TWI391672B - 測試系統以及探針裝置 - Google Patents

測試系統以及探針裝置 Download PDF

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Publication number
TWI391672B
TWI391672B TW098113186A TW98113186A TWI391672B TW I391672 B TWI391672 B TW I391672B TW 098113186 A TW098113186 A TW 098113186A TW 98113186 A TW98113186 A TW 98113186A TW I391672 B TWI391672 B TW I391672B
Authority
TW
Taiwan
Prior art keywords
wafer
probe
wiring substrate
semiconductor
semiconductor wafer
Prior art date
Application number
TW098113186A
Other languages
English (en)
Chinese (zh)
Other versions
TW200951449A (en
Inventor
Yoshiharu Umemura
Yoshio Komoto
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200951449A publication Critical patent/TW200951449A/zh
Application granted granted Critical
Publication of TWI391672B publication Critical patent/TWI391672B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW098113186A 2008-04-25 2009-04-21 測試系統以及探針裝置 TWI391672B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/058143 WO2009130793A1 (ja) 2008-04-25 2008-04-25 試験システムおよびプローブ装置

Publications (2)

Publication Number Publication Date
TW200951449A TW200951449A (en) 2009-12-16
TWI391672B true TWI391672B (zh) 2013-04-01

Family

ID=41216542

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098113186A TWI391672B (zh) 2008-04-25 2009-04-21 測試系統以及探針裝置

Country Status (2)

Country Link
TW (1) TWI391672B (ja)
WO (1) WO2009130793A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3214100U (ja) * 2017-10-06 2017-12-21 ワイエイシイガーター株式会社 測定装置、及び分類装置
TWI710768B (zh) * 2019-09-04 2020-11-21 創意電子股份有限公司 測試裝置及使用其的測試流程
CN112444723B (zh) * 2019-09-04 2022-12-16 创意电子股份有限公司 测试装置及使用其的测试流程

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW555987B (en) * 2001-06-19 2003-10-01 Matsushita Electric Ind Co Ltd Probe apparatus applicable to a wafer level burn-in screening
TW579538B (en) * 2001-08-31 2004-03-11 Asyst Technologies Wafer engine
US20040070413A1 (en) * 2002-10-02 2004-04-15 Susumu Kasukabe Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
TW200605253A (en) * 2004-04-09 2006-02-01 Renesas Tech Corp Method of manufacturing semiconductor integrated circuit and probe card
JP2008039768A (ja) * 2006-07-10 2008-02-21 Tokyo Electron Ltd プローブカード

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3865115B2 (ja) * 1999-09-13 2007-01-10 Ｈｏｙａ株式会社 多層配線基板及びその製造方法、並びに該多層配線基板を有するウエハ一括コンタクトボード
JP2002139540A (ja) * 2000-10-30 2002-05-17 Nec Corp プローブ構造体とその製造方法
JP2004053409A (ja) * 2002-07-19 2004-02-19 Matsushita Electric Ind Co Ltd プローブカード

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW555987B (en) * 2001-06-19 2003-10-01 Matsushita Electric Ind Co Ltd Probe apparatus applicable to a wafer level burn-in screening
TW579538B (en) * 2001-08-31 2004-03-11 Asyst Technologies Wafer engine
US20040070413A1 (en) * 2002-10-02 2004-04-15 Susumu Kasukabe Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
TW200605253A (en) * 2004-04-09 2006-02-01 Renesas Tech Corp Method of manufacturing semiconductor integrated circuit and probe card
JP2008039768A (ja) * 2006-07-10 2008-02-21 Tokyo Electron Ltd プローブカード

Also Published As

Publication number Publication date
TW200951449A (en) 2009-12-16
WO2009130793A1 (ja) 2009-10-29

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MM4A Annulment or lapse of patent due to non-payment of fees