TW200849498A - Optical semiconductor device - Google Patents

Optical semiconductor device Download PDF

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Publication number
TW200849498A
TW200849498A TW97113989A TW97113989A TW200849498A TW 200849498 A TW200849498 A TW 200849498A TW 97113989 A TW97113989 A TW 97113989A TW 97113989 A TW97113989 A TW 97113989A TW 200849498 A TW200849498 A TW 200849498A
Authority
TW
Taiwan
Prior art keywords
optical semiconductor
light
semiconductor device
laser
accommodating
Prior art date
Application number
TW97113989A
Other languages
Chinese (zh)
Other versions
TWI405305B (en
Inventor
Satoshi Matsumoto
Masatsugu Takatsuka
Original Assignee
Hamamatsu Photonics Kk
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Publication date
Application filed by Hamamatsu Photonics Kk filed Critical Hamamatsu Photonics Kk
Publication of TW200849498A publication Critical patent/TW200849498A/en
Application granted granted Critical
Publication of TWI405305B publication Critical patent/TWI405305B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B29C65/1667—Laser beams characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1674—Laser beams characterised by the way of heating the interface making use of laser diodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1687—Laser beams making use of light guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7814—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of inter-cooperating positioning features, e.g. tenons and mortises
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/541—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms
    • B29C66/5414—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms said substantially flat extra element being rigid, e.g. a plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8227—Transmission mechanisms using springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

Disclosed is an optical semiconductor device (1), wherein a container member (2) constituting a package in which an optical semiconductor element (5) is contained and a holding member (9) are made of a resin, and the container member (2) and the holding member (9) are laser welded with each other with a light-transmitting member (8), which generally transmits the light emitted from or received by the optical semiconductor element (5), being sandwiched between them. In this optical semiconductor device (1), the light-transmitting member (8) can be surely arranged in the resin package regardless of the material from which the light-transmitting member (8) is made.

Description

200849498 九、發明說明： 【發明所屬之技術領域】 本發明係關於光半導體裝置。 【先前技術】 對於光半導體裝置而言，為謀求低成本化，要求收容光 半導體元件之封裝由樹脂形成。作為由樹脂形成封裝之技 術，已知於杯狀之本體部件上雷射焊接蓋部件之技術（例 如，參照專利文獻1〜4)。 r\ ^ 專利文獻1 :日本專利特表平9-5 10930號公報 專利文獻2:曰本專利特表2〇〇5-5〇8262號公報 專利文獻3:曰本專利特開2〇〇3_32〇585號公報 專利文獻4 :曰本專利特開2〇〇5-4 1073號公報 【發明内容】 發明所欲解決之問題 而於光半導體裝置中，必須將使光半導體元件所發出或 (； 接受之光大致透過之透光部件設置於樹脂製之封裝中。然 而，並未開發不拘泥於透光部件之材質而將透光部件確實 设置於樹脂製之封裝中的有效技術。200849498 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to an optical semiconductor device. [Prior Art] In order to reduce the cost of the optical semiconductor device, it is required that the package for accommodating the optical semiconductor element be formed of a resin. As a technique of forming a package from a resin, a technique of laser-welding a cover member to a cup-shaped body member is known (for example, refer to Patent Documents 1 to 4). r\ ^ Patent Document 1: Japanese Patent Laid-Open Publication No. Hei 9-5 10930. Patent Document 2: Japanese Patent Laid-Open Publication No. 2-5-5〇8262 Patent Document 3: Japanese Patent Laid-Open No. 2〇〇3_32 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2-5-4107. SUMMARY OF THE INVENTION In the optical semiconductor device, it is necessary to cause the optical semiconductor element to emit or (; The light-transmitting member through which the received light is transmitted is provided in a resin-made package. However, an effective technique for reliably providing the light-transmitting member in a resin-made package has not been developed without being limited to the material of the light-transmitting member.

種巧不拘泥於透光部件之材質而將透光部件確實設置於樹 脂製之封裝申的光半導體褒置。 解決問題之技術手段 之特徵在於包 收容部件，其 為達成上述目的，本發明之光半導體裝置 括··光半導體元件，其係發出光或接受光； 130532.doc 200849498 係具有收容光半導轉^ π 蓋收容空間之開；=1容空間’·透光部件，其係覆 $且使光大致透過 收容部件央持透光部件；收容部件與夹持部件^由^與 成且被相互雷射焊接。 “由树知形 ^該光半導料置中，構錢容光何體 =部分的收容部件與夹持部件係由樹，= 使光半導體元件所發出或接受之光 於夹持 狀態下，被相互雷射焊# ^之透光部件的 可不拘泥於透光因此’根據該光半導雜裝置’ 製之《中。 材質而將透光部件確實設置於接m 於本發明之光半導體裝置令，較好 & 杯狀，央持部件形成為環狀。 收谷顿形成為 持部件夾持透光部件之 θ 1用收容部件與夹 封裝。 Ρ件之周邊部，而構成設置有透光部件之 於本發明之光半導^$ 置透光部件之凹的是夹持部件具有配 部。藉此，可謀求光半導/=件具有配置透光部件之凹 〜亍等體裝置之小型化。 θ件具有配置透光部件之凹部之情形時，較好的 疋夹持部件於與夹持透光部件之方向大致正交之方^好的 持透光部件之= = = :的是收容部件於與* 有間隙。藉此，於收容部件與夹持部件雷與=之間具 樹脂可收納於間隙中’因此可防止溶融樹脂流= 130532.doc 200849498 =並且可將透光部件牢固地固定於收容部件或央持部 於本發明之光半導體裝置中，較好的是於收容部件中， 於與夾持透光部件之方向大致 十杖加μ 乃句上，設置有限制 央持^件移動的限制部。藉此，可使夹持部件相對於收容 部件之定位容易化。 =發=之光半導體裝置中，較好的是透光部件係由玻 、藉此，由散熱性咼於樹脂之破璃形成之透光部件 位於收容部件與夾持部件之雷射蟬接部之收容空間側，因 脂 此於收容部件與线部件之雷射焊接時，可防止炼融樹 流入收容空間。 於本發明之光半導體褒置中，較好的是收容部件係由大 致吸收與夹持部件雷射焊接時所使用之雷射光的材料形 成，夾持部件係由使雷射光大致透過之材料形成。藉此， 於收容部件與夾持部件之㈣焊接時，經由夾持部件而對 收谷部件照射雷射光’藉此於收容部件與夾持部件之接觸 部使兩部件㈣、再固彳匕’從而可將收容部件與夾持部件 雷射焊接。 於本發明之光半導體裝置中，較好的是收容部件與失持 部件於相互分離之複數個雷射焊接部被相互雷射焊接。藉 此，例如於以回流焊接安裝光半導體裝置之情形時，即^ 於回流爐中收容空間内之空氣膨脹，空氣亦可自收容部件 與夾持部件未被雷射焊接之部分洩漏，因此可防止因收容 空間内之空氣膨脹而造成光半導體裝置之破損。 130532.doc 200849498 發明之效果 而將透光部件 根據本發明，可不拘泥於透光部件之材質 確實設置於樹脂製之封裝中。 【實施方式】 以下，參照圖式詳細說明本發明之較佳實施形態。再 者’各圖中相同或相當部分標上相同符號，省略重複說 明0 ϋThe light-transmitting member is surely disposed on the optical semiconductor device of the resin package, regardless of the material of the light-transmitting member. The technical means for solving the problem is characterized by a package housing member for achieving the above object, and the optical semiconductor device of the present invention comprises an optical semiconductor element which emits light or receives light; 130532.doc 200849498 has a semi-conducting light for accommodating light ^ π cover the opening of the accommodating space; =1 capacity space · the light-transmitting member, which is covered with $ and allows the light to pass through the accommodating member to hold the light-transmitting member; the accommodating member and the holding member are made of Shot welding. "By the tree, the light semi-conducting material is centered, and the storage member and the holding member are part of the tree, and the light emitted or received by the optical semiconductor element is clamped to each other. The light-transmitting member of the laser welding #^ can be placed in the optical semiconductor device of the present invention in accordance with the material of the light-transmissive device of the present invention. Preferably, the cup-shaped member is formed in a ring shape. The groin is formed so that the holding member holds the light-transmitting member θ 1 and is housed by the accommodating member and the clip. The peripheral portion of the member is provided with a light-transmitting member. In the light semi-conducting member of the present invention, the concave member is provided with a fitting portion, whereby the optical semi-conducting member has a small size such as a concave-shaped device in which the light-transmitting member is disposed. When the θ member has a concave portion in which the light transmitting member is disposed, it is preferable that the 疋 holding member is substantially perpendicular to the direction in which the light transmitting member is sandwiched. The accommodating member has a gap with *, thereby accommodating the receiving member and the holding member. The intervening resin can be accommodated in the gap ′ so that the flow of the molten resin can be prevented = 130532.doc 200849498 = and the light transmissive member can be firmly fixed to the accommodating member or the holding portion in the optical semiconductor device of the present invention, preferably In the accommodating member, a restriction portion for restricting the movement of the central member is provided in a direction in which the direction of the light-transmitting member is substantially increased, so that the positioning of the holding member with respect to the accommodating member can be easily performed. In the semiconductor device of the light source, it is preferable that the light-transmitting member is made of glass, whereby the light-transmitting member formed by the heat-dissipating property of the resin is located on the laser beam of the housing member and the holding member. The side of the accommodating space of the joint portion prevents the smelting tree from flowing into the accommodating space during the laser welding of the accommodating member and the wire member. In the optical semiconductor device of the present invention, it is preferable that the accommodating member is substantially The material that absorbs the laser light used for laser welding of the clamping member is formed, and the clamping member is formed of a material that substantially transmits the laser light. Thereby, when the receiving member and the clamping member are welded (four), the clamping is performed. The member is irradiated with the laser light by the grain receiving member. The two members (four) are re-fixed at the contact portion between the receiving member and the holding member, so that the receiving member and the holding member can be laser welded. In the semiconductor device, it is preferable that a plurality of laser welded portions separated from each other by the receiving member and the missing member are laser-welded to each other, whereby, for example, when the optical semiconductor device is mounted by reflow soldering, that is, reflow The air in the accommodating space of the furnace expands, and the air can also leak from the portion where the receiving member and the holding member are not laser welded, thereby preventing the optical semiconductor device from being damaged due to the expansion of the air in the accommodating space. 130532.doc 200849498 According to the present invention, the light-transmitting member can be surely provided in a resin-made package regardless of the material of the light-transmitting member. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and the repeated description is omitted.

圖/係本發明之光半導體裝置之一實施形態之平面圖， 圖係/〇圖1中所示之π_π線之剖面圖，圖3係圖1中所示之 光半導體裝置之分解立體圖。如圖1〜3所示，光半導體裝 置1具備由PPS(聚苯硫醚）、ΡΡΑ(聚鄰笨二甲醯胺）或 LCP(液晶聚合物)等樹脂，以射出成形形成為長方體杯狀 (例如，外形10 mmx10 mm，高2 mm)的收容部件2。收容 邛件2具有剖面四角形之凹部（收容空間，光半導體元件$ 收容於凹部3中。 、半導體元件5係LED、LD等發光元件，或cc：E)影像感 、 衫像感測器等受光元件，設置於凹部$之底面 光半導體元件5與貫穿收容部件2之側壁之複數個電子 仏號輪入輸出端子6藉由線7而電性連接。 '、P件2之一端面2a上配置有由玻璃形成為四角形薄 片（例如’外形9 mmX9 mm，厚0.5 mm)的透光部件8。 透光部件8覆蓋凹部3之開口部讣，使光半導體元件5所發 出或接党之光大致透過。如此，由玻璃形成使光半導體元 件5所發出或接受之光大致透過之透光部件8，藉此可防止 130532.doc 200849498 透光部件8受損。 石進而’收容部件2之-端®2a上配置有由與收容部们相 同之樹脂以射出成形形成為四角形環狀（例如，外形1〇 _ ’厚！叫的线部件9。夾持部件9具有配置 ^部件8之剖面四角形之凹部u，㈣部u之底面Ua形 • 二有剖面四角形之通光孔12。如此，透光部件8配置於夹 持顿9之凹部u，#此可謀求光半導體裝l之小型化。 Γ ^據以上構成，透光部件8之周邊部係夾持於收容部件2Fig. 3 is a plan view showing an embodiment of an optical semiconductor device according to the present invention, and Fig. 3 is an exploded perspective view showing the optical semiconductor device shown in Fig. 1. As shown in FIGS. 1 to 3, the optical semiconductor device 1 is provided with a resin such as PPS (polyphenylene sulfide), ruthenium (poly-o-dimethyl phthalamide) or LCP (liquid crystal polymer), and is formed into a rectangular parallelepiped shape by injection molding. (For example, 10 mm x 10 mm in profile and 2 mm in height). The housing member 2 has a rectangular portion having a rectangular cross section (a housing space, the optical semiconductor element $ is housed in the recess portion 3. The semiconductor element 5 is a light-emitting element such as an LED or an LD, or cc: E), and the image sensor or the image sensor receives light. The element is disposed on the bottom surface of the recess portion. The optical semiconductor element 5 and the plurality of electronic scale wheel input/output terminals 6 penetrating the side wall of the housing member 2 are electrically connected by the wire 7. On one end face 2a of the P piece 2, a light transmissive member 8 formed of glass into a quadrangular piece (e.g., 'outer shape 9 mm X 9 mm, thickness 0.5 mm thick) is disposed. The light transmitting member 8 covers the opening portion 凹 of the concave portion 3 to substantially transmit the light emitted or received by the optical semiconductor element 5. Thus, the light-transmitting member 8 which substantially transmits the light emitted or received by the optical semiconductor element 5 is formed of glass, whereby the light-transmitting member 8 of 130532.doc 200849498 can be prevented from being damaged. In the stone and the end portion 2a of the accommodating member 2, a resin having the same shape as that of the accommodating portion is formed in a square shape by injection molding (for example, the outer shape 1 〇 'thickness! The wire member 9 is called. The holding member 9 The recessed portion u having the quadrangular shape of the cross-section of the component 8 is formed, the bottom surface Ua of the (four) portion u is formed, and the light-transmitting hole 12 having the cross-section of the quadrangular shape is provided. Thus, the light-transmitting member 8 is disposed in the concave portion u of the pinch 9 and can be sought The miniaturization of the optical semiconductor package 1. According to the above configuration, the peripheral portion of the light transmissive member 8 is sandwiched between the housing member 2

Si面與夾持部件9之凹部U之底面1U之間，由收容 4件2與夾持部件9夾持。 又，收容部件2之一端面2a上於大致四方設置有 突起狀(例如，外…, 万。又置有長方體 n ^ mmX .5 _，高0.5 mm)之限制部 1 3。夹持部件9之周邊邱形士士办 一 <周遺°卩形成有各限制部13嵌合之缺口 =此’於與夹持透光部件8之方向（即透光部件8之 此+ 又之方向上，限制夹持部件9之移動，因 ^ 可使夹持部件9相對於收容部件2之定位容易化。 p收容部 =與夾持部件9於相互分離之複數個雷射焊接部 成Λ互^射焊接。收容部件2與夾持部件9由同種樹脂構 料开^收谷部件2係由大致吸收雷射焊接用之雷射光之材 ㈣部―使㈣焊制之雷射光大致透過 之材料形成。 、 圖4係沿圖1中戶斤 一 ’、 —V線之部分剖面圖。如圖4所 = 牛2與夹持部件9之雷射焊接時，雷射焊接用 射至雷射焊接部Ρ，雷射光L大致透過夹持部 130532.doc 200849498 件9而被收容部件2大致吸收。藉此，收容部件2一時發熱， 於收容部件2與夾持部件9之接觸部（圖4中之點部）兩部件熔 融、再固化’從而使收容部件2與夾持部件9雷射焊接。 此時，由散熱性高於樹脂之玻璃形成之透光部件8位於 雷射焊接部Ρ之收容部件2之凹部3側。藉此，收容部件2之 一端面2a中，於凹部3側之區域（與透光部件8接觸之區域） 内，收谷部件2吸收雷射光乙所產生之發熱可較好地溢出。 口此，可防止收容部件2之一端面2a中，凹部3側之區域過 度熔融，且於收容部件2與夾持部件9之雷射烊接時，可防 ΓBetween the Si surface and the bottom surface 1U of the recess U of the holding member 9, the holder 4 is held by the holding member 9. Further, the end surface 2a of the accommodating member 2 is provided with a restricting portion 13 having a projection shape (e.g., a rectangular shape, a rectangular parallelepiped n ^ mm X .5 _, a height of 0.5 mm). The periphery of the gripping member 9 is shaped by a pair of pockets. The recess is formed by the fitting of each of the restricting portions 13 = this is in the direction of holding the light transmitting member 8 (i.e., the light transmitting member 8 is + Further, the movement of the holding member 9 is restricted, so that the positioning of the holding member 9 with respect to the receiving member 2 can be facilitated. p housing portion = a plurality of laser welding portions separated from the holding member 9收容 Λ Λ 。 。 。 。 。 。 。 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容 收容Figure 4 is a partial cross-sectional view along the line of the household and the V line of Figure 1. As shown in Figure 4, when laser welding of the cow 2 and the clamping member 9, the laser welding is used to In the laser welding portion, the laser beam L is substantially absorbed by the accommodating member 2 through the nip portion 130532.doc 200849498. Thus, the accommodating member 2 is heated at one time, and is in contact with the accommodating member 2 and the nip member 9 ( In Fig. 4, the two parts are melted and re-solidified to thereby laser-weld the receiving member 2 and the holding member 9. At this time, the light-transmitting member 8 formed of glass having a higher heat dissipation property than the resin is located on the side of the concave portion 3 of the housing member 2 of the laser welded portion 。. Thereby, the one end surface 2a of the housing member 2 is on the side of the concave portion 3 side. In the region (which is in contact with the light-transmitting member 8), the heat generated by the valley member 2 absorbing the laser light B can be better overflowed. Thus, it is possible to prevent the region on the side of the recess 3 from being excessive in one end face 2a of the housing member 2. Melting, and preventing smashing when the receiving member 2 and the clamping member 9 are connected by a laser

止熔融樹脂或樹脂熔融所產生之氣體流入凹部3。又，夹 持部件9於與夾持透光部件8之方向大致正交之方向上，與 透光部件8之間具有間隙G。藉此，收容部件2與央持部件9 之雷射焊接時，熔融樹脂可收納於間隙，目此可防止 熔融樹月旨流人凹部3’並且可將透光部件8牢固地固定於收 容部件2或夾持部件9。且可緩和配置透光部件8之凹部^ 之加工精度。 如上所述 於光半導體裴置1中 ，構成收容光半導體元 ^之封裝的收容部件2與夹持部件9係由樹脂形成，於夹 /吏先+導體元件5所發出或接受之光大致透過之透光部 =的狀態下’被相互雷射焊接。W，根據光半導體裝 置1，即使不使用接著劑等， 折 了不拘泥於透光部件8之材 將透光部件8喊實設置於樹脂製之封事中。 ^於光，導體裝置心收容部件2形成為杯狀，夹持部 件9 ^/成為環狀。藉此，可利 和用收各部件2與夾持部件9夾持 130532.doc 200849498 透光部件8之周邊部，而構成設置有透光部件8之封裝。 進而，於光半導體裝置1中，收容部件2與夾持部件9於 相互刀離之禝數個雷射焊接部p相互雷射焊接。藉此，例 士於以回々IL焊接封震光半導體裝置工之情形時，即使於回 、盧中收今#件2之凹部3内之空氣膨脹，空氣亦可自收容 • 部件2與夾持部件9未雷射焊接之部分茂漏出，因此可防止 因凹部3内之空氣膨脹而對光半導體裝置1造成之損傷。 Γ、 ^而，對光半導體裝置1之製造方法加以說明。圖5係雷 射焊接用夾具之剖面圖，圖6係雷射焊接用雷射光照射裝 置之概略構成圖。 、 如圖5所示，於收容部件2之凹部3之底面化設置光半導 體元件5後’於收容部件2之—端面仏配置透光部件8及夹 持牛9，製作組裝體1〇，冑組裝體1〇安裝於雷射焊接用 爽具20上。雷射焊接用夹具2〇可如圖5⑷所示，為具備支 持組裝體10之底座21，使雷射焊接用之雷射光大致透過之 , 玻璃板22，使玻璃板22相對底座21移動之氣缸23者；亦可 如圖5(b)所示，為具備底座21，玻璃板22，配置於底座21 之凹部内、載置組裝體10之載置台24，配置於底座21之凹 邛内、對載置台24向玻璃板22側施力之彈簧25者。 繼而，如圖6所示，於安裝於雷射焊接用夾具2〇上且夾 持部件9受收容部件2按壓之狀態下，藉由雷射焊接用雷射 光照射裝置30,對各雷射焊接部p照射雷射光L，藉此將收 容部件2與夾持部件9雷射焊接，製作光半導體裝置丨。雷 射焊接用雷射光照射裝置3〇具備：以與各雷射焊接部？對 130532.doc -12- 200849498 向之方式配置有前端部之光纖31;保持各光纖 之玻璃框m光纖31之基端部光學連接 j = L之雷射二極體33。 '田射光 於對各雷射焊接部P照射雷射光L時，使收容部件2 持部件9相互廢接。藉此，於各雷射焊接部P於收容部件2 與失持部件9相互压接之狀態下使雙方炫融，因此^ 步提面焊接強度。又，抑制了夾持部件9之趣曲 因此可使收容部件2與夾持部件9確實地雷射焊接。/ 再者’雷射焊接用夹具2G可構成為：可 組裝體10，又，雷射焊桩田+ U , 衣歿數個 可…… 照射裝置30可構成為： 可對複數個組裝體10同時照射雷射焊接用之雷射光卜 本發明並非限定於上述實施形態者。 圖7=明之光半導體裝置之其他實施形態之分解立 體圖。如圖7所示，，收容部件2可代替夹持 置透光部件8之剖面四角形之凹部4。於此情形時，收= 7體元件5之凹部3形成於凹部4之底面h。如此，於透 半導體心之Γ；Γ之凹部4之情料，亦可謀求光 圖8係圖7中所示之光丰莫辦 % 體裝置之邛勿剖面圖（相當於 ^ 不之ΙλΜν線之部分剖面圖）0如® 8所示，收容 牛2於與夹持透光部件8之方向（即，透光部件$之厚度方 σ )致正又之方向上，與透光部件8之間具有間隙〇。藉 於收谷^件2與夾持部件9之雷射焊接時，溶融樹脂可 内於間隙G中’因此可防止炼融樹月旨流入收容部件2之凹 130532.doc 200849498 邛3，並且可將透光部件8牢固地固定於收容部件2或夾持 部件9。且可緩和配置透光部件8之凹部4之加工精度。 又，於上述實施形態中，收容部件2係由大致吸收雷射 焊接用之雷射光之材料形成，夾持部件9係由使雷射焊接 用之田射光大致透過之材料形成，但並不限定於此。例 如，收容部件2可由使雷射焊接用之雷射光大致透過之材 料形成，夹持部件9可由大致吸收雷射焊接用t雷射光之 f υ 材料形成’或收容部件2及夾持部件9之兩者均由使雷射焊 接用之雷射光大致透過之材料形成。於後者之情形時於 ^容部件2與夾持部件9之間插入雷射光吸收體，照射雷射 焊接用之雷射光即可將收容部件2與夾持部件9雷射焊接。 =，收容部件2及夾持部件9之兩者可均由大致吸收雷射 = 之雷射光之材料形成。於此情形時，自與夹持透光 向大致正父之方向，對收容部件2與夾持部件9 之接觸部照射雷射焊接用之雷射光 夾持部件”射焊接。 卩了將U部件2與 又，於上述實施形態中，收容部件2與夾持部件 ^離之複數個雷射焊接部P相互雷料接，收容部件2 /件9亦可於整個收容部件2與夾持部件9之接 目 ^射焊接。於此情料，可對接觸部之整 j ^ 谭接用之雷射光，或使雷射焊接用之雷射光沿接觸2射 移動並對接觸部之整體照射雷射焊接用之雷射光。σ目對 產業上之可利用性 。 根據本發明’可不拘泥於透光部件之材質而將透光部件 130532.doc -14- 200849498 確實設置於樹脂製之封裝中。 【圖式簡單說明】 圖i係本發明之光半導體裝置之_實施形態之平面圖。 圖2係沿圖1中所示之II-II線之剖面圖。 圖3係圖1中所示之光半導體裝置之分解立體圖。 圖4係沿圖1中所示之1V-IV線之部分剖面圖。 圖5(a)、（b)係雷射焊接用夾具之剖面圖。The gas generated by melting the molten resin or the resin flows into the concave portion 3. Further, the holding member 9 has a gap G with the light transmitting member 8 in a direction substantially perpendicular to the direction in which the light transmitting member 8 is sandwiched. Thereby, the molten resin can be accommodated in the gap during the laser welding of the accommodating member 2 and the holding member 9, and the molten metal member can be prevented from being firmly fixed to the accommodating member. 2 or clamping member 9. Moreover, the processing precision of the concave portion of the light transmitting member 8 can be alleviated. As described above, in the optical semiconductor device 1, the housing member 2 and the holding member 9 constituting the package for accommodating the optical semiconductor element are formed of a resin, and the light emitted or received by the clip/吏+conductor element 5 is substantially transmitted. In the state where the light transmitting portion =, 'the laser is welded to each other. W, according to the optical semiconductor device 1, the material of the light-transmitting member 8 is folded without using an adhesive or the like. The light-transmitting member 8 is slammed in the sealing of the resin. In the case of the light, the conductor housing member 2 is formed in a cup shape, and the holding member 9^/ is formed in a ring shape. Thereby, the peripheral portion of the light transmitting member 8 can be sandwiched between the member 2 and the holding member 9, and the package provided with the light transmitting member 8 can be formed. Further, in the optical semiconductor device 1, the housing member 2 and the holding member 9 are laser-welded to each other by a plurality of laser welding portions p which are mutually separated from each other. Therefore, when the case is used to seal the light-storage semiconductor device, the air can be self-contained even if the air in the recess 3 of the back of the article 2 is inflated, and the components can be self-contained. The portion of the holding member 9 that is not laser-welded is leaked, so that damage to the optical semiconductor device 1 due to expansion of the air in the recess 3 can be prevented.制造, ^, the method of manufacturing the optical semiconductor device 1 will be described. Fig. 5 is a cross-sectional view showing a jig for laser welding, and Fig. 6 is a schematic view showing a configuration of a laser beam irradiating device for laser welding. As shown in Fig. 5, after the optical semiconductor element 5 is placed on the bottom surface of the recessed portion 3 of the accommodating member 2, the light transmitting member 8 and the nipple 9 are placed on the end surface 收容 of the accommodating member 2, and the assembly 1 is produced. The assembly 1 is attached to the laser welding refresher 20. As shown in Fig. 5 (4), the laser welding jig 2 is a cylinder having a base 21 for supporting the assembly 10 and allowing laser light for laser welding to pass therethrough, and a glass plate 22 for moving the glass plate 22 relative to the base 21. As shown in FIG. 5(b), the base 21 and the glass plate 22 may be disposed in the recess of the base 21, and the mounting table 24 on which the assembly 10 is placed may be placed in the recess of the base 21, The spring 25 that biases the mounting table 24 toward the glass plate 22 side. Then, as shown in FIG. 6, in the laser welding jig 2, and the holding member 9 is pressed by the accommodating member 2, the laser beam irradiation device 30 for laser welding is used for each laser welding. The portion p irradiates the laser light L, whereby the housing member 2 and the holding member 9 are laser-welded to form an optical semiconductor device. The laser beam irradiation apparatus 3 for laser welding is provided with: each laser welding part? The optical fiber 31 having the front end portion is disposed in a manner of 130532.doc -12- 200849498; and the laser diode j of the glass frame m optical fiber 31 of each fiber is optically connected to j = L. When the laser beam L is irradiated to each of the laser welding portions P, the accommodating member 2 holding members 9 are detached from each other. As a result, in each of the laser welding portions P, the two members are slid in a state in which the accommodating member 2 and the disengagement member 9 are pressed against each other, so that the welding strength is improved. Further, the charm of the holding member 9 is suppressed, so that the receiving member 2 and the holding member 9 can be surely laser welded. Further, the 'laser welding jig 2G' can be configured as an assembleable body 10, and a laser welded pile field + U, and a number of clothes can be used. The irradiation device 30 can be configured as: a plurality of assemblies 10 At the same time, the laser light for laser welding is irradiated. The present invention is not limited to the above embodiment. Fig. 7 is an exploded perspective view showing another embodiment of the optical semiconductor device. As shown in Fig. 7, the housing member 2 can replace the recessed portion 4 of the cross-sectional shape of the translucent member 8. In this case, the recess 3 of the body member 5 is formed on the bottom surface h of the recess 4. In this way, in the case of the semiconductor heart; the situation of the concave portion 4 of the , , , , 亦可 亦可 亦可 亦可 8 8 8 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( A partial cross-sectional view of the light-transmitting member 8 is in the direction in which the cow 2 is oriented in the direction in which the light-transmitting member 8 is sandwiched (that is, the thickness σ of the light-transmitting member $), as shown in FIG. There is a gap between them. By the laser welding of the receiving member 2 and the holding member 9, the molten resin can be placed in the gap G. Therefore, the smelting tree can be prevented from flowing into the concave portion of the receiving member 2 130532.doc 200849498 邛3, and The light transmitting member 8 is firmly fixed to the housing member 2 or the holding member 9. Moreover, the processing precision of the concave portion 4 of the light transmitting member 8 can be alleviated. Further, in the above-described embodiment, the accommodating member 2 is formed of a material that absorbs laser light for laser welding, and the nip member 9 is formed of a material that substantially transmits the field light for laser welding, but is not limited thereto. herein. For example, the housing member 2 may be formed of a material that substantially transmits laser light for laser welding, and the holding member 9 may be formed of a material that substantially absorbs the laser light for laser welding, or the housing member 2 and the holding member 9. Both are formed of a material that substantially transmits laser light for laser welding. In the latter case, a laser beam is inserted between the capacitor member 2 and the holding member 9, and the housing member 2 and the holding member 9 are laser-welded by irradiating the laser beam for laser welding. =, both the receiving member 2 and the holding member 9 can be formed of a material that substantially absorbs the laser light of the laser. In this case, the contact portion between the accommodating member 2 and the nip member 9 is irradiated with the laser beam clamping member for laser welding from the direction in which the light is transmitted to the substantially positive parent. In addition, in the above embodiment, the plurality of laser welded portions P that are separated from the holding member 2 are connected to each other, and the receiving member 2 / member 9 may be used for the entire receiving member 2 and the holding member 9 In this case, the laser light for the contact portion can be used, or the laser light for laser welding can be moved along the contact lens 2 and the entire contact portion can be irradiated with laser light. Laser light for welding. σ mesh is industrially usable. According to the present invention, the light-transmitting member 130532.doc -14-200849498 can be disposed in a resin package without being restricted to the material of the light-transmitting member. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of an embodiment of an optical semiconductor device of the present invention. Fig. 2 is a cross-sectional view taken along line II-II of Fig. 1. Fig. 3 is an optical semiconductor shown in Fig. 1. An exploded perspective view of the device. Fig. 4 is a partial cross-sectional view taken along line 1V-IV shown in Fig. 1. FIG. FIG. 5 (a), (b) a sectional view of lines of laser welding jig.

圖6係雷射焊接用雷射光照射裝置之概略構成圖。 圖7係本發明之光半導體裝置之其他實 解立 體圖。 圖8係圖7中所示之光半導體裝置之部分剖面圖。 【主要元件符號說明】 1 光半導體裝置 2 收容部件 3 凹部（收容空間） 3b 開口部 4, 11 凹部 5 光半導體元件 8 透光部件 9 夾持部件 13 限制部 G 間隙 L 雷射光 P 雷射焊接部 130532.doc • 15Fig. 6 is a schematic configuration diagram of a laser beam irradiation apparatus for laser welding. Fig. 7 is a perspective view showing another embodiment of the optical semiconductor device of the present invention. Figure 8 is a partial cross-sectional view showing the optical semiconductor device shown in Figure 7. [Description of main component symbols] 1 Optical semiconductor device 2 Storage member 3 Recessed portion (accommodating space) 3b Opening portion 4, 11 Recessed portion 5 Optical semiconductor element 8 Transmissive member 9 Clamping member 13 Restricted portion G Clearance L Laser light P Laser welding Department 130532.doc • 15

Claims (1)

200849498 十、申請專利範園：200849498 X. Applying for a patent garden: -種光半導體裝置，其特徵在於包括： 光半導體元件，其係發出光或接受光； 之收容空 收谷口p件，其係具有收容上述光半導體元件 透光部件’其係覆蓋上述收容空間 光大致透過；及 之開口部且使上 述 夾持部件，其係與上述收容部件夹持上述透光部件’· 上述收容部件與上述夹持部件係由樹脂 雷射焊接。 |相互 2. 3· 如請求項1之光半導體裝置， 杯狀，上述夾持部件形成為環 如請求項1之光半導體裝置， 置上述透光部件之凹部。 其中上述收容部件形成為 狀。 其中上述夾持部件具有配 (如請求項3之光半導體裝置，其中上述夹持部件於盘夹 持上述透光部件之方向大致正交之方向上，在與上述透 光部件之間具有間隙。 5·如請求項!之光半導體裝置，其中上述收容部件具有配 置上述透光部件之凹部。 6.如請求項5之光半導體裝置’其中上述收容部件於盥夾 持上述透光部件之方向大致正交之方向上，在與上述透 光部件之間具有間隙。 7·如請求項丨之光半導體裝置，其中於上述收容部件中， 於與夾持上述透光部件之方向大致正交之方向上，設置 130532.doc 200849498 有限制上述爽持部件移^ 8 ·如請求項1之光半導體裝 璃形成。 的限制部。 置，其中上述透光部件係由 玻 9·如請求項1之光半導骰驻 卞♦體衣置，其中上述收容部件係由大 致吸收與上述夾持部件雷射焊接時所使用之雷射光之材 料形成，上述失持部件係由使上述雷射光大致透過之材 料形成。An optical semiconductor device comprising: an optical semiconductor element that emits light or receives light; and an accommodating empty valley port p member that has a light transmissive member for accommodating the optical semiconductor element And the opening portion and the holding member sandwich the light transmitting member with the opening portion. The storage member and the holding member are laser-welded by resin. In the case of the optical semiconductor device of claim 1, the cup member is formed in a ring shape as in the optical semiconductor device of claim 1, and the concave portion of the light transmitting member is placed. The housing member is formed in a shape. The holding member has the optical semiconductor device according to claim 3, wherein the holding member has a gap between the light transmitting member and the light transmitting member in a direction substantially perpendicular to a direction in which the disk sandwiches the light transmitting member. 5. The optical semiconductor device according to claim 3, wherein the accommodating member has a concave portion in which the light transmitting member is disposed. 6. The optical semiconductor device according to claim 5, wherein the accommodating member has a direction in which the permeable member is sandwiched. In the direction of the orthogonal direction, there is a gap between the light transmissive member and the light transmissive member. 7. The optical semiconductor device according to claim 1, wherein the housing member is substantially orthogonal to a direction in which the light transmissive member is sandwiched. In the above, the setting 130532.doc 200849498 is limited to the above-mentioned cooling member shifting device. The limiting portion is formed by the optical semiconductor glass of claim 1. The light transmitting member is made of glass. a semi-conducting body, wherein the receiving member is formed of a material that substantially absorbs laser light used in laser welding with the clamping member, A holding member so that the laser beam lines substantially pass through the sheet material is formed. 10.如明求項1之光半導體裝置，其中上述收容部件與上述 夾持部件於相互分離之複數個雷射焊接部被相互雷射焊 接。10. The optical semiconductor device according to claim 1, wherein the plurality of laser welded portions separated from each other by the receiving member and the holding member are laser welded to each other. 130532.doc130532.doc
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