TW200924591A - Low loss multilayered circuit board - Google Patents
Low loss multilayered circuit board Download PDFInfo
- Publication number
- TW200924591A TW200924591A TW96144857A TW96144857A TW200924591A TW 200924591 A TW200924591 A TW 200924591A TW 96144857 A TW96144857 A TW 96144857A TW 96144857 A TW96144857 A TW 96144857A TW 200924591 A TW200924591 A TW 200924591A
- Authority
- TW
- Taiwan
- Prior art keywords
- signal
- circuit board
- circuit
- grounding
- layer circuit
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000010410 layer Substances 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 description 32
- 239000000523 sample Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 8
- 230000008054 signal transmission Effects 0.000 description 7
- 238000005476 soldering Methods 0.000 description 4
- 230000035515 penetration Effects 0.000 description 3
- 230000005571 horizontal transmission Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005570 vertical transmission Effects 0.000 description 2
- 241000255925 Diptera Species 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96144857A TW200924591A (en) | 2007-11-26 | 2007-11-26 | Low loss multilayered circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96144857A TW200924591A (en) | 2007-11-26 | 2007-11-26 | Low loss multilayered circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200924591A true TW200924591A (en) | 2009-06-01 |
| TWI361028B TWI361028B (enExample) | 2012-03-21 |
Family
ID=44729086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96144857A TW200924591A (en) | 2007-11-26 | 2007-11-26 | Low loss multilayered circuit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200924591A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302094A (zh) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | 多层式电路板 |
| TWI494032B (zh) * | 2013-07-15 | 2015-07-21 | Mpi Corp | A circuit board with low perforation effect |
-
2007
- 2007-11-26 TW TW96144857A patent/TW200924591A/zh not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302094A (zh) * | 2013-07-15 | 2015-01-21 | 旺矽科技股份有限公司 | 多层式电路板 |
| TWI489922B (zh) * | 2013-07-15 | 2015-06-21 | Mpi Corp | Multilayer circuit boards |
| TWI494032B (zh) * | 2013-07-15 | 2015-07-21 | Mpi Corp | A circuit board with low perforation effect |
| CN104302094B (zh) * | 2013-07-15 | 2017-12-26 | 旺矽科技股份有限公司 | 多层式电路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI361028B (enExample) | 2012-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |