TWI370823B - - Google Patents

Info

Publication number
TWI370823B
TWI370823B TW097125328A TW97125328A TWI370823B TW I370823 B TWI370823 B TW I370823B TW 097125328 A TW097125328 A TW 097125328A TW 97125328 A TW97125328 A TW 97125328A TW I370823 B TWI370823 B TW I370823B
Authority
TW
Taiwan
Application number
TW097125328A
Other languages
Chinese (zh)
Other versions
TW200916496A (en
Inventor
Yoshihiko Takada
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of TW200916496A publication Critical patent/TW200916496A/zh
Application granted granted Critical
Publication of TWI370823B publication Critical patent/TWI370823B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/60—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/64—Amino alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW97125328A 2007-07-05 2008-07-04 Curing agent for epoxy resin and curing agent composition for epoxy resin TW200916496A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007177261 2007-07-05

Publications (2)

Publication Number Publication Date
TW200916496A TW200916496A (en) 2009-04-16
TWI370823B true TWI370823B (fr) 2012-08-21

Family

ID=40226176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97125328A TW200916496A (en) 2007-07-05 2008-07-04 Curing agent for epoxy resin and curing agent composition for epoxy resin

Country Status (3)

Country Link
JP (1) JP5138685B2 (fr)
TW (1) TW200916496A (fr)
WO (1) WO2009005135A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010122995A1 (fr) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 Composition microencapsulée contenant un composé imidazole, composition durcissable l'utilisant et agent de durcissement de type mélange-maître
TWI406925B (zh) * 2010-09-14 2013-09-01 Zhen Ding Technology Co Ltd 電路板基板及其製作方法
GB201116240D0 (en) * 2011-09-20 2011-11-02 Henkel Ag & Co Kgaa Electrically conductive adhesives comprising silver-coated particles
JP6039895B2 (ja) * 2011-11-02 2016-12-07 旭化成株式会社 硬化剤、マイクロカプセル型硬化剤、マスターバッチ型硬化剤組成物、一液性エポキシ樹脂組成物および加工品
TWI582370B (zh) * 2015-03-17 2017-05-11 Method for Making High Thermal Conductivity Elements
KR102042239B1 (ko) * 2017-08-08 2019-11-08 주식회사 케이씨씨 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물
CN112500821B (zh) * 2020-12-29 2022-07-15 烟台信友新材料有限公司 一种紫外光固化可变操作时间单组份环氧胶及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH041219A (ja) * 1990-04-19 1992-01-06 Toyama Pref Gov 一液型熱硬化性組成物
JP3270775B2 (ja) * 1992-01-24 2002-04-02 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 改良されたエポキシ樹脂用潜在性硬化剤及びその製造方法
JP3454437B2 (ja) * 1992-10-02 2003-10-06 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JPH06184274A (ja) * 1992-12-16 1994-07-05 Fuji Kasei Kogyo Kk 一成分系加熱硬化性エポキシド組成物
JPH09175848A (ja) * 1995-10-24 1997-07-08 Asahi Chem Ind Co Ltd セメント成形体用組成物
JP3562323B2 (ja) * 1998-07-09 2004-09-08 株式会社スリーボンド 熱硬化型導電性接着剤
JP4128281B2 (ja) * 1998-09-03 2008-07-30 旭化成エレクトロニクス株式会社 エポキシ系樹脂組成物
JP3390416B2 (ja) * 2000-09-14 2003-03-24 三和化学工業株式会社 エポキシ樹脂用低温硬化型潜在性硬化剤
JP4201632B2 (ja) * 2003-03-28 2008-12-24 株式会社Ａｄｅｋａ エポキシ樹脂用硬化剤組成物
CA2625794A1 (fr) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy
WO2007088889A1 (fr) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite

Also Published As

Publication number Publication date
JP5138685B2 (ja) 2013-02-06
JPWO2009005135A1 (ja) 2010-08-26
WO2009005135A1 (fr) 2009-01-08
TW200916496A (en) 2009-04-16

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