TWI370951B - - Google Patents
Info
- Publication number
- TWI370951B TWI370951B TW096146127A TW96146127A TWI370951B TW I370951 B TWI370951 B TW I370951B TW 096146127 A TW096146127 A TW 096146127A TW 96146127 A TW96146127 A TW 96146127A TW I370951 B TWI370951 B TW I370951B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006341844 | 2006-12-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200848930A TW200848930A (en) | 2008-12-16 |
TWI370951B true TWI370951B (zh) | 2012-08-21 |
Family
ID=39536165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96146127A TW200848930A (en) | 2006-12-19 | 2007-12-04 | Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5136423B2 (zh) |
KR (3) | KR101289569B1 (zh) |
CN (1) | CN101558356B (zh) |
TW (1) | TW200848930A (zh) |
WO (1) | WO2008075531A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010197831A (ja) * | 2009-02-26 | 2010-09-09 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
CN106918991A (zh) * | 2010-07-13 | 2017-07-04 | 日立化成工业株式会社 | 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板 |
JP6022749B2 (ja) * | 2010-07-30 | 2016-11-09 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、リードフレームの製造方法及びプリント配線板の製造方法 |
KR20130095631A (ko) * | 2010-07-30 | 2013-08-28 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물 및 이것을 이용한 감광성 엘리멘트, 레지스트 패턴 제조 방법, 리드 프레임의 제조 방법, 인쇄 배선판, 및 인쇄 배선판의 제조 방법 |
JP5777461B2 (ja) * | 2011-09-14 | 2015-09-09 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
JP6358094B2 (ja) * | 2012-11-20 | 2018-07-18 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
CN106132104A (zh) * | 2016-07-05 | 2016-11-16 | 浙江近点电子股份有限公司 | 一种软性线路板的生产工艺 |
CN111258180B (zh) * | 2018-11-30 | 2024-03-08 | 常州正洁智造科技有限公司 | 六芳基双咪唑类混合光引发剂及应用 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6180319B1 (en) | 1998-03-11 | 2001-01-30 | E. I. Du Pont De Nemours And Company | Process for the continuous liquid processing of photosensitive compositions having reduced levels of residues |
JP2004012812A (ja) * | 2002-06-06 | 2004-01-15 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント及びプリント配線板の製造方法 |
JP4209148B2 (ja) * | 2002-07-09 | 2009-01-14 | 保土谷化学工業株式会社 | 感光性樹脂組成物 |
JP2004287090A (ja) * | 2003-03-20 | 2004-10-14 | Hitachi Chem Co Ltd | 感光性樹脂組成物層、感光性エレメント、これを用いたレジストパターンの製造方法及びプリント配線板の製造方法 |
JP2004317850A (ja) | 2003-04-17 | 2004-11-11 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法およびプリント配線板の製造方法 |
JP2005031583A (ja) | 2003-07-11 | 2005-02-03 | Hitachi Chem Co Ltd | 感光性樹脂組成物及びプリント配線板の製造方法 |
JP2006078558A (ja) * | 2004-09-07 | 2006-03-23 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法 |
JP4578269B2 (ja) * | 2005-02-23 | 2010-11-10 | 旭化成イーマテリアルズ株式会社 | 光重合性樹脂組成物 |
KR100741295B1 (ko) * | 2005-05-03 | 2007-07-20 | 주식회사 동진쎄미켐 | 감광성 수지 조성물 |
JP4874707B2 (ja) * | 2005-05-03 | 2012-02-15 | ドンジン セミケム カンパニー リミテッド | 感光性樹脂組成物 |
JP2008058636A (ja) * | 2006-08-31 | 2008-03-13 | Fujifilm Corp | パターン形成材料及びパターン形成方法 |
JP4936848B2 (ja) * | 2006-10-16 | 2012-05-23 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物およびその積層体 |
-
2007
- 2007-11-22 CN CN200780046551.XA patent/CN101558356B/zh active Active
- 2007-11-22 KR KR1020127012619A patent/KR101289569B1/ko active IP Right Grant
- 2007-11-22 KR KR1020137010400A patent/KR20130049836A/ko not_active Application Discontinuation
- 2007-11-22 JP JP2008550073A patent/JP5136423B2/ja active Active
- 2007-11-22 WO PCT/JP2007/072623 patent/WO2008075531A1/ja active Application Filing
- 2007-11-22 KR KR1020097012445A patent/KR20090084941A/ko not_active Application Discontinuation
- 2007-12-04 TW TW96146127A patent/TW200848930A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20120068988A (ko) | 2012-06-27 |
JPWO2008075531A1 (ja) | 2010-04-08 |
JP5136423B2 (ja) | 2013-02-06 |
KR101289569B1 (ko) | 2013-07-24 |
KR20090084941A (ko) | 2009-08-05 |
KR20130049836A (ko) | 2013-05-14 |
WO2008075531A1 (ja) | 2008-06-26 |
CN101558356B (zh) | 2013-09-25 |
CN101558356A (zh) | 2009-10-14 |
TW200848930A (en) | 2008-12-16 |
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