TWI360614B - Valve door with ball coupling - Google Patents

Valve door with ball coupling Download PDF

Info

Publication number
TWI360614B
TWI360614B TW096123367A TW96123367A TWI360614B TW I360614 B TWI360614 B TW I360614B TW 096123367 A TW096123367 A TW 096123367A TW 96123367 A TW96123367 A TW 96123367A TW I360614 B TWI360614 B TW I360614B
Authority
TW
Taiwan
Prior art keywords
ball
valve member
cavity
sealing surface
valve
Prior art date
Application number
TW096123367A
Other languages
English (en)
Chinese (zh)
Other versions
TW200809123A (en
Inventor
Hyungsam Sam Kim
Jae-Chull Lee
William N Sterling
Paul Brown
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200809123A publication Critical patent/TW200809123A/zh
Application granted granted Critical
Publication of TWI360614B publication Critical patent/TWI360614B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
  • Details Of Valves (AREA)
TW096123367A 2006-06-28 2007-06-27 Valve door with ball coupling TWI360614B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80606606P 2006-06-28 2006-06-28

Publications (2)

Publication Number Publication Date
TW200809123A TW200809123A (en) 2008-02-16
TWI360614B true TWI360614B (en) 2012-03-21

Family

ID=39035470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096123367A TWI360614B (en) 2006-06-28 2007-06-27 Valve door with ball coupling

Country Status (4)

Country Link
JP (1) JP5519099B2 (ko)
KR (2) KR100929718B1 (ko)
CN (1) CN101101066B (ko)
TW (1) TWI360614B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007711B1 (ko) * 2008-05-19 2011-01-13 주식회사 에스에프에이 플라즈마 처리장치
JP5490435B2 (ja) * 2009-03-31 2014-05-14 東京エレクトロン株式会社 ゲートバルブ装置
KR101105671B1 (ko) 2010-03-12 2012-01-18 (주)동광 방폭 도어용 로커 핀의 가이드구조
TWM476362U (en) * 2012-09-07 2014-04-11 Applied Materials Inc Load lock chamber with slit valve doors
KR101327251B1 (ko) * 2012-11-15 2013-11-13 주식회사 선익시스템 회전형 챔버도어
USD755153S1 (en) * 2014-06-20 2016-05-03 Zuna Designz, Llc Cell phone case with resilient suspension hook
CN111164730B (zh) * 2017-09-29 2023-08-15 应用材料公司 关闭机构真空腔室隔离装置和子系统
CN108531871A (zh) * 2018-07-09 2018-09-14 山东三齐能源有限公司 一种连续镀膜溅镀系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU74745A1 (ko) * 1976-04-12 1976-11-11
DE3047295A1 (de) * 1980-12-16 1982-07-29 Basf Ag, 6700 Ludwigshafen Verfahren zur kontinuierlichen herstellung alterungsbestaendiger aes-polymerisate
US5259881A (en) * 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US4785962A (en) * 1987-04-20 1988-11-22 Applied Materials, Inc. Vacuum chamber slit valve
KR930009811A (ko) * 1991-11-08 1993-06-21 원본미기재 볼조인트(ball joint) 조립체와 만드는 방법
US7575220B2 (en) * 2004-06-14 2009-08-18 Applied Materials, Inc. Curved slit valve door
CN2709730Y (zh) * 2004-06-16 2005-07-13 锦州电炉有限责任公司 高真空转阀
US8061920B2 (en) 2006-11-29 2011-11-22 Wimberley, Inc. Pivoting ball mount having four equally spaced contact points

Also Published As

Publication number Publication date
JP2008006437A (ja) 2008-01-17
KR20090077030A (ko) 2009-07-14
TW200809123A (en) 2008-02-16
KR101274963B1 (ko) 2013-06-13
KR100929718B1 (ko) 2009-12-03
CN101101066B (zh) 2010-06-02
CN101101066A (zh) 2008-01-09
JP5519099B2 (ja) 2014-06-11
KR20080001649A (ko) 2008-01-03

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees