TWI413679B - 研磨液 - Google Patents

研磨液 Download PDF

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Publication number
TWI413679B
TWI413679B TW96149674A TW96149674A TWI413679B TW I413679 B TWI413679 B TW I413679B TW 96149674 A TW96149674 A TW 96149674A TW 96149674 A TW96149674 A TW 96149674A TW I413679 B TWI413679 B TW I413679B
Authority
TW
Taiwan
Prior art keywords
polishing
formula
polishing liquid
acid
compound represented
Prior art date
Application number
TW96149674A
Other languages
English (en)
Chinese (zh)
Other versions
TW200840861A (en
Inventor
Tetsuya Kamimura
Toshiyuki Saie
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200840861A publication Critical patent/TW200840861A/zh
Application granted granted Critical
Publication of TWI413679B publication Critical patent/TWI413679B/zh

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW96149674A 2006-12-28 2007-12-24 研磨液 TWI413679B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006355571A JP5094112B2 (ja) 2006-12-28 2006-12-28 研磨液

Publications (2)

Publication Number Publication Date
TW200840861A TW200840861A (en) 2008-10-16
TWI413679B true TWI413679B (zh) 2013-11-01

Family

ID=39695629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96149674A TWI413679B (zh) 2006-12-28 2007-12-24 研磨液

Country Status (2)

Country Link
JP (1) JP5094112B2 (ja)
TW (1) TWI413679B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5441345B2 (ja) * 2008-03-27 2014-03-12 富士フイルム株式会社 研磨液、及び研磨方法
JP2010067681A (ja) * 2008-09-09 2010-03-25 Fujifilm Corp 研磨液及び研磨方法
US8252687B2 (en) * 2008-09-19 2012-08-28 Cabot Microelectronics Corporation Barrier slurry for low-k dielectrics
JP2017197590A (ja) * 2014-09-08 2017-11-02 ニッタ・ハース株式会社 研磨用組成物
US9631122B1 (en) * 2015-10-28 2017-04-25 Cabot Microelectronics Corporation Tungsten-processing slurry with cationic surfactant

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW593647B (en) * 2000-11-24 2004-06-21 Nec Electronics Corp Chemical mechanical polishing slurry

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816836B2 (ja) * 1998-12-28 2011-11-16 日立化成工業株式会社 金属用研磨液及びそれを用いた研磨方法
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
JP2004152785A (ja) * 2002-10-28 2004-05-27 Shibaura Mechatronics Corp 銅拡散防止膜用研磨組成物および半導体装置の製造方法
US7018560B2 (en) * 2003-08-05 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composition for polishing semiconductor layers
JP2005244123A (ja) * 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
JP2006179845A (ja) * 2004-11-26 2006-07-06 Fuji Photo Film Co Ltd 金属用研磨液及び研磨方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW593647B (en) * 2000-11-24 2004-06-21 Nec Electronics Corp Chemical mechanical polishing slurry

Also Published As

Publication number Publication date
JP5094112B2 (ja) 2012-12-12
JP2008166568A (ja) 2008-07-17
TW200840861A (en) 2008-10-16

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