TWI381473B - 利用彎液面處理晶圓表面時之相對於近接頭實質上均一流體流率用的設備 - Google Patents

利用彎液面處理晶圓表面時之相對於近接頭實質上均一流體流率用的設備 Download PDF

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Publication number
TWI381473B
TWI381473B TW098104111A TW98104111A TWI381473B TW I381473 B TWI381473 B TW I381473B TW 098104111 A TW098104111 A TW 098104111A TW 98104111 A TW98104111 A TW 98104111A TW I381473 B TWI381473 B TW I381473B
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TW
Taiwan
Prior art keywords
flow
fluid
bore
resistor
block
Prior art date
Application number
TW098104111A
Other languages
English (en)
Chinese (zh)
Other versions
TW201001587A (en
Inventor
阿諾德 科洛丹可
林政宇
羅素 馬汀
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201001587A publication Critical patent/TW201001587A/zh
Application granted granted Critical
Publication of TWI381473B publication Critical patent/TWI381473B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW098104111A 2008-02-08 2009-02-09 利用彎液面處理晶圓表面時之相對於近接頭實質上均一流體流率用的設備 TWI381473B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6508808P 2008-02-08 2008-02-08

Publications (2)

Publication Number Publication Date
TW201001587A TW201001587A (en) 2010-01-01
TWI381473B true TWI381473B (zh) 2013-01-01

Family

ID=40952731

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098104111A TWI381473B (zh) 2008-02-08 2009-02-09 利用彎液面處理晶圓表面時之相對於近接頭實質上均一流體流率用的設備

Country Status (7)

Country Link
US (2) US8317966B2 (https=)
JP (1) JP5427792B2 (https=)
KR (1) KR101679432B1 (https=)
CN (1) CN101971299B (https=)
SG (1) SG188086A1 (https=)
TW (1) TWI381473B (https=)
WO (1) WO2009100409A2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
JP5701645B2 (ja) * 2011-03-01 2015-04-15 株式会社Ｓｃｒｅｅｎホールディングス ノズル、基板処理装置、および基板処理方法
JP6061181B2 (ja) 2012-08-20 2017-01-18 ローム株式会社 半導体装置
US9859135B2 (en) * 2014-12-19 2018-01-02 Applied Materials, Inc. Substrate rinsing systems and methods
KR102116534B1 (ko) * 2018-06-25 2020-05-28 주식회사 에이치에스하이테크 기판 세정용 노즐 및 그 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041181A (en) * 1987-10-06 1991-08-20 Integrated Fluidics Company Method of bonding plastics
JP2003234286A (ja) * 2001-12-06 2003-08-22 Tokyo Electron Ltd 液処理装置
US20030209323A1 (en) * 2002-05-07 2003-11-13 Nec Electronics Corporation Production apparatus for manufacturing semiconductor device
US20060124153A1 (en) * 2002-09-30 2006-06-15 Lam Research Corp. Enhanced wafer cleaning method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7234477B2 (en) * 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
JP2002075947A (ja) * 2000-08-30 2002-03-15 Alps Electric Co Ltd ウェット処理装置
JP3916491B2 (ja) 2002-03-28 2007-05-16 芝浦メカトロニクス株式会社 基板の処理装置
US7240679B2 (en) * 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US6954993B1 (en) * 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7520285B2 (en) * 2002-09-30 2009-04-21 Lam Research Corporation Apparatus and method for processing a substrate
JP4343031B2 (ja) * 2004-05-31 2009-10-14 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US7003899B1 (en) * 2004-09-30 2006-02-28 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head
JP5068471B2 (ja) 2006-03-31 2012-11-07 東京エレクトロン株式会社 基板処理装置
US7998304B2 (en) * 2007-12-20 2011-08-16 Lam Research Corporation Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041181A (en) * 1987-10-06 1991-08-20 Integrated Fluidics Company Method of bonding plastics
JP2003234286A (ja) * 2001-12-06 2003-08-22 Tokyo Electron Ltd 液処理装置
US20030209323A1 (en) * 2002-05-07 2003-11-13 Nec Electronics Corporation Production apparatus for manufacturing semiconductor device
US20060124153A1 (en) * 2002-09-30 2006-06-15 Lam Research Corp. Enhanced wafer cleaning method

Also Published As

Publication number Publication date
SG188086A1 (en) 2013-03-28
JP2011512654A (ja) 2011-04-21
US20100037922A1 (en) 2010-02-18
US20130048765A1 (en) 2013-02-28
CN101971299A (zh) 2011-02-09
JP5427792B2 (ja) 2014-02-26
US8317966B2 (en) 2012-11-27
CN101971299B (zh) 2013-03-20
TW201001587A (en) 2010-01-01
KR20100119763A (ko) 2010-11-10
WO2009100409A3 (en) 2009-12-03
KR101679432B1 (ko) 2016-12-06
WO2009100409A2 (en) 2009-08-13
US8900400B2 (en) 2014-12-02

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