TWI357438B - - Google Patents

Download PDF

Info

Publication number
TWI357438B
TWI357438B TW093132622A TW93132622A TWI357438B TW I357438 B TWI357438 B TW I357438B TW 093132622 A TW093132622 A TW 093132622A TW 93132622 A TW93132622 A TW 93132622A TW I357438 B TWI357438 B TW I357438B
Authority
TW
Taiwan
Prior art keywords
diamond
particles
honing
artificial
density
Prior art date
Application number
TW093132622A
Other languages
English (en)
Chinese (zh)
Other versions
TW200516135A (en
Inventor
Noriyuki Kumasaka
Original Assignee
Nippon Micro Coating Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micro Coating Kk filed Critical Nippon Micro Coating Kk
Publication of TW200516135A publication Critical patent/TW200516135A/zh
Application granted granted Critical
Publication of TWI357438B publication Critical patent/TWI357438B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/06Processes using ultra-high pressure, e.g. for the formation of diamonds; Apparatus therefor, e.g. moulds or dies
    • B01J3/08Application of shock waves for chemical reactions or for modifying the crystal structure of substances
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00Carbon; Compounds thereof
    • C01B32/25Diamond
    • C01B32/28After-treatment, e.g. purification, irradiation, separation or recovery
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Geology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Carbon And Carbon Compounds (AREA)
TW093132622A 2003-10-28 2004-10-27 Diamond polishing particles and method of producing same TW200516135A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003366851A JP2005131711A (ja) 2003-10-28 2003-10-28 ダイヤモンド研磨粒子及びその製造方法

Publications (2)

Publication Number Publication Date
TW200516135A TW200516135A (en) 2005-05-16
TWI357438B true TWI357438B (cg-RX-API-DMAC7.html) 2012-02-01

Family

ID=34510265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132622A TW200516135A (en) 2003-10-28 2004-10-27 Diamond polishing particles and method of producing same

Country Status (3)

Country Link
US (1) US20050086870A1 (cg-RX-API-DMAC7.html)
JP (1) JP2005131711A (cg-RX-API-DMAC7.html)
TW (1) TW200516135A (cg-RX-API-DMAC7.html)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006006721A1 (ja) * 2004-07-12 2006-01-19 Showa Denko K.K. テクスチャリング加工用組成物
JP5221953B2 (ja) * 2005-06-29 2013-06-26 日本化薬株式会社 微細ダイヤモンドの製造方法及び爆薬組成物
JP4936424B2 (ja) * 2005-10-31 2012-05-23 日本ミクロコーティング株式会社 研磨材及びその製造方法
JP5599547B2 (ja) * 2006-12-01 2014-10-01 Mipox株式会社 硬質結晶基板研磨方法及び油性研磨スラリー
JP4838703B2 (ja) 2006-12-26 2011-12-14 富士電機株式会社 磁気記録媒体用ディスク基板の製造方法、磁気記録媒体用ディスク基板、磁気記録媒体の製造方法、磁気記録媒体、及び磁気記録装置
KR101503545B1 (ko) * 2007-03-26 2015-03-17 가부시키가이샤 도쿄 다이아몬드 고우구세이사쿠쇼 합성지석
WO2009078277A1 (ja) * 2007-12-17 2009-06-25 Vision Development Co., Ltd. 研磨材
JP5199011B2 (ja) * 2007-12-17 2013-05-15 ビジョン開発株式会社 研磨材
WO2009094481A2 (en) * 2008-01-25 2009-07-30 The Regents Of The University Of California Nanodiamonds and diamond-like particles from carbonaceous material
JP4953323B2 (ja) * 2008-10-28 2012-06-13 ビジョン開発株式会社 グラファイト系炭素とダイヤモンドとからなる粒子を含有する繊維及びそれを用いた寝具
CN102348637B (zh) * 2009-03-09 2015-01-28 国家健康与医学研究院 制备金刚石立方纳米晶体的方法
CN104962234B (zh) * 2015-05-13 2017-05-03 华侨大学 一种掺杂二氧化钛金刚石复合磨粒及其制备方法和应用
US9865470B2 (en) * 2015-06-29 2018-01-09 Panasonic Corporation Processing apparatus and processing method
US12403437B2 (en) 2019-03-26 2025-09-02 Daicel Corporation Method for producing nanodiamonds doped with group 14 element, and method for purifying same
CN115340089B (zh) * 2022-08-24 2024-02-06 内蒙古唐合科技有限公司 一种人造金刚石的提纯方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE319138B (cg-RX-API-DMAC7.html) * 1966-05-11 1970-01-12 A Lovegreen
EP0731490A3 (en) * 1995-03-02 1998-03-11 Ebara Corporation Ultra-fine microfabrication method using an energy beam
JP4245310B2 (ja) * 2001-08-30 2009-03-25 忠正 藤村 分散安定性に優れたダイヤモンド懸濁水性液、このダイヤモンドを含む金属膜及びその製造物

Also Published As

Publication number Publication date
JP2005131711A (ja) 2005-05-26
US20050086870A1 (en) 2005-04-28
TW200516135A (en) 2005-05-16

Similar Documents

Publication Publication Date Title
TWI357438B (cg-RX-API-DMAC7.html)
US7857876B2 (en) Method of producing polishing material comprising diamond clusters
TWI409323B (zh) Hard crystalline substrate grinding methods and oily grinding slurry
TW200918653A (en) Recycling method of polishing slurry
CN1253963A (zh) 研磨用组合物及漂洗用组合物
CN101939137A (zh) 研磨粒子粉体
TW200946659A (en) Dispersion comprising cerium oxide and colloidal silicon dioxide
JP3655811B2 (ja) 単結晶質ダイヤモンド微粉
JP2004339412A (ja) 研磨材用サブミクロンダイヤモンド粉及びその製造方法
TW201234466A (en) Planarization method for hard and brittle wafer and polishing pad for planarization
CN104981324B (zh) 单晶SiC基板的表面加工方法、其制造方法和单晶SiC基板的表面加工用磨削板
TWI283008B (en) Slurry for CMP and method of producing the same
CN102482554B (zh) 磨料颗粒的悬浮液
WO2002008122A1 (en) Single crystal fine diamond powder having narrow particle size distribution and method for production thereof
US7374473B2 (en) Texturing slurry and texturing method by using same
CN115924909B (zh) 一种碳化硅晶片粗磨加工专用金刚石微粉及其制备方法
CN1818002A (zh) 磨料颗粒、抛光浆料及其制造方法
JP4835973B2 (ja) 高融点金属系粉末の製造方法およびターゲット材の製造方法
JP2015003379A (ja) 再生酸化セリウム系研磨剤粒子の製造方法および再生粒子
US20100203809A1 (en) Method of polishing a magnetic hard disc substrate
JP2004200268A (ja) Cmp研磨剤及び基板の研磨方法
JPH1143791A (ja) 研磨液用洗浄剤組成物
JP2004175964A (ja) 高純度酸化セリウム研摩材の製造方法及びそれにより得られた高純度酸化セリウム研摩材
JP2006095649A (ja) 表面欠陥が少ないマグネシウム合金コイルの製造方法
JP2008264945A (ja) テクスチャ加工スラリー及び方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees