TWI376993B - - Google Patents

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Publication number
TWI376993B
TWI376993B TW97122610A TW97122610A TWI376993B TW I376993 B TWI376993 B TW I376993B TW 97122610 A TW97122610 A TW 97122610A TW 97122610 A TW97122610 A TW 97122610A TW I376993 B TWI376993 B TW I376993B
Authority
TW
Taiwan
Prior art keywords
printed circuit
cover film
hot plate
workpiece
target
Prior art date
Application number
TW97122610A
Other languages
English (en)
Chinese (zh)
Other versions
TW200904285A (en
Inventor
Fan Lin
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200904285A publication Critical patent/TW200904285A/zh
Application granted granted Critical
Publication of TWI376993B publication Critical patent/TWI376993B/zh

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Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW97122610A 2007-07-10 2008-06-18 Laminating apparatus and method for printed circuit board TW200904285A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007180502A JP5021384B2 (ja) 2007-07-10 2007-07-10 プリント配線板の貼付装置および貼付方法

Publications (2)

Publication Number Publication Date
TW200904285A TW200904285A (en) 2009-01-16
TWI376993B true TWI376993B (ja) 2012-11-11

Family

ID=40247903

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97122610A TW200904285A (en) 2007-07-10 2008-06-18 Laminating apparatus and method for printed circuit board

Country Status (3)

Country Link
JP (1) JP5021384B2 (ja)
CN (1) CN101346046B (ja)
TW (1) TW200904285A (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101951731B (zh) * 2010-10-18 2012-04-18 卓盈微电子（昆山）有限公司 一种用于胶水固化的加热平台
JP6313932B2 (ja) * 2013-05-29 2018-04-18 富士通株式会社 回路基板用の修復部材、回路基板の製造方法、及び回路基板用の修復部材の製造方法
DE102014207633A1 (de) * 2014-04-23 2015-10-29 Zf Friedrichshafen Ag Verfahren zum Schutz eines elektronischen Schaltungsträgers vor Umwelteinflüssen und Schaltungsmodul
CN106658985A (zh) * 2016-11-01 2017-05-10 深圳市大乾自动化技术有限公司 微调机构以及fpc覆盖膜贴合设备
CN107396542A (zh) * 2017-08-31 2017-11-24 东莞市五株电子科技有限公司 覆盖膜贴板、覆盖膜贴板装置及覆盖膜防偏控制方法
KR20210000610A (ko) * 2019-06-25 2021-01-05 주식회사 두산 복합 기판의 제조시스템 및 제조방법
CN112684630A (zh) * 2019-10-17 2021-04-20 北京小米移动软件有限公司 背光模组的组装方法、背光模组及终端设备
CN114340136B (zh) * 2020-09-29 2023-08-08 荣耀终端有限公司 一种电路板拼板、分板方法和分板装置
CN112611324B (zh) * 2020-12-02 2022-05-24 南京尚孚电子电路有限公司 一种用于柔性电路板的绝缘薄膜贴敷检测系统及其检测方法
CN113619177B (zh) * 2021-07-07 2023-06-30 浙江明恩新材料科技有限公司 一种耐高温改性材料制品的生产设备
CN114501821B (zh) * 2022-03-14 2023-09-01 江西众达泰科技有限公司 一种柔性电路板制作加工机械及制作加工工艺
CN114938564B (zh) * 2022-05-19 2023-05-05 深圳市邦正精密机械有限公司 一种全自动卷对卷补强片贴合机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62132394A (ja) * 1985-12-04 1987-06-15 日立化成工業株式会社 フレキシブル配線板の製造法
JPH0521956A (ja) * 1991-07-11 1993-01-29 Mitsubishi Electric Corp 多層プリント配線板の製造方法
JPH06254888A (ja) * 1993-03-08 1994-09-13 Hitachi Chem Co Ltd 積層板の製造方法及び製造装置
JPH08113764A (ja) * 1994-10-17 1996-05-07 Sumitomo Electric Ind Ltd 接着シート、カバーレイフィルム、プリント配線板及びプリント配線板の製造方法

Also Published As

Publication number Publication date
JP2009021271A (ja) 2009-01-29
CN101346046A (zh) 2009-01-14
TW200904285A (en) 2009-01-16
JP5021384B2 (ja) 2012-09-05
CN101346046B (zh) 2012-02-29

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MM4A Annulment or lapse of patent due to non-payment of fees