TWI384581B - Device for supporting substrate - Google Patents

Description

Device for supporting a substrate

The present invention relates to a device for supporting a substrate, such as a semiconductor wafer, a liquid crystal display, or a plasma display. Still further, the present invention relates to a device for supporting a substrate, which can be selectively lifted or lowered by using a raised portion, and by using a rotating portion The guiding guides are rotated while simultaneously processing the front and back surfaces of the substrate.

In order to manufacture a semiconductor device, a process of manufacturing a substrate is required, and a semiconductor device is fabricated on the substrate, and in such a process, processing such as deposition and photolithography is repeated. In order to manufacture a semiconductor device in accordance with such a process with high precision and high yield, etching and cleaning of the substrate are very important, and in carrying out such a process, a device for supporting the substrate is required.

Conventionally, the cleaning device used is a wet workstation that chemically cleans impurities on the substrate by dipping the substrate into a liquid bath containing detergent. However, such wet workstations have the disadvantage of being susceptible to cross-contamination between substrates; both surfaces of the substrate are simultaneously chemically treated, which reduces the uniformity of the etch, turn-around time It's long and you can't choose which surface to process.

The development of semiconductor manufacturing equipment is gradually moving toward the trend that the diameter of the substrate is getting larger and the size of the line is getting smaller and smaller, so as to reduce the cost, and the new material is continuously introduced to improve the performance of the device to make up for mass production. Insufficient equipment, therefore, single-chip processors are widely used. The benefit of a single-wafer processor is that each device can choose which surface to process, but still has the disadvantage that the processor used to process the front surface of the substrate and the processor used to handle the back surface of the substrate must be individual Equipment.

Figures 1 and 2 illustrate a device for supporting a substrate that can handle the upper and lower surfaces of a substrate. As shown in Fig. 1, the conventional device for supporting the substrate is provided with a suction cup (10), and a plurality of holes (32, 40, 42) are mounted on the suction cup to supply the first gas (inert gas). The first gas is formed on the suction cup from a plurality of nozzles, so that the substrate (A) floats from the suction cup and is simultaneously disposed in a rotatable state, and the substrate (A) treatment agent flows down from above. Thereby treating the upper surface of the substrate.

The conventional apparatus for supporting a substrate as shown in FIGS. 1 and 2 can float the substrate by an inert gas to treat the front surface and the back surface of the substrate. However, it has the disadvantage that it cannot simultaneously treat the substrate. The two surfaces of the material.

At the same time, the problem with a conventional Bernoulli suction cup is that in order for the substrate to float, it must supply a high pressure gas, which results in a high precision lithographic pattern on the substrate. In addition, its problem is due to the non-uniform temperature on the entire surface of the substrate, the temperature at the edge of the substrate being lower than the central temperature of the substrate, that is, an "edge cooling" effect.

3, 4, and 5 respectively show a mechanical suction cup, a centrifugal suction cup, and a magnetic chuck used in a conventional apparatus for supporting a substrate. A mechanical suction cup supports the substrate by using one or more pins constructed on the upper portion thereof. A centrifugal suction cup has an S-shaped support member for holding the center of the aforementioned support member by a centrifugal force to support the substrate. In the magnetic chuck, a magnet is placed at the bottom of the struts in the same shape as that used in the centrifugal suction cup, and when the magnet is lifted from the bottom to the top, the substrate is supported by centrifugal force. However, the devices using these suction cups support the substrate, although the front surface of the substrate and the two surfaces of the substrate can be treated, but the back of the substrate cannot be uniformly treated.

It is an object of the present invention to provide a device for supporting a substrate that can selectively treat the front or back surface of the substrate, or both surfaces of the substrate.

Another object of the present invention is to provide an apparatus for supporting a substrate that prevents contamination of the side of the substrate that is not processed by the lithographic pattern during processing of the lithographic pattern on one side of the substrate.

Another object of the present invention is to provide an apparatus for supporting a substrate that does not require a large amount of gas to float the substrate during processing of the non-lithographic pattern of the substrate, without "edge cooling". effect.

Detailed description of the preferred embodiment:

A feature for supporting a substrate device according to the present invention includes: a non-contact guiding portion for supplying a gas to the substrate to float the substrate a predetermined distance; and an upper portion supporting the non-contact portion a contact guiding portion that lifts or lowers the non-contact guiding portion in a vertical direction; a contact guiding portion fixes the substrate at an upper portion, the contact guiding portion is annular, surrounding The non-contact guide portion is disposed in a concentric manner with the non-contact guide portion; and a rotating portion supports and rotates the contact guide portion; in the device, when the non-contact guide portion When the position is lower than the contact guide portion, the contact guide portion supports the base material; and when the position of the non-contact guide portion is higher than the contact guide portion, the substrate floats on the non-contact type On the guide. Therefore, the front surface, the back surface, or the front surface and the back surface of the substrate can be selectively treated simultaneously by using a single device for supporting a substrate.

In addition, the contact guide is characterized in that it comprises a plurality of support pins arranged annularly on the upper surface of the contact guide, when the contact guide supports the substrate and the position is different When the top of the contact guide is low, the plurality of support pin positions are higher than the top of the non-contact guide, and when the substrate floats on the non-contact guide, the plurality of support pin positions Lower than the top of the non-contact guide; and a plurality of guide pins arranged on the outer surface of the plurality of support pins on the upper surface of the contact guide, the plurality of guide pins and the side surface of the substrate Contact to secure the substrate. The support pins and the guide pins may be formed integrally or separately.

In another embodiment of the invention, the contact guide can be a centrifugal suction cup as shown in FIG. The contact guide includes an annular brace, the center of the brace is hollow, and a plurality of fasteners are twisted on the brace. Each fastener has a connection holding substrate at an upper portion thereof, and at the same time, a protrusion of the upper portion abuts against an edge of the substrate, and when the contact guide rotates, the fasteners are centrifugally The lower portion is inclined to a direction opposite to the center of the contact guide.

In another embodiment of the invention, the contact guide can be a magnetic chuck as shown in FIG. The contact guide comprises an annular support column, the center of the support column is hollow, and a plurality of fasteners are twisted on the support column and a magnet is at a lower portion thereof; and a plurality of magnets have the same magnetic poles as the magnets. The magnets are arranged on the struts at positions corresponding to the lower positions of the fasteners; and a cylinder is coupled to the plurality of magnets for upward and downward movement. Each fastener has a connection holding substrate at its upper portion, and at the same time, a protrusion of the upper portion abuts against the edge of the substrate, and when the magnet in the lower portion moves upward, the magnetic force by repelling The lower portions of the fasteners are inclined to face the center of the contact guide.

At the same time, the perforated plate of the non-contact guide comprises one or more circular plates having different diameters and arranged in a concentric manner. The one or more circular plates may have a plurality of holes of equal size or a plurality of holes of different sizes. Therefore, the non-contact guide can float the substrate with a small pressure of inert gas, so that the high-precision lithographic pattern formed on the front surface of the substrate is prevented from being damaged when the back surface of the substrate is processed; When the front surface of the substrate is treated, the back surface of the substrate is prevented from being damaged.

Preferably, the plurality of holes have a diameter of from 1 to 1000 microns. When the diameter of the holes is within the foregoing range, the non-contacting guide provides a filtering action to intercept impurities in the inert gas.

In addition, the non-contact guide portion further includes a first-rate liquid supply hole at a center thereof, and the one or more circular plates surround at least a portion of the fluid supply hole. The fluid supply hole has a cylindrical shape and includes a plurality of liquid supply pipes provided in the cylinder, and the plurality of liquid pipes are insulated by a heat insulating material. Therefore, the front surface and the back surface of the substrate can be simultaneously processed by supplying the fluid to the back surface of the substrate while processing the front surface of the substrate. The non-contact guide can be a circle or a polygon.

In addition, the substrate holding device includes a first hollow shaft and a second hollow shaft, which are arranged in a concentric manner, in which the first hollow shaft is held in the second hollow shaft, the first a diameter of the hollow shaft is smaller than a diameter of the second hollow shaft; in the device, the first hollow shaft is lifted or lowered in a vertical direction by the lifting portion to the non-contact guide portion Lifting or lowering, a lower portion of the first hollow shaft is coupled to the upper lift portion, and an upper portion of the first hollow shaft supports the non-contact guide portion; and in the device, the second hollow shaft is rotated by the second hollow shaft The portion rotates in a horizontal direction to rotate the contact guide portion, and a lower portion of the second hollow shaft is coupled to the rotating portion, and an upper portion of the second hollow portion supports the contact guide portion.

Meanwhile, a substrate supporting device according to the present invention comprises a non-contact guiding portion for supplying gas to a substrate through a plurality of annular holes to float the substrate a predetermined distance, in the device, a plurality of annular holes are formed on the upper surface of the non-contact guiding portion; a lifting portion supports the non-contact guiding portion, and the lifting portion lifts or lowers the non-contact guiding portion in a vertical direction; The contact guiding portion fixes the base material at an upper portion, the contact guiding portion has an annular shape surrounding the non-contact guiding portion, and is disposed concentrically with the non-contact guiding portion; and a rotating portion Supporting and rotating the contact guide; and in the device, when the position of the non-contact guide is lower than the contact guide, the contact guide supports the substrate, and when the contact When the position of the guide portion is higher than the contact guide portion, the substrate floats on the non-contact guide portion.

Moreover, in accordance with an embodiment of the present invention, the non-contact guide supplies gas to the substrate through the plurality of holes to float the substrate a predetermined distance and includes one or more circular shapes Plates, which have different diameters and are arranged in a concentric manner. The one or more circular plates may have a plurality of holes of equal size or a plurality of holes of different sizes. Preferably, the plurality of holes have a diameter of from 1 to 1000 microns. The non-contact suction cup further includes a first-rate liquid supply hole disposed at a center thereof, and the one or more circular plates surround at least a portion of the fluid supply hole. The fluid supply hole has a cylindrical shape including a plurality of liquid supply pipes provided in the cylinder, and the plurality of liquid pipes are insulated by a heat insulating material.

The working principles and advantages of the present invention are clearly and in detail described in the embodiments disclosed below. The following is a detailed description of a substrate device for supporting a substrate in accordance with a preferred embodiment of the present invention, with reference to the accompanying drawings.

First, referring to Fig. 6, an overall structure for supporting a substrate device will be described in accordance with an embodiment of the present invention.

As shown in FIG. 6, in accordance with an embodiment of the present invention, a substrate holding device includes a non-contact suction cup (106) that supplies gas through one or more perforated plates having a plurality of holes therein. To lift the substrate, lift a cylinder (113) to support the non-contact suction cup and lift or lower it in a vertical direction, a contact suction cup (101) including a guide pin (102) And a support pin (103), which fixes the base material, and a rotating portion that includes a rotary motor (112) that rotates the contact suction cup (101).

A more detailed description of the apparatus for supporting a substrate in accordance with the present invention is disclosed below.

7 through 15 illustrate the construction of a contact suction cup (101) and a non-contact suction cup (106) in accordance with an embodiment of the present invention.

As shown in FIG. 7 and FIG. 8, the contact type suction cup (101) has a ring shape and is hollow in a central shaft portion thereof. The non-contact type suction cup (106) has a circular shape and a diameter larger than the contact type suction cup (101). The central hollow portion has a small diameter such that the non-contact suction cup (106) passes through the central hollow portion of the contact suction cup (101).

9 to 11 are structural views, specifically illustrating the structure of the contact type suction cup shown in Fig. 7. As shown in Figures 9 and 10, the contact chuck (101) is composed of an upper disc body (201), a rotating body (202) and a lower disc body (203). The upper disc body (201) has a plurality of supporting pins (103a, 103b, 103c) fixed on its circumference on the upper surface thereof, the supporting pins have the same diameter, and a plurality of holes are arranged along the circumference to set the number a guide pin having a circumference larger than a circumference of the support pin. The rotating body (202) includes a plurality of guide pins (102a, 102b, 102c) that are fixed upward by a plurality of holes passing through the upper disc body.

In addition, as shown in FIG. 11, the lower disc body (203) includes a plurality of cylindrical rotating stops (205) having a height greater than the thickness of the rotating body (202) and one end of a spring (204) being fixed. To the lower disc body (203), the other end includes a ring, and a pin closing position slot (206) which is hollow, from the outer circumferential surface toward the inner circumferential surface, is a rectangle having a predetermined depth and length The length of the spring is short.

As shown in Fig. 11, when one side of the pin closing position groove (206) contacts the rotation stop (205), the rotating body (202) is in the initial position. In order to load the substrate onto the contact chuck, the rotating body (202) is fixed by a withdrawal shaft (not shown), along with the upper tray (201) (not shown) and the contact suction cup. The lower body of (101) is rotated counterclockwise along a predetermined angle, and the guide pin (102) is rotated counterclockwise, thereby opening the guide pin. In addition, in order to fix the substrate on the contact chuck, the upper disc body (201) (not shown) and the lower disc body (203) of the contact chuck rotate clockwise along a predetermined angle. The guide pin (102a) is rotated clockwise, and the upper portion of the guide pin (102a) is locked as it contacts the substrate. Due to the spring force of the spring (204), the substrate is restrained by the guide pin (102).

According to an embodiment of the invention, the contact suction cup (101) is a ring shape having a hollow shape at the central shaft portion. Therefore, it is characterized in that the conventional suction cup has a bow in the hollow than the conventional contact type suction cup. In order to set a spring, due to such a feature, its effect is smaller than that of the conventional contact type suction cup, and the time for acceleration and deceleration can be reduced when the substrate is rotated and stopped, and the turn-back time is reduced (turn -around-time), thereby increasing the substrate processing speed and reducing the motor specifications for rotating the contact chuck, thus reducing the price of the substrate holding device.

12 to 15 are plan views showing the non-contact type suction cup shown in Fig. 8. A first-rate liquid supply hole (212) for supplying a fluid to a substrate to simultaneously treat both sides of the substrate, and an orifice plate for floating the substrate when the back surface of the substrate is treated are constructed on the non-contact suction cup ( 106) on the upper surface. Further, as shown in Fig. 13, an inert gas supply hole (213) is constructed on the lower surface of the non-contact suction cup (106).

As shown in Fig. 14, on the upper surface of the non-contact type suction cup (106), one or a plurality of circular plates (214a, 214b, 214c) are formed as the perforated plates. These circular plates (214a, 214b, 214c) can be made of, for example, a material such as polytetrafluoroethylene (PTFE), which has strong chemical resistance and thus does not with the chemical agent used to process the wafer. The reaction will not produce impurities.

Orifice plates (214a, 214b, 214c) having holes of different sizes are arranged in a concentric manner. The aforementioned plates are arranged along the direction from the center to the edge of the non-contact suction cup (106), from the plate with the small holes to the plate with the large holes, or from the plate with the large holes to the plate with the small holes. The structure corresponds to the centrifugal force generated by the rotation of the substrate.

As described above, the substrate floats on the upper portion of the non-contact type suction cup (106) by an inert gas, and therefore, the front surface of the substrate, that is, the side having the lithographic pattern, is processed (for example, cleaning The back surface of the substrate is prevented from being contaminated because the inert gas supplied through the holes (215) prevents impurities from flowing into the back surface of the substrate. In addition, on the back surface of the substrate, that is, the side without the lithographic pattern, the front surface of the substrate can also be protected from contamination during processing (such as etching or cleaning).

The size and number of holes (215) can be adjusted as needed. Preferably, the holes are between 1 and 1000 microns in diameter. When the diameter of the pore is within 1 to 1000 μm, undesired impurities in the inert gas (which floats the substrate) are intercepted, and as a result, a filtration effect prevents the base when the substrate is treated. The material is contaminated. In addition, since the impurities are trapped in the holes, a pressure difference is generated, and the replacement time of the circular plates (214a, 214b, 214c) can be estimated by measuring the aforementioned pressure difference using a pressure gauge.

Furthermore, the perforated plate should preferably cover at least 50% or more of the substrate. When the area covered by the perforated plate is within the foregoing range, the inert gas supplied through the plurality of holes provided on the perforated plate portion flows into the remaining region (i.e., the edge) of the substrate. As a result, since the inert gas is uniformly supplied to the entire surface of the substrate, the entire surface temperature of the substrate is uniformly changed, thereby avoiding the "edge cooling effect" (that is, the edge temperature of the substrate is higher than the center of the substrate). Low temperature).

Figure 15 shows a fluid drain hole (104) disposed in the center of the non-contact suction cup (106). The fluid discharge orifice (104) has a cylindrical shape with a plurality of fluid supply tubes therein. According to an embodiment of the present invention, a pipe provided in the fluid discharge hole supplies dry gas (say, dry nitrogen) to the substrate through the gas supply hole (211), and is arranged on the circumference around the circumference of the central pipe. The tube is constructed to supply various fluids (for example, a chemical agent for treating the substrate, deionized water (DIW) for cleaning the substrate, etc.) to the substrate through the fluid supply hole (212). surface. Further, the fluid discharge hole (104) includes a heat insulating portion provided in a plurality of tubes such that the plurality of tubes are insulated. The heat insulating portion may be formed using a heat insulating material or by making a vacuum.

The back surface of the substrate can be treated by applying a first-rate fluid to the center of the non-contact suction cup (106) with a first-rate liquid drain (104). In addition, since a plurality of tubes provided in the fluid discharge hole (104) are insulated by the heat insulating portion (223), temperature difference interference between the liquid and the liquid can be prevented, and the liquid liquid supplied through each of the tubes is prevented. It is supplied to the substrate at the initially set temperature, so that processing errors due to temperature difference interference between the respective streams can be avoided.

16 and 17 illustrate a raised portion and a rotating portion, in accordance with an embodiment of the present invention.

Figure 16 is a perspective view, particularly showing the structure for supporting the upper and rotating portions of the substrate device in accordance with an embodiment of the present invention, and Figure 17 is a perspective view showing the rotation Part of the ministry.

First, the structure of the upper part will be explained. In one embodiment, a lift motor can be aligned onto the back surface of the substrate holding device. The lift motor is coupled to a lift base plate (109) through a timing belt, the lift base plate (109) having a shaft housing fixed on its upper surface, and a shaft (111) in the center of the lift base plate And the shaft is guided by a two-liner (108).

The shaft housing (in which a shaft (111) is received) and a lifting cylinder (113) are secured to the upper floor. Therefore, as the lift bottom moves up and down, the shaft housing and the lift cylinder (113) also move. The shaft housing includes a two-shaft bushing (108) that guides to raise or sink the shaft (111), and a bearing (321, 322) is provided on the outer surface of the bushing (108) to rotate on the mandrel (325) At the same time, the friction between the bushing (108) and the mandrel (325) is reduced. The shaft (111) is positioned in the hollow of the mandrel (325); however, since it does not actually contact the mandrel (325), the shaft (111) does not rotate even when the mandrel (325) is rotated.

The lifting cylinder (113) includes a lifting cylinder fixing device (328), and the shaft (111) is fixed to the lifting cylinder (113) by the lifting cylinder fixing device, so The upper cylinder moves up and down, and the shaft (111) also moves up and down. Further, since the shaft (111) supports the non-contact suction cup (106) at the uppermost portion thereof, the non-contact suction cup (106) also moves upward and downward as the shaft (111) moves up and down.

Next, the structure of the rotating portion will be described. As shown in Figure 16, the mandrel (325) is received within the mandrel housing (324). Further, a hollow is provided around the central shaft, including a shaft (111) in the hollow. The mandrel housing (324) reduces friction with the mandrel (325) by bearings (323, 326) disposed within the mandrel housing. A spindle housing (324) is fixed to the upper base plate (109), and a spindle (325) received in the spindle housing (324) supports the rotating wheel (107), and the rotating wheel (107) is used by The contact suction cup struts (105) support the contact suction cup (101). Therefore, as the lift base plate (109) moves up and down, the spindle housing (324) also moves up and down.

The uppermost portion of the mandrel (325) is fixed to the lower surface of the rotating wheel (107), and the plurality of contact cup holders (105) (fixed to the upper surface of the rotating wheel (107)) are connected to the contact type Suction cup (101). As shown in Fig. 17, the spindle (325) is rotated by receiving the rotational force of the rotary motor (112) through the timing belt. The rotating wheel (107) (fixed to the upper portion of the mandrel (325)) rotates as the mandrel (325) rotates, so that the contact suction cup (101) also rotates.

18 to FIG. 21, a front surface (having a lithographic pattern on the surface) and a back surface for supporting a substrate in a substrate device according to an embodiment of the present invention. A method of (without a lithographic pattern on the surface) is explained.

18 and 19 show the contact suction cup and the non-contact suction cup ascending and sinking as the lift motor and the lift cylinder rise and sink. In particular, Fig. 18 shows the ascending and sinking of the contact chuck and the non-contact suction cup when the front surface of the substrate is treated or both the front surface and the back surface are treated. As shown in FIG. 18, the upper bottom plate (109) (which is connected to a lift motor (not shown)) is raised by a lift motor C, and the contact suction cup (101) and the non-contact suction cup (106) ) (supported by the lift base plate (109)) also moves up C. In such an embodiment, the height difference between the lift cylinder (113) and the lift cylinder fixture (328) is A.

In this embodiment, the uppermost position of the non-contact suction cup (106) is lower than the uppermost portion of the support pin (103a) of the contact suction cup (101), and therefore, the substrate is supported by the support pin.

Meanwhile, FIG. 19 shows the ascending and sinking of the contact chuck and the non-contact suction cup when the back surface of the substrate is processed. As shown in Fig. 18, the upper bottom plate (109) is raised C by the lift motor, so that the contact suction cup (101) and the non-contact suction cup (106) also rise C. However, in this embodiment, the lift cylinder fixture (328) is additionally raised by A-B due to the rise of the cylinder provided in the lift cylinder (113). Therefore, the difference in height between the lift cylinder (113) and the lift cylinder fixture (328) is B. Due to the additional rise of the lift cylinder fixture (328), the shaft (111) fixed to the upper cylinder fixture (328), and the non-contact suction cup supported by the uppermost portion of the shaft (111) (106) A-B was also raised. Therefore, the uppermost position of the non-contact suction cup (106) is higher than the uppermost portion of the support pin (103a) of the contact suction cup (101), and therefore, the substrate is floated by the non-contact suction cup (106).

Next, referring to Fig. 20 and Fig. 21, a description will be given of a difference between the method of supporting the substrate by the movement of the contact type suction cup shown in Fig. 18 and the movement of the non-contact type suction cup shown in Fig. 19.

Figure 20 illustrates a method for supporting a substrate while treating the front surface of the substrate or simultaneously treating the front and back surfaces of the substrate. The side surface of the substrate is fixed by the guide pins (102a, 102b), so that the movement in the horizontal direction can be prevented even when the substrate is rotated. As described above, the uppermost position of the non-contact type suction cup (106) is lower than the uppermost position of the support pin (103a, 103b) constructed on the upper portion of the contact type suction cup (101), and therefore, the substrate (A) It is supported by the support pins (103a, 103b). Therefore, the substrate front surface on which the lithographic pattern is formed can be subjected to processing such as etching and cleaning using the substrate processing apparatus (not shown) provided on the upper portion of the supporting substrate device according to the present invention.

Further, at the same time, by supplying the fluid (for example, chemical agent, deionized water (DIW), etc.) through the fluid discharge hole (104) located in the center of the non-contact suction cup (106), it is possible to The substrate (A) was not treated with a back surface on which a lithographic pattern was formed. Therefore, it is possible to treat the front surface of the substrate or to simultaneously treat the front and back surfaces of the substrate.

Figure 21 illustrates a method for supporting a substrate device to treat the back surface of a substrate. The uppermost position of the non-contact suction cup (106) is higher than the uppermost position of the support pin (103a, 103b), and therefore, the substrate (A) is supplied through a hole having an orifice plate of the non-contact suction cup (106). The inert gas floats. In this embodiment, the substrate (A) also avoids movement in the horizontal direction by the guide pins (102a, 102b). The substrate (A) is floated by the non-contact type suction cup (106), and since the substrate processing apparatus (not shown) is fastened to the upper portion of the substrate holding device of the present invention, the substrate can be The back surface of the lithographic pattern is subjected to processing such as etching.

As can be seen from the above description, according to an embodiment of the present invention, the substrate holding device has higher device utilization than a conventional substrate supporting device, and the conventional device cannot selectively treat the substrate, and the need thereof Separately mounting a contact suction cup and a non-contact suction cup, the apparatus of the present invention can selectively treat a single device by utilizing the position of the contact suction cup (101) opposite to the non-contact suction cup (106). A surface on which a lithographic pattern is formed on the substrate and a surface on the substrate where no lithographic pattern is formed. In addition, the device of the present invention has higher device utilization than the conventional support substrate device, and the device of the present invention can realize the treatment of the front surface of the substrate, the treatment of the back surface of the substrate, and the simultaneous treatment of the front surface of the substrate and All modes of the back surface.

The above description of the disclosed embodiments is provided to those skilled in the art, so that anyone skilled in the art can practice the invention. It is obvious to those skilled in the art that the foregoing embodiments are susceptible to variations and the general principles defined in the present specification can be applied to other embodiments without departing from the spirit and scope of the invention. Therefore, the present invention should not be limited to the embodiment disclosed in the specification, and the principles and features disclosed in the specification are in the broadest scope of the invention.

<Effect of the invention>

The invention comprises a non-contact suction cup and a contact suction cup in a single device, and solves the problem of the traditional substrate supporting device by adjusting the relevant positions by using the lifting portion, the traditional substrate supporting device Two or more devices are required to perform all three modes of processing to process the front surface of the substrate on which the lithographic pattern is formed, to treat the back surface of the substrate on which the lithographic pattern is not formed, and to simultaneously treat the substrate Front and back surfaces.

Further, with the contact type suction cup according to an embodiment of the present invention, the volume of the suction cup is reduced, thereby increasing the yield and reducing the selling price of the apparatus.

Further, with the non-contact type suction cup according to an embodiment of the present invention, when the front surface of the substrate is processed, the back surface on which the lithographic pattern is formed on the substrate can be prevented from being contaminated. In addition, when the back surface of the lithographic pattern is not formed on the substrate, the entire surface of the substrate forms a uniform temperature, and the substrate can be floated only by the low-pressure inert gas, and is not processed on the substrate. When the back surface of the lithographic pattern is formed, the front surface of the substrate on which the high-precision lithographic pattern is formed can be prevented from being damaged.

Non-contact suction cups. . . (106)

Lift the cylinder. . . (113)

Contact suction cup. . . (101)

Guide pin. . . (102)

Support pin. . . (103)

Rotating motor. . . (112)

Contact suction cup support. . . (105)

Rotating wheel. . . (107)

Bushing. . . (108)

Lift the cylinder. . . (113)

axis. . . (111)

Lift the bottom plate. . . (109)

Fluid drain hole. . . (104)

Guide pin. . . (102a, 102b, 102c)

Support pin. . . (103a, 103b, 103c)

Upper plate. . . (201)

Rotating body. . . (202)

Lower body. . . (203)

Rotating stop. . . (205)

spring. . . (204)

Pin closed position slot. . . (206)

Fluid supply hole. . . (212)

Inert gas supply hole. . . (213)

Round plate. . . (214a, 214b, 214c)

hole. . . (215)

Gas supply hole. . . (211)

Thermal insulation department. . . (223)

Bearing. . . (321, 322)

Mandrel. . . (325)

Lift the cylinder fixture. . . (328)

Mandrel housing. . . (324)

Bearing. . . (323, 326)

Substrate. . . (A)

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of an apparatus for supporting a substrate in accordance with conventional techniques which simultaneously treats the upper and lower surfaces of the substrate.

Figure 2 is a plan view of a suction cup (10) for holding a substrate device shown in Figure 1.

Figure 3 is a cross-sectional view of a conventional mechanical suction cup.

Figure 4 is a cross-sectional view of a conventional centrifugal force suction cup.

Figure 5 is a cross-sectional view of a conventional magnetic disk.

Figure 6 is a cross-sectional view of a device for supporting a substrate in accordance with an embodiment of the present invention.

Figure 7 is a top plan view of a contact guide in accordance with an embodiment of the present invention.

Figure 8 is a top plan view of a non-contact guide in accordance with an embodiment of the present invention.

Figure 9 is a block diagram showing the structure of the contact guide of Figure 7.

Figure 10 is a perspective view showing the upper surface of the contact guide of Figure 7.

Figure 11 is a perspective view showing the rotating body and the lower body of the contact guide of Figure 7.

Figure 12 is a top plan view of the upper surface of the non-contact guide of Figure 8.

Figure 13 is a top plan view of the lower surface of the non-contacting guide of Figure 8.

Figure 14 is a top plan view showing the arrangement of a perforated plate of Figure 8 on the non-contact guide.

Figure 15 is a perspective view of one of the fluid supply holes of the non-contact guide of Figure 12;

Figure 16 is a cross-sectional view showing the structure of the upper portion and the rotating portion in accordance with an embodiment of the present invention.

Figure 17 is a perspective view showing a portion of a rotating portion in accordance with an embodiment of the present invention.

Figure 18 is a diagram depicting the lift, contact, and non-contact of the device when the front surface (or both the front and back surfaces) of the substrate are treated, in accordance with an embodiment of the present invention. The movement of the guide.

Figure 19 is a diagram depicting the movement of the upper and non-contact guides of the device as the back surface of the substrate is treated in accordance with an embodiment of the present invention.

Figure 20 is a cross-sectional view showing a method for supporting a substrate when treating a front surface of a substrate (or a front surface and a back surface of a substrate) in accordance with an embodiment of the present invention.

Figure 21 is a cross-sectional view showing a method for supporting a substrate when treating a back surface of a substrate in accordance with an embodiment of the present invention.

Non-contact suction cups. . . (106)

Lift the cylinder. . . (113)

Contact suction cup. . . (101)

Guide pin. . . (102)

Support pin. . . (103)

Rotating motor. . . (112)

Contact suction cup support. . . (105)

Rotating wheel. . . (107)

Bushing. . . (108)

Lift the cylinder. . . (113)

axis. . . (111)

Lift the bottom plate. . . (109)

Fluid drain hole. . . (104)

Claims (22)

A device for supporting a substrate, comprising: a non-contact guide for supplying gas to a substrate to float the substrate at a predetermined distance; and an upper portion for the non-contact type The guiding portion is lifted or lowered in a vertical direction, the upper lifting portion supports the non-contact guiding portion; and the contact guiding portion has an annular shape for surrounding the non-contact guiding portion, the contact guiding a portion is fixed to the upper portion thereof and disposed in a concentric manner with the non-contact guide portion; and a rotating portion for supporting and rotating the contact guide portion, in the device, when the non-contact guide The contact guiding portion supports the substrate when the position of the portion is lower than the contact guiding portion, and the substrate floats when the position of the non-contact guiding portion is higher than the contact guiding portion On the non-contact guide. The device for supporting a substrate according to claim 1, wherein the contact guiding portion comprises: a plurality of supporting pins, when the contact guiding portion supports the substrate, The position is higher than the top of the non-contact guide portion. When the substrate floats on the non-contact guide portion, the position is lower than the top of the non-contact guide portion, and the plurality of support pins are arranged in a ring shape. On the upper surface of the contact guiding portion, and a plurality of guiding pins are in contact with the side surface of the substrate to fix the substrate, and the plurality of guiding pins are arranged outside the plurality of supporting pins, the contact guide On the upper surface of the lead. The apparatus for supporting a substrate according to claim 2, wherein the plurality of support pins and the plurality of guide pins are separately separated. The apparatus for supporting a substrate according to the second aspect of the patent application, wherein the plurality of support pins and the plurality of guide pins are integrally formed. The device for supporting a substrate according to claim 1, wherein the contact guide comprises an annular support column having a hollow at the center thereof, and the plurality of fasteners are twisted at The brace; each brace has a connection at its upper portion, and holds the substrate with a protrusion of the upper portion, closely abutting the edge of the substrate, and at the same time, the lower portion of the fastener is rotated by the contact guide By the centrifugal force, it is inclined to the opposite direction of the center of the contact guide. The device for supporting a substrate according to claim 1, wherein the contact guide comprises: an annular support pillar, and a hollow is formed in the center; and the plurality of fasteners are twisted To the brace, there is a first magnet at a lower portion thereof; the plurality of second magnets have the same magnetic pole as the first magnet, and the plurality of second magnets are placed on the brace and are located at a lower position of the bucks Corresponding; and a cylinder combined with a plurality of the second magnets for moving up and down; in the device, each fastener has a protrusion on the upper portion thereof to hold the substrate and closely lean against At the same time, the edges of the substrate, at the same time, the lower portions of the fasteners are tilted by the repulsive magnetic force to the opposite direction of the center of the contact guide when the second magnets are moved upward. The device for supporting a substrate according to claim 1, wherein the non-contact guide of the perforated plate comprises one or more circular plates, when two or more pieces are included Each of the two or more circular plates has a different diameter and is arranged in a concentric manner. A device for supporting a substrate according to claim 7 in which the one or more circular plates have a plurality of holes of the same size. The apparatus for supporting a substrate according to the seventh aspect of the patent application, wherein the two or more circular plates each have a plurality of holes of different sizes. The apparatus for supporting a substrate according to claim 8 or 9, wherein the plurality of holes have a diameter of 1 to 1000 μm. The apparatus for supporting a substrate according to claim 10, wherein the non-contact guide further comprises a first-class liquid supply hole provided in the center thereof, and one or more circular plates At least a portion of the flow supply aperture is surrounding. The apparatus for supporting a substrate according to claim 11, wherein the fluid supply hole has a cylindrical shape and includes a plurality of tubes disposed therein, and in the apparatus, Several tubes are insulated by a heat insulating material. The apparatus for supporting a substrate according to claim 1, wherein in the application, the substrate supporting device comprises a first hollow shaft and a second hollow shaft, which are arranged in a concentric manner; In the device, the first hollow shaft is held in the second hollow shaft, and the diameter of the first hollow shaft is smaller than the diameter of the second hollow shaft; in the device, the first hollow shaft is lifted by the lifting Lifting or lowering the non-contact guide portion to be lifted or lowered in a vertical direction, the lower portion of the first hollow shaft being connected to the upper lift portion and the upper portion of the first hollow shaft supporting the non-contact type a guiding portion; and in the device, the second hollow shaft is rotated in a horizontal direction by rotating the contact guiding portion by the rotating portion, and a lower portion of the second hollow shaft is connected to the rotating portion, and the foregoing The upper portion of the two hollow shafts supports the contact guide. A device for supporting a substrate according to any one of claims 1 to 9, wherein the non-contact guide has a circular shape. The device for supporting a substrate according to any one of claims 1 to 9, wherein the non-contact guide is a polygon. A device for supporting a substrate, comprising: a non-contact guide for supplying gas to a substrate through an annular nozzle to float the substrate at a predetermined distance, in the device, one or a plurality of different annular nozzles are arranged concentrically on the upper surface of the non-contact guide; an upper portion is used for lifting or lowering the non-contact guide in a vertical direction, and the above-mentioned upper support is supported The non-contact guide portion has a ring shape for surrounding the non-contact guide portion, and the contact guide portion fixes the base material at an upper portion and is concentric with the non-contact guide portion. And a rotating portion for supporting and rotating the contact guiding portion; in the device, when the position of the non-contact guiding portion is lower than the contact guiding portion, the contact guiding portion supports The substrate, wherein the substrate floats on the non-contact guide when the position of the non-contact guide is higher than the contact guide. A non-contact suction cup for supplying gas to a substrate to float the substrate by a predetermined distance, the non-contact suction cup comprising one or more circular plates, when two or more circular plates are included Each of the two or more circular plates has a different diameter and is arranged in a concentric manner; the non-contact suction cup further includes a first-rate liquid supply hole, and the fluid supply hole includes a fluid supply hole A plurality of fluid supply pipes are provided in the holes, and the plurality of fluid supply pipes are insulated by a heat insulating material. According to the non-contact type suction cup of claim 17, in the suction cup, the one or more circular plates each have a plurality of holes of the same size. According to the non-contact type suction cup of claim 17, in the suction cup, the two or more circular plates each have several different sizes Hole. The non-contact type suction cup according to any one of claims 17, 18 and 19, wherein the plurality of holes have a diameter of 1 to 1000 μm. According to the non-contact type suction cup of claim 20, one or more circular plates surround at least a portion of the liquid supply hole. According to the non-contact type suction cup of claim 21, the liquid supply hole has a cylindrical shape in the suction cup.