CN101971299B - 用于晶片表面处理中相对临近头的均匀的流体流率的设备 - Google Patents

用于晶片表面处理中相对临近头的均匀的流体流率的设备 Download PDF

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Publication number
CN101971299B
CN101971299B CN200980104907.XA CN200980104907A CN101971299B CN 101971299 B CN101971299 B CN 101971299B CN 200980104907 A CN200980104907 A CN 200980104907A CN 101971299 B CN101971299 B CN 101971299B
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China
Prior art keywords
fluid
hole
impedor
pressure stabilizing
flow
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Expired - Fee Related
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CN200980104907.XA
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English (en)
Chinese (zh)
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CN101971299A (zh
Inventor
阿诺德·霍洛坚科
林成渝(肖恩)
拉塞尔·马丁
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN200980104907.XA 2008-02-08 2009-02-07 用于晶片表面处理中相对临近头的均匀的流体流率的设备 Expired - Fee Related CN101971299B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6508808P 2008-02-08 2008-02-08
US61/065,088 2008-02-08
PCT/US2009/033499 WO2009100409A2 (en) 2008-02-08 2009-02-07 Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus

Publications (2)

Publication Number Publication Date
CN101971299A CN101971299A (zh) 2011-02-09
CN101971299B true CN101971299B (zh) 2013-03-20

Family

ID=40952731

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980104907.XA Expired - Fee Related CN101971299B (zh) 2008-02-08 2009-02-07 用于晶片表面处理中相对临近头的均匀的流体流率的设备

Country Status (7)

Country Link
US (2) US8317966B2 (https=)
JP (1) JP5427792B2 (https=)
KR (1) KR101679432B1 (https=)
CN (1) CN101971299B (https=)
SG (1) SG188086A1 (https=)
TW (1) TWI381473B (https=)
WO (1) WO2009100409A2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
JP5701645B2 (ja) * 2011-03-01 2015-04-15 株式会社Ｓｃｒｅｅｎホールディングス ノズル、基板処理装置、および基板処理方法
JP6061181B2 (ja) 2012-08-20 2017-01-18 ローム株式会社 半導体装置
US9859135B2 (en) * 2014-12-19 2018-01-02 Applied Materials, Inc. Substrate rinsing systems and methods
KR102116534B1 (ko) * 2018-06-25 2020-05-28 주식회사 에이치에스하이테크 기판 세정용 노즐 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234286A (ja) * 2001-12-06 2003-08-22 Tokyo Electron Ltd 液処理装置
US6954993B1 (en) * 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
JP2007270232A (ja) * 2006-03-31 2007-10-18 Tokyo Electron Ltd 基板処理装置および基板載置台

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041181A (en) * 1987-10-06 1991-08-20 Integrated Fluidics Company Method of bonding plastics
US7234477B2 (en) * 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
JP2002075947A (ja) * 2000-08-30 2002-03-15 Alps Electric Co Ltd ウェット処理装置
JP3916491B2 (ja) 2002-03-28 2007-05-16 芝浦メカトロニクス株式会社 基板の処理装置
JP2003324072A (ja) * 2002-05-07 2003-11-14 Nec Electronics Corp 半導体製造装置
US7240679B2 (en) * 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7520285B2 (en) * 2002-09-30 2009-04-21 Lam Research Corporation Apparatus and method for processing a substrate
US7329321B2 (en) * 2002-09-30 2008-02-12 Lam Research Corporation Enhanced wafer cleaning method
JP4343031B2 (ja) * 2004-05-31 2009-10-14 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US7003899B1 (en) * 2004-09-30 2006-02-28 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head
US7998304B2 (en) * 2007-12-20 2011-08-16 Lam Research Corporation Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234286A (ja) * 2001-12-06 2003-08-22 Tokyo Electron Ltd 液処理装置
US6954993B1 (en) * 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
JP2007270232A (ja) * 2006-03-31 2007-10-18 Tokyo Electron Ltd 基板処理装置および基板載置台

Also Published As

Publication number Publication date
SG188086A1 (en) 2013-03-28
TWI381473B (zh) 2013-01-01
JP2011512654A (ja) 2011-04-21
US20100037922A1 (en) 2010-02-18
US20130048765A1 (en) 2013-02-28
CN101971299A (zh) 2011-02-09
JP5427792B2 (ja) 2014-02-26
US8317966B2 (en) 2012-11-27
TW201001587A (en) 2010-01-01
KR20100119763A (ko) 2010-11-10
WO2009100409A3 (en) 2009-12-03
KR101679432B1 (ko) 2016-12-06
WO2009100409A2 (en) 2009-08-13
US8900400B2 (en) 2014-12-02

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Granted publication date: 20130320