TWI413679B - 研磨液 - Google Patents
研磨液 Download PDFInfo
- Publication number
- TWI413679B TWI413679B TW96149674A TW96149674A TWI413679B TW I413679 B TWI413679 B TW I413679B TW 96149674 A TW96149674 A TW 96149674A TW 96149674 A TW96149674 A TW 96149674A TW I413679 B TWI413679 B TW I413679B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- formula
- polishing liquid
- acid
- compound represented
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006355571A JP5094112B2 (ja) | 2006-12-28 | 2006-12-28 | 研磨液 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200840861A TW200840861A (en) | 2008-10-16 |
TWI413679B true TWI413679B (zh) | 2013-11-01 |
Family
ID=39695629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96149674A TWI413679B (zh) | 2006-12-28 | 2007-12-24 | 研磨液 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5094112B2 (ja) |
TW (1) | TWI413679B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5441345B2 (ja) * | 2008-03-27 | 2014-03-12 | 富士フイルム株式会社 | 研磨液、及び研磨方法 |
JP2010067681A (ja) * | 2008-09-09 | 2010-03-25 | Fujifilm Corp | 研磨液及び研磨方法 |
US8252687B2 (en) * | 2008-09-19 | 2012-08-28 | Cabot Microelectronics Corporation | Barrier slurry for low-k dielectrics |
JP2017197590A (ja) * | 2014-09-08 | 2017-11-02 | ニッタ・ハース株式会社 | 研磨用組成物 |
US9631122B1 (en) * | 2015-10-28 | 2017-04-25 | Cabot Microelectronics Corporation | Tungsten-processing slurry with cationic surfactant |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW593647B (en) * | 2000-11-24 | 2004-06-21 | Nec Electronics Corp | Chemical mechanical polishing slurry |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4816836B2 (ja) * | 1998-12-28 | 2011-11-16 | 日立化成工業株式会社 | 金属用研磨液及びそれを用いた研磨方法 |
US6776810B1 (en) * | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
JP2004152785A (ja) * | 2002-10-28 | 2004-05-27 | Shibaura Mechatronics Corp | 銅拡散防止膜用研磨組成物および半導体装置の製造方法 |
US7018560B2 (en) * | 2003-08-05 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Composition for polishing semiconductor layers |
JP2005244123A (ja) * | 2004-02-27 | 2005-09-08 | Fujimi Inc | 研磨用組成物 |
JP2006179845A (ja) * | 2004-11-26 | 2006-07-06 | Fuji Photo Film Co Ltd | 金属用研磨液及び研磨方法 |
-
2006
- 2006-12-28 JP JP2006355571A patent/JP5094112B2/ja active Active
-
2007
- 2007-12-24 TW TW96149674A patent/TWI413679B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW593647B (en) * | 2000-11-24 | 2004-06-21 | Nec Electronics Corp | Chemical mechanical polishing slurry |
Also Published As
Publication number | Publication date |
---|---|
JP5094112B2 (ja) | 2012-12-12 |
JP2008166568A (ja) | 2008-07-17 |
TW200840861A (en) | 2008-10-16 |
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