TWI368465B - Multilayered construction for resistor and capacitor formation - Google Patents

Multilayered construction for resistor and capacitor formation

Info

Publication number
TWI368465B
TWI368465B TW095105536A TW95105536A TWI368465B TW I368465 B TWI368465 B TW I368465B TW 095105536 A TW095105536 A TW 095105536A TW 95105536 A TW95105536 A TW 95105536A TW I368465 B TWI368465 B TW I368465B
Authority
TW
Taiwan
Prior art keywords
resistor
capacitor formation
multilayered construction
multilayered
construction
Prior art date
Application number
TW095105536A
Other languages
English (en)
Other versions
TW200637443A (en
Inventor
John A Andresakis
Pranabes K Pramanik
Bruce Mahler
Daniel Brandler
Original Assignee
Oak Mitsui Inc
Ohmega Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oak Mitsui Inc, Ohmega Technologies Inc filed Critical Oak Mitsui Inc
Publication of TW200637443A publication Critical patent/TW200637443A/zh
Application granted granted Critical
Publication of TWI368465B publication Critical patent/TWI368465B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/203—Fibrous material or synthetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12826—Group VIB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW095105536A 2005-02-22 2006-02-17 Multilayered construction for resistor and capacitor formation TWI368465B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/062,751 US7192654B2 (en) 2005-02-22 2005-02-22 Multilayered construction for resistor and capacitor formation

Publications (2)

Publication Number Publication Date
TW200637443A TW200637443A (en) 2006-10-16
TWI368465B true TWI368465B (en) 2012-07-11

Family

ID=36913052

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105536A TWI368465B (en) 2005-02-22 2006-02-17 Multilayered construction for resistor and capacitor formation

Country Status (9)

Country Link
US (1) US7192654B2 (zh)
EP (1) EP1851049A4 (zh)
JP (1) JP2008536292A (zh)
KR (1) KR101204546B1 (zh)
CN (1) CN101194326B (zh)
CA (1) CA2595300C (zh)
MY (1) MY144218A (zh)
TW (1) TWI368465B (zh)
WO (1) WO2006091462A2 (zh)

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US7596842B2 (en) * 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
US20070085654A1 (en) * 2005-10-14 2007-04-19 Georgia Tech Research Corporation Process development and optimization of embedded thin film resistor on body
US20070258190A1 (en) * 2006-05-05 2007-11-08 Irwin Patricia C High temperature capacitors and method of manufacturing the same
WO2008043187A1 (en) * 2006-10-12 2008-04-17 Abb Research Ltd Layered electrically conductive structure and potentiometer comprising such a structure
US7605048B2 (en) * 2007-04-06 2009-10-20 Kemet Electronics Corporation Method for forming a capacitor having a copper electrode and a high surface area aluminum inner layer
KR100851067B1 (ko) * 2007-04-18 2008-08-12 삼성전기주식회사 캐패시터 및 그 제조방법
KR100966638B1 (ko) * 2008-03-25 2010-06-29 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
KR20100123886A (ko) * 2008-03-31 2010-11-25 미쓰이 긴조꾸 고교 가부시키가이샤 커패시터 형성재 및 커패시터를 구비한 프린트 배선판
KR100999918B1 (ko) * 2008-09-08 2010-12-13 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
US7791897B2 (en) * 2008-09-09 2010-09-07 Endicott Interconnect Technologies, Inc. Multi-layer embedded capacitance and resistance substrate core
US8866018B2 (en) * 2009-01-12 2014-10-21 Oak-Mitsui Technologies Llc Passive electrical devices and methods of fabricating passive electrical devices
CN102216078B (zh) * 2009-12-22 2015-03-25 Jx日矿日石金属株式会社 层积体的制造方法及层积体
WO2012151738A1 (zh) * 2011-05-06 2012-11-15 广东生益科技股份有限公司 埋容材料及其制作方法
CN102516896A (zh) * 2011-12-30 2012-06-27 常熟市富邦胶带有限责任公司 覆铜用导热涂层型聚酰亚胺薄膜及其制作方法
WO2014113703A1 (en) * 2013-01-18 2014-07-24 Ohmega Technologies, Inc. Improved circuit board material
WO2014198684A1 (en) * 2013-06-11 2014-12-18 Solvay Specialty Polymers Usa, Llc Improved mobile electronic parts
CN103402311B (zh) * 2013-07-19 2016-09-07 广东生益科技股份有限公司 一种埋容材料、制备方法及其用途
CN103594456A (zh) * 2013-11-08 2014-02-19 溧阳市江大技术转移中心有限公司 一种粗化表面的透明电容
CN105101626B (zh) * 2015-08-04 2018-04-24 东莞市毅联电子科技有限公司 一种柔性复合铝基板及其制备方法
US9707738B1 (en) 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
CN106101968B (zh) * 2016-07-18 2019-08-02 瑞声科技(新加坡)有限公司 一种埋容埋阻结构的制作方法及mems麦克风
FR3059201B1 (fr) * 2016-11-18 2019-06-21 Safran Electrical & Power Circuit imprime a isolation renforcee et procede de fabrication
US10032856B1 (en) 2017-01-24 2018-07-24 International Business Machines Corporation Nanosheet capacitor
CN107768054B (zh) * 2017-09-25 2019-07-19 江苏时恒电子科技有限公司 一种热敏电阻铜电极阻挡层及其制备方法
CN108323008B (zh) * 2018-03-06 2020-10-02 深圳崇达多层线路板有限公司 一种埋电阻软硬结合板的制作方法
CN109661100A (zh) * 2019-01-21 2019-04-19 广东生益科技股份有限公司 一种低插损高频导热基板及其应用
CN109688697B (zh) * 2019-01-21 2021-05-11 广东生益科技股份有限公司 一种低插损高频高导热基板及其应用
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Also Published As

Publication number Publication date
EP1851049A2 (en) 2007-11-07
KR101204546B1 (ko) 2012-11-23
WO2006091462A3 (en) 2007-11-22
US20060188701A1 (en) 2006-08-24
TW200637443A (en) 2006-10-16
EP1851049A4 (en) 2009-09-23
US7192654B2 (en) 2007-03-20
CA2595300A1 (en) 2006-08-31
KR20070112458A (ko) 2007-11-26
CN101194326B (zh) 2011-04-27
CN101194326A (zh) 2008-06-04
CA2595300C (en) 2013-01-29
MY144218A (en) 2011-08-15
JP2008536292A (ja) 2008-09-04
WO2006091462A2 (en) 2006-08-31

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