the lower surface of the core board, and the through holes of each of the glass fiber board and the core board form a receiving groove; wherein the thickness of the two metal blocks and the thermoplastic heat conductive layer match the capacity The depth of the groove is accommodated in the accommodating groove, wherein the thermoplastic heat conductive layer is sandwiched between the two metal blocks; and the plurality of fiberglass plates and the core plate are thermocompression-bonded. The method of manufacturing the multi-layer circuit board according to any one of claims 23 to 24, wherein the method of inserting the heat-conducting member together with the upper and lower metal blocks comprises: drilling the two metal blocks to form a plurality of through-holes Drilling; electroplating drilling to form a plurality of conductive holes; and inner plug holes for each of the conductive holes to fill the conductive holes. 27. The method of manufacturing a multilayer circuit board according to claim 26, 201233258, which is filled with a conductive column by an insulating material, a heat conducting material or a conductive material. 28_ The multi-slope system according to any one of claims 23 to 24, wherein the heat-conducting member is electrically connected to the upper and lower metal layers: To form a plurality of through-holes; and to pass through a corresponding bore through a plurality of conductive columns. 29. The method of manufacturing a multilayer circuit board according to claim 28, wherein the conductive post is a screw or a metal post. The method of manufacturing the multi-layer circuit board according to claim 23, wherein a metal block is further embedded in the second same position on the upper and lower surfaces of the multilayer circuit substrate, so that the upper and lower metal blocks in the second same position are separated from each other. The upper and lower metal blocks of the second same position are also pierced together by a heat conducting member, so that the upper and lower surfaces of the multilayer circuit board form two heat conducting paths. 31. The method of manufacturing a multilayer circuit board according to claim 30, wherein the step of providing the upper and lower metal blocks in the first and second identical positions comprises the following steps: # preparing a plurality of fiberglass boards, a core board, and two a thermally conductive metal component; wherein a part of the fiberglass plate is formed with a plurality of through holes and a communication passage connecting the plurality of through holes in the lateral direction, and each of the heat conductive metal components includes two first and second metal blocks and a lateral connection of the first and the third a transverse heat conducting member of the two metal blocks, wherein the total thickness of the two first heat conducting metal blocks and the second heat conducting metal blocks of the two heat conducting metal components is less than a total thickness of the plurality of glass fiber sheets and the core sheets; and the plurality of glass sheets They are respectively stacked on the lower surface of the core plate, wherein the depth of each of the holes of the fiberglass plate under the nuclear anger plate matches the thickness of the first and second metal blocks of the corresponding heat conductive metal component, and the transverse heat conductive member matches the communication pass 19 201233258 a channel for accommodating the heat conductive metal component therein, and the depth of each of the through holes of the fiberglass plate above the core plate matches the first and second metal blocks of the other heat conductive metal component Degrees, and the lateral heat conducting member matching the communication channels to accommodate the thermally conductive metallic component housed therein; and a plurality of thermocompression bonding glass plate and core plate. 32. The multi-layer circuit board manufacturing method according to claim 31, wherein the heat-conducting member-to-peel-corresponding upper and lower metal block method comprises: drilling two metal blocks to form a plurality of through-holes; Drilling to form a plurality of conductive via posts; and internally plugging the conductive vias to fill the conductive vias. 33. The method of manufacturing a multilayer circuit board as described in claim 32, filling the conductive hole column with an insulating material, a heat conductive material or a conductive material. 34_ The above-mentioned heat-conducting member-to-seat upper and lower metal block system includes a plate having a method for drilling two metal blocks to form a plurality of through-holes as described in claim 31; and a plurality of conductive columns Wear the corresponding hole. ▲ 35. The multi-layer circuit board method of claim 34, wherein the conductive post is a screw or a metal post. The method of manufacturing a multi-layer circuit board according to claim 24, 25 or 31, wherein a part of the fiberglass board or the core board is soldered with an electronic component, and a heat conducting block is embedded in the electronic component. The part corresponds to the upper and lower metal blocks and is passed through by the heat conducting member. Eight, schema: (such as the next page)
TW100103643A 2011-01-31 2011-01-31 Multi-layer circuit board with embedded thermal conductive metal block and its preparation method TWI415527B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100103643A TWI415527B (en) 2011-01-31 2011-01-31 Multi-layer circuit board with embedded thermal conductive metal block and its preparation method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100103643A TWI415527B (en) 2011-01-31 2011-01-31 Multi-layer circuit board with embedded thermal conductive metal block and its preparation method
CN201110054328.8A CN102625563B (en) 2011-01-31 2011-03-08 Multilayer circuit board with embedded heat-conducting metal blocks and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201233258A true TW201233258A (en) 2012-08-01
TWI415527B TWI415527B (en) 2013-11-11

Family

ID=46565180

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100103643A TWI415527B (en) 2011-01-31 2011-01-31 Multi-layer circuit board with embedded thermal conductive metal block and its preparation method

Country Status (2)

Country Link
CN (1) CN102625563B (en)
TW (1) TWI415527B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013019617B4 (en) 2013-11-25 2015-07-02 Tesat-Spacecom Gmbh & Co.Kg High voltage electrical component for use in a satellite and satellite therewith
CN104754887B (en) * 2013-12-30 2018-06-05 深南电路有限公司 The method and wiring board of processing line plate
KR20160015980A (en) * 2014-08-01 2016-02-15 삼성전기주식회사 Printed circuit board and manufacturing method thereof
WO2017138104A1 (en) * 2016-02-10 2017-08-17 株式会社メイコー Substrate and method for manufacturing substrate
CN106341941A (en) * 2016-10-17 2017-01-18 珠海杰赛科技有限公司 Manufacturing method for locally burying copper block and conducting internal-layer lead wire
CN107249287A (en) * 2017-07-27 2017-10-13 维沃移动通信有限公司 A kind of electronic building brick and electronic equipment
TWI704852B (en) * 2018-11-28 2020-09-11 先豐通訊股份有限公司 Plating method for circuit board and circuit board made therefrom

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5561322A (en) * 1994-11-09 1996-10-01 International Business Machines Corporation Semiconductor chip package with enhanced thermal conductivity
CN1240327A (en) * 1998-06-23 2000-01-05 日东电工株式会社 Installed circuit board structure and multi-layer circuit board for same
CN1802069A (en) * 2005-01-05 2006-07-12 照敏企业股份有限公司 Substrate with high heat conduction and its making process
TWI346766B (en) * 2008-04-11 2011-08-11 Unimicron Technology Corp Circuit board and process for fabricating the same
CN104284533B (en) * 2008-09-28 2019-03-19 华为技术有限公司 Multilayer circuit board and preparation method thereof and communication equipment

Also Published As

Publication number Publication date
CN102625563A (en) 2012-08-01
CN102625563B (en) 2014-11-12
TWI415527B (en) 2013-11-11

Similar Documents

Publication Publication Date Title
KR100488412B1 (en) Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device
US10818448B2 (en) Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air
CN1812088B (en) Multi-level semiconductor module and method for fabricating the same
JP5064210B2 (en) Electronic module and manufacturing method thereof
EP3148298A1 (en) Manufacturing method of printing circuit board with micro-radiators
JP5101542B2 (en) Chip built-in printed circuit board and manufacturing method thereof
KR101466062B1 (en) Method of fabricating heat dissipating board
DE19681758B4 (en) Single-sided circuit substrate for multi-layer circuit board, multi-layer circuit board and method of making the same
JP4767269B2 (en) Method for manufacturing printed circuit board
US9204552B2 (en) Printed wiring board
JP3927955B2 (en) Multilayer printed circuit board with improved interlayer electrical connection and method for manufacturing the same
JP5129645B2 (en) Manufacturing method of wiring board with built-in components
KR100502498B1 (en) Multilayer circuit board and method for manufacturing multilayer circuit board
US8222539B2 (en) Wiring board and method for manufacturing the same
JPWO2009141927A1 (en) Printed wiring board and manufacturing method thereof
KR102032171B1 (en) Electronic component built-in substrate and method of manufacturing the same
KR100982795B1 (en) Manufacturing method of printed circuit board having electro component
US10015885B2 (en) Printed circuit board, and method for manufacturing same
US8811019B2 (en) Electronic device, method for producing the same, and printed circuit board comprising electronic device
US8419884B2 (en) Method for manufacturing multilayer wiring substrate
US9961780B2 (en) Method for manufacturing resin multilayer board
KR20070085917A (en) Printed board and printed board manuafctruing method
JP2008522397A (en) Electronic module and manufacturing method thereof
CN104869753B (en) Printed circuit board and manufacturing methods
KR101289140B1 (en) Embedded substrate and a method for manufacturing the same