TWI365481B - Semi-compliant joining mechanism for semiconductor cooling applications - Google Patents

Semi-compliant joining mechanism for semiconductor cooling applications

Info

Publication number
TWI365481B
TWI365481B TW094115837A TW94115837A TWI365481B TW I365481 B TWI365481 B TW I365481B TW 094115837 A TW094115837 A TW 094115837A TW 94115837 A TW94115837 A TW 94115837A TW I365481 B TWI365481 B TW I365481B
Authority
TW
Taiwan
Prior art keywords
semi
semiconductor cooling
joining mechanism
cooling applications
compliant
Prior art date
Application number
TW094115837A
Other languages
English (en)
Other versions
TW200540963A (en
Inventor
Grant Brewer Richard
Tsao Paul
Herms Richard
Munch Mark
Mcmaster Mark
Corbin Dave
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Publication of TW200540963A publication Critical patent/TW200540963A/zh
Application granted granted Critical
Publication of TWI365481B publication Critical patent/TWI365481B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW094115837A 2004-06-04 2005-05-16 Semi-compliant joining mechanism for semiconductor cooling applications TWI365481B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57726204P 2004-06-04 2004-06-04
US10/945,807 US7301773B2 (en) 2004-06-04 2004-09-20 Semi-compliant joining mechanism for semiconductor cooling applications

Publications (2)

Publication Number Publication Date
TW200540963A TW200540963A (en) 2005-12-16
TWI365481B true TWI365481B (en) 2012-06-01

Family

ID=35457704

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115837A TWI365481B (en) 2004-06-04 2005-05-16 Semi-compliant joining mechanism for semiconductor cooling applications

Country Status (5)

Country Link
US (1) US7301773B2 (zh)
JP (1) JP2008502138A (zh)
DE (1) DE112005001321T5 (zh)
TW (1) TWI365481B (zh)
WO (1) WO2005122662A2 (zh)

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TW200847914A (en) * 2007-05-02 2008-12-01 Cooligy Inc Micro-tube/multi-port counter flow radiator design for electronic cooling applications
TW200934352A (en) * 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
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US8299604B2 (en) 2008-08-05 2012-10-30 Cooligy Inc. Bonded metal and ceramic plates for thermal management of optical and electronic devices
TW201333412A (zh) * 2012-02-09 2013-08-16 Hon Hai Prec Ind Co Ltd 散熱器組合
JP6439326B2 (ja) 2014-08-29 2018-12-19 株式会社Ihi リアクタ
WO2022064426A1 (en) * 2020-09-24 2022-03-31 Valgroup S.A. Continuous liquefying system for waste plastic treatment

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Also Published As

Publication number Publication date
TW200540963A (en) 2005-12-16
US7301773B2 (en) 2007-11-27
WO2005122662A2 (en) 2005-12-22
WO2005122662A3 (en) 2007-04-12
JP2008502138A (ja) 2008-01-24
DE112005001321T5 (de) 2007-06-14
US20050270742A1 (en) 2005-12-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees