TWI370109B - Cerium oxide powder for abrasive and cmp slurry comprising the same - Google Patents
Cerium oxide powder for abrasive and cmp slurry comprising the sameInfo
- Publication number
- TWI370109B TWI370109B TW097116203A TW97116203A TWI370109B TW I370109 B TWI370109 B TW I370109B TW 097116203 A TW097116203 A TW 097116203A TW 97116203 A TW97116203 A TW 97116203A TW I370109 B TWI370109 B TW I370109B
- Authority
- TW
- Taiwan
- Prior art keywords
- abrasive
- same
- cerium oxide
- oxide powder
- cmp slurry
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F17/00—Compounds of rare earth metals
- C01F17/20—Compounds containing only rare earth metals as the metal element
- C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
- C01F17/224—Oxides or hydroxides of lanthanides
- C01F17/235—Cerium oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F17/00—Compounds of rare earth metals
- C01F17/10—Preparation or treatment, e.g. separation or purification
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F17/00—Compounds of rare earth metals
- C01F17/20—Compounds containing only rare earth metals as the metal element
- C01F17/247—Carbonates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/20—Particle morphology extending in two dimensions, e.g. plate-like
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Analytical Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070043156 | 2007-05-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200911694A TW200911694A (en) | 2009-03-16 |
TWI370109B true TWI370109B (en) | 2012-08-11 |
Family
ID=39943674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097116203A TWI370109B (en) | 2007-05-03 | 2008-05-02 | Cerium oxide powder for abrasive and cmp slurry comprising the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US8333815B2 (zh) |
JP (1) | JP5475642B2 (zh) |
KR (1) | KR100962960B1 (zh) |
CN (1) | CN101652324B (zh) |
TW (1) | TWI370109B (zh) |
WO (1) | WO2008136593A1 (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5475642B2 (ja) | 2007-05-03 | 2014-04-16 | エルジー・ケム・リミテッド | 研磨材用酸化セリウム粉末及びこれを含むcmpスラリー |
US9054025B2 (en) * | 2008-11-03 | 2015-06-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Process for controlling shallow trench isolation step height |
KR101050789B1 (ko) * | 2009-09-21 | 2011-07-20 | 주식회사 엘지화학 | 탄산세륨계 화합물의 제조 방법, 산화세륨의 제조 방법 및 결정성 산화세륨 |
JP5781287B2 (ja) * | 2009-10-01 | 2015-09-16 | ニッタ・ハース株式会社 | 研磨組成物 |
KR101075966B1 (ko) | 2010-03-09 | 2011-10-21 | 주식회사 엘지화학 | 결정성 산화세륨 및 이의 제조 방법 |
CN104137232A (zh) * | 2012-02-21 | 2014-11-05 | 日立化成株式会社 | 研磨剂、研磨剂组和基体的研磨方法 |
WO2014208414A1 (ja) * | 2013-06-27 | 2014-12-31 | コニカミノルタ株式会社 | 酸化セリウム研磨材、酸化セリウム研磨材の製造方法及び研磨加工方法 |
WO2014208379A1 (ja) * | 2013-06-27 | 2014-12-31 | コニカミノルタ株式会社 | 研磨材、研磨材の製造方法及び研磨加工方法 |
WO2015019888A1 (ja) * | 2013-08-07 | 2015-02-12 | コニカミノルタ株式会社 | 研磨材粒子、研磨材の製造方法及び研磨加工方法 |
CN103818943B (zh) * | 2014-02-18 | 2016-05-04 | 常州大学 | 一种球形氧化铈多孔磨料及其在超精密抛光中的用途 |
EP3020689A1 (en) * | 2014-11-12 | 2016-05-18 | Rhodia Operations | Cerium oxide particles and method for production thereof |
CN106915760B (zh) * | 2015-12-28 | 2021-04-30 | 安集微电子科技(上海)股份有限公司 | 一种氧化铈的制备方法及其在sti抛光领域的应用 |
CN106915761B (zh) * | 2015-12-28 | 2021-04-30 | 安集微电子科技(上海)股份有限公司 | 一种氧化铈制备方法及其在sti化学机械抛光中的应用 |
CN106927495A (zh) * | 2015-12-31 | 2017-07-07 | 安集微电子科技(上海)有限公司 | 一种氧化铈的制备方法及其cmp应用 |
CN110040759A (zh) * | 2019-04-28 | 2019-07-23 | 乐山师范学院 | 一种碱式碳酸铈的合成方法 |
US11931855B2 (en) * | 2019-06-17 | 2024-03-19 | Applied Materials, Inc. | Planarization methods for packaging substrates |
CN113120943A (zh) * | 2019-12-30 | 2021-07-16 | 安集微电子科技(上海)股份有限公司 | 一种碱式碳酸铈的合成方法 |
CN111834229A (zh) * | 2020-07-23 | 2020-10-27 | 大连理工大学 | 一种碲锌镉晶片的绿色环保化学机械抛光方法 |
KR102484570B1 (ko) * | 2020-08-31 | 2023-01-05 | 솔브레인 주식회사 | 산화 세륨 입자, 이를 포함하는 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법 |
KR20240062238A (ko) * | 2022-10-28 | 2024-05-09 | 솔브레인 주식회사 | 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3440505B2 (ja) * | 1993-09-14 | 2003-08-25 | 昭和電工株式会社 | 酸化第二セリウムの製造方法 |
KR100475976B1 (ko) * | 1998-12-25 | 2005-03-15 | 히다치 가세고교 가부시끼가이샤 | Cmp 연마제, cmp 연마제용 첨가액 및 기판의 연마방법 |
KR100477939B1 (ko) * | 2002-04-15 | 2005-03-18 | 주식회사 엘지화학 | 단결정 산화세륨 분말의 제조방법 |
TWI256971B (en) * | 2002-08-09 | 2006-06-21 | Hitachi Chemical Co Ltd | CMP abrasive and method for polishing substrate |
WO2006080796A1 (en) | 2005-01-26 | 2006-08-03 | Lg Chem, Ltd. | Cerium oxide abrasive and slurry containing the same |
KR20080011044A (ko) * | 2006-07-28 | 2008-01-31 | 주식회사 엘지화학 | 산화세륨 분말, 그 제조방법, 및 이를 포함하는cmp슬러리 |
WO2007035034A1 (en) * | 2005-09-20 | 2007-03-29 | Lg Chem, Ltd. | Cerium carbonate powder, method for preparing the same, cerium oxide powder made therefrom, method for preparing the same, and cmp slurry comprising the same |
KR100812052B1 (ko) | 2005-11-14 | 2008-03-10 | 주식회사 엘지화학 | 탄산세륨 분말, 산화세륨 분말, 그 제조방법, 및 이를포함하는 cmp 슬러리 |
US7976810B2 (en) * | 2007-03-16 | 2011-07-12 | Lg Chem, Ltd. | Method for preparing cerium carbonate powder |
JP5475642B2 (ja) | 2007-05-03 | 2014-04-16 | エルジー・ケム・リミテッド | 研磨材用酸化セリウム粉末及びこれを含むcmpスラリー |
-
2008
- 2008-04-30 JP JP2010506077A patent/JP5475642B2/ja active Active
- 2008-04-30 WO PCT/KR2008/002460 patent/WO2008136593A1/en active Application Filing
- 2008-04-30 US US12/598,666 patent/US8333815B2/en active Active
- 2008-04-30 CN CN2008800111384A patent/CN101652324B/zh active Active
- 2008-05-02 TW TW097116203A patent/TWI370109B/zh active
- 2008-05-06 KR KR1020080041787A patent/KR100962960B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2010526433A (ja) | 2010-07-29 |
WO2008136593A1 (en) | 2008-11-13 |
TW200911694A (en) | 2009-03-16 |
JP5475642B2 (ja) | 2014-04-16 |
US20100062687A1 (en) | 2010-03-11 |
CN101652324B (zh) | 2012-05-30 |
KR20080097954A (ko) | 2008-11-06 |
CN101652324A (zh) | 2010-02-17 |
US8333815B2 (en) | 2012-12-18 |
KR100962960B1 (ko) | 2010-06-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI370109B (en) | Cerium oxide powder for abrasive and cmp slurry comprising the same | |
EP1948568A4 (en) | CERCARBONATE POWDER, CEROXIDE POWDER, METHOD OF MANUFACTURING THEREOF, AND CMP SPRAYING THEREWITH | |
EP1838620A4 (en) | METHOD FOR PRODUCING CEROXIDE POWDER FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR PRODUCING CMP SLUD WITH THEREIN | |
EP2322322A4 (en) | ALUMINUM OXIDE PARTICLES AND POLISHING COMPOSITION THEREIN | |
EP1934142A4 (en) | CERIUM CARBONATE POWDER, PROCESS FOR PREPARING THE SAME, CERIUM OXIDE POWDER PREPARED THEREFROM, PROCESS FOR PREPARING THE SAME, AND CMP POLISHING SLURRY COMPRISING THE SAME | |
TWI367863B (en) | Liquid suspension and powder of cerium oxide particles, processes for the preparation thereof and use in polishing | |
EP2489714A4 (en) | SLUDGE COMPOSITION FOR CHEMICAL-MECHANICAL POLISHING AND POLISHING METHOD | |
IL193976A (en) | A method of chemical-mechanical polishing and a method of extending the life of the composition used for chemical-mechanical polishing | |
HK1149630A1 (en) | Colloidal silica with modified surface and polishing composition for cmp containing the same | |
EP1951837A4 (en) | POLISHING LIQUIDS AND CMP PROCESS | |
SG130113A1 (en) | Cerium oxide powder and cerium oxide dispersion | |
EP2135707A4 (en) | CUSHION FOR POLISHING DISC AND CUSHIONING POLISHING DISC | |
TWI368648B (en) | Slurry composition for chemical mechanical polishing and precursor composition thereof | |
IL186687A0 (en) | Multi-layer polishing pad material for cmp | |
ZA201000522B (en) | Abrasive compact | |
EP2011765A4 (en) | FINE OXIDE CRYSTAL PARTICLES AND POLISHER PENSION THEREWITH | |
EP2329519A4 (en) | ABRASIVE CHEMICAL MECHANICAL POLISHING COMPOSITIONS AND METHODS OF USE THEREOF | |
IL219144A (en) | A chemical mechanical lightening compound containing inorganic particles and polymer particles | |
TWI350564B (en) | Polising slurry for chemical mechanical polishing (cmp) and polishing method | |
GB0815229D0 (en) | Polycrystalline diamond abrasive compact | |
EP2193010A4 (en) | POLISHING CUSHION | |
EP2108472A4 (en) | HIGH COMPRESSIBILITY IRON POWDER, IRON POWDER COMPRISING THE SAME FOR AN IRON POWDER CORE, AND IRON POWDER CORE | |
EP1778587A4 (en) | CERIUM OXIDE POWDER AND PROCESS FOR PRODUCING THE SAME | |
EP1994112A4 (en) | CHEMICAL MECHANICAL POLISHING PASTE AND METHOD OF POLISHING A SEMICONDUCTOR WAFER USING THE SAME | |
EP1983558A4 (en) | ABRASIVE SKATE AND ABRASIVE DEVICE |