TWI360611B - Device for offsetting reaction force, method of se - Google Patents

Device for offsetting reaction force, method of se Download PDF

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Publication number
TWI360611B
TWI360611B TW097150872A TW97150872A TWI360611B TW I360611 B TWI360611 B TW I360611B TW 097150872 A TW097150872 A TW 097150872A TW 97150872 A TW97150872 A TW 97150872A TW I360611 B TWI360611 B TW I360611B
Authority
TW
Taiwan
Prior art keywords
vibration
unit
reaction force
movable body
mass
Prior art date
Application number
TW097150872A
Other languages
English (en)
Chinese (zh)
Other versions
TW201020413A (en
Inventor
Yong Kyu Seo
Do Hyun Ryu
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW201020413A publication Critical patent/TW201020413A/zh
Application granted granted Critical
Publication of TWI360611B publication Critical patent/TWI360611B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Vibration Prevention Devices (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Manipulator (AREA)
  • Coating Apparatus (AREA)
TW097150872A 2008-11-20 2008-12-26 Device for offsetting reaction force, method of se TWI360611B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080115765A KR20100056789A (ko) 2008-11-20 2008-11-20 반력 상쇄 장치, 그것의 질량체 설정 방법, 그것을 이용한 반력 상쇄 방법 및 그것을 구비한 디스펜서

Publications (2)

Publication Number Publication Date
TW201020413A TW201020413A (en) 2010-06-01
TWI360611B true TWI360611B (en) 2012-03-21

Family

ID=42280736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097150872A TWI360611B (en) 2008-11-20 2008-12-26 Device for offsetting reaction force, method of se

Country Status (4)

Country Link
JP (1) JP2010120003A (ko)
KR (1) KR20100056789A (ko)
CN (1) CN101734024B (ko)
TW (1) TWI360611B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698159B (zh) * 2014-12-16 2020-07-01 日商新川股份有限公司 封裝裝置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8646932B2 (en) 2010-06-15 2014-02-11 Lg Innotek Co., Ltd. Backlight unit and the display device having the same
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6057284B2 (ja) * 2012-10-09 2017-01-11 シンフォニアテクノロジー株式会社 多関節ロボット及び半導体ウェハ搬送装置
JP6057283B2 (ja) * 2012-10-09 2017-01-11 シンフォニアテクノロジー株式会社 多関節ロボット及び半導体ウェハ搬送装置
JP6276545B2 (ja) * 2013-09-18 2018-02-07 ファスフォードテクノロジ株式会社 ダイボンダ
CN107532894B (zh) * 2015-04-28 2020-03-06 赫克斯冈技术中心 控制测量装置和提供主动阻尼的方法、坐标测量机及存储介质
KR101709577B1 (ko) * 2015-08-26 2017-03-09 한국생산기술연구원 잔류 진동 제어 시스템과 이를 이용한 광학 검사 장치 및 후가공 장치
JP6186053B2 (ja) * 2016-07-19 2017-08-23 株式会社新川 実装装置
CN112119240A (zh) * 2018-08-31 2020-12-22 松下知识产权经营株式会社 减振装置
CN112605700B (zh) * 2020-12-04 2022-02-25 黑龙江工业学院 一种计算机机箱侧板切割装置
CN112916343B (zh) * 2021-02-24 2021-11-02 赣州逸豪新材料股份有限公司 一种铝基板加工用定向涂胶装置及其加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916635A (en) * 1988-09-12 1990-04-10 Massachusetts Institute Of Technology Shaping command inputs to minimize unwanted dynamics
JPH11168064A (ja) * 1997-09-22 1999-06-22 Nikon Corp ステージ駆動方法、ステージ装置、及び露光装置
JP4009691B2 (ja) * 1999-07-22 2007-11-21 井関農機株式会社 コンバイン
JP2001179732A (ja) * 1999-12-27 2001-07-03 Thk Co Ltd スクライブ装置
JP4481576B2 (ja) * 2003-02-28 2010-06-16 芝浦メカトロニクス株式会社 ペースト塗布装置
NL1028138C2 (nl) * 2005-01-27 2006-07-31 Be Semiconductor Ind N V Inrichting en werkwijze voor het manipuleren van een object.
JP2006231201A (ja) * 2005-02-24 2006-09-07 Tokyo Ohka Kogyo Co Ltd 塗布装置
EP1721754B1 (en) * 2005-05-09 2010-08-11 Agfa Graphics N.V. Forceless support frame for printhead shuttle in digital printers
KR20090066968A (ko) * 2007-12-20 2009-06-24 윤병태 자가 튜닝 기능을 가지는 고속정밀 이송장치의 제어장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698159B (zh) * 2014-12-16 2020-07-01 日商新川股份有限公司 封裝裝置

Also Published As

Publication number Publication date
CN101734024A (zh) 2010-06-16
CN101734024B (zh) 2011-12-21
JP2010120003A (ja) 2010-06-03
KR20100056789A (ko) 2010-05-28
TW201020413A (en) 2010-06-01

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MM4A Annulment or lapse of patent due to non-payment of fees