JPH0386611U - - Google Patents
Info
- Publication number
- JPH0386611U JPH0386611U JP14803389U JP14803389U JPH0386611U JP H0386611 U JPH0386611 U JP H0386611U JP 14803389 U JP14803389 U JP 14803389U JP 14803389 U JP14803389 U JP 14803389U JP H0386611 U JPH0386611 U JP H0386611U
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- acoustic wave
- surface acoustic
- substrate
- oscillation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010355 oscillation Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010897 surface acoustic wave method Methods 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14803389U JPH0386611U (zh) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14803389U JPH0386611U (zh) | 1989-12-21 | 1989-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0386611U true JPH0386611U (zh) | 1991-09-02 |
Family
ID=31694501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14803389U Pending JPH0386611U (zh) | 1989-12-21 | 1989-12-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0386611U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006101182A (ja) * | 2004-09-29 | 2006-04-13 | Seiko Epson Corp | 発振装置 |
JP2008502138A (ja) * | 2004-06-04 | 2008-01-24 | クーリギー インコーポレイテッド | 半導体冷却装置の連結装置及び取付方法 |
-
1989
- 1989-12-21 JP JP14803389U patent/JPH0386611U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008502138A (ja) * | 2004-06-04 | 2008-01-24 | クーリギー インコーポレイテッド | 半導体冷却装置の連結装置及び取付方法 |
JP2006101182A (ja) * | 2004-09-29 | 2006-04-13 | Seiko Epson Corp | 発振装置 |
JP4538791B2 (ja) * | 2004-09-29 | 2010-09-08 | セイコーエプソン株式会社 | 発振装置および弾性表面波素子の駆動方法 |
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