TWI384581B - 用以撐持基材的裝置 - Google Patents

用以撐持基材的裝置 Download PDF

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Publication number
TWI384581B
TWI384581B TW96128550A TW96128550A TWI384581B TW I384581 B TWI384581 B TW I384581B TW 96128550 A TW96128550 A TW 96128550A TW 96128550 A TW96128550 A TW 96128550A TW I384581 B TWI384581 B TW I384581B
Authority
TW
Taiwan
Prior art keywords
contact
substrate
supporting
suction cup
contact guide
Prior art date
Application number
TW96128550A
Other languages
English (en)
Chinese (zh)
Other versions
TW200816361A (en
Inventor
Ki-Jo Kim
Hyung-Soo Park
Original Assignee
Mujin Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mujin Electronics Co Ltd filed Critical Mujin Electronics Co Ltd
Publication of TW200816361A publication Critical patent/TW200816361A/zh
Application granted granted Critical
Publication of TWI384581B publication Critical patent/TWI384581B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW96128550A 2006-08-08 2007-08-03 用以撐持基材的裝置 TWI384581B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060074919A KR100862912B1 (ko) 2006-08-08 2006-08-08 기판 처리 장치

Publications (2)

Publication Number Publication Date
TW200816361A TW200816361A (en) 2008-04-01
TWI384581B true TWI384581B (zh) 2013-02-01

Family

ID=39033220

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96128550A TWI384581B (zh) 2006-08-08 2007-08-03 用以撐持基材的裝置

Country Status (4)

Country Link
KR (1) KR100862912B1 (ko)
CN (1) CN101501833B (ko)
TW (1) TWI384581B (ko)
WO (1) WO2008018731A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566327B (zh) * 2015-12-01 2017-01-11 錫宬國際有限公司 晶圓承載裝置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010100710A1 (ja) * 2009-03-02 2010-09-10 キヤノンアネルバ株式会社 基板処理装置、磁気デバイスの製造装置及び製造方法
KR102034754B1 (ko) * 2012-09-18 2019-10-22 삼성디스플레이 주식회사 공기압을 이용한 기판 고정 장치
US8939451B2 (en) * 2013-03-11 2015-01-27 Varian Semiconductor Equipment Associates, Inc. Floating high vacuum seal cartridge
CN113161280B (zh) * 2015-01-28 2024-05-17 北京北方华创微电子装备有限公司 顶针机构和除气腔室
CN105345937B (zh) * 2015-11-23 2017-06-30 河南理工大学 制备巴西圆盘人字形裂缝的实验装置及其操作方法
CN106548971A (zh) * 2016-10-11 2017-03-29 武汉新芯集成电路制造有限公司 一种湿法单片清洗机台的卡盘
KR101917432B1 (ko) * 2016-11-21 2018-11-09 세메스 주식회사 기판 지지 부재 및 이를 구비하는 프로브 스테이션
CN108346607B (zh) * 2017-01-25 2020-11-03 上海新昇半导体科技有限公司 竖直插入式阻挡脚及伯努利吸盘
CN110034062A (zh) * 2019-04-19 2019-07-19 德淮半导体有限公司 晶圆夹持装置及卡盘
FR3110948B1 (fr) * 2020-05-29 2022-08-12 Commissariat Energie Atomique Système de positionnement d’une plaque.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239038B1 (en) * 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
US20040065354A1 (en) * 2002-10-08 2004-04-08 Tadashi Ishizaki Apparatus and method for substrate processing
US20050023773A1 (en) * 2003-07-28 2005-02-03 Sipec Corporation Substrate supporting apparatus
WO2005099350A2 (en) * 2004-04-14 2005-10-27 Coreflow Scientific Solutions Ltd. Non-contact support platforms for distance adjustment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2855046B2 (ja) * 1993-03-31 1999-02-10 大日本スクリーン製造株式会社 回転式基板処理装置用の基板回転保持装置
KR100340154B1 (ko) * 1999-12-06 2002-06-10 김광교 웨이퍼를 스피닝하기 위한 웨이퍼 척
JP4467379B2 (ja) * 2004-08-05 2010-05-26 大日本スクリーン製造株式会社 基板処理装置
KR100674922B1 (ko) 2004-12-02 2007-01-26 삼성전자주식회사 포커스 링을 냉각하는 냉각 유로를 가지는 웨이퍼지지장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6239038B1 (en) * 1995-10-13 2001-05-29 Ziying Wen Method for chemical processing semiconductor wafers
US20040065354A1 (en) * 2002-10-08 2004-04-08 Tadashi Ishizaki Apparatus and method for substrate processing
US20050023773A1 (en) * 2003-07-28 2005-02-03 Sipec Corporation Substrate supporting apparatus
WO2005099350A2 (en) * 2004-04-14 2005-10-27 Coreflow Scientific Solutions Ltd. Non-contact support platforms for distance adjustment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566327B (zh) * 2015-12-01 2017-01-11 錫宬國際有限公司 晶圓承載裝置

Also Published As

Publication number Publication date
WO2008018731A1 (en) 2008-02-14
CN101501833A (zh) 2009-08-05
KR100862912B1 (ko) 2008-10-13
KR20080013426A (ko) 2008-02-13
TW200816361A (en) 2008-04-01
CN101501833B (zh) 2012-07-04

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