TWI355569B - Formulation for removal of photoresist, etch resid - Google Patents

Formulation for removal of photoresist, etch resid Download PDF

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Publication number
TWI355569B
TWI355569B TW096104641A TW96104641A TWI355569B TW I355569 B TWI355569 B TW I355569B TW 096104641 A TW096104641 A TW 096104641A TW 96104641 A TW96104641 A TW 96104641A TW I355569 B TWI355569 B TW I355569B
Authority
TW
Taiwan
Prior art keywords
weight
formulation
acid
group
photoresist
Prior art date
Application number
TW096104641A
Other languages
English (en)
Chinese (zh)
Other versions
TW200823611A (en
Inventor
Matthew I Egbe
Michael Walter Legenza
Original Assignee
Air Prod & Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/602,662 external-priority patent/US7674755B2/en
Application filed by Air Prod & Chem filed Critical Air Prod & Chem
Publication of TW200823611A publication Critical patent/TW200823611A/zh
Application granted granted Critical
Publication of TWI355569B publication Critical patent/TWI355569B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/06—Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096104641A 2006-11-21 2007-02-08 Formulation for removal of photoresist, etch resid TWI355569B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/602,662 US7674755B2 (en) 2005-12-22 2006-11-21 Formulation for removal of photoresist, etch residue and BARC

Publications (2)

Publication Number Publication Date
TW200823611A TW200823611A (en) 2008-06-01
TWI355569B true TWI355569B (en) 2012-01-01

Family

ID=39480229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104641A TWI355569B (en) 2006-11-21 2007-02-08 Formulation for removal of photoresist, etch resid

Country Status (5)

Country Link
JP (1) JP4499751B2 (https=)
KR (1) KR100942009B1 (https=)
CN (1) CN101187789B (https=)
SG (1) SG143115A1 (https=)
TW (1) TWI355569B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101399502B1 (ko) * 2008-09-19 2014-06-27 주식회사 동진쎄미켐 티에프티 엘시디용 열경화성 수지 박리액 조성물
US8309502B2 (en) * 2009-03-27 2012-11-13 Eastman Chemical Company Compositions and methods for removing organic substances
CN102043356B (zh) * 2009-10-13 2012-09-26 奇美实业股份有限公司 清洗基板用洗净液组成物
WO2012166902A1 (en) * 2011-06-01 2012-12-06 Avantor Performance Materials, Inc. SEMI-AQUEOUS POLYMER REMOVAL COMPOSITIONS WITH ENHANCED COMPATIBILITY TO COPPER, TUNGSTEN, AND POROUS LOW-ĸ DIELECTRICS
CN102902169A (zh) * 2011-07-29 2013-01-30 中芯国际集成电路制造(上海)有限公司 去除光刻胶层的方法
DE102011088885A1 (de) * 2011-12-16 2013-06-20 Wacker Chemie Ag Siliconlöser
US9460934B2 (en) * 2013-03-15 2016-10-04 Globalfoundries Inc. Wet strip process for an antireflective coating layer
KR101420571B1 (ko) * 2013-07-05 2014-07-16 주식회사 동진쎄미켐 드라이필름 레지스트 박리제 조성물 및 이를 이용한 드라이필름 레지스트의 제거방법
WO2017169834A1 (ja) * 2016-03-31 2017-10-05 富士フイルム株式会社 半導体製造用処理液、及び、パターン形成方法
CA3037975A1 (en) * 2016-09-28 2018-04-05 Dow Global Technologies Llc Solvents for use in the electronics industry
CN107957661A (zh) * 2016-10-18 2018-04-24 东友精细化工有限公司 抗蚀剂剥离液组合物及利用其的抗蚀剂的剥离方法
US10761423B2 (en) * 2017-08-30 2020-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical composition for tri-layer removal
TWI778192B (zh) 2017-12-15 2022-09-21 日商東京威力科創股份有限公司 在蝕刻殘留物移除期間保護基板上特徵部的水性清潔溶液及方法
TWI692679B (zh) * 2017-12-22 2020-05-01 美商慧盛材料美國責任有限公司 光阻剝除劑
CN108753478A (zh) * 2018-06-19 2018-11-06 成都青洋电子材料有限公司 一种半导体单晶硅清洗剂及其清洗方法
CN108998267A (zh) * 2018-08-29 2018-12-14 李少伟 一种半导体器件防蚀剂清洗剂及制备方法
US12089590B2 (en) 2019-02-06 2024-09-17 Virox Technologies, Inc. Shelf-stable antimicrobial compositions
US10952430B2 (en) 2019-02-06 2021-03-23 Virox Technologies Inc. Shelf-stable antimicrobial compositions
TWI749964B (zh) * 2020-12-24 2021-12-11 達興材料股份有限公司 鹼性清洗組合物、清洗方法和半導體製造方法
KR102364962B1 (ko) 2021-09-01 2022-02-18 김봉건 절삭용 공구 및 이를 포함하는 절삭 공작기계

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3264405B2 (ja) 1994-01-07 2002-03-11 三菱瓦斯化学株式会社 半導体装置洗浄剤および半導体装置の製造方法
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US6828289B2 (en) * 1999-01-27 2004-12-07 Air Products And Chemicals, Inc. Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature
KR100518714B1 (ko) * 2002-02-19 2005-10-05 주식회사 덕성 레지스트 박리액 조성물
KR100520397B1 (ko) * 2002-10-29 2005-10-11 동우 화인켐 주식회사 후-스트립 세정제 조성물 및 그를 이용한 포토레지스트스트립 공정 후의 반도체 소자 또는 액정표시소자의 세정방법
SG129274A1 (en) * 2003-02-19 2007-02-26 Mitsubishi Gas Chemical Co Cleaaning solution and cleaning process using the solution
US6951710B2 (en) * 2003-05-23 2005-10-04 Air Products And Chemicals, Inc. Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof
JP2005215627A (ja) * 2004-02-02 2005-08-11 Japan Organo Co Ltd レジスト剥離廃液の再生処理方法及び装置
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
KR20050110470A (ko) * 2004-05-19 2005-11-23 테크노세미켐 주식회사 반도체 기판용 세정액 조성물, 이를 이용한 반도체 기판세정방법 및 반도체 장치 제조 방법
KR100606187B1 (ko) * 2004-07-14 2006-08-01 테크노세미켐 주식회사 반도체 기판 세정용 조성물, 이를 이용한 반도체 기판세정방법 및 반도체 장치 제조 방법
US9217929B2 (en) * 2004-07-22 2015-12-22 Air Products And Chemicals, Inc. Composition for removing photoresist and/or etching residue from a substrate and use thereof
CN1290962C (zh) * 2004-12-22 2006-12-20 中国科学院上海微系统与信息技术研究所 高介电材料钛酸锶钡化学机械抛光用的纳米抛光液
KR20060108436A (ko) * 2005-04-13 2006-10-18 매그나칩 반도체 유한회사 반도체 소자 세정용 조성물 및 이를 이용한 반도체 소자의세정 방법
US7674755B2 (en) * 2005-12-22 2010-03-09 Air Products And Chemicals, Inc. Formulation for removal of photoresist, etch residue and BARC

Also Published As

Publication number Publication date
KR100942009B1 (ko) 2010-02-12
CN101187789B (zh) 2012-10-03
JP2008129571A (ja) 2008-06-05
JP4499751B2 (ja) 2010-07-07
CN101187789A (zh) 2008-05-28
KR20080046073A (ko) 2008-05-26
SG143115A1 (en) 2008-06-27
TW200823611A (en) 2008-06-01

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MM4A Annulment or lapse of patent due to non-payment of fees