1374121 六、發明說明： 【發明所層之技術領域】 本發明特別係關於用於低溫燒成陶究基板等脆性材料 基板之切斷之劃線裝置及劃線方法。 【先前技術】 低溫燒成陶竟（以下稱為LTCC)，係於混合氧化紹之骨 材與玻璃材料之薄板進行導體配線而成多層膜，以8〇代程 又^低/皿加以燒成之基板。LTCC基板係用於在工片母基板 y數之機能區域同時形成多數格子狀’將該等機能區域 》割為小基板。以往，於母基板之分割係使用切斷工具， 以機械式進行切斷以使其斷開。 於以往之對脆性材料基板劃線之劃線方法之一，有如 =文獻1所示從脆性材料基板之外側至外側劃線之割線 性姑2如圖1所示’使劃線輪2(有時亦稱為刀輪）於比脆 、板1之端部稍外侧之點τ降至 位於脆性材料基板1之上面之猫下士 炙敢下私 加既―告, 之上面之勒下方。且在對劃線輪2施 加既疋之劃線塵之狀態下使其往圖中之右方向 從脆性材料基板1 緣開 ., 緣開始劃線劃線至脆性材料基板1 下將其稱為外切劃線。於外切劃線時由於 ㈣’故㈣後之_(折…容易，又，在割 線開始位置之滑動問題雖會 一 之缺點4主W 货生但有劃線輪容易消耗 缺2。特別在對LTCC等陶瓷進行 線輪消耗更顯著。 順時，外切導致之劃 1374121 又’亦有一種從脆性材料基板之内側劃線至内側而外 側不劃線之劃線方法。其係如圖2所示，使劃線輪2下降 至脆性基& 1之緣之稍内側，之後在對劃線輪2施加向下 之既定劃線壓之狀態下’使向圖中右方水平移動，藉此從 脆性材料基板1之内側開始劃線，劃至另一端之内側。以1374121. Description of the Invention: [Technical Field of the Invention] The present invention relates to a scribing apparatus and a scribing method for cutting a brittle material substrate such as a low-temperature firing ceramic substrate. [Prior Art] Low-temperature firing of ceramics (hereinafter referred to as LTCC) is carried out by mixing and oxidizing the aggregates of the aggregates and glass materials to form a multilayer film, which is fired by 8 〇 and ^ low / dish. The substrate. The LTCC substrate is used to form a plurality of lattices in the functional region of the y number of the mother substrate, and the functional regions are cut into small substrates. Conventionally, in the division of the mother substrate, the cutting tool is mechanically cut and disconnected. In the past, one of the scribing methods for the slab of the brittle material substrate is as shown in the literature 1. The cutting line from the outer side of the brittle material substrate to the outer scribe line is as shown in FIG. When it is also called a cutter wheel, it is lowered to a point below the brittle material, and the point τ which is slightly outside the end of the plate 1 is lowered to the lower part of the brittle material substrate. And in the state where the scribing wheel 2 is applied with the scribing dust of the scribing wheel 2, it is opened from the edge of the brittle material substrate 1 in the right direction in the drawing, and the edge is drawn under the scribing line to the brittle material substrate 1. Externally cut lines. Because of the (4) after the slashing line, the slash is easy. Moreover, the sliding problem at the beginning of the secant will be a disadvantage. 4 The main W goods but the scribe wheel are easy to consume. The reel consumption of ceramics such as LTCC is more remarkable. In time, the outer cut causes the stroke 1374121 and there is also a scribing method from the inner side of the brittle material substrate to the inner side and the outer side without the scribing line. As shown in the figure, the scribing wheel 2 is lowered to the inner side of the brittle base & 1, and then moved to the right in the figure in the state where the downward scribing pressure is applied to the scribing wheel 2, This is scribed from the inner side of the brittle material substrate 1 and is drawn to the inner side of the other end.
下將其稱為内切劃線。於内切劃線時，劃線輪雖比外切劃 線之狀況不易消耗’但由於劃線未達基板之兩端，故有劃 線後之斷開（折斷）變難之傾向。特別是對ltcc等陶瓷劃線 時’以内切難以分割。x，基板與製品基板較小時(例如分 割縱橫200 mm以下（特別是1〇〇 mm以下）之基版時以分 割獲得縱橫10 mm以下（特別是5 mm以下）之製品時）以内 切分割顯著變難。另外，本說明書所稱之劃線，係指使劃 線輪於脆性材料基板上為壓接狀態並使其轉動，藉此刻出 剑線（切痕），並沿劃線使垂直裂痕（於板厚方向伸展之裂痕） 發生。 【專利文獻1】曰本專利第371〇495號公報 【發明内容】 以往之劃線裝i，劃線係僅以前述外切及内财之一 方進行，無法使該等組合以形成劃線。 本發明係解決此種前述之缺點，其目的在能將外切及 内切劃線等加以組合進行劃線。 為解決此課題，本發明之劃線裝置係為將形成於脆性 材料基板上之機能區域依各機能區域分割以製成製品基板 1374121This is called an undercut. When the inner scribing line is used, the scribing wheel is less likely to be consumed than the outer scribing line. However, since the scribing does not reach the both ends of the substrate, the disconnection (breaking) after the scribing tends to be difficult. In particular, when dicing ceramics such as ltcc, it is difficult to divide by incision. x When the substrate and the product substrate are small (for example, when the base plate having a width of 200 mm or less (especially 1 mm or less) is divided, the product is divided into 10 mm or less (especially 5 mm or less) by the division. Significantly difficult. In addition, the scribe line referred to in the present specification means that the scribing wheel is crimped on the brittle material substrate and rotated, thereby engraving the sword line (cutting) and causing the vertical crack along the scribe line (in the plate thickness) The crack in the direction of stretching occurs. [Patent Document 1] Japanese Patent Publication No. 371〇495. SUMMARY OF THE INVENTION In the conventional scribing apparatus i, the scribing is performed only by one of the above-mentioned outer and inner margins, and it is not possible to combine these to form a scribe line. SUMMARY OF THE INVENTION The present invention solves the aforementioned drawbacks, and its object is to enable scribe lines by combining circumscribed and inscribed scribe lines. In order to solve the problem, the scribing apparatus of the present invention divides the functional regions formed on the substrate of the brittle material into functional regions according to the respective functional regions to form a product substrate 1374121
而劃線之劃線裝置，具備··使前㈣線之種類為從前述脆 =材料基板之一邊之内侧至另一邊之内側之内切劃線、從 前述脆性材料基板之-邊之外側至另—邊之外側之外切劃 線，前述劃線裝置係具備設置前述脆性材料基板之平台、 被設為可對向於前述平台上之脆性材料基板升降且於其前 端保持劃線輪之劃線頭、在將前述劃線輪㈣於前述脆性 材料基板之表面之狀態下使前述劃線頭及脆性材料基板相 子移動之移動手段、先保持顯示包含劃之線與其種類之劃 T内2之配方資料表再基於前述配方資料表以前述移動手 段使前述劃線頭及脆性材料基板相對移動且使前述劃線頭 升降以進行對應於劃線種類之劃線之控制器。 為解決此課題，本發明之劃線裝置係為將形成於脆性 材料基板上之機肐區域依各機能區域分割以製成製品基板 而劃線之劃線裝置’具備：使前述劃線之種類為從前述脆 性材料基板之一邊之内側至另一邊之内侧之内切劃線、從 前述脆性材料基板之—邊之外側至另―邊之外側之外切劃 線、從前述脆性材料基板之—邊之内側至另―邊之外側之 内外切靠、從前㈣性材料基板之—邊之外側至另—邊 之内側之外内切劃線，前述劃線裝置係具備設置前述脆性 材料基板之平台、被設為可對向於前述平台上之脆性材料 基板升降且於其前端保持劃線輪m頭、 輪㈣於前述脆性材料基板之表面之狀態下使前述劃線頭 及脆性材料基板相對移動之移動手段、先保持顯示包含劃 之線…、種類之劃線内容之配方資料表再基於前述配方資 1374121 料表以刖述移動手段使前述劃線頭及脆性材料基板相對移 動且使則述劃線頭升降以進行對應於劃線種類之劃線之控 制器。 在此前述劃線輪可為高滲透型之劃線輪。由於高滲透 里之sj線輪令易咬入基板，故即使内切，亦具有在劃線開 始位置之滑動之問題不易發生之優點。The scribing line device has a type in which the front (four) line is an inner scribe line from the inner side of one side of the brittle=material substrate to the inner side of the other side, from the outer side of the brittle material substrate Further, the scribing device is provided with a scribing device, and the scribing device includes a platform on which the brittle material substrate is provided, and is configured to be capable of lifting and lowering the brittle material substrate on the platform and maintaining the scribing wheel at the tip end thereof. a moving means for moving the scribing head and the brittle material substrate in a state in which the scribing wheel (4) is on the surface of the brittle material substrate, and holding the display line including the line of the stroke and the type thereof The recipe data sheet is further configured to move the scribing head and the brittle material substrate relative to each other by the moving means to move the scribing head up and down to perform a scribing corresponding to the scribing type. In order to solve the problem, the scribing device of the present invention is a scribing device that divides a lobe region formed on a brittle material substrate into respective functional regions to form a product substrate, and includes: The scribe line is cut out from the inner side of one side of the brittle material substrate to the inner side of the other side, and is scribed from the outer side of the brittle material substrate to the outer side of the other side, from the brittle material substrate. The inner side of the side is cut to the inner side and the outer side of the other side, and the inner scribe line is cut out from the outer side of the front side (four) material substrate to the inner side of the other side, and the scribing device is provided with a platform on which the brittle material substrate is disposed. The scribe head and the brittle material substrate are relatively moved in a state in which the brittle material substrate on the platform is lifted and lowered, and the scribing wheel m head and the wheel (4) are held on the surface of the brittle material substrate at the front end thereof. The moving means, the display of the formula data table including the line of the drawing, the type of the line, and the above-mentioned scribing head based on the above-mentioned formula 1374121 And a controller in which the substrate of the brittle material is relatively moved and the scribing head is raised and lowered to perform scribing corresponding to the type of scribing. Here, the aforementioned scribing wheel may be a high permeability type scribing wheel. Since the sj linear wheel in the high permeability makes it easy to bite into the substrate, even if it is inscribed, there is an advantage that the problem of sliding at the starting position of the scribing is less likely to occur.
為解決此課題，本發明之劃線方法，係為將形成於脆 性材料基板上之機能區域依各機能區域分割以製成製品基 板而使用可升降之劃線頭劃線之劃線方法，在使前述劃線 之種類為從前述脆性材料基板之—邊之内側至另—邊之内 側之内切劃線、從前述脆性材料基板之—邊之外側至另一 邊之外側之外切t彳線時’先保持顯示包含劃之線與其種類 之劃線内容之配方資料表’再基於前述配方資料表使前述 劃線頭及脆性材料基板相對移動且使基於前述配方資料表 前述劃線頭升降以對應於劃線之種類劃線。 為解決此課題’本發明之劃線方法係為將形成於脆性 材料基板上之機能區域依各機能區域分割以製成製品基板 而使用可料之靠㈣線之劃線方法，在使前述劃線之 種類為從前述脆性材料基板之—邊之内側至另—邊之内側 之内切劃線、從前述脆性材料基板之—邊之外側至另一邊 之外側之外切劃線、從前述脆性材料基板之—邊之内側至 另-邊之外侧之内外切劃線、從前述脆性材料基板之一邊 之外側至另-邊之内側之外内切劃線時，S保持顯示包含 劃之線與其種類之劃線内容之配方資料表再基於前述配 劃線頭及脆性材料基板相對移動且使基於 線。貝科表前述劃線頭升降以對應於劃線之種類劃 在此别述脆性材料基板可以格子狀形成有機能區域， 子狀進行前述内切劃線以於前 能F Θ八利 ^ k脆注材科基板之各機 W割’沿對向之平行2邊之邊緣部外切劃線。 :此前述脆性材料基板可形成有複數之機能區域，在 从：：線以將别述脆性材料基板依各機能區域分割時 ^述脆性材料基板之對向之2邊之最外側之劃線為外= W線，使其餘劃線為内切劃線。 ，此前述脆性材料基板可形成有複數之機能區域 ::劃線以將前述脆性材料基板依各機能區域分割時，使 ^述脆性材料基板之對向之2邊之最外側之中之一方= 為外切劃線，使其餘劃線為内切劃線，並沿前述2邊 之中之另:邊於前述内切劃線之外側進行外切劃線。 ^此刖述外切劃線之劃線可形成為與前述 劃線中與該外切劃線正交之方向之劃線交又。之 在此前述劃線輪可為高滲透型之劃線輪。In order to solve the problem, the scribing method of the present invention is to divide a functional region formed on a substrate of a brittle material into individual product regions to form a product substrate, and to use a scribing method capable of lifting and lowering a scribing line. The type of the scribe line is cut from the inner side of the edge of the brittle material substrate to the inner side of the other side, and the tangent line is cut from the outer side of the brittle material substrate to the outer side of the other side. When the 'formulation data table containing the lined content of the line and its kind is displayed first', the aforementioned scribing head and the brittle material substrate are relatively moved based on the aforementioned formula data table, and the scribing head is lifted and lowered based on the aforementioned formula data table. Corresponding to the type of the scribe line. In order to solve the problem, the scribing method of the present invention is to divide the functional region formed on the brittle material substrate into functional regions to form a product substrate, and to use the scribe line method of the (four) line. The type of the line is an undercut from the inner side of the edge of the brittle material substrate to the inner side of the other side, and is scribed from the outer side of the brittle material substrate to the outer side of the other side, from the aforementioned brittleness. When the inner side of the material substrate is scribed by the inner side and the outer side of the other side, and the inner scribe line is from the outer side of one side of the brittle material substrate to the inner side of the other side, the S keeps displaying the line including the line The formula data sheet of the type of scribing content is further based on the relative movement of the aforementioned scribing head and the brittle material substrate and is based on the line. The above-mentioned scribing head lifting and lowering of the Becco table is in accordance with the type of the scribing. The brittle material substrate can be formed into a lattice-like organic energy region, and the sub-line is subjected to the aforementioned inscribed scribe line to enable F Θ 利 ^ Each machine of the substrate of the injecting material is cut and scribed at the edge of the parallel two sides of the opposite side. The brittle material substrate can be formed with a plurality of functional regions. When the brittle material substrate is divided into different functional regions from the :: line, the outermost side of the two sides of the brittle material substrate is defined as Outside = W line, leaving the remaining lines as inscribed lines. The brittle material substrate may be formed with a plurality of functional regions: when scribing to divide the brittle material substrate according to each functional region, one of the outermost sides of the two sides of the brittle material substrate is defined. For the outer scribe line, the remaining scribe line is an inner scribe line, and the outer scribe line is scribed along the outer side of the aforementioned inner scribe line along the other of the two sides. The scribe line of the circumscribed line can be formed to intersect with the scribe line in the direction orthogonal to the scribe line in the aforementioned scribe line. Here, the aforementioned scribing wheel may be a high permeability type scribing wheel.
利用具有此種特徵之太旅nB 、2拔* 浅之本發明’可於所欲之各劃線任音 線、外切劃線、或加上内外切劃線、外内切； 1之ΓΓ:提高。因此可選擇適合劃線後之分割:： 向對向之2邊平行外切之且進行平行於從其外周部 之線施力可容易將周邊部分：劃:：’藉由對被外切劃線 1刀離。且在除去周邊部後可沿被 1374121 内切劃線之劃線將各機能區域容易分割為製品基板。又， 藉由使外切劃線之線為必要最低限度，故可將劃線輪之劣 化減至最低。 【實施方式】 圖3為顯示本實施形態之劃線裝置之一例之概略立體 圖。此劃線裝置1 00係移動台i 〇 i被保持為可沿一對導軌 102a、102b於y軸方向移動。滾珠螺桿1〇3與移動台ι〇ι 螺合。滚珠螺桿103由馬達104之驅動而旋轉，使移動台 101沿導軌102a、102b於y軸方向移動。於移動台1〇1上 面設有馬達105。馬達1〇5係使平台1〇6在xy平面旋轉以 定位於既定角度。此處，設脆性材料基板丨〇7係低溫燒成 陶瓷基板。此脆性材料基板1 〇7被載置於平台丨〇6上，受 未圖示之真空吸引手段等保持。於劃線裝置上部設有拍攝 脆性材料基板107之對準標記之2台之CCD攝影機l〇8a、 108b。此外，於平台1〇6上之周邊部2處設有用以定位脆 性材料基板107之定位銷i〇9a、l〇9b。 於劃線裝置1 0 0沿x軸方向以支柱1丨丨a、1丨丨b架設有 橋110跨越移動台101與其上部之平台1〇6。橋11〇係藉由 線性馬達113將劃線頭112保持為可移動。線性馬達113 石X軸方向直線驅動劃線頭112。於劃線頭丨丨2之前端部透 過保持具1 1 4安裝有劃線輪11 5。劃線頭丨丨2係以適當之荷 重將劃線輪11 5壓接於脆性材料基板丨〇7之表面上並使其 轉動，以形成劃線。劃線輪115使用日本發明專利第3 〇 7 41 5 3 丄 號所示之高滲透型之割绩鉍 此心… 較理想’於實施形態中亦使用 、 精由於—般所使用之通常之劃線輪之 輪。一 Γ既疋即距形成既定深度之槽形成高滲透之劃線 邱又所使用之通常之劃線輪，係例如沿盤狀輪之圓周The invention of the present invention is characterized in that the present invention is capable of using any of the lines of the desired line, the outer cut line, or the inner and outer cut lines, and the outer cut; :improve. Therefore, it is possible to select a segment suitable for scribing:: Applying parallel to the two sides of the opposite side and applying a force parallel to the line from the outer peripheral portion thereof can easily make the peripheral portion: stroke:: 'by being cut outwards Line 1 knife away. Further, after the peripheral portion is removed, each functional region can be easily divided into product substrates along a scribe line which is internally scribed by 1374121. Further, by making the line of the scribe line to the minimum necessary, the deterioration of the scribing wheel can be minimized. [Embodiment] Fig. 3 is a schematic perspective view showing an example of a scribing device of the embodiment. The scribing device 100 is held by the mobile station i 〇 i so as to be movable in the y-axis direction along the pair of guide rails 102a, 102b. The ball screw 1〇3 is screwed to the moving table ι〇ι. The ball screw 103 is rotated by the motor 104 to move the moving table 101 in the y-axis direction along the guide rails 102a and 102b. A motor 105 is provided above the mobile station 101. The motor 1〇5 rotates the platform 1〇6 in the xy plane to be positioned at a predetermined angle. Here, the brittle material substrate 丨〇7 is a low-temperature fired ceramic substrate. The brittle material substrate 1 〇 7 is placed on the stage 丨〇 6 and held by a vacuum suction means or the like (not shown). Two CCD cameras 10a and 108b for photographing the alignment marks of the brittle material substrate 107 are provided on the upper portion of the scribing apparatus. Further, positioning pins i〇9a and l9b for positioning the brittle material substrate 107 are provided at the peripheral portion 2 on the stage 1〇6. A bridge 110 spanning the movable table 101 and the upper platform 1〇6 is bridged by the scribing device 100 in the x-axis direction with the strut 1丨丨a, 1丨丨b. The bridge 11 is held by the linear motor 113 to keep the scribing head 112 movable. The linear motor 113 linearly drives the scribing head 112 in the X-axis direction. A scribing wheel 11 5 is attached to the end portion of the scribing head 透 2 through the holder 1 1 4 . The scribing head 丨丨 2 presses the scribing wheel 11 5 against the surface of the brittle material substrate 7 with a suitable load and rotates it to form a scribe line. The scribing wheel 115 uses the high-permeability cutting performance shown in Japanese Patent No. 3 〇7 41 5 3 铋. This is ideal... It is also used in the embodiment, and the usual stroke is used. The wheel of the reel. A scribe line that forms a high permeability from a groove that forms a predetermined depth. The usual scribe wheel used by Qiu is, for example, along the circumference of a disk wheel.
口 Is形成V字母丨之77。V A U 子31刀之收束角通常為鈍角，例如 °使/、為90〜160度’較理想為95〜15〇度’更理想為1⑼〜⑽ 度例如’ V予型之刃係將盤狀輪沿其圓周部研削形成外圓 周部而形成。例如，藉由研削形成之V字型之刀呈因研削 條痕造成之微小㈣狀^高渗透型之劃線輪，可藉由規律 形成大於通常劃線輪之刃前端之㈣狀之谷之凹部（槽）來 加以製造。槽之深度例如可使“ 2〜1〇〇”，較理想為 3 50 " m，更理想為5〜2〇 v爪。槽之寬度例如可使其為 1〇 100 " m，|父理想為15〜1〇〇" m，更理想為2〇〜5〇"爪。 形成槽之節距在例如直徑為卜⑺mm(特別是丨5〜7瓜岣之 劃線輪時，可使其為20〜250 ym，較理想為3〇〜18〇"m， 更理想為40〜80从m。此處，節距為劃線輪之圓周方向之槽 1個之長度、與因槽之形成而殘存之突起丨個之長度。通常， 在高滲透型之劃線輪中，劃線輪之圓周方向之槽1個之長 度大於突起1個之長度。劃線輪之材質雖可使用燒結金剛 石（PCD)、超硬合金等，但考量劃線輪壽命因素，以燒結金 剛石（PCD)較理想。 此處’移動台101、導軌l〇2a、l〇2b或平台106及驅 動該等之馬達104、1〇5及使劃線頭112移動之線性馬達 113，構成使劃線頭與脆性材料基板在該基板之面内相對移 1374121 動之移動手段。 制写二方塊圖說明本實施形態之劃線裝^100之控 構成：圖4為劃線裝置⑽之控制器12〇之方塊圖。 卜圖中D台之CCD攝影機i()8a、⑽匕之輸出係透過控 ，益、12G之影像處理部121傳至控制部122。輸入部123係 如後述輸人關於脆性材料基1()7之劃線之配 控制部122遠桩v霞、土 ' 連接γ馬達驅動部125、旋轉用馬達驅動部126 及劃線頭驅動部〗9 7 v . ^ 助丨127。Y馬達驅動部125係驅動馬達1〇4， 方疋轉用馬達驅動都〗9 sr_ & β Α 一 咬呢助。丨5 126係驅動馬達105。控制部122根據配 方貝料控制平纟106之y軸方向之位置，旋轉控制平台 1〇6。又，控制部122透過劃線頭驅動部127於X軸方向驅 動剎線頭，並於劃線輪115之轉動時驅動為劃線輪I。以 適虽之何重壓接脆性材料基板之表面上。此外，於控制部 122連接監視器128及配方資料保持部129。配方資料保持 部129係保持後述之劃線用之配方資料。配方資料係在監 視器128確認輸入並由輸入部123輸入。 以下’說明此實施形態之劃線裝置之劃線方法。此實 施形態係於各劃線設定圖丨所示之外切劃線與圖2所示之 内切劃線以進行劃線。由於外切劃線之狀況於劃線開始時 使劃線輪衝擊脆性材料基板之端部，故有劃線輪容易劣化 之缺點。但因外切劃線係從基板之端部至端部形成劃線及 從劃線形成往基板之厚度方向伸展之垂直裂痕，故涵蓋脆 性材料基板之全寬度形成劃線及垂直裂痕，分割較容易。 其次由於圖2所示之内切劃線之狀況係使劃線輪下降 至，性材料基板107之端部之内側，故劃線造成之垂直裂 痕常較淺。在此，本實施形態中係使用高滲透型之刀前端 做為劃線輪115。因此即使為内切劃線亦可使垂直裂痕滲透 至邊緣部。本實施形態可於各劃線適當切換外切劃線與内 切劃線以劃線。 以下基於圖面說明劃線之例。圖5係顯示脆性材料基 =。107與於其面形成為格子狀之2〇塊機能區域。又於各機 旎區域之中間如圖所示事先形成有對準標記。令其中外周 之對準標記為a~r。 ,以下參照流程圖說明本實施形態之劃線裝置之動作。 =先如圖6所示於劃線前先設定外伸量，作成配方資料表。 線之種類如前述有内切及外切劃線，事Μ定外切與内 切之外伸量。⑨S11係如圖！所示，設定外切之開始時之 外伸量QH1及終端之外伸量〇Η2。在此所謂外伸量係指從 基板之端部至劃線頭之降下位置或上升位置之距離。於外 切時使外伸量為正值。例如將開始外伸量、終端外伸量分 別設定為+5 mm時，從離基板之端部5 mm外側之處使劃線 輪降下，在基板端部之5 mm之外側使劃線輪上升，可使其 為外切。於S 12係如圖2所示，設定内切之開始外伸量〇H3 及、.·、端外伸量〇Η4。於内切時使外伸量為負值。例如將開 始外伸量、終端外伸量分別設定為-2 mm時，從離基板之端 2 mm内側之處開始劃線，在基板端部之2爪爪之内側劃 線結束’可使其為内切劃線。 其後推進至Sl3作成配方資料表。配方資料表係例如 $ 7所示設定劃、線與麟方法及節距。此配方資料表中設 。有圖5所示之脆性材料基板1〇7之對準標記a_f間及與其 +行之對準標記r_g間、q_h間、間、叫間之内切劃線。 又’設定有沿劃線0S1之外切劃線、對準標記a-〇、b_n㈠ 間之内切劃線、沿劃線OS2之外切劃線。 /又里m方法係設定為0、丄、2之一。此處劃線方法〇 係才曰内切’對準標記a_f間之㈣及與其平行之對準標記η 間、q_h間、p-i fa1、Η間之劃線等係、設為劃線方法〇。劃 線方法1為外切，係表示不使用對準標記之狀況。劃線方 法2為外切，係基於對準標記獨自對準之狀況。如後述， 對於外切亦事S設有對準標記之脆性材料基板可在外切時 此外’節距係以mm為單位表示離劃線之基準線之平行 移動量。所謂基準線係指連結一對之對準標記之線或基板 之端邊。通常在内切劃線中，連結一對之對準標記之線直 接成為劃線時之基準線，故節距為0即可。因此對準標記 “、r-g…a_〇、b_n…㈣之内切劃線中，係使節：為 〇。又’關於劃線方法i之外切係以例如職表示離基準線 即基板之端邊之偏移量。於圖7之配方資料表對外切用之 劃線0S1設為劃線方法！，使節距為離基準線之偏移量即$ mm。又，對外切之劃線〇S2亦設節距為5mm。 在此使内切之外伸量之絕對值小於“之節以㈣ 值，藉此，可使與外切劃線正交之内切劃線與外切劃線交 叉。例如於前述之狀況内切劃線之外伸量之絕對值為2,外 (S3 12 切劃線之節距之絕對值為5,故可如圖5所示使a"間、卜旦 間...之劃線與劃線〇s丨、劃線〇S2交又。 次以下以圖8之流程圖說明在如上述作成劃線實行用配 =貪料表後劃線之動作。首先將脆性材料基&…配合平 台106上之定位銷1〇9a、1〇9b置於平台1〇6上。且在劃線 開始後於S2I從事先已保持之配方f料表讀出】劃線之資 料。例如圖7所示之配方資料表時，讀出通過對準標記a_f 之線 之後於S22於基準線+節距之位置設定此劃線。此時 由於連結肖準標記之線為基準線，節距為〇,故連結對準標 圮之線直接成為劃線。因此以控制部1 22使平台1 〇6於y 軸方向移動，根據需要使平纟咖旋轉。之後定位以使在 以線性馬達11 3使此劃線頭i i 2於χ軸移動時能形成劃線。 此設定結束後，於S23讀出劃線方法，選擇内切或外 切。内切時前進至步驟S24進行内切。此時係從已設定之 内切劃線之開始外伸量0H3之位置開始劃線。藉此可如前 述圖2所示從脆性材料基板之内側開始劃線。之後進行劃 線至以終端外伸量〇H4設定之終端位置，使劃線頭上升以 結束劃線。之後前進至步驟S26檢查是否完成配方資料表 中之所有劃線，若劃線未完成便返回步驟S21重複同樣之 處理。藉此可基於事先設定之配方資料表依序進行劃線。 在基於配方資料表完成a_f、r_g、 〇_』之内切劃線後， 前進至外切之劃線0S1。此時驅動馬達1〇5將平台丨〇6旋轉 90度。此時係設平行於基板之邊5 mm内側之線為外切之 劃線OS1。|由於劃線方法A i，&離脆性材料基板之外側 IS) 13 1374121 外切之開始外伸量0H丨之量開始劃線動作（劃線頭之降 下）’進行外切劃線動作至跪性材料基板之外側終端外伸量 〇H2之量’使劃線頭上升。之後同樣進行劃線a-o、b-n、...f-j 間之内切劃線動作。此外，對劃線〇S2與〇s 1同樣進行外 切劃線。藉此可對圖5所示之脆性材料基板丨〇7沿所欲之 線劃線。 以下說明如上述形成圖5所示之劃線後之分割。首先 如圖9 A所示，沿2條之外切劃線〇s丨、〇S2除去基板之邊 緣4 °如此劃線a_f、r_g、 〇_j成為被劃線至基板之端部， 故如圖9B所示可容易沿此線將脆性材料基板分割為細長之 形狀。且如此分割後再沿劃線a-o、b-n、...f-j分割，可使 其為正方形狀之製品脆性材料基板（製品LTCC基板）。 另外’此實施形態中，雖於外切劃線以平行於基板之 邊緣偏離節距之量之線為劃線，但在如劃線〇S2有前一内 切劃線f-j時，可設定從此線之間隔決定外切劃線之位置。 又’對外切亦可事先於脆性材料基板設置對準標記，基於 此對準標記實行外切。 又’此實施形態中係使外切之劃線〇S丨、〇S2與與其垂 直之内切劃線交叉。因此，在沿外切之劃線分割外側之邊 緣後可谷易沿與其垂直之劃線分割基板。由於外切及内 切可於各劃線設定，故可考慮使劃線後容易分割、延長劃 線輪之壽命等而適當選擇。例如可使一方向之劃線全為外 切劃線。但若將外切劃線抑制於最小限度可使刃前端之損 傷減少。 1374121 例如圖10A所示，對具有9個機能區域之脆性材料基 板107a可使分割各機能區域之劃線中平行於脆性材料基板 1 07a之左右之對向2邊之2條外側之劃線為外 切劃線。圖10A巾，可根據格子狀之内切畫^線與平行於2 邊之2條外切劃線OS3、〇S4分割脆性材料基板i〇7a，亦 可省略2條内切劃線。 又，如於圖10B顯不其他脆性材料基板丨〇7b，可使分 割機能區域之劃線中平行於對向《2邊之劃線之―，此時 為僅右側為外切劃，線OS3,沿3 — #之邊於内切劃線之外側 設置其他外切劃線OS5。 另外，此實施形態中係以移動手段使平台於y軸方向 移動且使平台轉動，使劃線頭於χ轴方向移動。取而代之， 移動手段可使平台於X軸及y軸方向移動，且使劃線頭於χ 軸及y軸方向移動。 另外，此實施形態中係使脆性材料基板為低溫燒成陶 瓷基板，但即使為用於液晶面板等之玻璃基板、其他之基 板亦可適用本發明。 又，本實施形態中雖可於各1條之劃線選擇内切割線 與外切劃、線，但並不限於此。亦可使用纟1條之劃線之開 始部分為内切而終端部分為外切之内外切劃線。同樣亦可 使用使1條之劃線之開始部分為外切而終端部分為内切之 外内切畫m。此時可選擇内切、外切、内外切、外 線4種劃線方法。 卜内刀畫] 此外，本實施形態中雖於各内切劃線使用對準標記對 [S3 15 1374121 準，但亦可設定冑丨個對準標記之節距或離前一劃線之節 距以決定劃線之位置。 此外，本實施形態雖係於各内切劃線與外切劃線設定 開始外伸置、結束外伸量並基於該資料決定外伸量，但亦 可於各劃線設定外伸量並基於此決定外伸量。 . 本心明可廣泛利用於對低溫燒成陶瓷基板之陶瓷基板 或玻璃基板專脆性材料基板形成劃線之流程。 修 【圖式簡單說明】 圖1為顯示脆性材料基板之外切劃線之圖。 圖2為顯示脆性材料基板之内切劃線之圖。 圖3為顯示本實施形態之劃線裝置之立體圖。 圖4為顯示本實施形態之控制器之方塊圖。 圖5為顯示本實施形態之劃線前之脆性材料基板之圖。 圖6為顯示劃線前之外伸量及配方資料表之作成之流 程圖。 圖7為顯示配方資料表之一例之圖。 ' 圖8為顯示本實施形態之劃線裝置之劃線動作之流程 . 圖。 圖9A為顯示劃線後之脆性材料基板之分割方法之圖。 圖9B為顯示劃線後之脆性材料基板之分割方法之圖。 圖10 A為顯示本實施形態之劃線前之脆性材料基板之 其他例之圖。 圖1 〇B為顯示本實施形態之劃線前之脆性材料基板之 16 [S3 1374121 其他例之圖 【主要元件符號說明 100 劃線裝置 101 移動台 102a 、102b 導執 103 滾珠螺桿 104、 105 馬達 106 平台 107、 107a 、 107b 脆性材料基板 108a ' 108b CCD攝影機 109a 、109b 定位銷 110 橋 1 11a '111b 支柱 112 劃線頭 113 線性馬達 114 保持具 115 劃線輪 120 控制器 121 影像處理部 122 控制部 123 輸入部 124 Y馬達驅動部 126 旋轉用馬達驅動部 17 1374121 127 劃線頭驅動部 128 監視器 129 配方資料保持部The mouth Is forms a V letter of 77. The angle of convergence of the VAU sub 31 knife is usually an obtuse angle, for example, ° makes /, 90 to 160 degrees 'preferably 95 to 15 degrees', more preferably 1 (9) to (10) degrees, for example, 'V pre-type blade will be disc-shaped The wheel is formed by grinding along its circumferential portion to form an outer circumferential portion. For example, a V-shaped knife formed by grinding is a small (four)-shaped high-permeability scribing wheel caused by grinding streaks, and can be formed by a rule that is larger than the (four) shape of the front end of the blade of the usual scribing wheel. A recess (groove) is manufactured. The depth of the groove can be, for example, "2 to 1", more preferably 3 50 " m, more preferably 5 to 2 〇 v-claw. The width of the groove can be, for example, 1〇 100 " m,|parent ideal is 15~1〇〇" m, more ideally 2〇~5〇"claw. The pitch of the groove is, for example, a diameter of (7) mm (especially a scribe wheel of 5 to 7 cucurbits, which may be 20 to 250 ym, more preferably 3 〇 to 18 〇" m, more preferably 40 to 80 from m. Here, the pitch is the length of one groove in the circumferential direction of the scribing wheel, and the length of the protrusion remaining due to the formation of the groove. Usually, in the high-permeability type scribing wheel The length of the groove in the circumferential direction of the scribing wheel is greater than the length of one of the protrusions. Although the material of the scribing wheel can use sintered diamond (PCD), super hard alloy, etc., considering the life factor of the scribing wheel, the sintered diamond is used. (PCD) is preferred. Here, the mobile station 101, the guide rails l〇2a, lb2b or the platform 106, and the motors 104, 1〇5 for driving the motors and the linear motor 113 for moving the scribing heads 112 constitute a plan The wire head and the brittle material substrate are moved relative to each other by 1374121 in the plane of the substrate. The writing block diagram illustrates the control structure of the scribing device 100 of the present embodiment: FIG. 4 is the controller 12 of the scribing device (10). The block diagram of 〇 。 CCD CCD CCD CCD i i i i i i i i i 12 12 12 12 12 12 12 12 12 12 12 12 12 The image processing unit 121 transmits the control unit 122 to the control unit 122. The input unit 123 is a control unit 122 for the scribe line of the brittle material base 1 (7), which is described later, and is connected to the γ motor drive unit 125 and the rotation. Motor drive unit 126 and scribing head drive unit 〖9 7 v . ^ 丨 127. Y motor drive unit 125 drives motor 1〇4, square turn motor drive is 9 sr_ & β Α丨5 126 is a drive motor 105. The control unit 122 rotates the control platform 1〇6 according to the position of the recipe to control the y-axis direction of the raft 106. Further, the control unit 122 passes the scribe head drive unit 127 in the X-axis direction. The brake head is driven and driven as the scribing wheel I when the scribing wheel 115 rotates. The pressure is applied to the surface of the brittle material substrate. Further, the control unit 122 is connected to the monitor 128 and the recipe data is maintained. The recipe data holding unit 129 holds the recipe data for the scribing which will be described later. The recipe data is input to the monitor 128 and input by the input unit 123. Hereinafter, the scribing method of the scribing apparatus of this embodiment will be described. This embodiment is cut out as shown in each of the scribing settings. The line is scribed by the inner scribe line shown in Fig. 2. Since the scribe line causes the scribe wheel to strike the end portion of the brittle material substrate at the start of the scribe line, there is a disadvantage that the scribe wheel is easily deteriorated. However, since the scribe line forms a scribe line from the end portion to the end portion of the substrate and a vertical crack extending from the scribe line to the thickness direction of the substrate, the full width of the substrate of the brittle material is formed to form a scribe line and a vertical crack, and the division is relatively high. Secondly, since the condition of the inscribed scribe line shown in Fig. 2 causes the scribing wheel to descend to the inner side of the end portion of the material substrate 107, the vertical crack caused by the scribe line is often shallow. Here, in the present embodiment, the front end of the high-permeability type knife is used as the scribing wheel 115. Therefore, even if it is an undercut, the vertical crack can be infiltrated into the edge portion. In the present embodiment, the outer scribe line and the inner scribe line can be appropriately switched between the scribe lines to scribe lines. The following is an example of a scribe line based on the drawing. Figure 5 shows the brittle material base =. 107 is a functional region of 2 blocks formed in a lattice shape on the surface thereof. Further, an alignment mark is formed in advance in the middle of each of the casing regions as shown in the figure. Let the alignment of the outer circumference be marked as a~r. The operation of the scribing apparatus of this embodiment will be described below with reference to a flowchart. = First set the overhang amount before the scribing as shown in Fig. 6, and make a formula data sheet. The types of the lines are inscribed as an inscribed and externally cut line as described above, and the amount of external and internal cutting is determined. 9S11 series as shown! As shown, the amount of overhang QH1 at the start of the circumcision and the amount of extension 〇Η2 of the terminal are set. The term "extension" as used herein refers to the distance from the end of the substrate to the lowered or raised position of the scribing head. When the outer cut is made, the amount of overhang is positive. For example, when the amount of overhang and the amount of extension of the terminal are set to +5 mm, respectively, the scribing wheel is lowered from the outer side of the end of the substrate by 5 mm, and the scribing wheel is raised at the outer side of 5 mm from the end of the substrate. Can be made to be external. As shown in Fig. 2, the S 12 system is set to have an inward extension amount 〇H3 and . . . and an end extension amount 〇Η4. The amount of overhang is negative when inscribed. For example, when the amount of protrusion and the amount of extension of the terminal are set to -2 mm, respectively, the scribe line is drawn from the inner side of 2 mm from the end of the substrate, and the inner side of the 2 claws at the end of the substrate is finished. For the inner cut line. Then proceed to Sl3 to make a recipe data sheet. The recipe data sheet is set, for example, as shown in $7, the line and the lining method, and the pitch. This recipe data sheet is set. There are scribe lines between the alignment marks a_f of the brittle material substrate 1〇7 and the alignment marks r_g and q_h, and between and between them. Further, a scribe line is formed along the scribe line 0S1, an scribe line between the alignment marks a-〇 and b_n(1), and a scribe line outside the scribe line OS2. / The m method is set to one of 0, 丄, 2. Here, the scribing method 曰 曰 曰 曰 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准 对准The scribing method 1 is an outer cut, indicating that the alignment mark is not used. The scribing method 2 is an outer cut based on the condition in which the alignment marks are individually aligned. As will be described later, when the brittle material substrate provided with the alignment mark is circumscribed, the pitch is expressed by the parallel movement amount from the reference line of the scribe line in mm. The reference line refers to the line connecting the pair of alignment marks or the edge of the substrate. Usually, in the inner scribe line, the line connecting the pair of alignment marks is directly the reference line at the time of scribe, so the pitch is 0. Therefore, in the alignment mark ", rg...a_〇, b_n...(4), in the scribe line, the line is: 〇. In addition, the line of the scribe line i is indicated by, for example, the reference line, that is, the end of the substrate. The offset of the edge. The score line 0S1 for the external cut in the formula data sheet of Fig. 7 is set as the scribing method!, so that the pitch is offset from the reference line, that is, $ mm. Also, the outer cut line 〇S2 The pitch is also set to 5 mm. Here, the absolute value of the inward extension is less than the "fourth" value, whereby the inner and outer scribe lines orthogonal to the outer scribe line can be crossed. . For example, in the above-mentioned situation, the absolute value of the outward extension of the scribe line is 2, and the outer (the absolute value of the pitch of the S3 12 scribe line is 5, so that a" The line of the line is intersected with the line 〇s丨 and the line 〇S2. Next, the operation of the scribe line after the scribe line is performed as described above with reference to the flowchart of Fig. 8. First, The brittle material base &...the positioning pins 1〇9a,1〇9b on the platform 106 are placed on the platform 1〇6, and after the start of the scribing, the S2I is read from the previously prepared formula f. For example, in the recipe data table shown in Fig. 7, after the line passing through the alignment mark a_f is read, the line is set at the position of the reference line + pitch at S22. At this time, the line connecting the mark is used as a reference. Since the line has a pitch of 〇, the line connecting the aligning marks directly becomes a scribe line. Therefore, the control unit 1 22 moves the stage 1 〇 6 in the y-axis direction, and rotates the squarish coffee as needed. When the linear head motor 11 3 moves the scribing head ii 2 on the x-axis, a scribing line can be formed. After the setting is completed, the scribing method is read in S23, and the inscribed end is selected. When the inner cutting is performed, the process proceeds to step S24 to perform the inner cutting. At this time, the scribing is started from the position where the outward inward scribe line has been set to the outward extension amount 0H3. Thereby, the brittle material substrate can be obtained as shown in FIG. 2 described above. The inner side starts to be scribed. Then, the scribe line is drawn to the end position set by the terminal extension amount 〇H4, and the scribe head is raised to end the scribe line. Then, the process proceeds to step S26 to check whether all the scribe lines in the recipe data table are completed. If the scribing is not completed, the process returns to step S21 to repeat the same process, whereby the scribing can be performed in sequence based on the formula data table set in advance. After the scribing within a_f, r_g, and 〇_" based on the recipe data table, Advance to the outer scribe line 0S1. At this time, the drive motor 1〇5 rotates the table 丨〇6 by 90 degrees. At this time, the line which is parallel to the inner side of the substrate by 5 mm is the scribed line OS1. Line method A i, & from the outer side of the brittle material substrate IS) 13 1374121 The starting amount of the external excision 0H丨 The amount of the start of the scribing action (the lowering of the scribing head) 'External scribing action to the inert material The amount of the external extension of the terminal outside the substrate 〇H2' Head to rise. Thereafter, the inner scribe line operation between the scribe lines a-o, b-n, ... f-j is also performed. Further, the scribe line S2 and the 〇s 1 are similarly scribed. Thereby, the brittle material substrate 丨〇 7 shown in Fig. 5 can be scribed along the desired line. The division after forming the scribe line shown in Fig. 5 as described above will be described below. First, as shown in FIG. 9A, the edges of the substrate are removed by scribe lines 〇s丨 and 〇S2 along two lines, so that the scribe lines a_f, r_g, and 〇_j are scribed to the ends of the substrate, so that The brittle material substrate can be easily divided into an elongated shape along this line as shown in Fig. 9B. Further, the film is divided into the scribe lines a-o, b-n, ..., f-j so that it can be a square-shaped product brittle material substrate (product LTCC substrate). In addition, in this embodiment, although the line of the outer scribe line which is offset from the edge of the substrate by the amount of the pitch is a scribe line, when the scribe line 2 S2 has the previous inner scribe line fj, it can be set from this point. The spacing of the lines determines the position of the scribed line. Further, the outer mark may be provided with an alignment mark on the brittle material substrate in advance, and the outer mark is performed based on the alignment mark. Further, in this embodiment, the scribed lines 〇S丨 and 〇S2 are intersected with the tangential scribe lines which are perpendicular thereto. Therefore, after the outer edge is divided along the scribed line, the substrate can be divided along the line perpendicular thereto. Since the outer cutting and the inner cutting can be set for each scribing line, it is possible to appropriately select the easiness of dividing the scribing line, extending the life of the scribing wheel, and the like. For example, the scribe lines in one direction can be all circumscribed lines. However, if the outer scribe line is suppressed to a minimum, the damage at the tip end of the blade can be reduced. 1374121, for example, as shown in FIG. 10A, for the brittle material substrate 107a having the nine functional regions, the scribe lines dividing the functional regions can be parallel to the two outer sides of the brittle material substrate 107a. Externally cut lines. In Fig. 10A, the brittle material substrate i〇7a may be divided according to the inner line of the grid pattern and the two outer scribe lines OS3 and 〇S4 parallel to the two sides, or two inner scribe lines may be omitted. Moreover, as shown in FIG. 10B, the other brittle material substrate 丨〇7b is displayed, so that the scribe line of the division function region can be parallel to the directional "two-side scribe line", and at this time, only the right side is the outer scribe line, the line OS3 , along the side of the 3 - #, set the other circumscribed line OS5 on the outer side of the inner cut line. Further, in this embodiment, the platform is moved in the y-axis direction by the moving means, and the stage is rotated to move the scribing head in the x-axis direction. Instead, the moving means moves the platform in the X-axis and y-axis directions and moves the scribing head in the y-axis and y-axis directions. Further, in this embodiment, the brittle material substrate is a low-temperature fired ceramic substrate. However, the present invention can be applied to a glass substrate or other substrate used for a liquid crystal panel or the like. Further, in the present embodiment, the inner cut line and the outer cut line and the line may be selected for each one of the scribe lines, but the invention is not limited thereto. It is also possible to use the first part of the scribe line of the scribe line to be inscribed and the end part to be circumscribed inside and outside. It is also possible to use an outer inscribed cut m in which the beginning portion of the one line is cut out and the end portion is inscribed. At this time, you can select four kinds of scribing methods: inner cutting, outer cutting, inner and outer cutting, and outer line. In addition, in the present embodiment, the alignment mark pair is used for each inner scribe line [S3 15 1374121, but the pitch of the alignment marks or the section from the previous scribe line may be set. Distance to determine the position of the line. Further, in the present embodiment, the inward scribe line and the outer scribe line are set to be extended outward, the amount of overhang is ended, and the amount of overhang is determined based on the data. However, the amount of overhang may be set for each scribe line and based on This determines the amount of overhang. The present invention can be widely used in the process of forming a scribe line for a ceramic substrate or a glass substrate-specific brittle material substrate which is fired on a low-temperature ceramic substrate. [Simplified description of the drawings] Fig. 1 is a view showing a scribe line outside the substrate of a brittle material. Fig. 2 is a view showing an inner scribe line of a brittle material substrate. Fig. 3 is a perspective view showing the scribing device of the embodiment. Fig. 4 is a block diagram showing the controller of the embodiment. Fig. 5 is a view showing a brittle material substrate before scribing in the embodiment; Fig. 6 is a flow chart showing the amount of overhang before the scribing and the formulation of the recipe data sheet. Fig. 7 is a view showing an example of a recipe data sheet. Fig. 8 is a flow chart showing the scribing operation of the scribing device of the embodiment. Fig. 9A is a view showing a method of dividing a substrate of a brittle material after scribing. Fig. 9B is a view showing a method of dividing a brittle material substrate after scribing. Fig. 10A is a view showing another example of the brittle material substrate before scribing in the embodiment. Fig. 1 〇B is a diagram showing a brittle material substrate before scribing in the present embodiment. [S3 1374121 Other examples of the figure [Main component symbol description 100 Scribe device 101 Mobile station 102a, 102b Derivative 103 Ball screw 104, 105 motor 106 platform 107, 107a, 107b brittle material substrate 108a' 108b CCD camera 109a, 109b locating pin 110 bridge 1 11a '111b pillar 112 scribe head 113 linear motor 114 holder 115 scribing wheel 120 controller 121 image processing unit 122 control Part 123 Input unit 124 Y motor drive unit 126 Rotary motor drive unit 17 1374121 127 Scribe head drive unit 128 Monitor 129 Recipe data holding unit