TWI361028B - - Google Patents
Download PDFInfo
- Publication number
- TWI361028B TWI361028B TW96144857A TW96144857A TWI361028B TW I361028 B TWI361028 B TW I361028B TW 96144857 A TW96144857 A TW 96144857A TW 96144857 A TW96144857 A TW 96144857A TW I361028 B TWI361028 B TW I361028B
- Authority
- TW
- Taiwan
- Prior art keywords
- signal
- circuit board
- grounding
- layer circuit
- conductors
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 29
- 239000010410 layer Substances 0.000 description 14
- 239000000523 sample Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 9
- 230000008054 signal transmission Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000005571 horizontal transmission Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005570 vertical transmission Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96144857A TW200924591A (en) | 2007-11-26 | 2007-11-26 | Low loss multilayered circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96144857A TW200924591A (en) | 2007-11-26 | 2007-11-26 | Low loss multilayered circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200924591A TW200924591A (en) | 2009-06-01 |
| TWI361028B true TWI361028B (enExample) | 2012-03-21 |
Family
ID=44729086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96144857A TW200924591A (en) | 2007-11-26 | 2007-11-26 | Low loss multilayered circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200924591A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI494032B (zh) * | 2013-07-15 | 2015-07-21 | Mpi Corp | A circuit board with low perforation effect |
| TWI489922B (zh) * | 2013-07-15 | 2015-06-21 | Mpi Corp | Multilayer circuit boards |
-
2007
- 2007-11-26 TW TW96144857A patent/TW200924591A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200924591A (en) | 2009-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI333685B (en) | Folded flex circuit interconnect having a grid array interface | |
| CN100547406C (zh) | 垂直式高频探针卡 | |
| TW201127232A (en) | Circuit board with air hole | |
| US9462679B2 (en) | Attenuation reduction grounding pattern structure for connection pads of flexible circuit board | |
| CN103298249A (zh) | 印刷电路板 | |
| CN101453825B (zh) | 低耗损的多层电路板 | |
| CN101557683B (zh) | 用于集成电路晶片电性测试的探针卡 | |
| CN101738509A (zh) | 高频垂直式探针装置 | |
| CN103579857B (zh) | 高频信号双层排线转接卡 | |
| TW201019801A (en) | High frequency circuit module | |
| TW202121643A (zh) | 多層基板的垂直互連結構 | |
| CN101374382B (zh) | 具空间转换的多层电路板以及探针卡 | |
| TWI506282B (zh) | 探針卡 | |
| TWI361028B (enExample) | ||
| JP2010200234A (ja) | 基板、基板の接続方式および基板の接続方法 | |
| TWI334323B (enExample) | ||
| CN105430890A (zh) | 印刷电路板和移动终端 | |
| US7307492B2 (en) | Design, layout and method of manufacture for a circuit that taps a differential signal | |
| CN102300400A (zh) | 具有低电容的电路板结构 | |
| TWM540453U (zh) | 軟式印刷電路板與硬式印刷電路板焊接結構 | |
| TW200942118A (en) | Multilayered circuit board | |
| WO2024140509A1 (zh) | 电路板及电子设备 | |
| TWI301543B (enExample) | ||
| CN115101497A (zh) | 一种集成电路封装体、印制电路板、板卡和电子设备 | |
| CN110611990A (zh) | 印刷电路板组合及应用所述印刷电路板组合的电子装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |