TWI373087B - Normal pressure drying device, substrate processing apparatus and substrate processing method - Google Patents

Normal pressure drying device, substrate processing apparatus and substrate processing method

Info

Publication number
TWI373087B
TWI373087B TW097130305A TW97130305A TWI373087B TW I373087 B TWI373087 B TW I373087B TW 097130305 A TW097130305 A TW 097130305A TW 97130305 A TW97130305 A TW 97130305A TW I373087 B TWI373087 B TW I373087B
Authority
TW
Taiwan
Prior art keywords
substrate processing
normal pressure
drying device
pressure drying
processing apparatus
Prior art date
Application number
TW097130305A
Other languages
English (en)
Chinese (zh)
Other versions
TW200931561A (en
Inventor
Fumihiko Ikeda
Hiroshi Nagata
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200931561A publication Critical patent/TW200931561A/zh
Application granted granted Critical
Publication of TWI373087B publication Critical patent/TWI373087B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Materials For Photolithography (AREA)
TW097130305A 2007-09-20 2008-08-08 Normal pressure drying device, substrate processing apparatus and substrate processing method TWI373087B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007243563A JP4384685B2 (ja) 2007-09-20 2007-09-20 常圧乾燥装置及び基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW200931561A TW200931561A (en) 2009-07-16
TWI373087B true TWI373087B (en) 2012-09-21

Family

ID=40611342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097130305A TWI373087B (en) 2007-09-20 2008-08-08 Normal pressure drying device, substrate processing apparatus and substrate processing method

Country Status (3)

Country Link
JP (1) JP4384685B2 (ko)
KR (1) KR20090031271A (ko)
TW (1) TWI373087B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4813583B2 (ja) * 2009-07-15 2011-11-09 東京エレクトロン株式会社 基板処理装置
JP4758513B2 (ja) * 2009-07-31 2011-08-31 富士フイルム株式会社 容器のスクリーニング方法
JP4805384B2 (ja) * 2009-11-12 2011-11-02 東京エレクトロン株式会社 基板処理装置
JP2011124342A (ja) * 2009-12-09 2011-06-23 Tokyo Electron Ltd 基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体
JP4967013B2 (ja) * 2009-12-11 2012-07-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体
KR101547458B1 (ko) * 2012-12-18 2015-08-26 주식회사 나래나노텍 개선된 기판 열처리 챔버 및 방법, 및 이를 구비한 기판 열처리 장치
JP7058907B2 (ja) * 2017-10-24 2022-04-25 住友重機械工業株式会社 加熱処理装置、アニール装置及び加熱処理方法
KR20210014121A (ko) * 2018-05-29 2021-02-08 도쿄엘렉트론가부시키가이샤 기판 처리 방법, 기판 처리 장치 및 컴퓨터 판독 가능한 기록 매체
JP2021536594A (ja) * 2018-08-27 2021-12-27 ケーエルエー コーポレイション 光学システム内の保護剤としての蒸気及び寿命延長装置
US11624904B2 (en) 2019-08-06 2023-04-11 Kla Corporation Vapor as a protectant and lifetime extender in optical systems
CN117663721B (zh) * 2024-01-31 2024-04-09 河北东海旭日木业有限公司 一种多层翻转降温及自动码放的晾板机

Also Published As

Publication number Publication date
JP2009076626A (ja) 2009-04-09
KR20090031271A (ko) 2009-03-25
TW200931561A (en) 2009-07-16
JP4384685B2 (ja) 2009-12-16

Similar Documents

Publication Publication Date Title
TWI373087B (en) Normal pressure drying device, substrate processing apparatus and substrate processing method
HK1259005A1 (zh) 曝光設備、曝光方法以及裝置製造方法
HK1249936B (zh) 曝光裝置、曝光方法和器件製造方法
HK1244893A1 (zh) 曝光裝置和方法以及設備製造方法
HK1243498A1 (zh) 曝光裝置、曝光方法及組件製造方法
HK1243499A1 (zh) 曝光裝置、曝光方法、及組件製造方法
HK1222716A1 (zh) 曝光裝置、曝光方法、及元件製造方法
EP2195828A4 (en) EXHAUST UNIT, EXHAUST METHOD COMPRISING THE USE OF SAID EXHAUST UNIT, AND APPARATUS FOR PROCESSING A SUBSTRATE COMPRISING SAID EXHAUST UNIT
HK1218186A1 (zh) 暴光設備、暴光方法以及器件製造方法
HK1218675A1 (zh) 曝光裝置、曝光方法以及元件製造方法
TWI367538B (en) Substrate processing apparatus and substrate processing method
TWI351060B (en) Substrate dryer using supercritical fluid, apparatus including the same, and method for treating substrate
HK1169861A1 (en) Exposure apparatus, exposure method and device manufacturing method
TWI370508B (en) Substrate processing apparatus and substrate processing method
HK1136878A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1181124A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1173232A1 (en) Exposure method and apparatus, and device manufacturing method
ZA200906966B (en) Method and device for treating liquids, using an electrolytic drying stage
TWI373067B (en) Substrate processing method and substrate processing device
HK1155821A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1150888A1 (en) Exposure apparatus, exposure method, and device manufacturing method
EP1995771A4 (en) SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
HK1137077A1 (en) Exposure apparatus, exposure method and device manufacturing method
EP2192785A4 (en) IMAGE PROCESSING DEVICE AND IMAGE PROCESSING METHOD
EP2233443A4 (en) HEATING DEVICE FOR GLASS SHEET MOLDING AND BENDING SHEET METHOD FOR GLASS WASHERS

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees