TWI374248B - - Google Patents

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Publication number
TWI374248B
TWI374248B TW094117746A TW94117746A TWI374248B TW I374248 B TWI374248 B TW I374248B TW 094117746 A TW094117746 A TW 094117746A TW 94117746 A TW94117746 A TW 94117746A TW I374248 B TWI374248 B TW I374248B
Authority
TW
Taiwan
Prior art keywords
mark
image
linear pattern
pattern
light
Prior art date
Application number
TW094117746A
Other languages
English (en)
Chinese (zh)
Other versions
TW200609483A (en
Inventor
Makoto Takagi
Yuwa Ishii
Tatsuo Fukui
Koichi Kudo
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004158874A external-priority patent/JP4389668B2/ja
Priority claimed from JP2004161611A external-priority patent/JP4599893B2/ja
Priority claimed from JP2004169520A external-priority patent/JP2005352543A/ja
Priority claimed from JP2004206887A external-priority patent/JP4484041B2/ja
Priority claimed from JP2004206888A external-priority patent/JP2006032521A/ja
Priority claimed from JP2004222331A external-priority patent/JP4691922B2/ja
Priority claimed from JP2004232369A external-priority patent/JP2006047922A/ja
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200609483A publication Critical patent/TW200609483A/zh
Application granted granted Critical
Publication of TWI374248B publication Critical patent/TWI374248B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW094117746A 2004-05-28 2005-05-30 Method of adjusting optical imaging system, imaging device, positional deviation detecting device, mark identifying device and edge position detecting device TW200609483A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2004158874A JP4389668B2 (ja) 2004-05-28 2004-05-28 位置検出方法および位置検出装置
JP2004161611A JP4599893B2 (ja) 2004-05-31 2004-05-31 位置ずれ検出方法
JP2004169520A JP2005352543A (ja) 2004-06-08 2004-06-08 テンプレートマッチング装置
JP2004206887A JP4484041B2 (ja) 2004-07-14 2004-07-14 エッジ位置検出装置
JP2004206888A JP2006032521A (ja) 2004-07-14 2004-07-14 マーク識別装置
JP2004222331A JP4691922B2 (ja) 2004-07-29 2004-07-29 結像光学系の調整方法
JP2004232369A JP2006047922A (ja) 2004-08-09 2004-08-09 結像装置

Publications (2)

Publication Number Publication Date
TW200609483A TW200609483A (en) 2006-03-16
TWI374248B true TWI374248B (ja) 2012-10-11

Family

ID=35450978

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117746A TW200609483A (en) 2004-05-28 2005-05-30 Method of adjusting optical imaging system, imaging device, positional deviation detecting device, mark identifying device and edge position detecting device

Country Status (2)

Country Link
TW (1) TW200609483A (ja)
WO (1) WO2005116577A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706216B (zh) * 2018-11-26 2020-10-01 荷蘭商Ａｓｍｌ荷蘭公司 判定橫跨圖案化器件或基板的標記佈局

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7351966B1 (en) * 2006-05-23 2008-04-01 International Business Machines Corporation High-resolution optical channel for non-destructive navigation and processing of integrated circuits
CN102566337B (zh) * 2010-12-28 2014-05-21 上海微电子装备有限公司 一种标记期望位置确定方法
JP5706861B2 (ja) * 2011-10-21 2015-04-22 キヤノン株式会社 検出器、検出方法、インプリント装置及び物品製造方法
TWI489573B (zh) * 2012-09-12 2015-06-21 Motech Ind Inc 檢測裝置
JP7412872B2 (ja) * 2017-10-31 2024-01-15 株式会社アドテックエンジニアリング 両面露光装置
JP7035933B2 (ja) * 2018-09-21 2022-03-15 東芝ライテック株式会社 検知装置
US10599055B1 (en) * 2018-11-15 2020-03-24 Applied Materials, Inc. Self aligning systems and methods for lithography systems
JP7406946B2 (ja) * 2019-09-20 2023-12-28 株式会社オーク製作所 露光装置およびその性能評価方法
EP3842866A1 (en) * 2019-12-24 2021-06-30 ASML Netherlands B.V. Metrology method
JP2021118045A (ja) * 2020-01-22 2021-08-10 東京エレクトロン株式会社 プラズマ観測システム及びプラズマ観測方法
US20230197483A1 (en) 2020-04-05 2023-06-22 Kla Corporation Systems and methods for correction of impact of wafer tilt on misregistration measurements
CN112904682B (zh) * 2021-01-22 2023-08-01 西华大学 一种测量倾角和旋转角的光刻对准标记及对准方法
CN114894712B (zh) * 2022-03-25 2023-08-25 业成科技（成都）有限公司 光学量测设备及其校正方法
TWI846579B (zh) * 2023-08-29 2024-06-21 三和技研股份有限公司 晶圓定位裝置與方法
CN116883515B (zh) * 2023-09-06 2024-01-16 菲特（天津）检测技术有限公司 光学环境调整方法及光学标定装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06267818A (ja) * 1993-03-11 1994-09-22 Nikon Corp 投影露光装置
JP2888233B2 (ja) * 1997-09-08 1999-05-10 株式会社ニコン 位置検出装置、露光装置及び方法
JP2002328288A (ja) * 2001-04-26 2002-11-15 Matsushita Electric Ind Co Ltd 組レンズ調整方法とその装置
JP2004134474A (ja) * 2002-10-09 2004-04-30 Nikon Corp 位置検出装置の検査方法、位置検出装置、露光装置、および露光方法
JP2004134473A (ja) * 2002-10-09 2004-04-30 Nikon Corp 位置検出用マーク、位置検出装置、位置検出方法、露光装置、および露光方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI706216B (zh) * 2018-11-26 2020-10-01 荷蘭商Ａｓｍｌ荷蘭公司 判定橫跨圖案化器件或基板的標記佈局
US12007701B2 (en) 2018-11-26 2024-06-11 Asml Netherlands B.V. Determining a mark layout across a patterning device or substrate

Also Published As

Publication number Publication date
TW200609483A (en) 2006-03-16
WO2005116577A1 (ja) 2005-12-08

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