TWI369589B - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
TWI369589B
TWI369589B TW096124514A TW96124514A TWI369589B TW I369589 B TWI369589 B TW I369589B TW 096124514 A TW096124514 A TW 096124514A TW 96124514 A TW96124514 A TW 96124514A TW I369589 B TWI369589 B TW I369589B
Authority
TW
Taiwan
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
TW096124514A
Other languages
English (en)
Other versions
TW200813652A (en
Inventor
Andre Bernardus Jeunink
Marcel Koenraad Marie Baggen
Dirk-Jan Bijvoet
Thomas Josephus Maria Castenmiller
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38948921&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI369589(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200813652A publication Critical patent/TW200813652A/zh
Application granted granted Critical
Publication of TWI369589B publication Critical patent/TWI369589B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096124514A 2006-07-14 2007-07-05 Lithographic apparatus and device manufacturing method TWI369589B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/486,379 US7675607B2 (en) 2006-07-14 2006-07-14 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
TW200813652A TW200813652A (en) 2008-03-16
TWI369589B true TWI369589B (en) 2012-08-01

Family

ID=38948921

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096124514A TWI369589B (en) 2006-07-14 2007-07-05 Lithographic apparatus and device manufacturing method

Country Status (5)

Country Link
US (1) US7675607B2 (zh)
JP (1) JP4791421B2 (zh)
KR (1) KR100918248B1 (zh)
CN (1) CN101105640B (zh)
TW (1) TWI369589B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008041287A1 (de) * 2007-08-24 2009-02-26 Carl Zeiss Smt Ag Kraftaktuator
NL2003673A (en) * 2008-11-21 2010-05-25 Asml Netherlands Bv Lithographic apparatus and methods for compensating substrate unflatness, determining the effect of patterning device unflatness, and determing the effect of thermal loads on a patterning device.
NL2006190A (en) * 2010-03-11 2011-09-13 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
TWI542952B (zh) * 2010-12-02 2016-07-21 Asml控股公司 圖案化裝置支撐件
KR101962487B1 (ko) * 2011-02-22 2019-07-17 가부시키가이샤 니콘 유지 장치, 노광 장치, 및 디바이스의 제조 방법
KR20130028165A (ko) * 2011-06-21 2013-03-19 삼성디스플레이 주식회사 마스크 유닛
DE102011086513A1 (de) 2011-11-16 2013-05-16 Carl Zeiss Smt Gmbh Projektionsbelichtungsverfahren und Projektionsbelichtungsanlage für die Mikrolithographie
US9910368B2 (en) 2012-10-23 2018-03-06 Asml Netherlands B.V. Patterning device manipulating system and lithographic apparatuses
DE102012111114B4 (de) * 2012-11-19 2018-10-04 Ev Group E. Thallner Gmbh Halbleiterbearbeitungsvorrichtung und -verfahren
US10289007B2 (en) * 2014-07-10 2019-05-14 Nikon Corporation Lithography tool having a reticle stage capable of dynamic reticle bending to compensate for distortion
CN104977815B (zh) * 2015-07-03 2018-02-23 苏州微影激光技术有限公司 直写式曝光系统中的扫描台
DE102018220565A1 (de) * 2018-11-29 2020-06-04 Carl Zeiss Smt Gmbh Projektionsbelichtungsanlage für die Halbleiterlithographie mit einem semiaktiven Abstandshalter und Verfahren zur Verwendung des semiaktiven Abstandshalters
CN113324894A (zh) * 2021-05-31 2021-08-31 海南大学 一种用于研究塑料光降解的实验装置

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FR2584824B1 (fr) * 1985-07-10 1987-09-25 Commissariat Energie Atomique Miroir deformable
US4711438A (en) * 1986-05-08 1987-12-08 Micrion Limited Partnership Mask holding
JPH02310912A (ja) * 1989-05-26 1990-12-26 Hitachi Ltd 露光方法及びその装置
JPH04158364A (ja) * 1990-10-23 1992-06-01 Fujitsu Ltd 投影露光装置
JPH06130344A (ja) * 1992-10-22 1994-05-13 Toshiba Corp マスク描画用基板の保持装置
JPH07263316A (ja) * 1994-03-25 1995-10-13 Toshiba Corp Ｘ線露光装置
JPH07297118A (ja) * 1994-04-27 1995-11-10 Canon Inc 基板および基板保持方法ならびにその装置
JPH088173A (ja) * 1994-06-16 1996-01-12 Nikon Corp 露光装置及び露光システム
JPH0982606A (ja) * 1995-09-13 1997-03-28 Nikon Corp レチクルホルダ
JP3305188B2 (ja) * 1996-02-07 2002-07-22 キヤノン株式会社 原版、原版保持装置およびこれを用いた露光装置ならびにディバイス製造方法
JP3648847B2 (ja) * 1996-05-20 2005-05-18 株式会社ニコン マスクの支持機構及びこれを用いた露光装置
JPH10214780A (ja) * 1997-01-28 1998-08-11 Nikon Corp 投影露光装置
JP3634539B2 (ja) * 1997-02-28 2005-03-30 キヤノン株式会社 マスク保持装置、露光装置、デバイス製造方法、及びマスク構造体
JP2001023886A (ja) * 1999-07-08 2001-01-26 Nikon Corp 試料保持装置及び露光装置
JP2001148335A (ja) * 1999-11-18 2001-05-29 Canon Inc 露光装置およびデバイス製造方法
TW504605B (en) * 1999-12-03 2002-10-01 Asm Lithography Bv Lithographic projection apparatus, method of manufacturing a device using the same, the device and mask
TW508653B (en) * 2000-03-24 2002-11-01 Asml Netherlands Bv Lithographic projection apparatus and integrated circuit manufacturing method
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US6398373B1 (en) * 2000-08-09 2002-06-04 Asml Us, Inc. Pneumatic control system and method for shaping deformable mirrors in lithographic projection systems
US6947195B2 (en) * 2001-01-18 2005-09-20 Ricoh Company, Ltd. Optical modulator, optical modulator manufacturing method, light information processing apparatus including optical modulator, image formation apparatus including optical modulator, and image projection and display apparatus including optical modulator
WO2002065519A1 (fr) * 2001-02-13 2002-08-22 Nikon Corporation Dispositif de support, procede de support, dispositif d'exposition et procede de production des dispositifs
JP2003133233A (ja) * 2001-10-23 2003-05-09 Hitachi Kokusai Electric Inc 基板処理装置
JP3713479B2 (ja) * 2001-11-09 2005-11-09 エイエスエムエル ネザランドズ ベスローテン フエンノートシャップ 平板投影装置および素子製造方法
US6806943B2 (en) * 2002-08-09 2004-10-19 International Business Machines Corporation Mask clamping device
JP2004153122A (ja) * 2002-10-31 2004-05-27 Nikon Corp 露光装置
CN1311301C (zh) * 2002-12-23 2007-04-18 Asml荷兰有限公司 一种光刻投影装置
TWI340406B (en) * 2003-06-04 2011-04-11 Nikon Corp Stage apparatus, fixing method , expose apparatus, exposing method and method for manufacturing device
KR100603326B1 (ko) * 2003-12-09 2006-07-20 삼성에스디아이 주식회사 마스크 및 마스크 프레임 조립 장치 및 조립 방법
US7019816B2 (en) * 2003-12-17 2006-03-28 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
US7119884B2 (en) * 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006178318A (ja) * 2004-12-24 2006-07-06 Nsk Ltd 露光装置
US7436484B2 (en) * 2004-12-28 2008-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7459701B2 (en) * 2005-06-08 2008-12-02 Asml Netherlands B.V. Stage apparatus, lithographic apparatus and device manufacturing method
US7239376B2 (en) * 2005-07-27 2007-07-03 International Business Machines Corporation Method and apparatus for correcting gravitational sag in photomasks used in the production of electronic devices
US7884919B2 (en) * 2006-02-09 2011-02-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
KR20080007185A (ko) 2008-01-17
US7675607B2 (en) 2010-03-09
US20080013068A1 (en) 2008-01-17
JP4791421B2 (ja) 2011-10-12
JP2008021997A (ja) 2008-01-31
CN101105640B (zh) 2010-12-29
TW200813652A (en) 2008-03-16
KR100918248B1 (ko) 2009-09-21
CN101105640A (zh) 2008-01-16

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees