JPH0386611U - - Google Patents
Info
- Publication number
- JPH0386611U JPH0386611U JP14803389U JP14803389U JPH0386611U JP H0386611 U JPH0386611 U JP H0386611U JP 14803389 U JP14803389 U JP 14803389U JP 14803389 U JP14803389 U JP 14803389U JP H0386611 U JPH0386611 U JP H0386611U
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- acoustic wave
- surface acoustic
- substrate
- oscillation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000010355 oscillation Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010897 surface acoustic wave method Methods 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Description
第１図ａ，ｂは本考案の一実施例を示した平面
図および横断面図、第２図は第１図に示す発振回
路を形成する基板を金属ケース内に密閉した実施
例の断面図、第３図は従来の弾性表面波レゾネー
タの一例の平面図である。
１……基板、２，３……ＩＤＴ電極、４〜７…
…反射器用電極、５１……チツプＩＣ、３１〜３
６……接続用パツド。
Figures 1a and b are a plan view and a cross-sectional view showing an embodiment of the present invention, and Figure 2 is a cross-sectional view of an embodiment in which the substrate forming the oscillation circuit shown in Figure 1 is sealed in a metal case. , FIG. 3 is a plan view of an example of a conventional surface acoustic wave resonator. 1...Substrate, 2, 3...IDT electrode, 4-7...
...Reflector electrode, 51...Chip IC, 31-3
6... Connection pad.
Claims (1)
を薄膜状に複数個形成した多周波発振素子と、前
記多周波発振素子の１個と前記基板上に搭載した
電子部品とにより形成された発振回路と、この発
振回路を含む前記基板を収容して密閉構造とした
ケースとを備え、外部から前記多周波発振素子の
１つを選択できるようにしたことを特徴とする弾
性表面波素子の多周波発振器。 A multi-frequency oscillation element in which a plurality of thin film surface acoustic wave patterns are formed on a substrate having a piezoelectric effect, and an oscillation circuit formed by one of the multi-frequency oscillation elements and an electronic component mounted on the substrate. A multi-frequency oscillator using a surface acoustic wave element, characterized in that the multi-frequency oscillator of a surface acoustic wave element is provided with a case having a sealed structure for accommodating the substrate containing the oscillation circuit, and one of the multi-frequency oscillating elements can be selected from the outside. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14803389U JPH0386611U (en) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14803389U JPH0386611U (en) | 1989-12-21 | 1989-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0386611U true JPH0386611U (en) | 1991-09-02 |
Family
ID=31694501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14803389U Pending JPH0386611U (en) | 1989-12-21 | 1989-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0386611U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006101182A (en) * | 2004-09-29 | 2006-04-13 | Seiko Epson Corp | Oscillator |
| JP2008502138A (en) * | 2004-06-04 | 2008-01-24 | クーリギー インコーポレイテッド | Semiconductor cooling device coupling device and mounting method |
-
1989
- 1989-12-21 JP JP14803389U patent/JPH0386611U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008502138A (en) * | 2004-06-04 | 2008-01-24 | クーリギー インコーポレイテッド | Semiconductor cooling device coupling device and mounting method |
| JP2006101182A (en) * | 2004-09-29 | 2006-04-13 | Seiko Epson Corp | Oscillator |
| JP4538791B2 (en) * | 2004-09-29 | 2010-09-08 | セイコーエプソン株式会社 | Oscillator and surface acoustic wave element driving method |
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