、發明說明： 【發明所屬之技術領域】 本發明係一種應用於電子裝置之散熱模組，特別是一種可防止水 分和鹽分進入電子裝置的散熱模組。 【先前技術】 隨著電腦晶片的處理速度不斷增快，其運作所需消耗的功率和連 帶產生的熱能亦不斷提升，因此散熱問題愈來愈受到人們的重視，尤 其在要求體積輕薄短小的筆記型電腦中更是如此。 傳統上’業界大多透過加裝散熱模组的方式對發熱電子元件進行 散熱，早期的筆記型電腦僅單靠熱管把電子元件於運作中所散發的熱 傳導至機殼作為解熱手段。 然而，隨著電子元件的處理速度愈來愈快，發熱量也愈來愈大， 因此傳統的解熱手段已不敷使用，因而目前多數筆記型電腦中所使用 的散熱模組係由風扇、散熱鰭片以及熱管等所組成。其中，熱管之一 端與電子元件做直接或間接的接觸，另—端則穿設於散_片中以將 電子元件所產生的熱傳導至散誠# ’再彻風扇運轉所產生的冷卻 氣流進-步將傳導至散熱則的熱錄發至外界t，而制散熱的目 的。 但此種解熱手縣增加電子裝置關σ面積賴孔處，對於軍規 或工規之筆記型電腦，除了散關題外，更需兼具防水耐候能力的情 況而言，致有顧此失彼的疑慮。，為了讓筆記型電腦兼具散熱及 防水耐候等功能’除了在筆記型電腦内絲散熱模組外，同時亦需在 筆記型電腦中加設防水模組。 然而’傳統針對軍規或工規之筆記型電腦所生產的散缝組和防 水模組在結構上均係屬不同且相互獨立的設計因而衍生出後段組裝 程序複雜，収使筆記型電動之各個電子元件空間配置受到侷限等 問題。 【發明内容】 有鑑於此，本發明提出一種散熱模、組，應用於電子裝置，其中電 子裝置具有賴殼體，且封體具有—破孔，本散熱敝包含：座 體後封件以及散熱几件，其中座體係正對於破孔且固定於封閉殼體 内側’散熱7C件係穿過封贿體的破孔_定於座體上，而密封件係 沿破孔周緣喊置於頻與封繼體咖密封封酿體之破孔。 此外’本發明亦提出一種電子裝置，包含：封閉殼體、座體、散 熱元件以及密封件’其巾座齡正對於魏且固定於封隨體内側； 散熱7G件係穿過賴殼體的破孔而固定於座體上，而密封件係沿破孔 周緣而設置於座體與_殼體間以密封封職體之破孔。 本發明之絲元件係設置於電抒置之封酿體糊，而電子裝 置所包含之電子元件係設置於封贿體内。其巾，固定於座體上之散 熱7C件财蝴’體的破孔而突出贿驗體外，而座體係正對於 破孔，並且_鎖_方式固定於封閉殼體上。此外…密封件沿破 孔周緣設i於座體與封閉殼體間以密封封閉殼體之破孔。 1364252 上述密封件係由橡膠或矽膠等彈性防水材質製成，當座體鎖固於 封閉殼體上時，透過將密封件鉗持於座體和封閉殼體間而達到密封破 孔的目的，使電子裝置之封閉殼體外的水氣、鹽份和灰塵等物質無法 經由破孔進入封閉殼體内損害設置於其内的電子元件。 综上所述，整合具有彈性及防水特性的密封件、具有散熱功用的 散熱元件與座體，本發明解決了電子裝置的散熱問題以及習知技術上 組裝程序複雜，以及電子元件的空間配置受到侷限等瓶頸。 【實施方式】 有關本發明之技細容、特點及功效，紐合賦與實施例說明 如後》 凊參照「第1酿第2圖」’分別為本發明之封閉殼體之外觀示意 圖與本發明之散熱模組暨電子裝置之爆賴，本發明所提出之散熱模 組係應用於電子裝置卜其中電子裝置i.具有封隨體u，封閉殼體 11具有-破孔⑴，而電子裝置所包含之電子元件(未圖示)係設置於封 閉殼體内。此外，封閉殼體u具有向封閉殼體u内侧凹入之容置槽 27 ’而破孔111係設置於容置槽27底面並延伸至容置槽27麻。本發 明之散熱觀包含：舰2卜雜树22以及密· 24，齡別詳 述如下： 座體21正對於破孔11卜並且固定於封閉殼體u内側，座體21 係以沖塵成型的方式製造而得，且包含底板211與侧壁212。其中，側 6 1364252 壁212具有穿孔213，且穿孔213係、正對於延伸至容置槽27側面之破 孔111。本實施例之座體21係鎖固於封閉殼體u上，且係藉由鎖固件 26自封閉设體11的内側向其外側鎖入，然而本發明並不欲以此為限， 鎖固件26亦可自封閉殼體11的外側向其内侧鎖入。 散熱元件22係穿過破孔ill而固定於座體21上，本實施例之散熱 元件22包含一散熱鰭片221以及一熱管222，其争散熱鰭片221係焊 接於底板211上，熱管222的一端係穿設於散熱鰭片221中，另一端則 依序穿過側壁212之穿孔213以及延伸至容置槽27侧面之破孔111， 進而延伸至封閉殼體11内。藉由延伸至封閉殼體U内之熱管222與設 置於封閉殼體11内之電子元件接觸並進行熱交換，使電子元件所發出 之熱量得以傳導至散熱鰭片221。 此外’本實施例進一步在熱管222與穿孔213之接觸部分塗佈防 水膠，以避免水分或鹽分經由側壁212之穿孔213進入封閉殼體11内 部而對電子元件造成損害。 密封件24係沿封閉殼體η之破孔hi周緣設置於座體21與封閉 殼體11間以密封破孔111。在較佳實施例中，密封件24的材質為橡膠 或矽膠等彈性防水材料’當座體21固定於封閉殼體U上時，密封件 24則被甜持於座體21和封閉殼體u間，藉由其本身的彈性變形填補 座體21與封閉殼體11之間的縫隙，進而防止外界的水氣、鹽分或者灰 塵等經由破孔ill進入封閉殼體η内，損害設置於封閉殼體U内的電 子元件。 7 1364252 另，本實施例更包含-風扇28以及一風扇蓋29，風扇28係設置 於電子裝置1之封閉殼體11的容置槽27中，而風扇蓋29係相對於容 置槽27 Μ合域酿體U上。透過_ 28產生舰散熱元件22 之氣流’將經由熱管222 «至散熱縛片221之熱進一步散發至電子 裝置1之外，提高對電子元件的散熱效果。 本發明亦提出-種電子裝置’包含：封閉殼體u、座體2卜散熱 元件22以及密封件24,如「第2圖」所示。其中： 封閉殼體11 *有一破孔⑴，且具有朝封閉題u内側凹入之容 置槽27, *破孔in係設置於容置槽27底面並延伸至容置槽27側面。 座體21正對於破孔in，並且固定於封閉殼體u内側，本實施例 之座體21係以沖壓成型的方式製造而得，且包含底板211與側壁。 其中’側壁212具有穿孔213 ’且穿孔213係正對於延伸至容置槽27 側面之破孔11卜此外’本實施例之座體21係鎖固於封閉殼體丨丨上， 且係藉由鎖ϋ件26自封義體U的_向其外_人，然而本發明並 不欲以此為限’鎖固件26亦可自封閉殼體^的外側向其内側鎖入。 散熱元件22係穿過破孔πι而固定於座體21上，本實施例之散熱 7G件22包含一散熱鰭片221以及一熱管222，其中散熱鰭片221係焊 接於底板211上’熱管222的一端係穿設於散熱鰭片221中，另一端則 依序穿過側壁212之穿孔213以及延伸至容置槽27侧面之破孔iU， 進而延伸至封閉殼體u内。藉由延伸至封閉殼體u内之熱管222與設 置於封酿冑11 子纟件接駿進行熱錢，使冑子雜所發出BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation module for an electronic device, and more particularly to a heat dissipation module that prevents moisture and salt from entering an electronic device. [Prior Art] As the processing speed of computer chips continues to increase, the power consumed by the operation and the heat energy generated by the operation are also increasing. Therefore, the heat dissipation problem has been paid more and more attention, especially in the case of requiring thin and short notes. This is especially true in computers. Traditionally, most of the industry has used heat-dissipating modules to dissipate heat-generating electronic components. Early notebook computers only used heat pipes to conduct heat from the operation of electronic components to the casing as a means of heat dissipation. However, as the processing speed of electronic components is getting faster and faster, the heat generation is getting larger and larger, so the traditional anti-heating method is not enough. Therefore, the cooling modules used in most notebook computers are cooled by fans and heat. It consists of fins and heat pipes. Wherein, one end of the heat pipe is in direct or indirect contact with the electronic component, and the other end is inserted in the diffused film to conduct the heat generated by the electronic component to the cooling airflow generated by the fan operation. The step of transmitting heat to the heat is transmitted to the outside t, and the purpose of heat dissipation is achieved. However, such an anti-heating county has increased the area of the electronic device to close the σ area. For notebook computers with military regulations or rules, in addition to the problem of scatter, it is necessary to have both waterproof and weather-resistant ability, which leads to doubts about this. In order to make the notebook computer have both heat dissipation and waterproof and weatherproof functions, in addition to the internal cooling module of the notebook computer, it is also necessary to add a waterproof module to the notebook computer. However, the traditional design of the gap group and the waterproof module produced by the notebook computer for military regulations or regulations are different and independent of each other. Therefore, the assembly process of the rear stage is complicated, and the electronic components of the notebook type are received. Space configuration is limited and so on. SUMMARY OF THE INVENTION In view of this, the present invention provides a heat dissipation die and a group for use in an electronic device, wherein the electronic device has a housing, and the sealing body has a broken hole, and the heat dissipation device includes: a rear sealing member and a heat dissipation body. A few pieces, the seat system is for the hole and is fixed on the inside of the closed casing. The heat dissipation 7C is passed through the hole of the sealing body. The seal is placed along the periphery of the hole. Sealed the body of the coffee to seal the broken holes of the brew. In addition, the present invention also provides an electronic device comprising: a closed casing, a seat body, a heat dissipating component, and a sealing member, wherein the towel seat is positively fixed to the inside of the sealing body; the heat dissipating 7G member passes through the casing. The hole is fixed to the seat body, and the sealing member is disposed between the seat body and the _ housing along the periphery of the hole to seal the hole of the sealing body. The silk element of the present invention is disposed on the sealed body paste of the electric device, and the electronic component included in the electronic device is disposed in the sealing body. The towel, which is fixed on the seat body, is a hole in the body of the 7C piece of fuel, and the body is exposed to the body, and the seat system is facing the hole, and the _lock_mode is fixed on the closed casing. In addition, the sealing member is disposed between the seat body and the closed casing along the periphery of the broken hole to seal the hole of the closed casing. 1364252 The above-mentioned sealing member is made of elastic waterproof material such as rubber or silicone rubber. When the seat body is locked on the closed casing, the sealing member is clamped between the seat body and the closed casing to achieve the purpose of sealing and breaking holes. The moisture, salt, dust and the like outside the closed casing of the electronic device cannot enter the closed casing through the broken holes to damage the electronic components disposed therein. In summary, the sealing member having the elastic and waterproof characteristics, the heat dissipating component having the heat dissipating function and the seat body are integrated, and the present invention solves the problem of heat dissipation of the electronic device and the complicated assembly procedure of the prior art, and the spatial arrangement of the electronic component is affected. Bottlenecks such as limitations. [Embodiment] The details, features, and functions of the present invention are described in the following, and the description of the embodiment of the present invention is as follows: The invention relates to a heat dissipation module and an electronic device. The heat dissipation module proposed by the invention is applied to an electronic device, wherein the electronic device has a sealed body u, and the closed casing 11 has a broken hole (1), and the electronic device The included electronic components (not shown) are disposed within the enclosed housing. In addition, the closed casing u has a receiving groove 27 ′ recessed toward the inner side of the closed casing u, and the breaking hole 111 is disposed on the bottom surface of the accommodating groove 27 and extends to the accommodating groove 27. The heat dissipation view of the present invention comprises: a ship 2 and a dense tree 22, and the age is detailed as follows: The seat body 21 is opposite to the hole 11 and is fixed to the inside of the closed casing u, and the seat body 21 is formed by dusting. The method is manufactured and includes a bottom plate 211 and a side wall 212. Wherein, the side 6 1364252 wall 212 has a perforation 213, and the perforation 213 is for the hole 111 extending to the side of the accommodating groove 27. The seat body 21 of the present embodiment is locked to the closed casing u, and is locked from the inner side of the closed body 11 to the outer side thereof by the locking member 26, but the invention is not limited thereto, and the fastener is not limited thereto. 26 can also be locked from the outside of the closed casing 11 to the inside thereof. The heat dissipating component 22 is fixed to the base body 21 through the hole ill. The heat dissipating component 22 of the embodiment includes a heat dissipating fin 221 and a heat pipe 222. The heat dissipating fin 221 is soldered to the bottom plate 211, and the heat pipe 222 is mounted on the bottom plate 211. One end is disposed in the heat dissipation fin 221, and the other end sequentially passes through the through hole 213 of the side wall 212 and the hole 111 extending to the side of the accommodating groove 27, and further extends into the closed casing 11. The heat generated by the electronic component is conducted to the heat radiating fins 221 by the heat pipes 222 extending into the closed casing U contacting the electronic components disposed in the closed casing 11 and performing heat exchange. Further, the present embodiment further applies a water-repellent glue to the contact portion of the heat pipe 222 and the through hole 213 to prevent moisture or salt from entering the inside of the closed casing 11 via the through hole 213 of the side wall 212 to cause damage to the electronic component. The seal member 24 is disposed between the seat body 21 and the closing casing 11 along the periphery of the hole hi of the closing casing n to seal the hole 111. In the preferred embodiment, the material of the sealing member 24 is an elastic waterproof material such as rubber or silicone. When the seat body 21 is fixed to the closed casing U, the sealing member 24 is sweetened to the seat body 21 and the closed casing. In the meantime, the gap between the seat body 21 and the closed casing 11 is filled by its own elastic deformation, thereby preventing the outside water, salt or dust from entering the closed casing η through the hole ill, and the damage is set in the closed casing. Electronic components within body U. 7 1364252 In addition, the fan cover 28 is disposed in the receiving slot 27 of the closed casing 11 of the electronic device 1 , and the fan cover 29 is opposite to the receiving slot 27 . Combine the brewing body U. The airflow of the ship heat dissipating member 22 is transmitted through the heat pipe 222 to the outside of the electronic device 1 through the heat pipe 222, thereby improving the heat dissipation effect on the electronic component. The present invention also proposes an electronic device 'includes a closed casing u, a base 2, a heat dissipating member 22, and a seal member 24, as shown in Fig. 2. The closed casing 11 has a hole (1) and a receiving groove 27 recessed toward the inside of the closing problem u. The hole is provided in the bottom surface of the receiving groove 27 and extends to the side of the receiving groove 27. The seat body 21 is opposite to the hole in and is fixed to the inside of the closed casing u. The seat body 21 of the present embodiment is manufactured by press forming and includes a bottom plate 211 and a side wall. Wherein the side wall 212 has a perforation 213 ′ and the perforation 213 is for the hole 11 extending to the side of the accommodating groove 27, and the seat 21 of the embodiment is locked on the closed casing , by The lock member 26 is self-sealing to the outside of the body U. However, the present invention is not intended to be limited thereto. The lock member 26 can also be locked from the outside of the closed casing to the inside thereof. The heat dissipating component 22 is fixed to the base body 21 through the hole πι. The heat dissipating fin member 221 of the embodiment includes a heat dissipating fin 221 and a heat pipe 222. The heat dissipating fin 221 is soldered to the bottom plate 211. One end is disposed in the heat dissipation fin 221, and the other end sequentially passes through the through hole 213 of the side wall 212 and the hole iU extending to the side of the accommodating groove 27, and further extends into the closed casing u. By the heat pipe 222 extending into the closed casing u and the hot money placed in the sealed 胄 11 sub-piece, the scorpion is issued
1364252 之熱得以傳導至散熱鰭片221。此外，本實施例進一步在熱管222與穿 孔213之接觸部分塗佈防水膠，以避免水分或鹽分經由側壁212之穿 孔213進入封閉殼體11内部而對電子元件造成損害》 密封件24係沿封閉殼體11之破孔111周緣設置於座體21與封閉 殼體11間以密封破孔111。在較佳實施例中，密封件24的材質係為橡 勝或矽膠等彈性防水材料，當座體21固定於封閉殼體^上時，密封件 24則被鉗持於座體21和封閉殼體η間，藉由其本身的彈性變形填補 座體21與封閉殼體11之間的鏠隙，進而防止外界的水氣、鹽分或者灰 塵等經由破孔111進入封閉殼體丨丨内，損害設置於封閉殼體u内的電 子元件。 本實施例亦包含一風扇28以及一風扇蓋29，風扇28係設置於電 子裝置1之麵殼體^的容置槽27巾，而風扇蓋29仙對於容置槽 27 ’並嵌合於封閉殼體u上。透過風扇28產生流經散熱元件r之氣The heat of 1364252 is conducted to the heat sink fins 221. In addition, the embodiment further applies a waterproof glue to the contact portion of the heat pipe 222 and the through hole 213 to prevent moisture or salt from entering the inside of the closed casing 11 through the through hole 213 of the side wall 212 to cause damage to the electronic component. The periphery of the hole 111 of the casing 11 is disposed between the seat body 21 and the closed casing 11 to seal the hole 111. In a preferred embodiment, the material of the sealing member 24 is an elastic waterproof material such as rubber or silicone. When the seat body 21 is fixed to the closed casing, the sealing member 24 is clamped to the seat body 21 and the closing shell. Between the body η, the crevice between the seat body 21 and the closed casing 11 is filled by the elastic deformation of the body, thereby preventing the outside water, salt or dust from entering the closed casing through the hole 111, thereby damaging. An electronic component disposed within the enclosed housing u. This embodiment also includes a fan 28 and a fan cover 29. The fan 28 is disposed on the receiving slot 27 of the outer casing of the electronic device 1, and the fan cover 29 is closed to the receiving slot 27'. On the housing u. Producing a gas flowing through the heat dissipating member r through the fan 28
流’將經由熱管222傳遞至散熱鰭片221之熱進一步散發至電子裝置i 之外，提高對電子元件的散熱效果。 在較佳實施例中，所述之電子裝置！係為一工料腦，工業電腦 與般Φ見之豕用個人電腦之主要差異在於工業電腦對防水以及对候 具有更加嚴格的要求。 π上所述’由於肋容許散航件穿設於電子裝置之封閉殼體夕丨 侧的破孔m ’造成_殼體u在_性上的細，因此本發明除] 利用沿著破孔m周緣設置的密封件24來密封破孔⑴，同時藉由名 9 1364252 熱管222與穿孔213之接觸部分塗佈防水膠，减保電子裝置〗外界的 水分、鹽份和灰塵或其錄質無舰由破孔⑴進人封職體1](内。 據此’本發明不僅整合了防水與散熱功能並解決習知技術上組裝程序 複雜’以及電子元件的空間配置受到侷限等瓶頸，更將散熱元件固定 紐體上，確保散熱元件於電子裝置中的位置避免受到震盈而損壞。 雖然本發_技細容已触較佳實劇減如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精神所作些許 鲁 之更動與满飾’皆應涵蓋於本發明的範嘴内，因此本發明之保護範圍 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖為本發明之封閉殼體之外觀示意圖 第2圖為本發明之散熱模組暨電子裝置之爆炸圖 【主要元件符號說明】 ^ 1........電子裝置 ..........封閉殼體 111........破孔 21 ........座體 211 ........底板 212 ........側壁 213 ........穿孔 22 ........散熱元件 10 1364252 221 ........散熱鰭片 222 ........熱管 24........密封件 26 ........鎖固件 27 ........容置槽 28 ........風扇 29 •風扇蓋The flow 'further dissipates heat transferred to the heat dissipation fins 221 via the heat pipe 222 to the outside of the electronic device i, improving the heat dissipation effect on the electronic components. In a preferred embodiment, the electronic device is described! The main difference between the use of personal computers and industrial PCs is that industrial computers are more stringent in terms of waterproofing and weathering. The above-mentioned π is caused by the ribs allowing the loosening member to pass through the through hole m' of the closed casing of the electronic device, so that the casing u is fine in the _ nature, so the present invention The sealing member 24 is provided at the periphery of the m to seal the hole (1), and the waterproof rubber is coated by the contact portion of the heat pipe 222 and the hole 213 of the name 9 1364252 to reduce the moisture, salt and dust of the electronic device or the recording thereof. The ship is broken by the hole (1) into the body 1] (inside. According to this invention, the invention not only integrates the waterproof and heat dissipation functions, but also solves the complicated assembly process of the prior art, and the space configuration of the electronic components is limited, etc. The heat dissipating component is fixed on the new body to ensure that the position of the heat dissipating component in the electronic device is not damaged by the shock. Although the present invention has been reduced to the above, it is not intended to limit the present invention, and is not familiar with any The subject matter of the present invention is intended to be included in the scope of the present invention, and the scope of the present invention is defined by the scope of the appended claims. [Simplified BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the appearance of a closed casing of the present invention. Fig. 2 is an exploded view of the heat dissipation module and electronic device of the present invention. [Main component symbol description] ^ 1........ Electronic device. .........closed housing 111........ broken hole 21 ........ seat 211 ........ bottom plate 212 ..... ...side wall 213 ........perforation 22 ........heat dissipation element 10 1364252 221 ........heat dissipation fin 222 ........heat pipe 24 ........seal 26 ........locking fastener 27 ........ accommodating groove 28 ........fan 29 •fan cover