TWI405305B - Optical semiconductor device - Google Patents

Optical semiconductor device Download PDF

Info

Publication number
TWI405305B
TWI405305B TW97113989A TW97113989A TWI405305B TW I405305 B TWI405305 B TW I405305B TW 97113989 A TW97113989 A TW 97113989A TW 97113989 A TW97113989 A TW 97113989A TW I405305 B TWI405305 B TW I405305B
Authority
TW
Taiwan
Prior art keywords
optical semiconductor
light
semiconductor device
laser
light transmitting
Prior art date
Application number
TW97113989A
Other languages
English (en)
Other versions
TW200849498A (en
Inventor
Satoshi Matsumoto
Masatsugu Takatsuka
Original Assignee
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of TW200849498A publication Critical patent/TW200849498A/zh
Application granted granted Critical
Publication of TWI405305B publication Critical patent/TWI405305B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B29C65/1667—Laser beams characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1674—Laser beams characterised by the way of heating the interface making use of laser diodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1687—Laser beams making use of light guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7814—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of inter-cooperating positioning features, e.g. tenons and mortises
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/541—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms
    • B29C66/5414—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms said substantially flat extra element being rigid, e.g. a plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8227—Transmission mechanisms using springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Description

光半導體裝置
本發明係關於光半導體裝置。
對於光半導體裝置而言，為謀求低成本化，要求收容光半導體元件之封裝由樹脂形成。作為由樹脂形成封裝之技術，已知於杯狀之本體部件上雷射焊接蓋部件之技術(例如，參照專利文獻1~4)。
專利文獻1：日本專利特表平9－510930號公報專利文獻2：日本專利特表2005－508262號公報專利文獻3：日本專利特開2003－320585號公報專利文獻4：日本專利特開2005－41073號公報
而於光半導體裝置中，必須將使光半導體元件所發出或接受之光大致透過之透光部件設置於樹脂製之封裝中。然而，並未開發不拘泥於透光部件之材質而將透光部件確實設置於樹脂製之封裝中的有效技術。
而本發明係鑒於上述情況而完成者，其目的在於提供一種可不拘泥於透光部件之材質而將透光部件確實設置於樹脂製之封裝中的光半導體裝置。
為達成上述目的，本發明之光半導體裝置之特徵在於包括：光半導體元件，其係發出光或接受光；收容部件，其 係具有收容光半導體元件之收容空間；透光部件，其係覆蓋收容空間之開口部且使光大致透過；夾持部件，其係與收容部件夾持透光部件；收容部件與夾持部件係由樹脂形成且被相互雷射焊接。
於該光半導體裝置中，構成收容光半導體元件之封裝之至少一部分的收容部件與夾持部件係由樹脂形成，於夾持使光半導體元件所發出或接受之光大致透過之透光部件的狀態下，被相互雷射焊接。因此，根據該光半導體裝置，可不拘泥於透光部件之材質而將透光部件確實設置於樹脂製之封裝中。
於本發明之光半導體裝置中，較好的是收容部件形成為杯狀，夾持部件形成為環狀。藉此，可利用收容部件與夾持部件夾持透光部件之周邊部，而構成設置有透光部件之封裝。
於本發明之光半導體裝置中，較好的是夾持部件具有配置透光部件之凹部，或收容部件具有配置透光部件之凹部。藉此，可謀求光半導體裝置之小型化。
於夾持部件具有配置透光部件之凹部之情形時，較好的是夾持部件於與夾持透光部件之方向大致正交之方向上，在與透光部件之間具有間隙。另一方面，於收容部件具有配置透光部件之凹部之情形時，較好的是收容部件於與夾持透光部件之方向大致正交之方向上，與透光部件之間具有間隙。藉此，於收容部件與夾持部件雷射焊接時，熔融樹脂可收納於間隙中，因此可防止熔融樹脂流入收容空 間，並且可將透光部件牢固地固定於收容部件或夾持部件。
於本發明之光半導體裝置中，較好的是於收容部件中，於與夾持透光部件之方向大致正交之方向上，設置有限制夾持部件移動的限制部。藉此，可使夾持部件相對於收容部件之定位容易化。
於本發明之光半導體裝置中，較好的是透光部件係由玻璃形成。藉此，由散熱性高於樹脂之玻璃形成之透光部件位於收容部件與夾持部件之雷射焊接部之收容空間側，因此於收容部件與夾持部件之雷射焊接時，可防止熔融樹脂流入收容空間。
於本發明之光半導體裝置中，較好的是收容部件係由大致吸收與夾持部件雷射焊接時所使用之雷射光的材料形成，夾持部件係由使雷射光大致透過之材料形成。藉此，於收容部件與夾持部件之雷射焊接時，經由夾持部件而對收容部件照射雷射光，藉此於收容部件與夾持部件之接觸部使兩部件熔融、再固化，從而可將收容部件與夾持部件雷射焊接。
於本發明之光半導體裝置中，較好的是收容部件與夾持部件於相互分離之複數個雷射焊接部被相互雷射焊接。藉此，例如於以回流焊接安裝光半導體裝置之情形時，即使於回流爐中收容空間內之空氣膨脹，空氣亦可自收容部件與夾持部件未被雷射焊接之部分洩漏，因此可防止因收容空間內之空氣膨脹而造成光半導體裝置之破損。
根據本發明，可不拘泥於透光部件之材質而將透光部件確實設置於樹脂製之封裝中。
以下，參照圖式詳細說明本發明之較佳實施形態。再者，各圖中相同或相當部分標上相同符號，省略重複說明。
圖1係本發明之光半導體裝置之一實施形態之平面圖，圖2係沿圖1中所示之II－II線之剖面圖，圖3係圖1中所示之光半導體裝置之分解立體圖。如圖1~3所示，光半導體裝置1具備由PPS(聚苯硫醚)、PPA(聚鄰苯二甲醯胺)或LCP(液晶聚合物)等樹脂，以射出成形形成為長方體杯狀(例如，外形10 mm×10 mm，高2 mm)的收容部件2。收容部件2具有剖面四角形之凹部(收容空間)3，光半導體元件5收容於凹部3中。
光半導體元件5係LED、LD等發光元件，或CCD影像感測器、MOS影像感測器等受光元件，設置於凹部3之底面3a。光半導體元件5與貫穿收容部件2之側壁之複數個電子信號輸入輸出端子6藉由線7而電性連接。
收容部件2之一端面2a上配置有由玻璃形成為四角形薄板狀(例如，外形9 mm×9 mm，厚0.5 mm)的透光部件8。透光部件8覆蓋凹部3之開口部3b，使光半導體元件5所發出或接受之光大致透過。如此，由玻璃形成使光半導體元件5所發出或接受之光大致透過之透光部件8，藉此可防止 透光部件8受損。
進而，收容部件2之一端面2a上配置有由與收容部件2相同之樹脂以射出成形形成為四角形環狀(例如，外形10 mm×10 mm，厚1 mm)的夾持部件9。夾持部件9具有配置透光部件8之剖面四角形之凹部11，於凹部11之底面11a形成有剖面四角形之通光孔12。如此，透光部件8配置於夾持部件9之凹部11，藉此可謀求光半導體裝置1之小型化。
根據以上構成，透光部件8之周邊部係夾持於收容部件2之一端面2a與夾持部件9之凹部11之底面11a之間，由收容部件2與夾持部件9夾持。
又，收容部件2之一端面2a上於大致四方設置有長方體突起狀(例如，外形0.5 mm×1.5 mm，高0.5 mm)之限制部13。夾持部件9之周邊部形成有各限制部13嵌合之缺口14。藉此，於與夾持透光部件8之方向(即，透光部件8之厚度方向)大致正交之方向上，限制夾持部件9之移動，因此可使夾持部件9相對於收容部件2之定位容易化。
收容部件2與夾持部件9於相互分離之複數個雷射焊接部P被相互雷射焊接。收容部件2與夾持部件9由同種樹脂構成，但收容部件2係由大致吸收雷射焊接用之雷射光之材料形成，夾持部件9係由使雷射焊接用之雷射光大致透過之材料形成。
圖4係沿圖1中所示之IV－IV線之部分剖面圖。如圖4所示，於收容部件2與夾持部件9之雷射焊接時，雷射焊接用之雷射光L照射至雷射焊接部P，雷射光L大致透過夾持部 件9而被收容部件2大致吸收。藉此，收容部件2一時發熱，於收容部件2與夾持部件9之接觸部(圖4中之點部)兩部件熔融、再固化，從而使收容部件2與夾持部件9雷射焊接。
此時，由散熱性高於樹脂之玻璃形成之透光部件8位於雷射焊接部P之收容部件2之凹部3側。藉此，收容部件2之一端面2a中，於凹部3側之區域(與透光部件8接觸之區域)內，收容部件2吸收雷射光L所產生之發熱可較好地溢出。因此，可防止收容部件2之一端面2a中，凹部3側之區域過度熔融，且於收容部件2與夾持部件9之雷射焊接時，可防止熔融樹脂或樹脂熔融所產生之氣體流入凹部3。又，夾持部件9於與夾持透光部件8之方向大致正交之方向上，與透光部件8之間具有間隙G。藉此，收容部件2與夾持部件9之雷射焊接時，熔融樹脂可收納於間隙G中，因此可防止熔融樹脂流入凹部3，並且可將透光部件8牢固地固定於收容部件2或夾持部件9。且可緩和配置透光部件8之凹部11之加工精度。
如上所述，於光半導體裝置1中，構成收容光半導體元件5之封裝的收容部件2與夾持部件9係由樹脂形成，於夾持使光半導體元件5所發出或接受之光大致透過之透光部件8的狀態下，被相互雷射焊接。因此，根據光半導體裝置1，即使不使用接著劑等，亦可不拘泥於透光部件8之材質而將透光部件8確實設置於樹脂製之封裝中。
又，於光半導體裝置1中，收容部件2形成為杯狀，夾持部件9形成為環狀。藉此，可利用收容部件2與夾持部件9夾持 透光部件8之周邊部，而構成設置有透光部件8之封裝。
進而，於光半導體裝置1中，收容部件2與夾持部件9於相互分離之複數個雷射焊接部P相互雷射焊接。藉此，例如於以回流焊接封裝光半導體裝置1之情形時，即使於回流爐中收容部件2之凹部3內之空氣膨脹，空氣亦可自收容部件2與夾持部件9未雷射焊接之部分洩漏出，因此可防止因凹部3內之空氣膨脹而對光半導體裝置1造成之損傷。
繼而，對光半導體裝置1之製造方法加以說明。圖5係雷射焊接用夾具之剖面圖，圖6係雷射焊接用雷射光照射裝置之概略構成圖。
如圖5所示，於收容部件2之凹部3之底面3a設置光半導體元件5後，於收容部件2之一端面2a配置透光部件8及夾持部件9，製作組裝體10，將組裝體10安裝於雷射焊接用夾具20上。雷射焊接用夾具20可如圖5(a)所示，為具備支持組裝體10之底座21，使雷射焊接用之雷射光大致透過之玻璃板22，使玻璃板22相對底座21移動之氣缸23者；亦可如圖5(b)所示，為具備底座21，玻璃板22，配置於底座21之凹部內、載置組裝體10之載置台24，配置於底座21之凹部內、對載置台24向玻璃板22側施力之彈簧25者。
繼而，如圖6所示，於安裝於雷射焊接用夾具20上且夾持部件9受收容部件2按壓之狀態下，藉由雷射焊接用雷射光照射裝置30，對各雷射焊接部P照射雷射光L，藉此將收容部件2與夾持部件9雷射焊接，製作光半導體裝置1。雷射焊接用雷射光照射裝置30具備：以與各雷射焊接部P對 向之方式配置有前端部之光纖31；保持各光纖31之前端部之玻璃框32；與各光纖31之基端部光學連接，射出雷射光L之雷射二極體33。
於對各雷射焊接部P照射雷射光L時，使收容部件2與夾持部件9相互壓接。藉此，於各雷射焊接部P於收容部件2與夾持部件9相互圧接之狀態下使雙方熔融，因此可進一步提高焊接強度。又，抑制了夾持部件9之翹曲等變形，因此可使收容部件2與夾持部件9確實地雷射焊接。
再者，雷射焊接用夾具20可構成為：可同時安裝複數個組裝體10，又，雷射焊接用雷射光照射裝置30可構成為：可對複數個組裝體10同時照射雷射焊接用之雷射光L。
本發明並非限定於上述實施形態者。
圖7係本發明之光半導體裝置之其他實施形態之分解立體圖。如圖7所示，收容部件2可代替夾持部件9而具有配置透光部件8之剖面四角形之凹部4。於此情形時，收容光半導體元件5之凹部3形成於凹部4之底面4a。如此，於透光部件8配置於收容部件2之凹部4之情形時，亦可謀求光半導體裝置1之小型化。
圖8係圖7中所示之光半導體裝置之部分剖面圖(相當於沿圖1中所示之IV－IV線之部分剖面圖)。如圖8所示，收容部件2於與夾持透光部件8之方向(即，透光部件8之厚度方向)大致正交之方向上，與透光部件8之間具有間隙G。藉此，於收容部件2與夾持部件9之雷射焊接時，熔融樹脂可收納於間隙G中，因此可防止熔融樹脂流入收容部件2之凹 部3，並且可將透光部件8牢固地固定於收容部件2或夾持部件9。且可緩和配置透光部件8之凹部4之加工精度。
又，於上述實施形態中，收容部件2係由大致吸收雷射焊接用之雷射光之材料形成，夾持部件9係由使雷射焊接用之雷射光大致透過之材料形成，但並不限定於此。例如，收容部件2可由使雷射焊接用之雷射光大致透過之材料形成，夾持部件9可由大致吸收雷射焊接用之雷射光之材料形成，或收容部件2及夾持部件9之兩者均由使雷射焊接用之雷射光大致透過之材料形成。於後者之情形時，於收容部件2與夾持部件9之間插入雷射光吸收體，照射雷射焊接用之雷射光即可將收容部件2與夾持部件9雷射焊接。進而，收容部件2及夾持部件9之兩者可均由大致吸收雷射焊接用之雷射光之材料形成。於此情形時，自與夾持透光部件8之方向大致正交之方向，對收容部件2與夾持部件9之接觸部照射雷射焊接用之雷射光，即可將收容部件2與夾持部件9雷射焊接。
又，於上述實施形態中，收容部件2與夾持部件9於相互分離之複數個雷射焊接部P相互雷射焊接，收容部件2與夾持部件9亦可於整個收容部件2與夾持部件9之接觸部相互雷射焊接。於此情形時，可對接觸部之整體同時照射雷射焊接用之雷射光，或使雷射焊接用之雷射光沿接觸部相對移動並對接觸部之整體照射雷射焊接用之雷射光。
產業上之可利用性
根據本發明，可不拘泥於透光部件之材質而將透光部件 確實設置於樹脂製之封裝中。
1‧‧‧光半導體裝置
2‧‧‧收容部件
3‧‧‧凹部(收容空間)
3b‧‧‧開口部
4,11‧‧‧凹部
5‧‧‧光半導體元件
8‧‧‧透光部件
9‧‧‧夾持部件
13‧‧‧限制部
G‧‧‧間隙
L‧‧‧雷射光
P‧‧‧雷射焊接部
圖1係本發明之光半導體裝置之一實施形態之平面圖。
圖2係沿圖1中所示之II－II線之剖面圖。
圖3係圖1中所示之光半導體裝置之分解立體圖。
圖4係沿圖1中所示之IV－IV線之部分剖面圖。
圖5(a)、(b)係雷射焊接用夾具之剖面圖。
圖6係雷射焊接用雷射光照射裝置之概略構成圖。
圖7係本發明之光半導體裝置之其他實施形態之分解立體圖。
圖8係圖7中所示之光半導體裝置之部分剖面圖。
1‧‧‧光半導體裝置
2‧‧‧收容部件
6‧‧‧電子信號輸入輸出端子
8‧‧‧透光部件
9‧‧‧夾持部件
11‧‧‧凹部
12‧‧‧通光孔
13‧‧‧限制部
14‧‧‧缺口
P‧‧‧雷射焊接部

Claims (10)

  1. 一種光半導體裝置，其特徵在於包括：光半導體元件，其係發出光或接受光；收容部件，其係具有收容上述光半導體元件之收容空間；透光部件，其係覆蓋上述收容空間之開口部且使上述光大致透過；及夾持部件，其係與上述收容部件夾持上述透光部件；上述收容部件與上述夾持部件係由樹脂形成且被相互雷射焊接。
  2. 如請求項1之光半導體裝置，其中上述收容部件形成為杯狀，上述夾持部件形成為環狀。
  3. 如請求項1之光半導體裝置，其中上述夾持部件具有配置上述透光部件之凹部。
  4. 如請求項3之光半導體裝置，其中上述夾持部件於與夾持上述透光部件之方向大致正交之方向上，在與上述透光部件之間具有間隙。
  5. 如請求項1之光半導體裝置，其中上述收容部件具有配置上述透光部件之凹部。
  6. 如請求項5之光半導體裝置，其中上述收容部件於與夾持上述透光部件之方向大致正交之方向上，在與上述透光部件之間具有間隙。
  7. 如請求項1之光半導體裝置，其中於上述收容部件中，於與夾持上述透光部件之方向大致正交之方向上，設置 有限制上述夾持部件移動的限制部。
  8. 如請求項1之光半導體裝置，其中上述透光部件係由玻璃形成。
  9. 如請求項1之光半導體裝置，其中上述收容部件係由大致吸收與上述夾持部件雷射焊接時所使用之雷射光之材料形成，上述夾持部件係由使上述雷射光大致透過之材料形成。
  10. 如請求項1之光半導體裝置，其中上述收容部件與上述夾持部件於相互分離之複數個雷射焊接部被相互雷射焊接。
TW97113989A 2007-04-25 2008-04-17 Optical semiconductor device TWI405305B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007115977A JP5193492B2 (ja) 2007-04-25 2007-04-25 光半導体デバイス

Publications (2)

Publication Number Publication Date
TW200849498A TW200849498A (en) 2008-12-16
TWI405305B true TWI405305B (zh) 2013-08-11

Family

ID=39925456

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97113989A TWI405305B (zh) 2007-04-25 2008-04-17 Optical semiconductor device

Country Status (3)

Country Link
JP (1) JP5193492B2 (zh)
TW (1) TWI405305B (zh)
WO (1) WO2008132997A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017188529A (ja) 2016-04-04 2017-10-12 株式会社フジクラ リッド、及び、光学素子パッケージ
JP6915236B2 (ja) * 2016-06-29 2021-08-04 セイコーエプソン株式会社 光源装置およびプロジェクター
FR3142039A1 (fr) * 2022-11-14 2024-05-17 Stmicroelectronics International N.V. Boîtier pour puce et son procédé de fabrication

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5529959A (en) * 1992-06-23 1996-06-25 Sony Corporation Charge-coupled device image sensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3270862B2 (ja) * 1992-09-02 2002-04-02 ソニー株式会社 固体撮像装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5529959A (en) * 1992-06-23 1996-06-25 Sony Corporation Charge-coupled device image sensor

Also Published As

Publication number Publication date
JP2008277346A (ja) 2008-11-13
TW200849498A (en) 2008-12-16
WO2008132997A1 (ja) 2008-11-06
JP5193492B2 (ja) 2013-05-08

Similar Documents

Publication Publication Date Title
TWI389339B (zh) 發光二極體模組之安裝鏡片
US7384202B2 (en) Optical module
TWI656934B (zh) 雷射焊接裝置
TWI405305B (zh) Optical semiconductor device
US20150253522A1 (en) Lens device attachment to printed circuit board
JP2007206337A (ja) 光モジュールの製造方法
JP2008042425A (ja) イメージセンサモジュール
JP2007305736A (ja) 光モジュールの製造方法
JP2010113938A (ja) 光電センサの筐体組立方法および光電センサ
JP5120751B2 (ja) ボンディング装置
JP2007221359A (ja) 画像読取装置およびその製造方法
JP2007189030A (ja) 半導体レーザ装置
JP6566895B2 (ja) 気密封止されたｌｅｄ灯、及び、気密封止されたｌｅｄ灯の製造方法
US20130335711A1 (en) Laser Device and Method for Producing Same
JP5677786B2 (ja) 検出センサの製造方法
JP6958121B2 (ja) 光モジュールおよびその製造方法
JP7326057B2 (ja) 電子部品の製造装置と電子部品の製造方法
KR101756195B1 (ko) 검출 센서 및 검출 센서의 제조방법
JP7206860B2 (ja) レンズユニット、対象物検出装置
JP2020190667A (ja) レンズユニット、レンズユニットの製造方法、対象物検出装置
JP2006338785A (ja) 受発光集積装置及び光ディスク装置
JP6626935B2 (ja) イメージセンサヘッドおよび読取装置
US20220317392A1 (en) Optical device and method for manufacturing optical device
JP4085919B2 (ja) 光モジュール
CN115280611A (zh) 量子级联激光装置