TWI365481B - Semi-compliant joining mechanism for semiconductor cooling applications - Google Patents
Semi-compliant joining mechanism for semiconductor cooling applicationsInfo
- Publication number
- TWI365481B TWI365481B TW094115837A TW94115837A TWI365481B TW I365481 B TWI365481 B TW I365481B TW 094115837 A TW094115837 A TW 094115837A TW 94115837 A TW94115837 A TW 94115837A TW I365481 B TWI365481 B TW I365481B
- Authority
- TW
- Taiwan
- Prior art keywords
- semi
- semiconductor cooling
- joining mechanism
- cooling applications
- compliant
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57726204P | 2004-06-04 | 2004-06-04 | |
US10/945,807 US7301773B2 (en) | 2004-06-04 | 2004-09-20 | Semi-compliant joining mechanism for semiconductor cooling applications |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200540963A TW200540963A (en) | 2005-12-16 |
TWI365481B true TWI365481B (en) | 2012-06-01 |
Family
ID=35457704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094115837A TWI365481B (en) | 2004-06-04 | 2005-05-16 | Semi-compliant joining mechanism for semiconductor cooling applications |
Country Status (5)
Country | Link |
---|---|
US (1) | US7301773B2 (zh) |
JP (1) | JP2008502138A (zh) |
DE (1) | DE112005001321T5 (zh) |
TW (1) | TWI365481B (zh) |
WO (1) | WO2005122662A2 (zh) |
Families Citing this family (21)
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US7836597B2 (en) * | 2002-11-01 | 2010-11-23 | Cooligy Inc. | Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system |
US8464781B2 (en) | 2002-11-01 | 2013-06-18 | Cooligy Inc. | Cooling systems incorporating heat exchangers and thermoelectric layers |
US6988535B2 (en) | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Channeled flat plate fin heat exchange system, device and method |
US20040233639A1 (en) * | 2003-01-31 | 2004-11-25 | Cooligy, Inc. | Removeable heat spreader support mechanism and method of manufacturing thereof |
US7591302B1 (en) | 2003-07-23 | 2009-09-22 | Cooligy Inc. | Pump and fan control concepts in a cooling system |
US7616444B2 (en) * | 2004-06-04 | 2009-11-10 | Cooligy Inc. | Gimballed attachment for multiple heat exchangers |
US7243704B2 (en) * | 2004-11-18 | 2007-07-17 | Delta Design, Inc. | Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end |
US7913719B2 (en) | 2006-01-30 | 2011-03-29 | Cooligy Inc. | Tape-wrapped multilayer tubing and methods for making the same |
JP5208769B2 (ja) * | 2006-02-16 | 2013-06-12 | クーリギー インコーポレイテッド | 取付装置 |
US20070227709A1 (en) * | 2006-03-30 | 2007-10-04 | Girish Upadhya | Multi device cooling |
DE112007000768T5 (de) | 2006-03-30 | 2009-02-12 | Cooligy, Inc., Mountain View | Integriertes Modul für die Flüssigkeits-Luft-Leitung |
US7715194B2 (en) | 2006-04-11 | 2010-05-11 | Cooligy Inc. | Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers |
US20070256815A1 (en) * | 2006-05-04 | 2007-11-08 | Cooligy, Inc. | Scalable liquid cooling system with modular radiators |
DE102006052620B4 (de) * | 2006-11-08 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist. |
WO2008137143A1 (en) * | 2007-05-02 | 2008-11-13 | Cooligy Inc. | Micro-tube/multi-port counter flow radiator design for electronic cooling applications |
TW200912621A (en) * | 2007-08-07 | 2009-03-16 | Cooligy Inc | Method and apparatus for providing a supplemental cooling to server racks |
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US8254422B2 (en) | 2008-08-05 | 2012-08-28 | Cooligy Inc. | Microheat exchanger for laser diode cooling |
TW201333412A (zh) * | 2012-02-09 | 2013-08-16 | Hon Hai Prec Ind Co Ltd | 散熱器組合 |
JP6439326B2 (ja) | 2014-08-29 | 2018-12-19 | 株式会社Ihi | リアクタ |
BR112023005201A2 (pt) * | 2020-09-24 | 2023-04-25 | Valgroup S A | Sistema de liquefação contínuo para tratamento de resíduo de plástico |
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-
2004
- 2004-09-20 US US10/945,807 patent/US7301773B2/en active Active
-
2005
- 2005-05-12 DE DE112005001321T patent/DE112005001321T5/de not_active Withdrawn
- 2005-05-12 WO PCT/US2005/016879 patent/WO2005122662A2/en active Application Filing
- 2005-05-12 JP JP2007515165A patent/JP2008502138A/ja active Pending
- 2005-05-16 TW TW094115837A patent/TWI365481B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2005122662A3 (en) | 2007-04-12 |
TW200540963A (en) | 2005-12-16 |
US7301773B2 (en) | 2007-11-27 |
US20050270742A1 (en) | 2005-12-08 |
JP2008502138A (ja) | 2008-01-24 |
DE112005001321T5 (de) | 2007-06-14 |
WO2005122662A2 (en) | 2005-12-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |