TWI360611B - Device for offsetting reaction force, method of se - Google Patents

Device for offsetting reaction force, method of se Download PDF

Info

Publication number
TWI360611B
TWI360611B TW097150872A TW97150872A TWI360611B TW I360611 B TWI360611 B TW I360611B TW 097150872 A TW097150872 A TW 097150872A TW 97150872 A TW97150872 A TW 97150872A TW I360611 B TWI360611 B TW I360611B
Authority
TW
Taiwan
Prior art keywords
vibration
unit
reaction force
movable body
mass
Prior art date
Application number
TW097150872A
Other languages
English (en)
Chinese (zh)
Other versions
TW201020413A (en
Inventor
Yong Kyu Seo
Do Hyun Ryu
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW201020413A publication Critical patent/TW201020413A/zh
Application granted granted Critical
Publication of TWI360611B publication Critical patent/TWI360611B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Vibration Prevention Devices (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Manipulator (AREA)
TW097150872A 2008-11-20 2008-12-26 Device for offsetting reaction force, method of se TWI360611B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080115765A KR20100056789A (ko) 2008-11-20 2008-11-20 반력 상쇄 장치, 그것의 질량체 설정 방법, 그것을 이용한 반력 상쇄 방법 및 그것을 구비한 디스펜서

Publications (2)

Publication Number Publication Date
TW201020413A TW201020413A (en) 2010-06-01
TWI360611B true TWI360611B (en) 2012-03-21

Family

ID=42280736

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097150872A TWI360611B (en) 2008-11-20 2008-12-26 Device for offsetting reaction force, method of se

Country Status (4)

Country Link
JP (1) JP2010120003A (ja)
KR (1) KR20100056789A (ja)
CN (1) CN101734024B (ja)
TW (1) TWI360611B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698159B (zh) * 2014-12-16 2020-07-01 日商新川股份有限公司 封裝裝置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI529459B (zh) 2010-06-15 2016-04-11 Ｌｇ伊諾特股份有限公司 背光單元及具有其之顯示裝置
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP6057284B2 (ja) * 2012-10-09 2017-01-11 シンフォニアテクノロジー株式会社 多関節ロボット及び半導体ウェハ搬送装置
JP6057283B2 (ja) * 2012-10-09 2017-01-11 シンフォニアテクノロジー株式会社 多関節ロボット及び半導体ウェハ搬送装置
JP6276545B2 (ja) * 2013-09-18 2018-02-07 ファスフォードテクノロジ株式会社 ダイボンダ
WO2016173625A1 (en) * 2015-04-28 2016-11-03 Hexagon Technology Center Gmbh Active damping of a measuring device
KR101709577B1 (ko) * 2015-08-26 2017-03-09 한국생산기술연구원 잔류 진동 제어 시스템과 이를 이용한 광학 검사 장치 및 후가공 장치
JP6186053B2 (ja) * 2016-07-19 2017-08-23 株式会社新川 実装装置
WO2020044704A1 (ja) * 2018-08-31 2020-03-05 パナソニックＩｐマネジメント株式会社 制振装置
CN112605700B (zh) * 2020-12-04 2022-02-25 黑龙江工业学院 一种计算机机箱侧板切割装置
CN112916343B (zh) * 2021-02-24 2021-11-02 赣州逸豪新材料股份有限公司 一种铝基板加工用定向涂胶装置及其加工方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4916635A (en) * 1988-09-12 1990-04-10 Massachusetts Institute Of Technology Shaping command inputs to minimize unwanted dynamics
JPH11168064A (ja) * 1997-09-22 1999-06-22 Nikon Corp ステージ駆動方法、ステージ装置、及び露光装置
JP4009691B2 (ja) * 1999-07-22 2007-11-21 井関農機株式会社 コンバイン
JP2001179732A (ja) * 1999-12-27 2001-07-03 Thk Co Ltd スクライブ装置
JP4481576B2 (ja) * 2003-02-28 2010-06-16 芝浦メカトロニクス株式会社 ペースト塗布装置
NL1028138C2 (nl) * 2005-01-27 2006-07-31 Be Semiconductor Ind N V Inrichting en werkwijze voor het manipuleren van een object.
JP2006231201A (ja) * 2005-02-24 2006-09-07 Tokyo Ohka Kogyo Co Ltd 塗布装置
ES2348242T3 (es) * 2005-05-09 2010-12-01 Agfa Graphics N.V. Estructura de ayuda sin fuerza para el traslado del cabezal de impresión en impresoras digitales.
KR20090066968A (ko) * 2007-12-20 2009-06-24 윤병태 자가 튜닝 기능을 가지는 고속정밀 이송장치의 제어장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698159B (zh) * 2014-12-16 2020-07-01 日商新川股份有限公司 封裝裝置

Also Published As

Publication number Publication date
CN101734024A (zh) 2010-06-16
JP2010120003A (ja) 2010-06-03
TW201020413A (en) 2010-06-01
CN101734024B (zh) 2011-12-21
KR20100056789A (ko) 2010-05-28

Similar Documents

Publication Publication Date Title
TWI360611B (en) Device for offsetting reaction force, method of se
CN107107336B (zh) 具有末端执行器位置估计的机器人自适应放置系统
US10493239B2 (en) Torque-based catheter articulation
US9645565B2 (en) Method and system for determination of at least one property of a joint
US9043023B2 (en) Robot system, and control apparatus and method thereof
KR101665543B1 (ko) 인간형 로봇의 안정화 장치 및 그 방법
JP5418272B2 (ja) 工作機械の熱変位補正方法および熱変位補正装置
JPH0268609A (ja) ステージ位置決め補正方法及び装置
JP6420149B2 (ja) 動的本体力を測定および評価するためのテストシステム
CN106737662A (zh) 机器人系统
SG146597A1 (en) Lithographic apparatus and device manufacturing method
JP2015066603A (ja) ロボット校正装置及びロボット校正方法、並びにロボット装置及びロボット装置の制御方法
JP2014504897A5 (ja)
JP4457353B2 (ja) 調整ボルトの操作方法および電磁石の位置・姿勢調整方法
JPWO2018092243A1 (ja) 作業位置補正方法および作業ロボット
US9815196B2 (en) Apparatus and method for recording positions
KR20140125728A (ko) 전자 또는 광학 부품을 기판상에 실장하기 위한 방법 및 장치
WO2021141039A1 (ja) ワーク搬送システム
KR101485003B1 (ko) 로봇의 위치 및 자세 제어 장치 및 방법
KR101882096B1 (ko) 스마트 벤딩 시스템
US20070132421A1 (en) Time constant automatic estimation method, time constant automatic estimation apparatus and servo motor control system
JP5752565B2 (ja) ロボットアーム
US11638995B2 (en) Compliant payload presentation using robotic system with coordinated serial and parallel robots
ES2765813T3 (es) Procedimiento y dispositivo para controlar la posición de una plataforma pivotable alrededor de tres ejes provista de un dispositivo de seguimiento de objetivos
JP2005337812A (ja) 材料試験機

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees