TWI399825B - 靜電夾盤組件 - Google Patents

靜電夾盤組件 Download PDF

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Publication number
TWI399825B
TWI399825B TW097139227A TW97139227A TWI399825B TW I399825 B TWI399825 B TW I399825B TW 097139227 A TW097139227 A TW 097139227A TW 97139227 A TW97139227 A TW 97139227A TW I399825 B TWI399825 B TW I399825B
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
cooling passage
substrate
pattern
grooves
Prior art date
Application number
TW097139227A
Other languages
English (en)
Chinese (zh)
Other versions
TW200926349A (en
Inventor
布區博格二世道格拉斯Ａ
布利哈特保羅
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW200926349A publication Critical patent/TW200926349A/zh
Application granted granted Critical
Publication of TWI399825B publication Critical patent/TWI399825B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW097139227A 2007-10-12 2008-10-13 靜電夾盤組件 TWI399825B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/871,807 US7649729B2 (en) 2007-10-12 2007-10-12 Electrostatic chuck assembly

Publications (2)

Publication Number Publication Date
TW200926349A TW200926349A (en) 2009-06-16
TWI399825B true TWI399825B (zh) 2013-06-21

Family

ID=40533966

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097139227A TWI399825B (zh) 2007-10-12 2008-10-13 靜電夾盤組件

Country Status (5)

Country Link
US (1) US7649729B2 (https=)
JP (1) JP5523326B2 (https=)
KR (1) KR101135242B1 (https=)
TW (1) TWI399825B (https=)
WO (1) WO2009049054A1 (https=)

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US9887121B2 (en) 2013-04-26 2018-02-06 Applied Materials, Inc. Protective cover for electrostatic chuck
US9666466B2 (en) 2013-05-07 2017-05-30 Applied Materials, Inc. Electrostatic chuck having thermally isolated zones with minimal crosstalk
US9865434B2 (en) 2013-06-05 2018-01-09 Applied Materials, Inc. Rare-earth oxide based erosion resistant coatings for semiconductor application
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US10079165B2 (en) * 2014-05-20 2018-09-18 Applied Materials, Inc. Electrostatic chuck with independent zone cooling and reduced crosstalk
US10186444B2 (en) 2015-03-20 2019-01-22 Applied Materials, Inc. Gas flow for condensation reduction with a substrate processing chuck
TWI616976B (zh) * 2015-06-05 2018-03-01 瓦特洛威電子製造公司 高熱傳導晶圓支撐臺座裝置
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
US11837479B2 (en) 2016-05-05 2023-12-05 Applied Materials, Inc. Advanced temperature control for wafer carrier in plasma processing chamber
US20180148835A1 (en) * 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
US11047035B2 (en) 2018-02-23 2021-06-29 Applied Materials, Inc. Protective yttria coating for semiconductor equipment parts
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
WO2021168027A1 (en) * 2020-02-20 2021-08-26 Lam Research Corporation Coolant channel with internal fins for substrate processing pedestals
KR102654628B1 (ko) * 2020-05-25 2024-04-03 엔지케이 인슐레이터 엘티디 정전 척
US11495483B2 (en) * 2020-10-15 2022-11-08 Applied Materials, Inc. Backside gas leakby for bevel deposition reduction
WO2022146667A1 (en) 2020-12-29 2022-07-07 Mattson Technology, Inc. Electrostatic chuck assembly for plasma processing apparatus
TWI772005B (zh) * 2021-04-28 2022-07-21 錼創顯示科技股份有限公司 半導體晶圓承載結構及有機金屬化學氣相沉積裝置
KR102697860B1 (ko) * 2022-02-08 2024-08-22 (주)아이씨디 정전 장치 및 그 동작 방법
WO2026044003A1 (en) * 2024-08-23 2026-02-26 Lam Research Corporation Improved wafer temperature uniformity via localized increase in substrate contact surface area density

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US20070075457A1 (en) * 2002-05-15 2007-04-05 Krauss-Maffei Kunststofftechnik Gmbh Molding tool, and method of making plastic articles
US20040040664A1 (en) * 2002-06-03 2004-03-04 Yang Jang Gyoo Cathode pedestal for a plasma etch reactor
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TWM264102U (en) * 2004-06-23 2005-05-11 Bing-Wen Tzeng Improvement on cooling structure for mold

Also Published As

Publication number Publication date
KR20090037839A (ko) 2009-04-16
US7649729B2 (en) 2010-01-19
KR101135242B1 (ko) 2012-04-12
JP2011501418A (ja) 2011-01-06
TW200926349A (en) 2009-06-16
WO2009049054A1 (en) 2009-04-16
JP5523326B2 (ja) 2014-06-18
US20090097184A1 (en) 2009-04-16

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