JP2008277346A - Optical semiconductor device - Google Patents

Optical semiconductor device Download PDF

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Publication number
JP2008277346A
JP2008277346A JP2007115977A JP2007115977A JP2008277346A JP 2008277346 A JP2008277346 A JP 2008277346A JP 2007115977 A JP2007115977 A JP 2007115977A JP 2007115977 A JP2007115977 A JP 2007115977A JP 2008277346 A JP2008277346 A JP 2008277346A
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JP
Japan
Prior art keywords
optical semiconductor
semiconductor device
light
laser
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007115977A
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Japanese (ja)
Other versions
JP5193492B2 (en
Inventor
Satoshi Matsumoto
松本　　聡
Masatsugu Takatsuka
雅嗣 高塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP2007115977A priority Critical patent/JP5193492B2/en
Priority to PCT/JP2008/056946 priority patent/WO2008132997A1/en
Priority to TW97113989A priority patent/TWI405305B/en
Publication of JP2008277346A publication Critical patent/JP2008277346A/en
Application granted granted Critical
Publication of JP5193492B2 publication Critical patent/JP5193492B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
    • B29C65/1667—Laser beams characterised by the way of heating the interface making use of several radiators at the same time, i.e. simultaneous laser welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1674—Laser beams characterised by the way of heating the interface making use of laser diodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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    • B29C65/1687—Laser beams making use of light guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7814—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of inter-cooperating positioning features, e.g. tenons and mortises
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/112—Single lapped joints
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    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/541—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms
    • B29C66/5414—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles a substantially flat extra element being placed between and clamped by the joined hollow-preforms said substantially flat extra element being rigid, e.g. a plate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/80—General aspects of machine operations or constructions and parts thereof
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    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/80—General aspects of machine operations or constructions and parts thereof
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    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8227—Transmission mechanisms using springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
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    • H01—ELECTRIC ELEMENTS
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device in which a light transmission member can be provided surely in a resin package regardless of a material of the light transmission member. <P>SOLUTION: In the optical semiconductor device 1, an accommodation member 2 and a clamp member 9 constituting a package for accommodating an optical semiconductor element 5 are formed of resins and welded by means of a laser in a state that a light transmission member 8 substantially transmitting light emitted or received by the optical semiconductor element 5 is clamped. According to the optical semiconductor device 1, the light transmission member 8 can be provided surely in a resin package regardless of the material of the light transmission member 8. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、光半導体デバイスに関する。   The present invention relates to an optical semiconductor device.

光半導体デバイスについては、低コスト化を図るために、光半導体素子が収容されるパッケージを樹脂により形成することが求められている。パッケージを樹脂により形成する技術としては、カップ状の本体部材に蓋部材をレーザ溶着する技術が知られている（例えば、特許文献１〜４参照）。
特表平９−５１０９３０号公報 特表２００５−５０８２６２号公報 特開２００３−３２０５８５号公報 特開２００５−４１０７３号公報 For optical semiconductor devices, in order to reduce costs, it is required to form a package in which an optical semiconductor element is accommodated with a resin. As a technique for forming a package from a resin, a technique is known in which a lid member is laser-welded to a cup-shaped main body member (see, for example, Patent Documents 1 to 4).
Japanese National Patent Publication No. 9-510930 JP 2005-508262 A JP 2003-320585 A JP 2005-41073 A

ところで、光半導体デバイスにおいては、光半導体素子が発光又は受光する光を略透過する光透過部材を樹脂製のパッケージに設ける必要がある。しかしながら、光透過部材の材質に拘わらず光透過部材を樹脂製のパッケージに確実に設けるための有効な技術は開発されていない。   By the way, in an optical semiconductor device, it is necessary to provide a light-transmitting member that substantially transmits light emitted or received by an optical semiconductor element in a resin package. However, no effective technique has been developed for reliably providing the light transmissive member on the resin package regardless of the material of the light transmissive member.

そこで、本発明は、このような事情に鑑みてなされたものであり、光透過部材の材質に拘わらず光透過部材を樹脂製のパッケージに確実に設けることができる光半導体デバイスを提供することを目的とする。   Therefore, the present invention has been made in view of such circumstances, and provides an optical semiconductor device capable of reliably providing a light transmitting member in a resin package regardless of the material of the light transmitting member. Objective.

上記目的を達成するために、本発明に係る光半導体デバイスは、光を発光又は受光する光半導体素子と、光半導体素子が収容される収容空間を有する収容部材と、収容空間の開口部を覆い、光を略透過する光透過部材と、収容部材とで光透過部材を挟持する挟持部材と、を備え、収容部材と挟持部材とは、樹脂により形成され、互いにレーザ溶着されていることを特徴とする。   To achieve the above object, an optical semiconductor device according to the present invention covers an optical semiconductor element that emits or receives light, an accommodation member having an accommodation space in which the optical semiconductor element is accommodated, and an opening of the accommodation space. A light transmitting member that substantially transmits light, and a holding member that holds the light transmitting member between the housing member, the housing member and the holding member being formed of resin and laser-welded to each other. And

この光半導体デバイスでは、光半導体素子が収容されるパッケージの少なくとも一部を構成する収容部材と挟持部材とが、樹脂により形成されており、光半導体素子が発光又は受光する光を略透過する光透過部材を挟持した状態で、互いにレーザ溶着されている。従って、この光半導体デバイスによれば、光透過部材の材質に拘わらず光透過部材を樹脂製のパッケージに確実に設けることができる。   In this optical semiconductor device, the housing member and the sandwiching member that constitute at least part of the package in which the optical semiconductor element is accommodated are formed of resin, and light that substantially transmits light emitted or received by the optical semiconductor element. Laser welding is performed with the transmission member sandwiched therebetween. Therefore, according to this optical semiconductor device, the light transmitting member can be reliably provided in the resin package regardless of the material of the light transmitting member.

本発明に係る光半導体デバイスにおいては、収容部材は、カップ状に形成されており、挟持部材は、環状に形成されていることが好ましい。これによれば、収容部材と挟持部材とで光透過部材の周縁部を挟持して、光透過部材が設けられたパッケージを構成することができる。   In the optical semiconductor device according to the present invention, the housing member is preferably formed in a cup shape, and the holding member is preferably formed in an annular shape. According to this, it is possible to configure a package provided with the light transmitting member by sandwiching the peripheral portion of the light transmitting member between the housing member and the holding member.

本発明に係る光半導体デバイスにおいては、挟持部材が、光透過部材が配置される凹部を有するか、或いは、収容部材が、光透過部材が配置される凹部を有することが好ましい。これらによれば、光半導体デバイスの小型化を図ることができる。   In the optical semiconductor device according to the present invention, it is preferable that the holding member has a recess in which the light transmission member is disposed, or the housing member has a recess in which the light transmission member is disposed. According to these, the optical semiconductor device can be miniaturized.

挟持部材が、光透過部材が配置される凹部を有する場合、挟持部材は、光透過部材が挟持される方向と略直交する方向において、光透過部材との間に隙間を有することが好ましい。一方、収容部材が、光透過部材が配置される凹部を有する場合、収容部材は、光透過部材が挟持される方向と略直交する方向において、光透過部材との間に隙間を有することが好ましい。これらによれば、収容部材と挟持部材とのレーザ溶着時に溶融樹脂が隙間に納まり得るため、溶融樹脂が収容空間に流れ込むのを防止しつつ、収容部材や挟持部材に光透過部材を強固に固定することができる。   When the holding member has a recess in which the light transmitting member is disposed, it is preferable that the holding member has a gap between the light transmitting member in a direction substantially orthogonal to the direction in which the light transmitting member is held. On the other hand, when the housing member has a recess in which the light transmissive member is disposed, the housing member preferably has a gap between the light transmissive member in a direction substantially perpendicular to the direction in which the light transmissive member is sandwiched. . According to these, since the molten resin can fit in the gap during laser welding of the housing member and the sandwiching member, the light transmitting member is firmly fixed to the housing member or the sandwiching member while preventing the molten resin from flowing into the housing space. can do.

本発明に係る光半導体デバイスにおいては、収容部材には、光透過部材が挟持される方向と略直交する方向において、挟持部材の移動を規制する規制部が設けられていることが好ましい。これによれば、収容部材に対する挟持部材の位置決めを容易化することができる。   In the optical semiconductor device according to the present invention, it is preferable that the accommodating member is provided with a restricting portion that restricts movement of the clamping member in a direction substantially orthogonal to the direction in which the light transmitting member is clamped. According to this, positioning of the clamping member with respect to the housing member can be facilitated.

本発明に係る光半導体デバイスにおいては、光透過部材は、ガラスにより形成されていることが好ましい。これによれば、収容部材と挟持部材とのレーザ溶着部における収容空間側には、樹脂に比べて放熱性の高いガラスにより形成された光透過部材が位置するため、収容部材と挟持部材とのレーザ溶着時に溶融樹脂が収容空間に流れ込むのを防止することができる。   In the optical semiconductor device according to the present invention, the light transmitting member is preferably formed of glass. According to this, since the light transmissive member formed of glass having higher heat dissipation than the resin is positioned on the accommodation space side in the laser welding portion between the accommodation member and the sandwiching member, the housing member and the sandwiching member It is possible to prevent the molten resin from flowing into the accommodation space at the time of laser welding.

本発明に係る光半導体デバイスにおいては、収容部材は、挟持部材とのレーザ溶着に使用されるレーザ光を略吸収する材料により形成されており、挟持部材は、レーザ光を略透過する材料により形成されていることが好ましい。これによれば、収容部材と挟持部材とのレーザ溶着時に、挟持部材を介して収容部材にレーザ光を照射することで、収容部材と挟持部材との接触部において両部材を溶融・再固化させて、収容部材と挟持部材とをレーザ溶着することができる。   In the optical semiconductor device according to the present invention, the housing member is formed of a material that substantially absorbs laser light used for laser welding with the holding member, and the holding member is formed of a material that substantially transmits laser light. It is preferable that According to this, at the time of laser welding between the housing member and the sandwiching member, both members are melted and re-solidified at the contact portion between the housing member and the sandwiching member by irradiating the housing member with laser light through the sandwiching member. Thus, the housing member and the clamping member can be laser-welded.

本発明に係る光半導体デバイスにおいては、収容部材と挟持部材とは、互いに離間する複数のレーザ溶着部において、互いにレーザ溶着されていることが好ましい。これによれば、例えば光半導体デバイスをリフロー半田付けで実装する場合に、リフロー炉において収容空間内の空気が膨張しても、収容部材と挟持部材とがレーザ溶着されていない部分から空気がリークし得るため、収容空間内の空気の膨張による光半導体デバイスの破損を防止することができる。   In the optical semiconductor device according to the present invention, it is preferable that the housing member and the holding member are laser-welded to each other at a plurality of laser welding portions that are separated from each other. According to this, for example, when an optical semiconductor device is mounted by reflow soldering, air leaks from a portion where the housing member and the clamping member are not laser-welded even if the air in the housing space expands in the reflow furnace. Therefore, it is possible to prevent the optical semiconductor device from being damaged due to the expansion of air in the accommodation space.

本発明によれば、光透過部材の材質に拘わらず光透過部材を樹脂製のパッケージに確実に設けることができる。   According to the present invention, the light transmitting member can be reliably provided in the resin package regardless of the material of the light transmitting member.

以下、本発明の好適な実施形態について、図面を参照して詳細に説明する。なお、各図において同一又は相当部分には同一符号を付し、重複する説明を省略する。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.

図１は、本発明に係る光半導体デバイスの一実施形態の平面図であり、図２は、図１に示されたII−II線に沿っての断面図であり、図３は、図１に示された光半導体デバイスの分解斜視図である。図１〜３に示されるように、光半導体デバイス１は、ＰＰＳ（ポリフェニレンサルファイド）、ＰＰＡ（ポリフタルアミド）又はＬＣＰ（液晶ポリマー）等の樹脂により直方体カップ状（例えば、外形１０ｍｍ×１０ｍｍ、高さ２ｍｍ）に射出成形で形成された収容部材２を備えている。収容部材２は、断面四角形状の凹部（収容空間）３を有しており、凹部３には、光半導体素子５が収容されている。   1 is a plan view of an embodiment of an optical semiconductor device according to the present invention, FIG. 2 is a cross-sectional view taken along the line II-II shown in FIG. 1, and FIG. 2 is an exploded perspective view of the optical semiconductor device shown in FIG. As shown in FIGS. 1 to 3, the optical semiconductor device 1 is made of a resin such as PPS (polyphenylene sulfide), PPA (polyphthalamide), or LCP (liquid crystal polymer) and has a rectangular parallelepiped cup shape (for example, an outer shape of 10 mm × 10 mm, a high height). 2 mm) is provided with a housing member 2 formed by injection molding. The accommodating member 2 has a concave portion (accommodating space) 3 having a quadrangular cross section, and the optical semiconductor element 5 is accommodated in the concave portion 3.

光半導体素子５は、ＬＥＤ、ＬＤ等の発光素子、又は、ＣＣＤイメージセンサ、ＭＯＳイメージセンサ等の受光素子であって、凹部３の底面３ａに設置されている。光半導体素子５は、収容部材２の側壁を貫通する複数の電気信号入出力端子６とワイヤ７によって電気的に接続されている。   The optical semiconductor element 5 is a light emitting element such as an LED or LD, or a light receiving element such as a CCD image sensor or a MOS image sensor, and is disposed on the bottom surface 3 a of the recess 3. The optical semiconductor element 5 is electrically connected to a plurality of electrical signal input / output terminals 6 penetrating the side wall of the housing member 2 by wires 7.

収容部材２の一端面２ａには、ガラスにより四角形薄板状（例えば、外形９ｍｍ×９ｍｍ、厚さ０．５ｍｍ）に形成された光透過部材８が配置されている。光透過部材８は、凹部３の開口部３ｂを覆い、光半導体素子５が発光又は受光する光を略透過する。このように、光半導体素子５が発光又は受光する光を略透過する光透過部材８をガラスにより形成することで、光透過部材８に傷が付くのを防止することができる。   On one end surface 2a of the housing member 2, a light transmissive member 8 formed in a rectangular thin plate shape (for example, outer shape 9 mm × 9 mm, thickness 0.5 mm) is disposed. The light transmitting member 8 covers the opening 3 b of the recess 3 and substantially transmits light emitted or received by the optical semiconductor element 5. As described above, the light transmitting member 8 that substantially transmits the light emitted or received by the optical semiconductor element 5 is formed of glass, so that the light transmitting member 8 can be prevented from being damaged.

更に、収容部材２の一端面２ａには、収容部材２と同種の樹脂により四角形環状（例えば、外形１０ｍｍ×１０ｍｍ、厚さ１ｍｍ）に射出成形で形成された挟持部材９が配置されている。挟持部材９は、光透過部材８が配置される断面四角形状の凹部１１を有しており、凹部１１の底面１１ａには、断面四角形状の光通過孔１２が形成されている。このように、挟持部材９の凹部１１に光透過部材８が配置されることで、光半導体デバイス１の小型化を図ることができる。   Further, a holding member 9 formed by injection molding into a quadrangular ring (for example, an outer shape of 10 mm × 10 mm and a thickness of 1 mm) of the same kind of resin as that of the housing member 2 is disposed on one end surface 2 a of the housing member 2. The clamping member 9 has a concave portion 11 having a quadrangular cross section in which the light transmitting member 8 is disposed, and a light passage hole 12 having a quadrangular cross section is formed on the bottom surface 11 a of the concave portion 11. Thus, the optical semiconductor device 1 can be miniaturized by arranging the light transmitting member 8 in the recess 11 of the holding member 9.

以上のような構成により、光透過部材８は、その周縁部が収容部材２の一端面２ａと挟持部材９の凹部１１の底面１１ａとの間に挟み込まれ、収容部材２と挟持部材９とで挟持されることになる。   With the configuration as described above, the light transmitting member 8 is sandwiched between the one end surface 2 a of the housing member 2 and the bottom surface 11 a of the concave portion 11 of the sandwiching member 9. It will be pinched.

また、収容部材２の一端面２ａには、直方体突起状（例えば、外形０．５ｍｍ×１．５ｍｍ、高さ０．５ｍｍ）の規制部１３が略四方に設けられている。挟持部材９の周縁部には、各規制部１３が嵌合する切欠き１４が形成されている。これにより、光透過部材８が挟持される方向（すなわち、光透過部材８の厚さ方向）と略直交する方向において、挟持部材９の移動が規制されるため、収容部材２に対する挟持部材９の位置決めを容易化することができる。   In addition, on one end surface 2 a of the housing member 2, a rectangular parallelepiped protrusion (for example, an outer shape of 0.5 mm × 1.5 mm, a height of 0.5 mm) is provided in substantially four directions. A notch 14 into which each regulating portion 13 is fitted is formed at the peripheral edge of the holding member 9. Thereby, since the movement of the clamping member 9 is restricted in a direction substantially orthogonal to the direction in which the light transmitting member 8 is clamped (that is, the thickness direction of the light transmitting member 8), the clamping member 9 with respect to the housing member 2 is restricted. Positioning can be facilitated.

収容部材２と挟持部材９とは、互いに離間する複数のレーザ溶着部Ｐにおいて、互いにレーザ溶着されている。収容部材２と挟持部材９とは同種の樹脂からなるが、収容部材２は、レーザ溶着用のレーザ光を略吸収する材料により形成されており、挟持部材９は、レーザ溶着用のレーザ光を略透過する材料により形成されている。   The housing member 2 and the clamping member 9 are laser welded to each other at a plurality of laser welding portions P that are separated from each other. The housing member 2 and the sandwiching member 9 are made of the same type of resin, but the housing member 2 is formed of a material that substantially absorbs laser light for laser welding, and the sandwiching member 9 receives laser light for laser welding. It is made of a substantially transparent material.

図４は、図１に示されたIV−IV線に沿っての部分断面図である。図４に示されるように、収容部材２と挟持部材９とのレーザ溶着時に、レーザ溶着部Ｐにレーザ溶着用のレーザ光Ｌが照射されると、レーザ光Ｌは、挟持部材９を略透過して収容部材２に略吸収される。これにより、収容部材２が一時発熱し、収容部材２と挟持部材９との接触部（図４におけるドット部分）において両部材が溶融・再固化するため、収容部材２と挟持部材９とがレーザ溶着される。   4 is a partial cross-sectional view taken along line IV-IV shown in FIG. As shown in FIG. 4, when the laser welding portion P is irradiated with laser light L for laser welding at the time of laser welding between the housing member 2 and the clamping member 9, the laser light L is substantially transmitted through the clamping member 9. Thus, it is substantially absorbed by the housing member 2. As a result, the housing member 2 generates heat temporarily, and both members melt and resolidify at the contact portion (dot portion in FIG. 4) between the housing member 2 and the sandwiching member 9, so that the housing member 2 and the sandwiching member 9 become lasers. Welded.

このとき、レーザ溶着部Ｐにおける収容部材２の凹部３側には、樹脂に比べて放熱性の高いガラスにより形成された光透過部材８が位置している。これにより、収容部材２の一端面２ａのうち、凹部３側の領域（光透過部材８と接触している領域）では、収容部材２がレーザ光Ｌを吸収して生じた発熱が好適に逃がされることとなる。従って、収容部材２の一端面２ａのうち、凹部３側の領域が過剰に溶融することが防止され、収容部材２と挟持部材９とのレーザ溶着時に、溶融樹脂や、樹脂が溶融することにより発生したガスが凹部３に流れ込むのを防止することができる。また、挟持部材９は、光透過部材８が挟持される方向と略直交する方向において、光透過部材８との間に隙間Ｇを有している。これにより、収容部材２と挟持部材９とのレーザ溶着時に溶融樹脂が隙間Ｇに納まり得るため、溶融樹脂が凹部３に流れ込むのを防止しつつ、収容部材２や挟持部材９に光透過部材８を強固に固定することができる。しかも、光透過部材８が配置される凹部１１の加工精度を緩和することができる。   At this time, the light transmitting member 8 made of glass having higher heat dissipation than the resin is positioned on the recess 3 side of the housing member 2 in the laser welded portion P. Thereby, in the one end surface 2a of the accommodating member 2, the heat generated by the accommodating member 2 absorbing the laser beam L is suitably released in the region on the concave portion 3 side (the region in contact with the light transmitting member 8). Will be. Accordingly, the region on the concave portion 3 side of the one end surface 2a of the housing member 2 is prevented from being excessively melted, and the molten resin or the resin is melted at the time of laser welding between the housing member 2 and the holding member 9. It is possible to prevent the generated gas from flowing into the recess 3. Further, the clamping member 9 has a gap G between itself and the light transmission member 8 in a direction substantially orthogonal to the direction in which the light transmission member 8 is sandwiched. As a result, the molten resin can be accommodated in the gap G at the time of laser welding of the accommodating member 2 and the holding member 9, and thus the light transmitting member 8 is inserted into the accommodating member 2 and the holding member 9 while preventing the molten resin from flowing into the recess 3. Can be firmly fixed. In addition, the processing accuracy of the recess 11 in which the light transmission member 8 is disposed can be relaxed.

以上説明したように、光半導体デバイス１では、光半導体素子５が収容されるパッケージを構成する収容部材２と挟持部材９とが、樹脂により形成されており、光半導体素子５が発光又は受光する光を略透過する光透過部材８を挟持した状態で、互いにレーザ溶着されている。従って、光半導体デバイス１によれば、接着剤等を使用しなくても、光透過部材８の材質に拘わらず光透過部材８を樹脂製のパッケージに確実に設けることができる。   As described above, in the optical semiconductor device 1, the housing member 2 and the sandwiching member 9 constituting the package in which the optical semiconductor element 5 is housed are formed of resin, and the optical semiconductor element 5 emits or receives light. Laser welding is performed with the light transmitting member 8 that substantially transmits light interposed therebetween. Therefore, according to the optical semiconductor device 1, the light transmitting member 8 can be reliably provided in the resin package regardless of the material of the light transmitting member 8 without using an adhesive or the like.

また、光半導体デバイス１においては、収容部材２がカップ状に形成されており、挟持部材９が環状に形成されている。これにより、収容部材２と挟持部材９とで光透過部材８の周縁部を挟持して、光透過部材８が設けられたパッケージを構成することができる。   Further, in the optical semiconductor device 1, the housing member 2 is formed in a cup shape, and the holding member 9 is formed in an annular shape. Thereby, the peripheral part of the light transmissive member 8 can be clamped by the housing member 2 and the clamping member 9 to constitute a package provided with the light transmissive member 8.

更に、光半導体デバイス１においては、収容部材２と挟持部材９とが、互いに離間する複数のレーザ溶着部Ｐにおいて、互いにレーザ溶着されている。これにより、例えば光半導体デバイス１をリフロー半田付けで実装する場合に、リフロー炉において収容部材２の凹部３内の空気が膨張しても、収容部材２と挟持部材９とがレーザ溶着されていない部分から空気がリークし得るため、凹部３内の空気の膨張による光半導体デバイス１の破損を防止することができる。   Further, in the optical semiconductor device 1, the housing member 2 and the clamping member 9 are laser welded to each other at a plurality of laser welding portions P that are separated from each other. Thereby, for example, when the optical semiconductor device 1 is mounted by reflow soldering, even if the air in the recess 3 of the housing member 2 expands in the reflow furnace, the housing member 2 and the clamping member 9 are not laser-welded. Since air can leak from the portion, it is possible to prevent the optical semiconductor device 1 from being damaged due to the expansion of the air in the recess 3.

次に、光半導体デバイス１の製造方法について説明する。図５は、レーザ溶着用治具の断面図であり、図６は、レーザ溶着用レーザ光照射装置の概略構成図である。   Next, a method for manufacturing the optical semiconductor device 1 will be described. FIG. 5 is a cross-sectional view of a laser welding jig, and FIG. 6 is a schematic configuration diagram of a laser beam irradiation apparatus for laser welding.

図５に示されるように、収容部材２の凹部３の底面３ａに光半導体素子５を設置した後、収容部材２の一端面２ａに光透過部材８及び挟持部材９を配置して、組立体１０を作製し、組立体１０をレーザ溶着用治具２０にセットする。レーザ溶着用治具２０は、図５（ａ）に示されるように、組立体１０を支持するベース２１と、レーザ溶着用のレーザ光を略透過するガラス板２２と、ベース２１に対してガラス板２２を移動させるエアシリンダ２３と、を備えるものであってもよいし、図５（ｂ）に示されるように、ベース２１と、ガラス板２２と、ベース２１の凹部内に配置され、組立体１０が載置される載置台２４と、ベース２１の凹部内に配置され、載置台２４をガラス板２２側に付勢するバネ２５と、を備えるものであってもよい。   As shown in FIG. 5, after the optical semiconductor element 5 is installed on the bottom surface 3 a of the recess 3 of the housing member 2, the light transmitting member 8 and the clamping member 9 are disposed on the one end surface 2 a of the housing member 2. 10 is prepared, and the assembly 10 is set on the laser welding jig 20. As shown in FIG. 5A, the laser welding jig 20 includes a base 21 that supports the assembly 10, a glass plate 22 that substantially transmits a laser beam for laser welding, and a glass for the base 21. The air cylinder 23 for moving the plate 22 may be provided. As shown in FIG. 5B, the base 21, the glass plate 22, and the concave portion of the base 21 are arranged and assembled. You may provide the mounting base 24 in which the solid 10 is mounted, and the spring 25 which is arrange | positioned in the recessed part of the base 21, and urges | biases the mounting base 24 to the glass plate 22 side.

続いて、図６に示されるように、レーザ溶着用治具２０にセットされて挟持部材９が収容部材２に押圧された状態で、レーザ溶着用レーザ光照射装置３０によって、各レーザ溶着部Ｐにレーザ光Ｌを照射することで、収容部材２と挟持部材９とをレーザ溶着して、光半導体デバイス１を作製する。レーザ溶着用レーザ光照射装置３０は、各レーザ溶着部Ｐと対向するように先端部が配置された光ファイバ３１と、各光ファイバ３１の先端部を保持するガラス枠３２と、各光ファイバ３１の基端部と光学的に接続され、レーザ光Ｌを出射するレーザダイオード３３と、を備えている。   Subsequently, as shown in FIG. 6, each laser welding portion P is set by the laser welding laser beam irradiation device 30 in a state where the holding member 9 is pressed against the housing member 2 while being set on the laser welding jig 20. By irradiating the laser beam L, the housing member 2 and the clamping member 9 are laser-welded to produce the optical semiconductor device 1. The laser welding laser beam irradiation device 30 includes an optical fiber 31 having a tip portion disposed so as to face each laser welding portion P, a glass frame 32 that holds the tip portion of each optical fiber 31, and each optical fiber 31. And a laser diode 33 that is optically connected to the base end of the laser beam and emits laser light L.

各レーザ溶着部Ｐにレーザ光Ｌを照射するに際しては、収容部材２と挟持部材９とが圧接させられている。これにより、各レーザ溶着部Ｐでは、収容部材２と挟持部材９とが圧接された状態で、双方が溶融することとなるため、より溶着強度を高くすることができる。また、挟持部材９の反り等の変形が抑制されるため、収容部材２と挟持部材９とを確実にレーザ溶着することができる。   When irradiating each laser welding portion P with the laser beam L, the housing member 2 and the clamping member 9 are pressed against each other. Thereby, in each laser welding part P, since both will fuse | melt in the state in which the accommodating member 2 and the clamping member 9 were press-contacted, welding intensity | strength can be made higher. Further, since deformation such as warping of the clamping member 9 is suppressed, the housing member 2 and the clamping member 9 can be reliably laser-welded.

なお、レーザ溶着用治具２０は、複数の組立体１０を同時にセットすることができるように構成されていてもよく、また、レーザ溶着用レーザ光照射装置３０は、複数の組立体１０にレーザ溶着用のレーザ光Ｌを同時に照射することができるように構成されていてもよい。   The laser welding jig 20 may be configured so that a plurality of assemblies 10 can be set at the same time, and the laser welding laser beam irradiation device 30 is provided with a laser beam on the plurality of assemblies 10. You may be comprised so that the laser beam L for welding can be irradiated simultaneously.

本発明は、上述した実施形態に限定されるものではない。   The present invention is not limited to the embodiment described above.

図７は、本発明に係る光半導体デバイスの他の実施形態の分解斜視図である。図７に示されるように、挟持部材９に替わって、収容部材２が、光透過部材８が配置される断面四角形状の凹部４を有していてもよい。この場合、光半導体素子５が収容される凹部３は、凹部４の底面４ａに形成されることになる。このように、収容部材２の凹部４に光透過部材８が配置される場合にも、光半導体デバイス１の小型化を図ることができる。   FIG. 7 is an exploded perspective view of another embodiment of the optical semiconductor device according to the present invention. As shown in FIG. 7, instead of the holding member 9, the housing member 2 may have a concave section 4 having a square cross section in which the light transmission member 8 is disposed. In this case, the recess 3 in which the optical semiconductor element 5 is accommodated is formed on the bottom surface 4 a of the recess 4. Thus, even when the light transmitting member 8 is disposed in the recess 4 of the housing member 2, the optical semiconductor device 1 can be downsized.

図８は、図７に示された光半導体デバイスの部分断面図である（図１に示されたIV−IV線に沿っての部分断面図に相当する）。図８に示されるように、収容部材２は、光透過部材８が挟持される方向（すなわち、光透過部材８の厚さ方向）と略直交する方向において、光透過部材８との間に隙間Ｇを有している。これにより、収容部材２と挟持部材９とのレーザ溶着時に溶融樹脂が隙間Ｇに納まり得るため、溶融樹脂が収容部材２の凹部３に流れ込むのを防止しつつ、収容部材２や挟持部材９に光透過部材８を強固に固定することができる。しかも、光透過部材８が配置される凹部４の加工精度を緩和することができる。   FIG. 8 is a partial cross-sectional view of the optical semiconductor device shown in FIG. 7 (corresponding to a partial cross-sectional view along line IV-IV shown in FIG. 1). As shown in FIG. 8, the accommodating member 2 has a gap between the light transmitting member 8 in a direction substantially perpendicular to the direction in which the light transmitting member 8 is sandwiched (that is, the thickness direction of the light transmitting member 8). G. As a result, the molten resin can be accommodated in the gap G when the accommodating member 2 and the clamping member 9 are welded to each other, so that the molten resin does not flow into the concave portion 3 of the accommodating member 2 and is prevented The light transmission member 8 can be firmly fixed. In addition, the processing accuracy of the recess 4 in which the light transmission member 8 is disposed can be relaxed.

また、上記実施形態では、収容部材２がレーザ溶着用のレーザ光を略吸収する材料により形成されており、挟持部材９がレーザ溶着用のレーザ光を略透過する材料により形成されていたが、これに限定されない。例えば、収容部材２がレーザ溶着用のレーザ光を略透過する材料により形成されており、挟持部材９がレーザ溶着用のレーザ光を略吸収する材料により形成されていてもよいし、或いは、収容部材２及び挟持部材９の両方がレーザ溶着用のレーザ光を略透過する材料により形成されていてもよい。後者の場合、収容部材２と挟持部材９との間にレーザ光吸収体を介在させてレーザ溶着用のレーザ光を照射すれば、収容部材２と挟持部材９とをレーザ溶着することができる。更に、収容部材２及び挟持部材９の両方がレーザ溶着用のレーザ光を略吸収する材料により形成されていてもよい。この場合、光透過部材８が挟持される方向と略直交する方向から、収容部材２と挟持部材９との接触部にレーザ溶着用のレーザ光を照射すれば、収容部材２と挟持部材９とをレーザ溶着することができる。   In the above embodiment, the housing member 2 is formed of a material that substantially absorbs laser welding laser light, and the holding member 9 is formed of a material that substantially transmits laser welding laser light. It is not limited to this. For example, the housing member 2 may be formed of a material that substantially transmits laser welding laser light, and the holding member 9 may be formed of a material that substantially absorbs laser welding laser light. Both the member 2 and the clamping member 9 may be formed of a material that substantially transmits laser light for laser welding. In the latter case, if the laser light absorber is interposed between the housing member 2 and the sandwiching member 9 and the laser beam for laser welding is irradiated, the housing member 2 and the sandwiching member 9 can be laser welded. Furthermore, both the accommodating member 2 and the clamping member 9 may be formed of a material that substantially absorbs laser welding laser welding. In this case, if the laser beam for laser welding is irradiated to the contact portion between the housing member 2 and the sandwiching member 9 from a direction substantially orthogonal to the direction in which the light transmitting member 8 is sandwiched, the housing member 2 and the sandwiching member 9 Can be laser welded.

また、上記実施形態では、収容部材２と挟持部材９とが、互いに離間する複数のレーザ溶着部Ｐにおいて、互いにレーザ溶着されていたが、収容部材２と挟持部材９とは、収容部材２と挟持部材９との接触部の全体において、互いにレーザ溶着されていてもよい。この場合、レーザ溶着用のレーザ光を接触部の全体に同時に照射してもよいし、或いは、接触部に沿ってレーザ溶着用のレーザ光を相対的に移動させながらレーザ溶着用のレーザ光を接触部の全体に照射してもよい。   Moreover, in the said embodiment, although the accommodating member 2 and the clamping member 9 were mutually laser-welded in the several laser welding part P mutually spaced apart, the accommodating member 2 and the clamping member 9 are the accommodation member 2 and The entire contact portion with the holding member 9 may be laser welded to each other. In this case, the laser beam for laser welding may be irradiated to the entire contact portion at the same time, or the laser beam for laser welding may be irradiated while relatively moving the laser beam for laser welding along the contact portion. You may irradiate the whole contact part.

本発明に係る光半導体デバイスの一実施形態の平面図である。1 is a plan view of an embodiment of an optical semiconductor device according to the present invention. 図１に示されたII−II線に沿っての断面図である。It is sectional drawing along the II-II line | wire shown by FIG. 図１に示された光半導体デバイスの分解斜視図である。FIG. 2 is an exploded perspective view of the optical semiconductor device shown in FIG. 1. 図１に示されたIV−IV線に沿っての部分断面図である。FIG. 4 is a partial cross-sectional view taken along line IV-IV shown in FIG. 1. レーザ溶着用治具の断面図である。It is sectional drawing of a laser welding jig. レーザ溶着用レーザ光照射装置の概略構成図である。It is a schematic block diagram of the laser beam irradiation apparatus for laser welding. 本発明に係る光半導体デバイスの他の実施形態の分解斜視図である。It is a disassembled perspective view of other embodiment of the optical semiconductor device which concerns on this invention. 図７に示された光半導体デバイスの部分断面図である。FIG. 8 is a partial cross-sectional view of the optical semiconductor device shown in FIG. 7.

符号の説明Explanation of symbols

１…光半導体デバイス、２…収容部材、３…凹部（収容空間）、３ｂ…開口部、４，１１…凹部、５…光半導体素子、８…光透過部材、９…挟持部材、１３…規制部、Ｐ…レーザ溶着部、Ｇ…隙間、Ｌ…レーザ光。   DESCRIPTION OF SYMBOLS 1 ... Optical semiconductor device, 2 ... Housing member, 3 ... Recessed part (accommodating space), 3b ... Opening part, 4, 11 ... Recessed part, 5 ... Optical semiconductor element, 8 ... Light transmitting member, 9 ... Holding member, 13 ... Restriction Part, P ... laser welding part, G ... gap, L ... laser beam.

Claims (10)

光を発光又は受光する光半導体素子と、
前記光半導体素子が収容される収容空間を有する収容部材と、
前記収容空間の開口部を覆い、前記光を略透過する光透過部材と、
前記収容部材とで前記光透過部材を挟持する挟持部材と、を備え、
前記収容部材と前記挟持部材とは、樹脂により形成され、互いにレーザ溶着されていることを特徴とする光半導体デバイス。 An optical semiconductor element that emits or receives light; and
An accommodating member having an accommodating space in which the optical semiconductor element is accommodated;
A light transmissive member that covers the opening of the housing space and substantially transmits the light;
A clamping member that clamps the light transmitting member with the housing member,
The optical semiconductor device, wherein the housing member and the clamping member are made of resin and laser-welded to each other. 前記収容部材は、カップ状に形成されており、前記挟持部材は、環状に形成されていることを特徴とする請求項１記載の光半導体デバイス。   The optical semiconductor device according to claim 1, wherein the housing member is formed in a cup shape, and the clamping member is formed in an annular shape. 前記挟持部材は、前記光透過部材が配置される凹部を有することを特徴とする請求項１又は２記載の光半導体デバイス。   The optical semiconductor device according to claim 1, wherein the clamping member has a recess in which the light transmission member is disposed. 前記挟持部材は、前記光透過部材が挟持される方向と略直交する方向において、前記光透過部材との間に隙間を有することを特徴とする請求項３記載の光半導体デバイス。   4. The optical semiconductor device according to claim 3, wherein the holding member has a gap between the holding member and the light transmitting member in a direction substantially perpendicular to the direction in which the light transmitting member is held. 前記収容部材は、前記光透過部材が配置される凹部を有することを特徴とする請求項１又は２記載の光半導体デバイス。   The optical semiconductor device according to claim 1, wherein the housing member has a recess in which the light transmission member is disposed. 前記収容部材は、前記光透過部材が挟持される方向と略直交する方向において、前記光透過部材との間に隙間を有することを特徴とする請求項５記載の光半導体デバイス。   6. The optical semiconductor device according to claim 5, wherein the housing member has a gap with the light transmissive member in a direction substantially perpendicular to a direction in which the light transmissive member is sandwiched. 前記収容部材には、前記光透過部材が挟持される方向と略直交する方向において、前記挟持部材の移動を規制する規制部が設けられていることを特徴とする請求項１〜６のいずれか一項記載の光半導体デバイス。   7. The control unit according to claim 1, wherein the accommodating member is provided with a restricting portion that restricts movement of the clamping member in a direction substantially orthogonal to a direction in which the light transmitting member is clamped. The optical semiconductor device according to one item. 前記光透過部材は、ガラスにより形成されていることを特徴とする請求項１〜７のいずれか一項記載の光半導体デバイス。   The optical semiconductor device according to claim 1, wherein the light transmission member is made of glass. 前記収容部材は、前記挟持部材とのレーザ溶着に使用されるレーザ光を略吸収する材料により形成されており、前記挟持部材は、前記レーザ光を略透過する材料により形成されていることを特徴とする請求項１〜８のいずれか一項記載の光半導体デバイス。   The housing member is formed of a material that substantially absorbs laser light used for laser welding with the sandwiching member, and the sandwiching member is formed of a material that substantially transmits the laser light. An optical semiconductor device according to any one of claims 1 to 8. 前記収容部材と前記挟持部材とは、互いに離間する複数のレーザ溶着部において、互いにレーザ溶着されていることを特徴とする請求項１〜９のいずれか一項記載の光半導体デバイス。   The optical semiconductor device according to claim 1, wherein the housing member and the clamping member are laser-welded to each other at a plurality of laser welding portions that are separated from each other.
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