JP2011192937A - Electronic controller for vehicle - Google Patents

Electronic controller for vehicle Download PDF

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Publication number
JP2011192937A
JP2011192937A JP2010060075A JP2010060075A JP2011192937A JP 2011192937 A JP2011192937 A JP 2011192937A JP 2010060075 A JP2010060075 A JP 2010060075A JP 2010060075 A JP2010060075 A JP 2010060075A JP 2011192937 A JP2011192937 A JP 2011192937A
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Japan
Prior art keywords
circuit board
heating element
main body
housing
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
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JP2010060075A
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Japanese (ja)
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JP5460397B2 (en
Inventor
Yoshio Kawai
義夫 河合
Eiji Ichikawa
英司 市川
Takayuki Fukuzawa
尭之 福沢
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Priority to JP2010060075A priority Critical patent/JP5460397B2/en
Priority to DE102011012673A priority patent/DE102011012673A1/en
Priority to US13/043,684 priority patent/US8797742B2/en
Priority to CN201110064335.6A priority patent/CN102196713B/en
Publication of JP2011192937A publication Critical patent/JP2011192937A/en
Application granted granted Critical
Publication of JP5460397B2 publication Critical patent/JP5460397B2/en
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To improve heat dissipation property of an electronic controller for vehicle. <P>SOLUTION: In an electronic controller 10 for vehicle which is configured to include a circuit board 20 on which a heating element HE is mounted and a housing 30 accommodating the circuit board 20 therein, on at least one surface of an inner surface and an outer surface of a body 32 or a cover 34 which compose the housing 30, a surface treatment, such as coating or electrodeposition of an insulating material that promotes heat absorption and emission, or alumite treatment is processed. In addition, on the inner surface of the cover 34 that seals an aperture of the body 32 accommodating the circuit board 20, a projection 34A extending toward the heating element HE is formed closer to the heating element HE of the circuit board 20. Heat generated in the heating element HE is transferred to the cover 34 through the projection 34A and dissipated from the outer surface of the cover 34 to the atmosphere. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、自動車に搭載される電子制御装置に関する。   The present invention relates to an electronic control device mounted on an automobile.

自動車に搭載される電子制御装置は、金属製の筐体と、筐体内部に収容される回路基板と、を含んで構成される。回路基板には、半導体スイッチング素子などの発熱素子が実装されているため、発熱素子で発生した熱を、例えば、サーマルビア及び伝熱性接着剤を介して回路基板の反対側に位置する筐体へと移動させ、筐体の外面から大気中へと放熱する放熱構造が採用されている。そして、発熱素子から筐体への熱移動、筐体から大気中への放熱を良好ならしめるため、特開２００４−３０４２００号公報（特許文献１）に記載されるように、筐体表面に表面処理を施す技術が提案されている。   An electronic control device mounted on an automobile includes a metal casing and a circuit board accommodated in the casing. Since a heat generating element such as a semiconductor switching element is mounted on the circuit board, the heat generated by the heat generating element is transferred to, for example, a housing located on the opposite side of the circuit board via a thermal via and a heat conductive adhesive. And a heat dissipation structure that dissipates heat from the outer surface of the housing to the atmosphere is employed. In order to improve heat transfer from the heating element to the casing and heat dissipation from the casing to the atmosphere, as described in JP-A-2004-304200 (Patent Document 1), the surface of the casing is Techniques for performing processing have been proposed.

特開２００４−３０４２００号公報JP 2004-304200 A

しかしながら、従来の提案技術では、筐体表面に施した表面処理で、発熱素子からの放射熱を吸収する構造であったため、発熱素子と筐体表面とが離れていると、発熱素子から筐体への熱移動が十分行われないおそれがあった。   However, in the conventional proposed technology, the surface treatment applied to the surface of the housing absorbs the radiant heat from the heat generating element. Therefore, if the heat generating element and the surface of the housing are separated from each other, There was a risk that heat transfer to

そこで、本発明は従来技術の問題点に鑑み、発熱素子から筐体への熱伝達構造を見直すことで、放熱性を向上させた自動車用電子制御装置を提供することを目的とする。   SUMMARY OF THE INVENTION In view of the problems of the prior art, an object of the present invention is to provide an automotive electronic control device with improved heat dissipation by reviewing a heat transfer structure from a heating element to a housing.

このため、本発明では、電子部品を実装する回路基板と、回路基板を内部に収容する金属製の筐体と、を備えた自動車用電子制御装置において、筐体の内面及び外面のうち少なくとも片面に、熱の吸収及び放射を促進する表面処理を施す。また、筐体の内面に、回路基板の発熱部位に近接するように、発熱部位へと向かって延びる突出部を形成する。   For this reason, in the present invention, in an automotive electronic control device comprising a circuit board on which electronic components are mounted and a metal housing that houses the circuit board, at least one of the inner surface and outer surface of the housing And surface treatment that promotes heat absorption and radiation. In addition, a protrusion that extends toward the heat generating part is formed on the inner surface of the housing so as to be close to the heat generating part of the circuit board.

本発明によれば、回路基板の発熱部位で発生した熱は、突出部を介して筐体へと伝達される。このとき、突出部が発熱部位に近接しているため、発熱部位で発生した熱を筐体へと効果的に伝達することができる。そして、筐体へと伝達された熱は、その外面から大気中へと放熱される。ここで、突出部を含む筐体の内面に表面処理を施しておけば、発熱部位で発熱した熱の吸収を促進することができる。一方、筐体の外面に表面処理を施しておけば、その外面から大気中への放熱効果を高めることができる。このため、自動車用電子制御装置の放熱性を向上させることができる。   According to the present invention, the heat generated at the heat generating portion of the circuit board is transmitted to the housing through the protruding portion. At this time, since the protrusion is close to the heat generating part, the heat generated in the heat generating part can be effectively transmitted to the housing. And the heat transmitted to the housing is radiated from the outer surface to the atmosphere. Here, if the surface treatment is applied to the inner surface of the housing including the protruding portion, it is possible to promote the absorption of heat generated at the heat generating portion. On the other hand, if a surface treatment is applied to the outer surface of the housing, the heat radiation effect from the outer surface to the atmosphere can be enhanced. For this reason, the heat dissipation of the electronic control apparatus for motor vehicles can be improved.

自動車用電子制御装置の一例を示す斜視図である。It is a perspective view which shows an example of the electronic controller for motor vehicles. 図１におけるＡ−Ａ断面図である。It is AA sectional drawing in FIG. 突出部の第１変形例を示す要部断面図である。It is principal part sectional drawing which shows the 1st modification of a protrusion part. 突出部の第２変形例を示す要部断面図である。It is principal part sectional drawing which shows the 2nd modification of a protrusion part. 突出部の第３変形例を示す要部断面図である。It is principal part sectional drawing which shows the 3rd modification of a protrusion part. 発熱素子の他の実装方法を示す要部断面図である。It is principal part sectional drawing which shows the other mounting method of a heat generating element. 本体の変形例を示す要部断面図である。It is principal part sectional drawing which shows the modification of a main body.

以下、添付された図面を参照して本発明を詳述する。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

図１は、自動車用電子制御装置（以下「電子制御装置」という）の一例を示す。   FIG. 1 shows an example of an automotive electronic control device (hereinafter referred to as “electronic control device”).

電子制御装置１０は、電子部品としての発熱素子ＨＥが少なくとも表面に実装された回路基板２０と、回路基板２０を内部に収容する筐体３０と、を含んで構成される。筐体３０は、回路基板２０を収容するための凹部３２Ａが陥凹形成された本体３２と、本体３２の開口を閉塞する蓋３４と、を含んで構成される。本体３２及び蓋３４は、夫々、アルミニウム（Ａｌ），マグネシウム（Ｍｇ），鉄（Ｆｅ）などを主成分とする合金からなり、金型を用いた鋳造，プレス又は切削加工などにより製造される。   The electronic control device 10 is configured to include a circuit board 20 on which at least a heat generating element HE as an electronic component is mounted, and a housing 30 that houses the circuit board 20 therein. The housing 30 includes a main body 32 in which a concave portion 32 </ b> A for housing the circuit board 20 is formed, and a lid 34 that closes an opening of the main body 32. The main body 32 and the lid 34 are each made of an alloy mainly composed of aluminum (Al), magnesium (Mg), iron (Fe), or the like, and are manufactured by casting, pressing or cutting using a mold.

本体３２は、平面視で略角丸四角形の外形を有し、その一面から反対側に位置する他面に向けて、回路基板２０を収容するための凹部３２Ａが陥凹形成される。本体３２の四隅には、締結部材の一例としてのネジ４０を用いて、蓋３４を締結するための雌ネジ３２Ｂが形成される。また、本体３２の凹部３２Ａには、図２に示すように、締結部材の一例としてのネジ５０を用いて、回路基板２０を支持しつつ固定するために、先端に雌ネジが形成されたボス（台座）３２Ｃが複数立設される。さらに、本体３２の凹部３２Ａの周囲には、蓋３４との間のシールを確保する目的で、例えば、Ｏリング，シリコーン，接着剤などの弾性部材６０が嵌合する周溝３２Ｄが陥凹形成される。一方、蓋３４は、平面視で略角丸四角形の外形を有し、その四隅にネジ４０が挿通する挿通孔が夫々開設される。   The main body 32 has a substantially rounded quadrangular outer shape in plan view, and a concave portion 32A for accommodating the circuit board 20 is recessed from one surface to the other surface located on the opposite side. Female screws 32B for fastening the lid 34 are formed at the four corners of the main body 32 using screws 40 as an example of a fastening member. Further, as shown in FIG. 2, a boss having a female screw formed at the tip is used in the recess 32 </ b> A of the main body 32 in order to support and fix the circuit board 20 using a screw 50 as an example of a fastening member. A plurality of (pedestal) 32C are erected. Further, a circumferential groove 32D into which an elastic member 60 such as an O-ring, silicone, adhesive, etc. is fitted is formed in the periphery of the recess 32A of the main body 32 for the purpose of ensuring a seal with the lid 34. Is done. On the other hand, the lid 34 has a substantially rounded quadrangular outer shape in plan view, and insertion holes through which the screws 40 are inserted are respectively opened at the four corners.

回路基板２０は、図２に示すように、発熱素子ＨＥが実装されている部分にサーマルビア２０Ａが開設され、伝熱性を有する接着剤７０を介在させて、本体３２の凹部３２Ａの底面と接触されている。また、発熱素子ＨＥが接触する本体３２の外面には、発熱素子ＨＥから本体３２へと伝達された熱を大気中に放熱するため、公知の放熱フィン３２Ｅが列設される。なお、接着剤７０の代わりに、伝熱性を有するグリース，放熱シートなどを用いてもよい。   As shown in FIG. 2, the circuit board 20 is provided with a thermal via 20 </ b> A at a portion where the heating element HE is mounted, and contacts the bottom surface of the recess 32 </ b> A of the main body 32 with an adhesive 70 having heat conductivity interposed therebetween. Has been. Further, on the outer surface of the main body 32 with which the heat generating element HE contacts, known heat dissipating fins 32E are arranged in a row in order to dissipate heat transferred from the heat generating element HE to the main body 32 into the atmosphere. In place of the adhesive 70, heat conductive grease, a heat radiation sheet, or the like may be used.

本体３２及び蓋３４の内面及び外面のうち少なくとも片面には、発熱素子ＨＥからの放射熱吸収及び筐体３０からの熱放射を促進するための表面処理が施される。表面処理の一例としては、絶縁材料の塗布又は電着等，アルマイト処理などが適用できる。   At least one of the inner and outer surfaces of the main body 32 and the lid 34 is subjected to a surface treatment for promoting radiant heat absorption from the heating element HE and heat radiation from the housing 30. As an example of the surface treatment, alumite treatment such as application or electrodeposition of an insulating material can be applied.

また、蓋３４の内面には、発熱素子ＨＥからの放射熱の吸収を促進することを目的として、図２に示すように、回路基板２０の発熱素子ＨＥに近接するように、発熱素子ＨＥへと向かって延びる突出部３４Ａが突出形成される。図示の例では、２つの発熱素子ＨＥが近接して実装されているため、２つの突出部３４Ａが一体化された形状となっているが、２つの突出部３４Ａを明確に分けた形状としてもよい。ここで、突出部３４Ａの先端が発熱素子ＨＥに接触すると、振動などにより回路基板２０に応力が作用してしまうため、筐体３０の寸法などを考慮して、突出部３４Ａの先端が発熱素子ＨＥに接触しないクリアランスを確保することが望ましい。なお、発熱素子ＨＥと蓋３４の突出部３４Ａとの間に、伝熱性を有するグリースなどを介在させるようにしてもよい。   Further, for the purpose of promoting absorption of radiant heat from the heating element HE, the inner surface of the lid 34 is connected to the heating element HE so as to be close to the heating element HE of the circuit board 20 as shown in FIG. A protruding portion 34A extending toward the top is formed to protrude. In the illustrated example, since the two heating elements HE are mounted close to each other, the two protrusions 34A are integrated, but the two protrusions 34A may be clearly separated. Good. Here, when the tip of the protruding portion 34A comes into contact with the heating element HE, stress is applied to the circuit board 20 due to vibration or the like. It is desirable to ensure a clearance that does not contact the HE. In addition, you may make it interpose the grease etc. which have heat conductivity between the heat generating element HE and the protrusion part 34A of the lid | cover 34. FIG.

このような電子制御装置１０によれば、回路基板２０の発熱素子ＨＥで発生した熱は、次のような２つの経路を経て筐体３０へと伝達され、その外面から大気中へと放熱される。即ち、発熱素子ＨＥで発生した熱は、サーマルビア２０Ａ及び接着剤７０を介して本体３２へと伝達される。また、発熱素子ＨＥで発生した熱は、突出部３４Ａを介して蓋３４へと伝達される。このとき、突出部３４Ａの先端が発熱素子ＨＥに近接しているため、発熱素子ＨＥからの放射熱の吸収が促進され、発熱素子ＨＥで発生した熱を蓋３４へと効果的に伝達することができる。そして、本体３２及び蓋３４へと伝達された熱は、放熱フィン３２Ｅ及び外面から大気中へと放熱される。ここで、突出部３４Ａを含む蓋３４の内面に表面処理を施しておけば、発熱素子ＨＥで発生した熱の吸収を促進することができる。一方、本体３２及び蓋３４の外面に表面処理を施しておけば、その外面から大気中への放熱効果を高めることができる。   According to such an electronic control device 10, heat generated by the heating element HE of the circuit board 20 is transmitted to the housing 30 through the following two paths, and is radiated from the outer surface to the atmosphere. The That is, the heat generated by the heating element HE is transmitted to the main body 32 through the thermal via 20A and the adhesive 70. Further, the heat generated by the heating element HE is transmitted to the lid 34 through the protrusion 34A. At this time, since the tip of the protrusion 34A is close to the heating element HE, absorption of radiant heat from the heating element HE is promoted, and heat generated by the heating element HE is effectively transferred to the lid 34. Can do. The heat transferred to the main body 32 and the lid 34 is radiated from the heat radiation fins 32E and the outer surface to the atmosphere. Here, if a surface treatment is applied to the inner surface of the lid 34 including the protruding portion 34A, absorption of heat generated by the heating element HE can be promoted. On the other hand, if surface treatment is performed on the outer surfaces of the main body 32 and the lid 34, the heat radiation effect from the outer surfaces to the atmosphere can be enhanced.

ところで、突出部３４Ａと発熱素子ＨＥとのクリアランスは、突出部３４Ａの先端が発熱素子ＨＥ及びその近傍に接触しない限りにおいて、できるだけ小さい方が伝熱の面から有利である。このため、突出部３４Ａは、本体３２と蓋３４との接合部分の近傍、又は、回路基板２０を本体３２に固定するボス３２Ｃの近傍に形成することが望ましい。このようにすれば、本体３２に対する回路基板２０の固定剛性が高い部分に突出部３４Ａが位置するため、例えば、振動，外部からの応力などにより回路基板２０又は筐体３０が多少変形しても、発熱素子ＨＥ及びその近傍と突出部３４Ａの先端とが接触することを抑制できる。接合部分又はボス３２Ｃの近傍に突出部３２Ａを形成することが困難であるときには、次に回路基板２０の固定剛性が高いと考えられる、２つのボス３２Ｃを結んだ線分にかかる位置に突出部３２Ａを形成することもできる。なお、突出部３２Ａに対向する位置に、回路基板２０の発熱素子ＨＥを実装すべきことは言うまでもない。   By the way, it is advantageous in terms of heat transfer that the clearance between the protruding portion 34A and the heating element HE is as small as possible as long as the tip of the protruding portion 34A does not contact the heating element HE and its vicinity. For this reason, it is desirable that the protruding portion 34 </ b> A is formed in the vicinity of the joint portion between the main body 32 and the lid 34, or in the vicinity of the boss 32 </ b> C that fixes the circuit board 20 to the main body 32. In this way, since the protruding portion 34A is located at a portion where the fixing rigidity of the circuit board 20 with respect to the main body 32 is high, for example, even if the circuit board 20 or the housing 30 is slightly deformed due to vibration, external stress, or the like. The heating element HE and the vicinity thereof and the tip of the protruding portion 34A can be prevented from contacting each other. When it is difficult to form the protruding portion 32A in the vicinity of the joint portion or the boss 32C, the protruding portion is located at a position corresponding to a line segment connecting the two bosses 32C, which is considered to have the next high fixing rigidity of the circuit board 20. 32A can also be formed. Needless to say, the heating element HE of the circuit board 20 should be mounted at a position facing the protruding portion 32A.

また、発熱素子ＨＥから突出部３４Ａへの熱伝達を良好ならしめるために、図３に示すように、突出部３４Ａに、発熱素子ＨＥの側壁を覆うように、発熱素子ＨＥへと向かって延びる延設部３４Ｂを一体化してもよい。このようにすれば、発熱素子ＨＥで発生した熱が延設部３４Ｂにも伝達されるため、筐体３０への熱伝達をさらに促進することができる。この場合、延設部３４Ｂは、発熱素子ＨＥの側壁の少なくとも一部、例えば、発熱素子ＨＥが略直方体を有していれば、４つの側壁のうち少なくとも１面を覆っていればよい。   Further, in order to improve heat transfer from the heating element HE to the protrusion 34A, as shown in FIG. 3, the protrusion 34A extends toward the heating element HE so as to cover the side wall of the heating element HE. The extending portion 34B may be integrated. In this way, the heat generated in the heating element HE is also transmitted to the extending portion 34B, so that the heat transfer to the housing 30 can be further promoted. In this case, the extending portion 34B may cover at least one surface of the four side walls if at least a part of the side walls of the heating element HE, for example, the heating element HE has a substantially rectangular parallelepiped.

本体３２及び蓋３４が金型を用いた鋳造により製造される場合、金型から本体３２又は蓋３４を離型するためのイジェクトピンで押された痕が残ってしまう。イジェクトピンの痕は、これと接触した部分が陥凹する一方、その周囲が盛り上がってしまうため、突出部３４Ａと発熱素子ＨＥとのクリアランスを小さくすることが困難になることから、突出部３４Ａの先端にイジェクトピンの痕が残ってしまうことは望ましくない。このため、突出部３４Ａをイジェクトピンが押す金型を使用する場合には、図４に示すように、突出部３４Ａの先端に、イジェクトピンの痕が収まるような陥凹部３４Ｃを陥凹形成するとよい。陥凹部３４Ｃの深さは、イジェクトピンが接触することで盛り上がる高さよりも大きく、陥凹部３４Ｃの径は、発熱素子ＨＥから突出部３４Ａへの伝熱性能を確保する観点から、イジェクトピンの径より若干大きくすればよい。なお、図示の例では、突出部３４Ａの先端に延設部３４Ｂが一体化されているが、延設部３４Ｂがなくてもよい。   In the case where the main body 32 and the lid 34 are manufactured by casting using a mold, there remains a mark pressed by an eject pin for releasing the main body 32 or the lid 34 from the mold. The portion of the ejector pin that is in contact with this is recessed, but the periphery of the ejector pin is raised, making it difficult to reduce the clearance between the protrusion 34A and the heating element HE. It is not desirable that the ejector pin mark remain at the tip. For this reason, when using a mold in which the ejector pin pushes the protrusion 34A, as shown in FIG. 4, a recess 34C is formed at the tip of the protrusion 34A so that the mark of the eject pin can be accommodated. Good. The depth of the recessed portion 34C is larger than the height raised by the contact of the eject pin, and the diameter of the recessed portion 34C is the diameter of the eject pin from the viewpoint of ensuring the heat transfer performance from the heating element HE to the protruding portion 34A. It may be slightly larger. In the illustrated example, the extending portion 34B is integrated with the tip of the protruding portion 34A, but the extending portion 34B may not be provided.

また、２つの発熱素子ＨＥが近接して実装されない回路基板２０においては、図５に示すように、発熱素子ＨＥと対向する範囲を越えて突出部３４Ａを突出形成し、発熱素子ＨＥと対向しない部分をイジェクトピンが押すようにしてもよい。   Further, in the circuit board 20 in which the two heating elements HE are not mounted close to each other, as shown in FIG. 5, the protruding portion 34A is formed to protrude beyond the range facing the heating element HE and does not face the heating element HE. You may make it an eject pin push a part.

発熱素子ＨＥは、図６に示すように、本体３２の凹部３２Ａの底面に対向する回路基板２０の裏面に取り付けるようにしてもよい。この場合には、本体３２の凹部３２Ａに、発熱素子ＨＥへと向かって延びる突出部３２Ｆを形成する。このようにすれば、突出部３２Ｆへの放熱により、回路基板２０の表面からの放熱分を軽減できることから、従来サーマルビアなどを配設して専ら放熱に用いていた回路基板２０の表面は、発熱素子ＨＥの放熱のために使用されず、ここに他の電子部品（発熱素子を含む）を実装することが可能となり、電子制御装置１０の小型化を図ることができる。また、この場合、蓋３４は積極的な熱伝達及び放熱等の役割が減少するため、蓋３４の材料として樹脂などの熱伝導の小さい材料を使用したり、蓋３４の代わりに樹脂等を充填して本体３２の開口を閉塞するようにしてもよい。   As shown in FIG. 6, the heating element HE may be attached to the back surface of the circuit board 20 facing the bottom surface of the recess 32 </ b> A of the main body 32. In this case, a protrusion 32F extending toward the heating element HE is formed in the recess 32A of the main body 32. In this way, since the heat radiation from the surface of the circuit board 20 can be reduced by the heat radiation to the projecting portion 32F, the surface of the circuit board 20 that is conventionally used for heat radiation by providing a thermal via or the like is It is not used for heat dissipation of the heating element HE, and other electronic components (including the heating element) can be mounted here, and the electronic control device 10 can be downsized. Further, in this case, since the role of the active heat transfer and heat dissipation is reduced, the lid 34 uses a material having a small thermal conductivity such as a resin as the material of the lid 34 or is filled with a resin or the like instead of the lid 34. Then, the opening of the main body 32 may be closed.

なお、突出部３２Ｆ又は３４Ａは、発熱素子ＨＥに対向する部分に限らず、発熱素子ＨＥ，基板パターン，放熱半田及びこれらの周辺を含んだ部位に形成してもよい。また、突出部３２Ｆ又は３４Ａの裏側にあたる本体３２又は蓋３４の外面は、平坦形状，陥凹形状（図７参照），フィン形状，陥凹部にフィンが列設された形状に形成されていてもよい。さらに、各図面に記載した構成を適宜組み合わせてもよい。   Note that the protrusion 32F or 34A is not limited to the portion facing the heat generating element HE, and may be formed in a portion including the heat generating element HE, the substrate pattern, the heat dissipating solder, and the periphery thereof. Further, the outer surface of the main body 32 or the lid 34 on the back side of the protrusion 32F or 34A may be formed in a flat shape, a recessed shape (see FIG. 7), a fin shape, or a shape in which fins are arranged in the recessed portion. Good. Furthermore, you may combine the structure described in each drawing suitably.

ここで、前記実施形態から把握し得る請求項以外の技術的思想について、以下に効果と共に記載する。
（イ）前記表面処理は、絶縁材料の塗布又は電着等，アルマイト処理などであることを特徴とする請求項１〜請求項４のいずれか１つに記載の自動車用電子制御装置。 Here, technical ideas other than the claims that can be grasped from the embodiment will be described together with effects.
(A) The surface treatment is an alumite treatment such as coating or electrodeposition of an insulating material, or the like. The electronic control device for an automobile according to any one of claims 1 to 4.

この発明によれば、熱の吸収及び放射を促進する表面処理を容易に実現することができる。
（ロ）前記発熱部位は、発熱素子，基板パターン，放熱半田及びこれらの周辺を含んだ部位であることを特徴とする請求項１〜請求項４及び（イ）のいずれか１つに記載の自動車用電子制御装置。 According to the present invention, it is possible to easily realize a surface treatment that promotes heat absorption and radiation.
(B) The heat generating part is a part including a heat generating element, a substrate pattern, a heat dissipating solder, and a periphery thereof, according to any one of claims 1 to 4 and (a). Electronic control device for automobiles.

この発明によれば、実際に発熱する発熱素子に限らず、その周囲を含んだ部位の熱が放熱されるため、回路基板の温度を効果的に低下させることができる。
（ハ）前記突出部の裏側にあたる筐体の外面は、平坦形状，陥凹形状，フィン形状，陥凹部にフィンが列設された形状に形成されたことを特徴とする請求項１〜請求項４，（イ）及び（ロ）のいずれか１つに記載の自動車用電子制御装置。 According to the present invention, not only the heat generating element that actually generates heat, but also the heat of the portion including the periphery is radiated, so the temperature of the circuit board can be effectively reduced.
(C) The outer surface of the casing corresponding to the back side of the projecting portion is formed in a flat shape, a recessed shape, a fin shape, and a shape in which fins are arranged in the recessed portion. 4. The electronic control device for an automobile according to any one of (i) and (b).

この発明によれば、突出部を介して筐体に伝達された熱は、筐体の外面から大気中に放熱することができる。このとき、筐体の外面をフィン形状，陥凹部にフィンが列設された形状とすれば、放熱のための表面積を増やすことができる。
（ニ）前記突出部は、前記回路基板を本体に締結する複数のボスのうち、２つのボスを結んだ線分にかかる位置にあることを特徴とする請求項１〜請求項４及び（イ）〜（ハ）のいずれか１つに記載の自動車用電子制御装置。 According to this invention, the heat transmitted to the housing via the protruding portion can be radiated from the outer surface of the housing to the atmosphere. At this time, if the outer surface of the housing has a fin shape and fins are arranged in the recessed portion, the surface area for heat dissipation can be increased.
(D) The protruding portion is located at a position on a line segment connecting two bosses among a plurality of bosses that fasten the circuit board to the main body. The electronic control device for automobiles according to any one of (1) to (iii).

この発明によれば、本体と蓋との接合部分又はボスの近傍に突出部を形成することが困難であっても、次に回路基板の固定剛性が高いと考えられる位置に突出部を形成することができる。このため、突出部と発熱部位とのクリアランスを小さくすることができる。
（ホ）前記突出部は、前記発熱部位と対向する範囲を越えて形成され、前記筐体を鋳造により製造するときに使用する離型用のイジェクトピンが、前記発熱部位と対向する範囲を越えて形成された突出部の部分を押すことを特徴とする請求項１〜請求項４及び（イ）〜（ニ）のいずれか１つに記載の自動車用電子制御装置。 According to the present invention, even if it is difficult to form the protruding portion in the vicinity of the joint portion of the main body and the lid or the boss, the protruding portion is formed at a position where the fixing rigidity of the circuit board is considered to be high next. be able to. For this reason, the clearance between the protruding portion and the heat generating portion can be reduced.
(E) The protruding portion is formed beyond a range facing the heat generating portion, and an ejection pin used for releasing when the casing is manufactured by casting exceeds a range facing the heat generating portion. 5. The automobile electronic control device according to any one of claims 1 to 4, and (a) to (d), wherein a portion of the protruding portion formed by pressing is pushed.

この発明によれば、発熱部位から突出部へと熱伝達する面積を小さくせずに、イジェクトピンが筐体を押す部分を確保することができる。
（ヘ）前記突出部の陥凹部は、前記イジェクトピンと当たる部分の周辺のみ陥凹形成されていることを特徴とする請求項４記載の自動車用電子制御装置。 According to the present invention, it is possible to secure a portion where the eject pin pushes the housing without reducing the area for heat transfer from the heat generating portion to the protruding portion.
(F) The electronic control device for an automobile according to claim 4, wherein the recessed portion of the projecting portion is formed only in the periphery of a portion that contacts the eject pin.

この発明によれば、発熱部位から突出部へと熱伝達する面積の減少を抑制できる。   According to the present invention, it is possible to suppress a decrease in the area of heat transfer from the heat generating portion to the protrusion.

２０ 回路基板
３０ 筐体
３２ 本体
３２Ａ 凹部
３２Ｃ ボス
３２Ｆ 突出部
３４ 蓋
３４Ａ 突出部
３４Ｂ 延設部
３４Ｃ 陥凹部
ＨＥ 発熱素子 20 circuit board 30 housing 32 main body 32A recess 32C boss 32F protrusion 34 lid 34A protrusion 34B extension 34C recess HE heating element

Claims (4)

電子部品を実装する回路基板と、
前記回路基板を内部に収容する金属製の筐体と、
を備えた自動車用電子制御装置において、
前記筐体の内面及び外面のうち少なくとも片面に、熱の吸収及び放射を促進する表面処理を施すと共に、前記筐体の内面に、前記回路基板の発熱部位に近接するように、該発熱部位へと向かって延びる突出部を形成したことを特徴とする自動車用電子制御装置。 A circuit board for mounting electronic components;
A metal housing that houses the circuit board therein;
In an automotive electronic control device comprising:
At least one of the inner surface and the outer surface of the housing is subjected to a surface treatment that promotes heat absorption and radiation, and the inner surface of the housing is moved to the heat generating portion so as to be close to the heat generating portion of the circuit board. An automotive electronic control device, characterized in that a projecting portion extending toward is formed. 前記筐体は、前記回路基板を収容する凹部が形成された本体と、前記本体の開口を閉塞する蓋と、を含んで構成され、
前記突出部は、前記本体と前記蓋との接合部分の近傍、又は、前記回路基板を本体に締結するボスの近傍に配置されることを特徴とする請求項１記載の自動車用電子制御装置。 The housing includes a main body in which a recess for accommodating the circuit board is formed, and a lid that closes an opening of the main body,
The electronic control device for an automobile according to claim 1, wherein the protruding portion is disposed in the vicinity of a joint portion between the main body and the lid, or in the vicinity of a boss that fastens the circuit board to the main body. 前記発熱部位は、前記回路基板に実装された発熱素子であり、
前記突出部には、前記発熱素子の側壁の少なくとも一部を覆うように、該発熱素子へと向かって延びる延設部が一体化されていることを特徴とする請求項１又は請求項２に記載の自動車用電子制御装置。 The heating part is a heating element mounted on the circuit board,
The extension part extended toward this heat generating element is integrated with the said protrusion part so that at least one part of the side wall of the said heat generating element may be covered, The Claim 1 or Claim 2 characterized by the above-mentioned. The automotive electronic control device described. 前記突出部は、前記筐体を鋳造により製造するときに離型用のイジェクトピンが当たる箇所が陥凹形成されていることを特徴とする請求項１〜請求項３のいずれか１つに記載の自動車用電子制御装置。   4. The protrusion according to claim 1, wherein the protruding portion is formed with a recessed portion where a release pin hits when the casing is manufactured by casting. 5. Electronic control unit for automobiles.
JP2010060075A 2010-03-17 2010-03-17 Electronic control unit for automobile Expired - Fee Related JP5460397B2 (en)

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US13/043,684 US8797742B2 (en) 2010-03-17 2011-03-09 Electronic controller for vehicle
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