TWI360614B - Valve door with ball coupling - Google Patents
Valve door with ball coupling Download PDFInfo
- Publication number
- TWI360614B TWI360614B TW096123367A TW96123367A TWI360614B TW I360614 B TWI360614 B TW I360614B TW 096123367 A TW096123367 A TW 096123367A TW 96123367 A TW96123367 A TW 96123367A TW I360614 B TWI360614 B TW I360614B
- Authority
- TW
- Taiwan
- Prior art keywords
- ball
- valve member
- cavity
- sealing surface
- valve
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Pressure Vessels And Lids Thereof (AREA)
- Details Of Valves (AREA)
Description
1360614 九、發明說明: 【發明所屬之技術領域】 本發明的實施方式主要關於用於密封真空處理系統中 的基板通道的真空隔離閥門。 【先前技術】1360614 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION Embodiments of the present invention generally relate to vacuum isolation valves for sealing substrate passages in vacuum processing systems. [Prior Art]
薄膜電晶體(TFT)普遍用於主動矩陣顯示器,諸如 電腦和電視監視器、行動電話顯示器、個人數位助理(PDA) 及越來越多的其他裝置。一般地,平板顯示器包括兩個玻 璃板,該兩玻璃板具有液晶材料層嵌入其間。至少一個玻 璃板包括設置在其上的導電薄膜,該導電薄膜與電源連 接。從電源提供給該導電薄膜的功率改變晶體材料的配 向,形成圖案顯示。Thin film transistors (TFTs) are commonly used in active matrix displays such as computer and television monitors, mobile phone displays, personal digital assistants (PDAs), and a growing number of other devices. Typically, a flat panel display includes two glass panels with a layer of liquid crystal material interposed therebetween. At least one of the glass sheets includes a conductive film disposed thereon, the conductive film being connected to a power source. The power supplied from the power source to the conductive film changes the alignment of the crystal material to form a pattern display.
隨著市場對於平板顯示技術的接受,對於更大顯示 器、更多產量和更低製造成本的需求促使設備製造商爲平 板顯示器製造商開發容納更大尺寸的玻璃基板的新系統。 現有的玻璃基板處理設備通常配置爲容納最高至約5平方 米的基板。在不久的將來預想配置容納超過5平方米基板 尺寸的處理設備。 玻璃基板處理通常在叢集設備(cluster tool)中通過 將基板經歷多個依次製程以在基板上形成元件、導體和絕 緣體而實施。這些製程的每個通常在配置爲實施單個步驟 的生産製程的製程腔中實施。爲了有效地完成全部次序的 處理步驟,叢集設備包括多個與中央傳送腔連接的製程 5 1360614 腔。安裝在傳送腔中的機械手臂輔助製程腔和負載閉鎖腔 之間的基板傳送。負載閉鎖腔允許基板在叢集設備的真空 環境和工廠介面的周圍環境之間傳送。這種用於玻璃基板 處理的叢集設備可從美國加州的 Santa Clara市的應用材 料公司的全資擁有子公司AKT公司購買。 由於用於製造平板顯示器的基板尺寸變大’用於這些 基板的製造設備也在尺寸上變得更大。相應地’將真空腔 (或負載閉鎖腔)彼此隔離的門或閘變得更九,或尤其是 更長,原因在於兩個腔之間的槽式開口必須變得更寬以容 納大寬度的基板通過槽式開口。閥門不斷增加的尺寸對兩 個腔之間通過設置在圍繞閥門和腔壁之間的狹槽開口的合 成橡膠密封而維持的良好的隔離密封帶來技術挑戰。 第1A圖示出了通過腔主體1〇6形成並利用傳統的真 空隔離閥門 U0選擇性密封的基板通道的部分截面 圖。傳統的真空隔離閥門通常由具有較長橫向跨度的鋁的 平板構件組成。如第1 A-〗B圖所示’通過與剛性旋轉軸1 04 連接的閘1 02向閥門1 1 〇的中心施加閉合力。閥門1 1 〇通 過與轴104連接的致動器118在密封通道108的位置(第 1 A圖所示)和通道1 〇 8的打開位置之間旋轉。密封件11 6 設置在閥門11 〇和腔主體10 6之間。 爲獲得良好腔隔離而要求載入密封件116的力很大。 如箭頭1 1 2所示,施加在閥門1 1 〇中心附近的高負載導致 閥門1 1 0的中心附近具有較高的負載力而閥門端部附近具 有基本上較小的密封力。如虛線的軸120所示,由於閥門 6 1360614As the market embraces flat panel display technology, the need for larger displays, higher throughput and lower manufacturing costs has prompted device manufacturers to develop new systems for flat panel display manufacturers that accommodate larger sized glass substrates. Existing glass substrate processing equipment is typically configured to accommodate substrates up to about 5 square meters. In the near future, it is expected to configure a processing device that accommodates a substrate size of more than 5 square meters. Glass substrate processing is typically performed in a cluster tool by subjecting the substrate to a plurality of sequential processes to form components, conductors, and insulators on the substrate. Each of these processes is typically implemented in a process chamber configured to perform a single step production process. In order to efficiently complete the processing steps of the entire sequence, the cluster device includes a plurality of processes 5 1360614 cavities connected to the central transfer chamber. The robotic arm mounted in the transfer chamber assists in substrate transfer between the process chamber and the load lock chamber. The load lock cavity allows the substrate to be transferred between the vacuum environment of the cluster device and the environment of the factory interface. This clustering device for glass substrate processing is available from AKT, a wholly owned subsidiary of Applied Materials, Inc. of Santa Clara, California. Since the size of substrates for manufacturing flat panel displays has become large, manufacturing equipment for these substrates has also become larger in size. Correspondingly, the door or gate that isolates the vacuum chambers (or load lock chambers) from each other becomes nine or more, because the slot openings between the two chambers must be wider to accommodate large widths. The substrate passes through the slotted opening. The ever-increasing size of the valve presents a technical challenge to the good isolation seal between the two chambers maintained by a synthetic rubber seal disposed around the slot opening between the valve and the chamber wall. Fig. 1A shows a partial cross-sectional view of a substrate passage formed through the chamber body 1〇6 and selectively sealed by a conventional vacuum isolation valve U0. Conventional vacuum isolation valves typically consist of a flat member of aluminum having a longer lateral span. As shown in Fig. 1A-B, the closing force is applied to the center of the valve 1 1 through the gate 102 connected to the rigid rotating shaft 104. The valve 1 1 is rotated by an actuator 118 coupled to the shaft 104 between the position of the seal passage 108 (shown in Figure 1A) and the open position of the passage 1 〇 8 . A seal 11 6 is disposed between the valve 11 〇 and the chamber body 106. The force required to load the seal 116 is large in order to achieve good cavity isolation. As indicated by arrow 113, the high load applied near the center of the valve 1 1 导致 results in a higher load force near the center of the valve 1 10 0 and a substantially smaller sealing force near the valve end. As indicated by the dashed axis 120, due to the valve 6 1360614
110在設置在腔主體106的壁内的轴承支架114和連接 閥門1 1 0的中心的閘1 0 2之間具有較長的跨度,軸1 〇 4 負載下可能彎曲。在閥門110在閉合位置時,軸104的 曲進一步惡化閥門的端部處的密封件的低負載條件。閥 的邊緣處的較低的密封力可導致通過通道108的不期望 露。 爲了對於更加均勻的密封負載提供更加剛性的閥門 閥門和/或軸可由更厚的材料或具有更高模量的材料 造。然而,由於高強度材料通常較爲昂貴,並且在操作 間較大的負載閉鎖腔可能需要具有足夠的間隙以容納具 較大、高強度的門,因此這種方式增加負載閉鎖腔的成才 由於腔本身增加的材料和製造成本,以及抽空較大真空 積需要增加泵功率,因此較大的負載閉鎖腔並不合需要 另外,增加的真空容積通常需要增加對系統産量具有不 影響的抽真空時間。 已提出採用彎曲的真空隔離閥門以解決這些問題, 且在共同轉讓並先前引入的2004年6月14日申請的標 爲“CURVED SLIT VALVE DOOR”的美國專利申請序 號No. 10/867,100中對其進行了描述。彎曲的真空隔 閥門的實施提出新的工程挑戰。例如,由於當按壓平面 腔壁以密封真空隔離閥門通道時閥門密封表面變成平面 因此應當容納彎曲的真空隔離閥門的投影長度的變化以 止閥門致動機構的過度磨損。另外,由於真空隔離閥門 對閥門密封表面旋轉,因此真空隔離閥門和閥門密封表 至 在 彎 門 泄 製 期 有 k 0 容 〇 利 並 題 列 離 的 防 相 面 7The 110 has a long span between the bearing bracket 114 disposed in the wall of the chamber body 106 and the gate 1 0 2 connecting the center of the valve 110. The shaft 1 〇 4 may bend under load. When the valve 110 is in the closed position, the curvature of the shaft 104 further deteriorates the low load condition of the seal at the end of the valve. The lower sealing force at the edge of the valve can result in undesirable exposure through the passage 108. To provide a more rigid valve for a more uniform sealed load, the valve and/or shaft can be made of a thicker material or a material with a higher modulus. However, since high strength materials are generally expensive and large load lock chambers between operations may need to have sufficient clearance to accommodate larger, high strength doors, this approach increases the load lock cavity due to the cavity. The increased material and manufacturing costs themselves, as well as the large vacuum build-up, require increased pump power, so larger load lock chambers are not desirable. Additionally, the increased vacuum volume typically requires an increase in vacuum time that does not affect system throughput. A curved vacuum isolation valve has been proposed to solve these problems, and is commonly assigned and previously incorporated by reference to U.S. Patent Application Serial No. 10/867,100, filed on Jun. 14, 2004, entitled "CURVED SLIT VALVE DOOR" It is described. The implementation of a curved vacuum barrier presents new engineering challenges. For example, since the valve sealing surface becomes flat when the planar cavity wall is pressed to seal the vacuum isolation valve passage, the change in the projected length of the curved vacuum isolation valve should be accommodated to prevent excessive wear of the valve actuation mechanism. In addition, since the vacuum isolation valve rotates on the valve sealing surface, the vacuum isolation valve and the valve sealing table have a k 0 tolerance and a separation prevention surface during the bending process of the curved door.
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80606606P | 2006-06-28 | 2006-06-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200809123A TW200809123A (en) | 2008-02-16 |
TWI360614B true TWI360614B (en) | 2012-03-21 |
Family
ID=39035470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096123367A TWI360614B (en) | 2006-06-28 | 2007-06-27 | Valve door with ball coupling |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5519099B2 (en) |
KR (2) | KR100929718B1 (en) |
CN (1) | CN101101066B (en) |
TW (1) | TWI360614B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101007711B1 (en) * | 2008-05-19 | 2011-01-13 | 주식회사 에스에프에이 | Plasma processing apparatus |
JP5490435B2 (en) * | 2009-03-31 | 2014-05-14 | 東京エレクトロン株式会社 | Gate valve device |
KR101105671B1 (en) | 2010-03-12 | 2012-01-18 | (주)동광 | Guide structure of locker fin for blast door |
TWM476362U (en) * | 2012-09-07 | 2014-04-11 | Applied Materials Inc | Load lock chamber with slit valve doors |
KR101327251B1 (en) * | 2012-11-15 | 2013-11-13 | 주식회사 선익시스템 | Rotatable a chamber door |
USD755153S1 (en) * | 2014-06-20 | 2016-05-03 | Zuna Designz, Llc | Cell phone case with resilient suspension hook |
KR20200051042A (en) * | 2017-09-29 | 2020-05-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Closed mechanism vacuum chamber isolation device and sub-system |
CN108531871A (en) * | 2018-07-09 | 2018-09-14 | 山东三齐能源有限公司 | A kind of continuous coating sputter system |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
LU74745A1 (en) * | 1976-04-12 | 1976-11-11 | ||
DE3047295A1 (en) * | 1980-12-16 | 1982-07-29 | Basf Ag, 6700 Ludwigshafen | METHOD FOR THE CONTINUOUS PRODUCTION OF AGING-RESISTANT AES POLYMERISATES |
US5259881A (en) * | 1991-05-17 | 1993-11-09 | Materials Research Corporation | Wafer processing cluster tool batch preheating and degassing apparatus |
US4785962A (en) * | 1987-04-20 | 1988-11-22 | Applied Materials, Inc. | Vacuum chamber slit valve |
KR930009811A (en) * | 1991-11-08 | 1993-06-21 | 원본미기재 | Ball joint assembly and how to make it |
US7575220B2 (en) * | 2004-06-14 | 2009-08-18 | Applied Materials, Inc. | Curved slit valve door |
CN2709730Y (en) * | 2004-06-16 | 2005-07-13 | 锦州电炉有限责任公司 | High vacuum rotary valve |
US8061920B2 (en) | 2006-11-29 | 2011-11-22 | Wimberley, Inc. | Pivoting ball mount having four equally spaced contact points |
-
2007
- 2007-06-25 JP JP2007166103A patent/JP5519099B2/en active Active
- 2007-06-27 TW TW096123367A patent/TWI360614B/en not_active IP Right Cessation
- 2007-06-28 CN CN2007101275567A patent/CN101101066B/en not_active Expired - Fee Related
- 2007-06-28 KR KR1020070064271A patent/KR100929718B1/en active IP Right Grant
-
2009
- 2009-05-22 KR KR1020090045004A patent/KR101274963B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20080001649A (en) | 2008-01-03 |
KR20090077030A (en) | 2009-07-14 |
JP2008006437A (en) | 2008-01-17 |
CN101101066B (en) | 2010-06-02 |
CN101101066A (en) | 2008-01-09 |
KR101274963B1 (en) | 2013-06-13 |
JP5519099B2 (en) | 2014-06-11 |
KR100929718B1 (en) | 2009-12-03 |
TW200809123A (en) | 2008-02-16 |
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