TWI414388B - 機械加工漸縮微孔之方法 - Google Patents

機械加工漸縮微孔之方法 Download PDF

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Publication number
TWI414388B
TWI414388B TW097116390A TW97116390A TWI414388B TW I414388 B TWI414388 B TW I414388B TW 097116390 A TW097116390 A TW 097116390A TW 97116390 A TW97116390 A TW 97116390A TW I414388 B TWI414388 B TW I414388B
Authority
TW
Taiwan
Prior art keywords
track
longitudinal axis
along
tooling
tool processing
Prior art date
Application number
TW097116390A
Other languages
English (en)
Chinese (zh)
Other versions
TW200909116A (en
Inventor
Mehmet E Alpay
Jeffrey Howerton
Michael Nashner
Ling Wen
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW200909116A publication Critical patent/TW200909116A/zh
Application granted granted Critical
Publication of TWI414388B publication Critical patent/TWI414388B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
TW097116390A 2007-05-03 2008-05-02 機械加工漸縮微孔之方法 TWI414388B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US91577007P 2007-05-03 2007-05-03

Publications (2)

Publication Number Publication Date
TW200909116A TW200909116A (en) 2009-03-01
TWI414388B true TWI414388B (zh) 2013-11-11

Family

ID=39938817

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097116390A TWI414388B (zh) 2007-05-03 2008-05-02 機械加工漸縮微孔之方法

Country Status (6)

Country Link
US (1) US8481887B2 (ja)
JP (2) JP2010525951A (ja)
KR (1) KR20100016102A (ja)
CN (1) CN101678505B (ja)
TW (1) TWI414388B (ja)
WO (1) WO2008137455A1 (ja)

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US8319149B2 (en) * 2008-04-16 2012-11-27 Applied Materials, Inc. Radiant anneal throughput optimization and thermal history minimization by interlacing
CN102473632A (zh) * 2009-10-13 2012-05-23 三菱综合材料株式会社 电极板的通气孔形成方法
KR100985518B1 (ko) * 2010-02-05 2010-10-05 주식회사 쿠키혼 미세홀 및 패턴이 형성된 금속판과 그 제조방법
US8524127B2 (en) * 2010-03-26 2013-09-03 Electro Scientific Industries, Inc. Method of manufacturing a panel with occluded microholes
CN102500927B (zh) * 2011-09-30 2015-01-14 武汉克瑞斯光电技术有限公司 一种光学振镜式激光药片打孔方法
US9289858B2 (en) * 2011-12-20 2016-03-22 Electro Scientific Industries, Inc. Drilling holes with minimal taper in cured silicone
CN103212857B (zh) * 2012-01-19 2015-09-30 昆山思拓机器有限公司 一种fpc盲孔加工方法
US8716625B2 (en) * 2012-02-03 2014-05-06 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Workpiece cutting
US10149390B2 (en) 2012-08-27 2018-12-04 Mycronic AB Maskless writing of a workpiece using a plurality of exposures having different focal planes using multiple DMDs
CN103084733A (zh) * 2012-12-06 2013-05-08 芜湖华力金属制品有限公司 一种500W激光切割机切割5mm钢板方法
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
WO2017112911A1 (en) 2015-12-22 2017-06-29 Canon U.S. Life Sciences, Inc Sample-to-answer system for microorganism detection featuring target enrichment, amplification and detection
CN107598397A (zh) * 2016-08-10 2018-01-19 南京魔迪多维数码科技有限公司 切割脆性材料基板的方法
DE112018005306T5 (de) * 2017-11-07 2020-06-18 Sumitomo Electric Sintered Alloy, Ltd. Sinterkörper auf Eisenbasis, Verfahren zur Laserbeschriftung desselben und Verfahren zur Herstellung desselben
JP7079740B2 (ja) * 2019-01-17 2022-06-02 オリンパス株式会社 光線調整部品の製造方法
CN113427137A (zh) * 2020-03-06 2021-09-24 大族激光科技产业集团股份有限公司 孔加工方法

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CN1500025A (zh) * 2001-11-30 2004-05-26 ���µ�����ҵ��ʽ���� 激光铣削方法

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JPH0487707A (ja) * 1990-07-30 1992-03-19 Nachi Fujikoshi Corp 中ぐりバリ取り装置及びその方法
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CN1500025A (zh) * 2001-11-30 2004-05-26 ���µ�����ҵ��ʽ���� 激光铣削方法

Also Published As

Publication number Publication date
JP2013223885A (ja) 2013-10-31
WO2008137455A1 (en) 2008-11-13
CN101678505B (zh) 2014-03-12
KR20100016102A (ko) 2010-02-12
US20080272095A1 (en) 2008-11-06
CN101678505A (zh) 2010-03-24
US8481887B2 (en) 2013-07-09
TW200909116A (en) 2009-03-01
JP2010525951A (ja) 2010-07-29

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MM4A Annulment or lapse of patent due to non-payment of fees