TWI365686B - Compositions and methods for creating electronic circuitry - Google Patents

Compositions and methods for creating electronic circuitry

Info

Publication number
TWI365686B
TWI365686B TW097125993A TW97125993A TWI365686B TW I365686 B TWI365686 B TW I365686B TW 097125993 A TW097125993 A TW 097125993A TW 97125993 A TW97125993 A TW 97125993A TW I365686 B TWI365686 B TW I365686B
Authority
TW
Taiwan
Prior art keywords
compositions
methods
electronic circuitry
creating electronic
creating
Prior art date
Application number
TW097125993A
Other languages
English (en)
Other versions
TW200922395A (en
Inventor
Yueh-Ling Lee
Shane Fang
Thomas Eugene Dueber
Harry Richard Zwicker
Richard A Wessel
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200922395A publication Critical patent/TW200922395A/zh
Application granted granted Critical
Publication of TWI365686B publication Critical patent/TWI365686B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
TW097125993A 2007-07-09 2008-07-09 Compositions and methods for creating electronic circuitry TWI365686B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US95874507P 2007-07-09 2007-07-09
US95875107P 2007-07-09 2007-07-09

Publications (2)

Publication Number Publication Date
TW200922395A TW200922395A (en) 2009-05-16
TWI365686B true TWI365686B (en) 2012-06-01

Family

ID=39884545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097125993A TWI365686B (en) 2007-07-09 2008-07-09 Compositions and methods for creating electronic circuitry

Country Status (5)

Country Link
US (1) US20090017309A1 (zh)
EP (1) EP2165582B1 (zh)
JP (1) JP2010534404A (zh)
TW (1) TWI365686B (zh)
WO (1) WO2009009072A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7547849B2 (en) * 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
US8475924B2 (en) * 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US8309640B2 (en) * 2008-05-23 2012-11-13 Sabic Innovative Plastics Ip B.V. High dielectric constant laser direct structuring materials
US8242375B2 (en) 2008-09-18 2012-08-14 United Technologies Corporation Conductive emissions protection
TWI394506B (zh) * 2008-10-13 2013-04-21 Unimicron Technology Corp 多層立體線路的結構及其製作方法
US20100193950A1 (en) * 2009-01-30 2010-08-05 E.I.Du Pont De Nemours And Company Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto
TWI410195B (zh) * 2009-10-19 2013-09-21 Taiwan Green Point Entpr Co Method for preparing conductive lines
KR20130037661A (ko) * 2010-03-08 2013-04-16 아지노모토 가부시키가이샤 수지 조성물
ITTV20120142A1 (it) * 2012-07-26 2014-01-27 Spf Logica S R L Migliorato materiale in cui realizzare circuiti conduttori
US20160005514A1 (en) * 2014-07-07 2016-01-07 Epistar Corporation Method for forming electronic element
CN105405848B (zh) * 2014-08-28 2019-07-30 旺宏电子股份有限公司 半导体装置及改善字元线电阻与减少硅化物桥接的方法
CN105042989B (zh) * 2015-08-26 2018-12-14 青岛海尔特种电冰箱有限公司 冰箱
DE102017108437B4 (de) * 2017-04-20 2020-07-09 Gottfried Wilhelm Leibniz Universität Hannover Elektrische Schaltungsstruktur und Verfahren zu deren Herstellung
CN111683472A (zh) * 2019-03-11 2020-09-18 罗门哈斯电子材料有限责任公司 印刷线路板、其制造方法及包含其的制品

Family Cites Families (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2833686A (en) * 1955-06-20 1958-05-06 Du Pont Bonding polytetrafluoroethylene resins
BE560454A (zh) * 1957-03-29
US3772161A (en) * 1972-01-03 1973-11-13 Borg Warner Method of selectively electroplating thermoplastic substrates using a strippable coating mask
US3991013A (en) * 1974-05-10 1976-11-09 E. I. Du Pont De Nemours And Company Copolyesters of derivatives of hydroquinone
PH15509A (en) * 1974-05-10 1983-02-03 Du Pont Improvements in an relating to synthetic polyesters
US3991014A (en) * 1974-05-10 1976-11-09 E. I. Du Pont De Nemours And Company Polyesters of derivatives of hydroquinone and bis(carboxyphenyl)ether
US3928670A (en) * 1974-09-23 1975-12-23 Amp Inc Selective plating on non-metallic surfaces
DE2507672C3 (de) * 1975-02-22 1980-10-09 Laboratorium Fuer Adsorptionstechnik Gmbh, 6000 Frankfurt Verfahren zum Imprägnieren von Aktivkohle
US4048148A (en) * 1975-05-09 1977-09-13 E. I. Du Pont De Nemours And Company Polyazomethine fibers and films
US4011199A (en) * 1975-11-28 1977-03-08 Eastman Kodak Company Acidolysis process
US4122070A (en) * 1976-03-19 1978-10-24 E. I. Du Pont De Nemours And Company Fibers and anisotropic melts of polyazomethines
US4083829A (en) * 1976-05-13 1978-04-11 Celanese Corporation Melt processable thermotropic wholly aromatic polyester
FR2356697A1 (fr) * 1976-06-30 1978-01-27 Sumitomo Chemical Co Composition de resine de polyester renfermant un polycarbonate et un polyester aromatique
US4159365A (en) * 1976-11-19 1979-06-26 E. I. Du Pont De Nemours And Company Polyphenyl-1,4-phenylene terephthalates and fibers therefrom
US4169933A (en) * 1977-08-08 1979-10-02 Eastman Kodak Company Liquid crystal copolyesters containing terephthalic acid and 2,6-naphthalenedicarboxylic acid
US4184996A (en) * 1977-09-12 1980-01-22 Celanese Corporation Melt processable thermotropic wholly aromatic polyester
US4130545A (en) * 1977-09-12 1978-12-19 Celanese Corporation Melt processable thermotropic wholly aromatic polyester comprising both para-oxybenzoyl and meta-oxybenzoyl moieties
US4161470A (en) * 1977-10-20 1979-07-17 Celanese Corporation Polyester of 6-hydroxy-2-naphthoic acid and para-hydroxy benzoic acid capable of readily undergoing melt processing
US4242496A (en) * 1978-12-21 1980-12-30 Eastman Kodak Company Liquid crystal copolyesters containing phenylhydroquinone
US4153779A (en) * 1978-06-26 1979-05-08 Eastman Kodak Company Liquid crystal copolyester containing a substituted phenylhydroquinone
EP0007715B1 (en) * 1978-07-24 1984-02-29 Imperial Chemical Industries Plc Thermotropic polyesteramides
US4245082A (en) * 1979-07-09 1981-01-13 E. I. Du Pont De Nemours And Company Polyesters derived from 3,4'-dihydroxy-benzophenones or 3-hydroxy-4'-(4-hydroxyphenyl-)benzophenone and certain aromatic dicarboxylic acids and filaments thereof
US4219461A (en) * 1979-04-23 1980-08-26 Celanese Corporation Polyester of 6-hydroxy-2-naphthoic acid, para-hydroxy benzoic acid, aromatic diol, and aromatic diacid capable of readily undergoing melt processing
US4256624A (en) * 1979-07-02 1981-03-17 Celanese Corporation Polyester of 6-hydroxy-2-naphthoic acid, aromatic diol, and aromatic diacid capable of undergoing melt processing
US4269965A (en) * 1979-09-17 1981-05-26 E. I. Du Pont De Nemours And Company Aromatic polyester which forms optically anisotropic melts and filaments thereof
US4232144A (en) * 1979-09-17 1980-11-04 E. I. Du Pont De Nemours And Company Polyester which exhibits anisotropy in the melt containing p-oxybenzoyl units and 4-oxy-3'-carbonylbenzophenone units or methyl and chloro derivatives of said units
US4232143A (en) * 1979-09-17 1980-11-04 E. I. Du Pont De Nemours And Company Polyester which exhibits anisotropy in the melt containing p-oxybenzoyl units and 4,4'-dioxybenzophenone units or methyl and chloro derivatives thereof
US4238600A (en) * 1979-11-19 1980-12-09 Eastman Kodak Company Copolyesters derived from terephthalic acid, phenylhydroquinone and t-butylhydroquinone
US4370466A (en) * 1981-09-28 1983-01-25 E. I. Du Pont De Nemours And Company Optically anisotropic melt forming polyesters
US4383105A (en) * 1981-12-28 1983-05-10 E. I. Du Pont De Nemours And Company Polyimide-esters and filaments
US4522974A (en) * 1982-07-26 1985-06-11 Celanese Corporation Melt processable polyester capable of forming an anisotropic melt comprising a relatively low concentration of 6-oxy-2-naphthoyl moiety-4-benzoyl moiety, 1,4-dioxyphenylene moiety, isophthaloyl moiety and terephthaloyl moiety
JPS5943021A (ja) * 1982-09-02 1984-03-09 Ueno Seiyaku Oyo Kenkyusho:Kk 芳香族（コ）ポリエステルの製法
US4447592A (en) * 1983-06-13 1984-05-08 E. I. Du Pont De Nemours And Company Anisotropic melt polyesters of 6-hydroxy-2-naphthoic acid
JPS61113296A (ja) * 1984-11-08 1986-05-31 キヤノン株式会社 プリント回路板の製造方法
US4617369A (en) * 1985-09-04 1986-10-14 E. I. Du Pont De Nemours And Company Polyester polymers of 3-hydroxy-4'-(4-hydroxyphenyl)benzophenone or 3,4'-dihydroxybenzophenone and dicarboxylic acids
DE3542814A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische mesomorphe polyester, deren herstellung sowie verwendung
DE3542777A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische polyestercarbamide, deren herstellung und verwendung
DE3542779A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische mesomorphe polyesteramide, deren herstellung und verwendung
DE3542797A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische mesomorphe polyesterimide, deren herstellung sowie verwendung
DE3542798A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische mesomorphe polyesteramidimide, deren herstellung und verwendung
DE3542855A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische mesomorphe polyesteramide, deren herstellung und verwendung
US4664972A (en) * 1986-04-23 1987-05-12 E. I. Du Pont De Nemours And Company Optically anisotropic melt forming aromatic copolyesters based on t-butylhydroquinone
DE3621519A1 (de) * 1986-06-27 1988-01-07 Basf Ag Vollaromatische mesomorphe polyester, deren herstellung sowie verwendung
JPH0717748B2 (ja) * 1986-12-19 1995-03-01 川崎製鉄株式会社 芳香族ポリエステルアミド
EP0272676A3 (en) * 1986-12-23 1989-03-29 Mitsubishi Chemical Corporation Wholly aromatic polyester and process for its production
GB8700923D0 (en) * 1987-01-16 1987-02-18 Ici Plc Aromatic copolyesters
US4882200A (en) * 1987-05-21 1989-11-21 General Electric Company Method for photopatterning metallization via UV-laser ablation of the activator
DE3878815T2 (de) * 1987-10-05 1993-06-09 Polyplastics Co Harz mit ausgezeichneter waermebestaendigkeit und anisotropischen eigenschaften in der schmelze.
IT1223401B (it) * 1987-12-02 1990-09-19 Montedison Spa Poliesteri aromatici liquido cristallini termotropici
DE3742205A1 (de) * 1987-12-12 1989-06-22 Huels Chemische Werke Ag Formmassen bestehend aus einem thermotropen, aromatischen polyester
IT1215682B (it) * 1988-01-12 1990-02-22 Montedison Spa Poliesteri aromatici liquido cristallini termotropici.
DE3802511A1 (de) * 1988-01-28 1989-08-10 Huels Chemische Werke Ag Formmassen bestehend aus einem thermoplastisch verarbeitbaren, aromatischen polyesterimid
US4849499A (en) * 1988-08-01 1989-07-18 Eastman Kodak Company Melt processable, liquid crystalline polyesters
US5025082A (en) * 1988-08-24 1991-06-18 Mitsubishi Kasei Corporation Aromatic polyester, aromatic polyester-amide and processes for producing the same
DE3914048A1 (de) * 1988-09-13 1990-03-22 Bayer Ag Leichtfliessende polyamid-formmassen und -legierungen
JPH02196819A (ja) * 1989-01-25 1990-08-03 Nippon Oil Co Ltd 全芳香族ポリエステル
JP2676112B2 (ja) * 1989-05-01 1997-11-12 イビデン株式会社 電子部品搭載用基板の製造方法
US5192581A (en) * 1989-08-10 1993-03-09 Microelectronics And Computer Technology Corporation Protective layer for preventing electroless deposition on a dielectric
JP3086231B2 (ja) 1989-11-01 2000-09-11 ポリプラスチックス株式会社 溶融時に異方性を示すポリエステル樹脂及び樹脂組成物
DE4006404A1 (de) * 1990-03-01 1991-09-05 Bayer Ag Leichtfliessende polyamid-formmassen
US5015722A (en) * 1990-04-04 1991-05-14 Hoechst Celanese Corporation Melt-processable polyester capable of forming an anisotropic melt which exhibits a highly attractive balance between its molding and heat deflection temperatures
US5110896A (en) * 1990-12-10 1992-05-05 E. I. Du Pont De Nemours And Company Thermotropic liquid crystalline polyester compositions
US5137618A (en) * 1991-06-07 1992-08-11 Foster Miller, Inc. Methods for manufacture of multilayer circuit boards
DE4417245A1 (de) * 1994-04-23 1995-10-26 Lpkf Cad Cam Systeme Gmbh Verfahren zur strukturierten Metallisierung der Oberfläche von Substraten
GB9420182D0 (en) * 1994-10-06 1994-11-23 Int Computers Ltd Printed circuit manufacture
JP3466355B2 (ja) * 1994-12-27 2003-11-10 三菱製紙株式会社 画像形成材料、画像形成方法、およびプリント配線板の製造方法
US6120131A (en) * 1995-08-28 2000-09-19 Lexmark International, Inc. Method of forming an inkjet printhead nozzle structure
US5674372A (en) * 1996-09-24 1997-10-07 Mac Dermid, Incorporated Process for preparing a non-conductive substrate for electroplating
US6251732B1 (en) * 1999-08-10 2001-06-26 Macronix International Co., Ltd. Method and apparatus for forming self-aligned code structures for semi conductor devices
US6361923B1 (en) * 1999-08-17 2002-03-26 International Business Machines Corporation Laser ablatable material and its use
DE19944908A1 (de) * 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten
US6492075B1 (en) * 2000-06-16 2002-12-10 Advanced Micro Devices, Inc. Chemical trim process
US20040170846A1 (en) * 2000-12-05 2004-09-02 Masaru Seita Resin composite material and method of forming the same
SG98017A1 (en) * 2000-12-19 2003-08-20 Inst Materials Research & Eng Method of forming selective electronics plating on polymer surfaces
GB2381274A (en) * 2001-10-29 2003-04-30 Qinetiq Ltd High resolution patterning method
JP2003305792A (ja) * 2002-04-15 2003-10-28 Toray Ind Inc 積層樹脂シート
US7235348B2 (en) * 2003-05-22 2007-06-26 Taiwan Semiconductor Manufacturing Co., Ltd. Water soluble negative tone photoresist
KR101076623B1 (ko) * 2003-07-17 2011-10-27 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 미세 패턴 형성 재료 및 이를 사용한 미세 패턴 형성방법
US7618704B2 (en) * 2003-09-29 2009-11-17 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
DE102004003890A1 (de) * 2004-01-27 2005-08-11 Mitsubishi Polyester Film Gmbh Mittels elektromagnetischer Strahlung ein- oder mehrschichtige, orientierte strukturierbare Folie aus thermoplastischem Polymer, Verfahren zu ihrer Herstellung und ihre Verwendung
DE102004003891A1 (de) * 2004-01-27 2005-08-11 Mitsubishi Polyester Film Gmbh Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung
US20060083939A1 (en) * 2004-10-20 2006-04-20 Dunbar Meredith L Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto
US7510951B2 (en) * 2005-05-12 2009-03-31 Lg Chem, Ltd. Method for forming high-resolution pattern with direct writing means
US7547849B2 (en) 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
US7237334B2 (en) * 2005-08-18 2007-07-03 Intel Corporation Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate

Also Published As

Publication number Publication date
TW200922395A (en) 2009-05-16
EP2165582B1 (en) 2012-08-22
WO2009009072A1 (en) 2009-01-15
JP2010534404A (ja) 2010-11-04
EP2165582A1 (en) 2010-03-24
US20090017309A1 (en) 2009-01-15

Similar Documents

Publication Publication Date Title
TWI365686B (en) Compositions and methods for creating electronic circuitry
ZA201001300B (en) Antigen-asjuvant compositions and methods
IL195619A0 (en) Compositions and methods for joininig non-conjoined iumens
LT2137210T (lt) Naujas būdas ir kompozicijos
EP2219554A4 (en) PROGESTER-CONTAINING COMPOSITIONS AND DEVICES
EP2086318A4 (en) NEUROPROTEKTIVE COMPOSITIONS AND METHOD
IL210153A0 (en) Nutrigenomics methods and compositions
EP2217250A4 (en) IMMUNOREGULATORY COMPOUNDS AND RELATED COMPOSITIONS AND METHODS
HK1137670A1 (zh) 用於關節固定過程的組合物和方法
EP2101731A4 (en) PROCESSES AND COMPOSITIONS WITH END OXIFES
EP2207420A4 (en) ANTIGLIFERING METHOD AND COMPOSITIONS
IL212822A0 (en) Anti-cxcr1 compositions and methods
GB0819530D0 (en) Methods and compositions
GB0709781D0 (en) Composition and method
GB0721291D0 (en) Methods and compositions
EP2152247A4 (en) COMPOSITIONS AND METHODS ANTI-INSOMNIA
GB0724967D0 (en) Composition and method
EP2088865A4 (en) METHODS AND COMPOSITIONS AROUND GUGGULPHOSPHOLIPIDS
IL205248A0 (en) Compositions and methods for making androstenediones
GB0617171D0 (en) Novel compositions and methods
GB0719526D0 (en) Compositions and methods
EP2247303A4 (en) HEMOSTASE MODULATING COMPOSITIONS AND USES THEREFOR
IL193921A0 (en) Maduramicin compositions and methods
GB0715428D0 (en) Compositions and uses thereof
GB0701170D0 (en) Compositions and uses thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees