TWI372094B - Polishing pad for electrochemical mechanical polishing - Google Patents

Polishing pad for electrochemical mechanical polishing

Info

Publication number
TWI372094B
TWI372094B TW094114619A TW94114619A TWI372094B TW I372094 B TWI372094 B TW I372094B TW 094114619 A TW094114619 A TW 094114619A TW 94114619 A TW94114619 A TW 94114619A TW I372094 B TWI372094 B TW I372094B
Authority
TW
Taiwan
Prior art keywords
polishing
electrochemical mechanical
pad
polishing pad
mechanical polishing
Prior art date
Application number
TW094114619A
Other languages
English (en)
Other versions
TW200603946A (en
Inventor
Joseph G Ameen
David B James
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200603946A publication Critical patent/TW200603946A/zh
Application granted granted Critical
Publication of TWI372094B publication Critical patent/TWI372094B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW094114619A 2004-05-25 2005-05-06 Polishing pad for electrochemical mechanical polishing TWI372094B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/854,321 US7618529B2 (en) 2004-05-25 2004-05-25 Polishing pad for electrochemical mechanical polishing

Publications (2)

Publication Number Publication Date
TW200603946A TW200603946A (en) 2006-02-01
TWI372094B true TWI372094B (en) 2012-09-11

Family

ID=35423995

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094114619A TWI372094B (en) 2004-05-25 2005-05-06 Polishing pad for electrochemical mechanical polishing

Country Status (5)

Country Link
US (2) US7618529B2 (zh)
JP (1) JP2005335062A (zh)
KR (1) KR101122106B1 (zh)
CN (1) CN100385631C (zh)
TW (1) TWI372094B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5091417B2 (ja) * 2006-03-30 2012-12-05 富士紡ホールディングス株式会社 研磨布
JP5109409B2 (ja) * 2007-02-28 2012-12-26 東レ株式会社 研磨パッドおよび研磨パッドの製造方法
US20110048963A1 (en) * 2008-01-18 2011-03-03 Toyo Trie & Rubber Co., Ltd. Method of manufacturing electropolishing pad
US7846715B2 (en) * 2008-05-13 2010-12-07 Owens Aaron M Sample chamber volume reducer
CN101780661B (zh) * 2009-01-15 2012-05-23 贝达先进材料股份有限公司 可导电的抛光垫及其制造方法
US9025455B2 (en) 2011-04-26 2015-05-05 Industrial Technology Research Institute Prioritized random access method, resource allocation method and collision resolution method
CN102773960A (zh) * 2012-07-11 2012-11-14 苏州市世嘉科技股份有限公司 密封条现场发泡的新型工艺
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9701323B2 (en) 2015-04-06 2017-07-11 Bedloe Industries Llc Railcar coupler
CN105058250B (zh) * 2015-06-30 2019-04-09 浙江师范大学 一种导电柔性磨具及其制备方法
CN107346731B (zh) * 2016-05-05 2021-03-16 盛美半导体设备(上海)股份有限公司 一种减少铜膜厚度的方法
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad

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Publication number Priority date Publication date Assignee Title
BE636018A (zh) 1962-08-13 1900-01-01
US3264274A (en) * 1963-11-18 1966-08-02 U S Peroxygen Corp Diperesters of polyols
US3504457A (en) 1966-07-05 1970-04-07 Geoscience Instr Corp Polishing apparatus
US3604457A (en) * 1969-08-20 1971-09-14 Emerson Electric Co Pilot-operated four-way valve system
US4481680A (en) * 1983-05-20 1984-11-13 Rosetta Mason Protective visor
US4612216A (en) * 1983-07-01 1986-09-16 The Dow Chemical Company Method for making duplex metal alloy/polymer composites
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US6099954A (en) 1995-04-24 2000-08-08 Rodel Holdings, Inc. Polishing material and method of polishing a surface
US6099964A (en) * 1997-02-06 2000-08-08 Wacker-Chemie Gmbh Metal deposits on mesoscopic organopolysiloxane particles
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
JP3697963B2 (ja) * 1999-08-30 2005-09-21 富士電機デバイステクノロジー株式会社 研磨布および平面研磨加工方法
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
DE60211878T2 (de) * 2001-04-24 2006-10-26 Applied Materials, Inc., Santa Clara Leitender polierkörper zum elektrochemisch-mechanischen polieren
US6706158B2 (en) * 2001-09-28 2004-03-16 Intel Corporation Electrochemical mechanical planarization
US7399516B2 (en) * 2002-05-23 2008-07-15 Novellus Systems, Inc. Long-life workpiece surface influencing device structure and manufacturing method
US6783657B2 (en) * 2002-08-29 2004-08-31 Micron Technology, Inc. Systems and methods for the electrolytic removal of metals from substrates
JP2004237381A (ja) * 2003-02-05 2004-08-26 Sony Corp 電解研磨パッド
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
JP2005260224A (ja) * 2004-02-27 2005-09-22 Asm Nutool Inc 電気化学機械研磨のためのシステム

Also Published As

Publication number Publication date
JP2005335062A (ja) 2005-12-08
US20050263406A1 (en) 2005-12-01
US7618529B2 (en) 2009-11-17
KR20060048076A (ko) 2006-05-18
US20100000877A1 (en) 2010-01-07
US7807038B2 (en) 2010-10-05
CN100385631C (zh) 2008-04-30
KR101122106B1 (ko) 2012-03-15
CN1702840A (zh) 2005-11-30
TW200603946A (en) 2006-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees