TWI373087B - Normal pressure drying device, substrate processing apparatus and substrate processing method - Google Patents

Normal pressure drying device, substrate processing apparatus and substrate processing method

Info

Publication number
TWI373087B
TWI373087B TW097130305A TW97130305A TWI373087B TW I373087 B TWI373087 B TW I373087B TW 097130305 A TW097130305 A TW 097130305A TW 97130305 A TW97130305 A TW 97130305A TW I373087 B TWI373087 B TW I373087B
Authority
TW
Taiwan
Prior art keywords
substrate processing
normal pressure
drying device
pressure drying
processing apparatus
Prior art date
Application number
TW097130305A
Other languages
Chinese (zh)
Other versions
TW200931561A (en
Inventor
Fumihiko Ikeda
Hiroshi Nagata
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200931561A publication Critical patent/TW200931561A/en
Application granted granted Critical
Publication of TWI373087B publication Critical patent/TWI373087B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
TW097130305A 2007-09-20 2008-08-08 Normal pressure drying device, substrate processing apparatus and substrate processing method TWI373087B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007243563A JP4384685B2 (en) 2007-09-20 2007-09-20 Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method

Publications (2)

Publication Number Publication Date
TW200931561A TW200931561A (en) 2009-07-16
TWI373087B true TWI373087B (en) 2012-09-21

Family

ID=40611342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097130305A TWI373087B (en) 2007-09-20 2008-08-08 Normal pressure drying device, substrate processing apparatus and substrate processing method

Country Status (3)

Country Link
JP (1) JP4384685B2 (en)
KR (1) KR20090031271A (en)
TW (1) TWI373087B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4813583B2 (en) * 2009-07-15 2011-11-09 東京エレクトロン株式会社 Substrate processing equipment
JP4758513B2 (en) * 2009-07-31 2011-08-31 富士フイルム株式会社 Container screening method
JP4805384B2 (en) * 2009-11-12 2011-11-02 東京エレクトロン株式会社 Substrate processing equipment
JP2011124342A (en) * 2009-12-09 2011-06-23 Tokyo Electron Ltd Substrate processing device, substrate processing method, and recording medium recording program for implementing the substrate processing method
JP4967013B2 (en) * 2009-12-11 2012-07-04 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND RECORDING MEDIUM RECORDING PROGRAM FOR EXECUTING THE SUBSTRATE PROCESSING METHOD
KR101547458B1 (en) * 2012-12-18 2015-08-26 주식회사 나래나노텍 Improved Heat Treatment Chamber and Method of Substrate, and Heat Treatment Apparatus of Substrate Having the Same
JP7058907B2 (en) * 2017-10-24 2022-04-25 住友重機械工業株式会社 Heat treatment equipment, annealing equipment and heat treatment method
WO2019230462A1 (en) * 2018-05-29 2019-12-05 東京エレクトロン株式会社 Substrate processing method, substrate processing device, and computer-readable recording medium
US11624904B2 (en) 2019-08-06 2023-04-11 Kla Corporation Vapor as a protectant and lifetime extender in optical systems
EP3811141A4 (en) * 2018-08-27 2022-03-23 KLA Corporation Vapor as a protectant and lifetime extender in optical systems
CN117663721B (en) * 2024-01-31 2024-04-09 河北东海旭日木业有限公司 Multilayer upset cooling and automatic stacking's trigger that dries in air

Also Published As

Publication number Publication date
TW200931561A (en) 2009-07-16
KR20090031271A (en) 2009-03-25
JP2009076626A (en) 2009-04-09
JP4384685B2 (en) 2009-12-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees