TWI359826B - - Google Patents

Download PDF

Info

Publication number
TWI359826B
TWI359826B TW96151545A TW96151545A TWI359826B TW I359826 B TWI359826 B TW I359826B TW 96151545 A TW96151545 A TW 96151545A TW 96151545 A TW96151545 A TW 96151545A TW I359826 B TWI359826 B TW I359826B
Authority
TW
Taiwan
Prior art keywords
prepolymer
weight
thermosetting resin
resin composition
solvent
Prior art date
Application number
TW96151545A
Other languages
English (en)
Chinese (zh)
Other versions
TW200927789A (en
Original Assignee
Iteq Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iteq Corp filed Critical Iteq Corp
Priority to TW96151545A priority Critical patent/TW200927789A/zh
Publication of TW200927789A publication Critical patent/TW200927789A/zh
Application granted granted Critical
Publication of TWI359826B publication Critical patent/TWI359826B/zh

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
TW96151545A 2007-12-31 2007-12-31 Prepolymer and thermosetting resin composition made therefrom TW200927789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96151545A TW200927789A (en) 2007-12-31 2007-12-31 Prepolymer and thermosetting resin composition made therefrom

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96151545A TW200927789A (en) 2007-12-31 2007-12-31 Prepolymer and thermosetting resin composition made therefrom

Publications (2)

Publication Number Publication Date
TW200927789A TW200927789A (en) 2009-07-01
TWI359826B true TWI359826B (enrdf_load_stackoverflow) 2012-03-11

Family

ID=44863740

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96151545A TW200927789A (en) 2007-12-31 2007-12-31 Prepolymer and thermosetting resin composition made therefrom

Country Status (1)

Country Link
TW (1) TW200927789A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
TW200927789A (en) 2009-07-01

Similar Documents

Publication Publication Date Title
US10689512B2 (en) Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
TWI278481B (en) Thermosetting resin composition, prepreg and laminate using the same
CN104341766B (zh) 低介电树脂组合物及应用其的铜箔基板及印刷电路板
JP7673862B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
CN101215405B (zh) 一种热固性树脂组合物
JP7409369B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、および、プリント配線板
CN1289594C (zh) 热固性树脂组合物及其应用
JP5499544B2 (ja) 熱硬化性絶縁樹脂組成物、並びにこれを用いたプリプレグ、樹脂付フィルム、積層板、及び多層プリント配線板
US10994516B2 (en) Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
JP6090684B1 (ja) プリント配線板用樹脂組成物、プリプレグ、樹脂複合シート及び金属箔張積層板
TWI725956B (zh) 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片、及印刷電路板
JP2017088745A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP6819921B2 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
CN101215358B (zh) 一种预聚物以及利用该预聚物制成的热固性树脂组合物
JP6350891B1 (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
US9006377B2 (en) Resin composition and uses of the same
JP2017052884A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
TWI798212B (zh) 樹脂組成物、預浸體、覆金屬箔疊層板、樹脂片及印刷電路板
JP2018123196A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
TWI359844B (enrdf_load_stackoverflow)
TWI359826B (enrdf_load_stackoverflow)
JP2017071738A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP2018131541A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
JP2017200966A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
JP2017095599A (ja) 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees