TWI371081B - Semiconductor device and fabrication method therefor - Google Patents

Semiconductor device and fabrication method therefor

Info

Publication number
TWI371081B
TWI371081B TW095136509A TW95136509A TWI371081B TW I371081 B TWI371081 B TW I371081B TW 095136509 A TW095136509 A TW 095136509A TW 95136509 A TW95136509 A TW 95136509A TW I371081 B TWI371081 B TW I371081B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
method therefor
fabrication method
fabrication
therefor
Prior art date
Application number
TW095136509A
Other languages
English (en)
Other versions
TW200721382A (en
Inventor
Masayuki Moriya
Takayuki Enda
Original Assignee
Spansion Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spansion Llc filed Critical Spansion Llc
Publication of TW200721382A publication Critical patent/TW200721382A/zh
Application granted granted Critical
Publication of TWI371081B publication Critical patent/TWI371081B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76804—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics by forming tapered via holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
TW095136509A 2005-09-30 2006-10-02 Semiconductor device and fabrication method therefor TWI371081B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/018105 WO2007043100A1 (ja) 2005-09-30 2005-09-30 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
TW200721382A TW200721382A (en) 2007-06-01
TWI371081B true TWI371081B (en) 2012-08-21

Family

ID=37902431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136509A TWI371081B (en) 2005-09-30 2006-10-02 Semiconductor device and fabrication method therefor

Country Status (4)

Country Link
US (1) US20070077726A1 (zh)
JP (1) JPWO2007043100A1 (zh)
TW (1) TWI371081B (zh)
WO (1) WO2007043100A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112071803A (zh) * 2020-09-17 2020-12-11 长江存储科技有限责任公司 一种半导体结构及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11204520A (ja) * 1998-01-08 1999-07-30 Hitachi Ltd 半導体集積回路装置およびその製造方法
US6600185B1 (en) * 1999-03-10 2003-07-29 Oki Electric Industry Co., Ltd. Ferroelectric capacitor with dielectric lining, semiconductor memory device employing same, and fabrication methods thereof
JP3525824B2 (ja) * 1999-09-17 2004-05-10 日立化成工業株式会社 Ｃｍｐ研磨液
KR100338771B1 (ko) * 1999-11-12 2002-05-30 윤종용 수소 어닐링 단계를 포함하는 공정이 간단한 트렌치소자분리방법
JP2001319929A (ja) * 2000-05-10 2001-11-16 Promos Technologies Inc 化学的機械的研磨のプロセスウインドウを増加する方法
EP1777739A3 (en) * 2000-09-11 2008-09-17 Tokyo Electron Limited Semiconductor device and fabrication method therefor
JP2002208633A (ja) * 2001-01-10 2002-07-26 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
US6753249B1 (en) * 2001-01-16 2004-06-22 Taiwan Semiconductor Manufacturing Company Multilayer interface in copper CMP for low K dielectric
US6583053B2 (en) * 2001-03-23 2003-06-24 Texas Instruments Incorporated Use of a sacrificial layer to facilitate metallization for small features
JP2004165434A (ja) * 2002-11-13 2004-06-10 Sony Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
WO2007043100A1 (ja) 2007-04-19
US20070077726A1 (en) 2007-04-05
JPWO2007043100A1 (ja) 2009-04-16
TW200721382A (en) 2007-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees